TC428CPA

M Features TC426/TC427/TC428 Package Type 8-Pin PDIP/SOIC/CERDIP NC 1 IN A 2 GND 3 IN B 4 NC 1 IN A 2 GND 3 IN B 4 NC 1 IN A 2 GND 3 IN B 4 8 NC 7 OUT A 2, 4 Inverting 7, 5 1.5A Dual High-Speed Power MOSFET Drivers • High-Speed Switching (CL = 1000pF): 30nsec • High Peak Output Current: 1.5A • High Output Voltage Swing - VDD -25mV - GND +25mV • Low Input Current (Logic "0" or "1"): 1µA • TTL/CMOS Input Compatible • Available in Inverting and Noninverting Configurations • Wide Operating Supply Voltage - 4.5V to 18V • Current Consumption - Inputs Low – 0.4mA - Inputs High – 8mA • Single Supply Operation • Low Output Impedance: 6Ω • Pinout Equivalent of DS0026 and MMH0026 • Latch-Up Resistant: Withstands > 500mA Reverse Current • ESD Protected: 2kV TC426 6 VDD 5 OUT B 8 NC 7 OUT A 2, 4 7, 5 TC427 6 VDD 5 OUT B 8 NC 7 OUT A Noninverting 2 7 TC428 6 VDD 5 OUT B 4 5 Complementary NC = No internal connection General Description The TC426/TC427/TC428 are dual CMOS high-speed drivers. A TTL/CMOS input voltage level is translated into a rail-to-rail output voltage level swing. The CMOS output is within 25mV of ground or positive supply. The low impedance, high-current driver outputs swing a 1000pF load 18V in 30nsec. The unique current and voltage drive qualities make the TC426/TC427/TC428 ideal power MOSFET drivers, line drivers, and DC-toDC converter building blocks. Input logic signals may equal the power supply voltage. Input current is a low 1µA, making direct interface to CMOS/bipolar switch-mode power supply control ICs possible, as well as open-collector analog comparators. Quiescent power supply current is 8mA maximum. The TC426 requires 1/5 the current of the pin-compatible bipolar DS0026 device. This is important in DC-to-DC converter applications with power efficiency constraints and high-frequency switch-mode power supply applications. Quiescent current is typically 6mA when driving a 1000pF load 18V at 100kHz. The inverting TC426 driver is pin-compatible with the bipolar DS0026 and MMH0026 devices. The TC427 is noninverting; the TC428 contains an inverting and noninverting driver. Other pin compatible driver families are the TC1426/ TC1427/TC1428, TC4426/TC4427/TC4428 and TC4426A/TC4427A/TC4428A. Applications • • • • Switch Mode Power Supplies Pulse Transformer Drive Clock Line Driver Coax Cable Driver Device Selection Table Part Number TC426COA TC426CPA TC426EOA TC426EPA TC426IJA TC426MJA TC427COA TC427CPA TC427EOA TC427EPA TC427IJA TC427MJA TC428COA TC428CPA TC428EOA TC428EPA TC428IJA TC428MJA Package 8-Pin SOIC 8-Pin PDIP 8-Pin SOIC 8-Pin PDIP 8-Pin CERDIP 8-Pin CERDIP 8-Pin SOIC 8-Pin PDIP 8-Pin SOIC 8-Pin PDIP 8-Pin CERDIP 8-Pin CERDIP 8-Pin SOIC 8-Pin PDIP 8-Pin SOIC 8-Pin PDIP 8-Pin CERDIP 8-Pin CERDIP Configuration Inverting Inverting Inverting Inverting Inverting Inverting Noninverting Noninverting Noninverting Noninverting Noninverting Noninverting Complementary Complementary Complementary Complementary Complementary Complementary Temp. Range 0°C to +70°C 0°C to +70°C -40°C to +85°C -40°C to +85°C -25°C to +85°C -55°C to +125°C 0°C to +70°C 0°C to +70°C -40°C to +85°C -40°C to +85°C -25°C to +85°C -55°C to +125°C 0°C to +70°C 0°C to +70°C -40°C to +85°C -40°C to +85°C -25°C to +85°C -55°C to +125°C  2002 Microchip Technology Inc. DS21415B-page 1 TC426/TC427/TC428 Functional Block Diagram V+ ≈500µA ≈2.5mA TC426 TC427 TC428 Noninverting Output (TC427) Input GND NOTE: TC428 has one inverting and one noninverting driver. Ground any unused driver input. Inverting Output (TC426) DS21415B-page 2  2002 Microchip Technology Inc. TC426/TC427/TC428 1.0 ELECTRICAL CHARACTERISTICS *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings* Supply Voltage..................................................... +20V Input Voltage, Any Terminal ................................... VDD + 0.3V to GND – 0.3V Power Dissipation (TA ≤ 70°C) PDIP ........................................................ 730mW CERDIP ................................................... 800mW SOIC........................................................ 470mW Derating Factor PDIP ....................................................... 8mW/°C CERDIP ............................................... 6.4mW/°C SOIC....................................................... 4mW/°C Operating Temperature Range C Version .........................................0°C to +70°C I Version....................................... -25°C to +85°C E Version ..................................... -40°C to +85°C M Version................................... -55°C to +125°C Storage Temperature Range ............. -65°C to +150°C TC426/TC427/TC428 ELECTRICAL SPECIFICATIONS Electrical Characteristics: TA = +25°C with 4.5V ≤ VDD ≤ 18V, unless otherwise noted. Symbol Input VIH VIL IIN Output VOH VOL ROH ROL IPK tR tF tD1 tD2 IS Note 1: Parameter Min Typ Max Units Test Conditions Logic 1, High Input Voltage Logic 0, Low Input Voltage Input Current High Output Voltage Low Output Voltage High Output Resistance Low Output Resistance Peak Output Current Rise Time Fall Time Delay Time Delay Time Power Supply Current Switching times ensured by design. 2.4 — -1 VDD – 0.025 — — — — — — — — — — — — — — — 10 6 1.5 — — — — — — — 0.8 1 — 0.025 15 10 — 30 30 50 75 8 0.4 V V µA 0V ≤ VIN ≤ VDD V V Ω Ω IOUT = 10mA, VDD = 18V IOUT = 10mA, VDD = 18V A nsec nsec nsec nsec mA Figure 3-1, Figure 3-2 Figure 3-1, Figure 3-2 Figure 3-1, Figure 3-2 Figure 3-1, Figure 3-2 VIN = 3V (Both Inputs) VIN = 0V (Both Inputs) Switching Time (Note 1) Power Supply  2002 Microchip Technology Inc. DS21415B-page 3 TC426/TC427/TC428 TC426/TC427/TC428 ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: Over operating temperature range with 4.5V ≤ VDD ≤ 18V, unless otherwise noted. Input VIH VIL IIN Output VOH VOL ROH ROL tR tF tD1 tD2 IS Note 1: Logic 1, High Input Voltage Logic 0, Low Input Voltage Input Current High Output Voltage Low Output Voltage High Output Resistance Low Output Resistance Rise Time Fall Time Delay Time Delay Time Power Supply Current Switching times ensured by design. 2.4 — -10 VDD – 0.025 — — — — — — — — — — — — — — 13 8 — — — — — — — 0.8 10 — 0.025 20 15 60 60 75 120 12 0.6 V V µA 0V ≤ VIN ≤ VDD V V Ω Ω IOUT = 10mA, VDD = 18V IOUT = 10mA, VDD = 18V Figure 3-1, Figure 3-2 Figure 3-1, Figure 3-2 Figure 3-1, Figure 3-2 Figure 3-1, Figure 3-2 VIN = 3V (Both Inputs) VIN = 0V (Both Inputs) Switching Time (Note 1) nsec nsec nsec nsec mA Power Supply DS21415B-page 4  2002 Microchip Technology Inc. TC426/TC427/TC428 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: Pin No. (8-Pin PDIP, SOIC, CERDIP) 1 2 3 4 5 6 7 8 PIN FUNCTION TABLE Symbol NC IN A GND IN B OUT B VDD OUT A NC No Internal Connection. Control Input A, TTL/CMOS compatible logic input. Ground. Control Input B, TTL/CMOS compatible logic input. CMOS totem-pole output. Supply input, 4.5V to 18V. CMOS totem-pole output. No internal Connection. Description  2002 Microchip Technology Inc. DS21415B-page 5 TC426/TC427/TC428 3.0 3.1 APPLICATIONS INFORMATION Supply Bypassing 3.4 Power Dissipation Charging and discharging large capacitive loads quickly requires large currents. For example, charging a 1000pF load to 18V in 25nsec requires an 0.72A current from the device power supply. To ensure low supply impedance over a wide frequency range, a parallel capacitor combination is recommended for supply bypassing. Low-inductance ceramic disk capacitors with short lead lengths (< 0.5 in.) should be used. A 1µF film capacitor in parallel with one or two 0.1µF ceramic disk capacitors normally provides adequate bypassing. The supply current vs frequency and supply current vs capacitive load characteristic curves will aid in determining power dissipation calculations. The TC426/TC427/TC428 CMOS drivers have greatly reduced quiescent DC power consumption. Maximum quiescent current is 8mA compared to the DS0026 40mA specification. For a 15V supply, power dissipation is typically 40mW. Two other power dissipation components are: • Output stage AC and DC load power. • Transition state power. Output stage power is: 3.2 Grounding The TC426 and TC428 contain inverting drivers. Ground potential drops developed in common ground impedances from input to output will appear as negative feedback and degrade switching speed characteristics. Individual ground returns for the input and output circuits or a ground plane should be used. Po = PDC + PAC = Vo (IDC) + f CL VS2 Where: Vo IDC f Vs = DC output voltage = DC output load current = Switching frequency = Supply voltage 3.3 Input Stage The input voltage level changes the no-load or quiescent supply current. The N-channel MOSFET input stage transistor drives a 2.5mA current source load. With a logic "1" input, the maximum quiescent supply current is 8mA. Logic "0" input level signals reduce quiescent current to 0.4mA maximum. Minimum power dissipation occurs for logic "0" inputs for the TC426/TC427/TC428. Unused driver inputs must be connected to VDD or GND. The drivers are designed with 100mV of hysteresis. This provides clean transitions and minimizes output stage current spiking when changing states. Input voltage thresholds are approximately 1.5V, making the device TTL compatible over the 4.5V to 18V supply operating range. Input current is less than 1µA over this range. The TC426/TC427/TC428 may be directly driven by the TL494, SG1526/1527, SG1524, SE5560, and similar switch-mode power supply integrated circuits. In power MOSFET drive applications the PDC term is negligible. MOSFET power transistors are high impedance, capacitive input devices. In applications where resistive loads or relays are driven, the PDC component will normally dominate. The magnitude of PAC is readily estimated for several cases: A. 1. f 2. CL 3. Vs 4. PAC = 200kHZ =1000pf = 18V = 65mW B. 1. f 2. CL 3. Vs 4. PAC = 200kHz =1000pf = 15V = 45mW During output level state changes, a current surge will flow through the series connected N and P channel output MOSFETS as one device is turning "ON" while the other is turning "OFF". The current spike flows only during output transitions. The input levels should not be maintained between the logic "0" and logic "1" levels. Unused driver inputs must be tied to ground and not be allowed to float. Average power dissipation will be reduced by minimizing input rise times. As shown in the characteristic curves, average supply current is frequency dependent. DS21415B-page 6  2002 Microchip Technology Inc. TC426/TC427/TC428 FIGURE 3-1: INVERTING DRIVER SWITCHING TIME TEST CIRCUIT VDD = 18V 1µF 0.1µF FIGURE 3-2: NONINVERTING DRIVER SWITCHING TIME TEST CIRCUIT VDD = 18V 1µF 0.1µF Input 1 Output CL = 1000pF Input 1 Output CL = 1000pF Input: 100kHz, square wave, tRISE = tFALL ≤ 10nsec 2 2 Input: 100kHz, square wave, tRISE = tFALL ≤ 10nsec TC426 (1/2 TC428) TC427 (1/2 TC428) +5V Input 0V 18V Output 0V 10% 10% tD1 tF 90% 90% +5V Input 90% tD2 0V tR 90% 10% 90% tR 10% 10% 90% tF 18V tD1 Output tD2 10% 0V FIGURE 3-3: +15V VOLTAGE DOUBLER 30. 29. 28. VOUT (V) VOUT + – 47µF 0.1µF + – 4.7µF 1N4001 27. 26. 25. 24. 23. 22. 0 6 2 fIN = 10kHz 1/2 TC426 3 – 7 + 10µF 1N4001 10 20 30 40 50 60 70 80 90 100 IOUT (mA) FIGURE 3-4: +15V + 0.1µF VOLTAGE INVERTER -5 -6 – -7 -8 4.7µF VOUT (V) -9 -10 -11 -12 2 fIN = 10kHz 6 1/2 TC426 3 + 7 – 1N4001 – + VOUT 10µF 1N4001 47µF -13 -14 0 10 20 30 40 50 60 70 80 90 100 IOUT (mA)  2002 Microchip Technology Inc. DS21415B-page 7 TC426/TC427/TC428 4.0 Note: TYPICAL CHARACTERISTICS The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Rise and Fall Times vs. Supply Voltage 70 60 50 TIME (ns) 40 30 20 10 Delay Times vs. Supply Voltage 90 80 DELAY TIME (ns) 70 60 50 40 30 Rise and Fall Times vs. Temperature 40 35 CL = 1000pF TA = +25°C CL = 1000pF TA = +25°C tD2 TIME (ns) CL = 1000pF VDD = 18V tR 30 25 tF 20 15 tR tF tD1 10 0 5 10 15 SUPPLY VOLTAGE (V) 20 0 5 10 15 SUPPLY VOLTAGE (V) 20 0 -25 0 25 50 75 100 125 150 TEMPERATURE (°C) Delay Times vs. Temperature 100 90 80 Supply Current vs. Capacitive Load 1K 70 SUPPLY CURRENT (mA) Rise and Fall Times vs. Capacitive Load TA = +25°C VDD = 18V 100 CL = 1000pF VDD = 18V tD2 60 TA = +25°C VDD = 18V 400kHz tR DELAY TIME (ns) 80 70 60 50 40 30 -25 TIME (ns) 50 40 30 20 10 0 200kHz tF 10 tD1 20kHz 1 10 100 1000 CAPACITIVE LOAD (pF) 10K 0 25 75 100 125 150 50 TEMPERATURE (°C) 10 100 1000 CAPACITIVE LOAD (pF) 10K Supply Current vs. Frequency 30 High Output vs. Voltage 2.20 1.20 Low Output vs. Voltage TA = +25°C OUTPUT VOLTAGE (V) TA = +25°C CL = 1000pF VDD = 18V 1.76  VDD – VOUT  (V) TA = +25°C 0.96 VDD = 5V SUPPLY CURRENT (mA) 20 VDD = 8V 1.32 10V 0.72 10V 13V 0.88 0.48 10 5V 18V 0.44 15V 0.24 0 1 10 100 FREQUENCY (kHz) 1000 0 10 20 30 40 50 60 70 80 90 100 CURRENT SOURCED (mA) 0 10 20 30 40 50 60 70 80 90 100 CURRENT SUNK (mA) DS21415B-page 8  2002 Microchip Technology Inc. TC426/TC427/TC428 TYPICAL CHARACTERISTICS (CONTINUED) Supply Voltage vs. Quiescent Supply Current 20 No Load Both Inputs Logic "1" TA = +25°C 20 Supply Voltage vs. Quiescent Supply Current No Load Both Inputs Logic "0" TA = +25°C SUPPLY VOLTAGE (V) SUPPLY VOLTAGE (V) 15 15 10 10 5 5 0 0 1 2 3 4 5 SUPPLY CURRENT (mA) 6 0 50 100 150 200 250 SUPPLY CURRENT (µA) 300 Thermal Derating Curves 1600 1400 8-Pin DIP 88-Pin CERDIP 1000 800 8-Pin SOIC 600 400 200 0 0 10 20 30 40 50 60 70 80 90 100 110 120 MAX. POWER (mW) 1200 AMBIENT TEMPERATURE (°C)  2002 Microchip Technology Inc. DS21415B-page 9 TC426/TC427/TC428 5.0 5.1 PACKAGING INFORMATION Package Marking Information Package marking data not available at this time. 5.2 Package Dimensions 8-Pin Plastic DIP PIN 1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92) .070 (1.78) .040 (1.02) .310 (7.87) .290 (7.37) .040 (1.02) .020 (0.51) .015 (0.38) .008 (0.20) .400 (10.16) .310 (7.87) 3° MIN. .110 (2.79) .090 (2.29) .022 (0.56) .015 (0.38) Dimensions: inches (mm) 8-Pin CERDIP (Narrow) .110 (2.79) .090 (2.29) PIN 1 .300 (7.62) .230 (5.84) .055 (1.40) MAX. .400 (10.16) .370 (9.40) .200 (5.08) .160 (4.06) .200 (5.08) .125 (3.18) .020 (0.51) MIN. .320 (8.13) .290 (7.37) .040 (1.02) .020 (0.51) .015 (0.38) .008 (0.20) .400 (10.16) .320 (8.13) .065 (1.65) .020 (0.51) .045 (1.14) .016 (0.41) Dimensions: inches (mm) .150 (3.81) MIN. 3° MIN. DS21415B-page 10  2002 Microchip Technology Inc. TC426/TC427/TC428 Package Dimensions (Continued) 8-Pin SOIC PIN 1 .157 (3.99) .150 (3.81) .244 (6.20) .228 (5.79) .050 (1.27) TYP. .197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) 8° MAX. . .050 (1.27) .016 (0.40) Dimensions: inches (mm) .010 (0.25) .007 (0.18)  2002 Microchip Technology Inc. DS21415B-page 11 TC426/TC427/TC428 NOTES: DS21415B-page 12  2002 Microchip Technology Inc. TC426/TC427/TC428 Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.  2002 Microchip Technology Inc. DS21415B-page13 TC426/TC427/TC428 NOTES: DS21415B-page14  2002 Microchip Technology Inc. TC426/TC427/TC428 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.  2002 Microchip Technology Inc. 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