TC4404EPA

M Features TC4404/TC4405 General Description The TC4404/TC4405 are CMOS buffer-drivers constructed with complementary MOS outputs, where the drains of the totem-pole output have been left separated so that individual connections can be made to the pull-up and pull-down sections of the output. This allows the insertion of drain-current-limiting resistors in the pull-up and/or pull-down sections, allowing the user to define the rates of rise and fall for a capacitive load; or a reduced output swing, if driving a resistive load, or to limit base current, when driving a bipolar transistor. Minimum rise and fall times, with no resistors, will be less than 30nsec for a 1000pF load. For driving MOSFETs in motor-control applications, where slow-ON/fast-OFF operation is desired, these devices are superior to the previously used technique of adding a diode-resistor combination between the driver output and the MOSFET, because they allow accurate control of turn-ON, while maintaining fast turnOFF and maximum noise immunity for an OFF device. When used to drive bipolar transistors, these drivers maintain the high speeds common to other Microchip drivers. They allow insertion of a base current-limiting resistor, while providing a separate half-output for fast turn-OFF. By proper positioning of the resistor, either npn or pnp transistors can be driven. For driving many loads in low-power regimes, these drivers, because they eliminate shoot-through currents in the output stage, require significantly less power at higher frequencies, and can be helpful in meeting low-power budgets. 1.5A Dual Open-Drain MOSFET Drivers • Independently Programmable Rise and Fall Times • Low Output Impedance – 7Ω Typ. • High Speed tR, tF – 500 — 0.8 1 — 0.025 10 — 100 — V V µA 0V ≤ VIN ≤ VDD V V Ω IOUT = 10mA, VDD = 18V; Any Drain Duty cycle ≤ 2%, t ≤ 300µsec Duty cycle ≤ 2%, t ≤ 300µsec A mA mA Switching Time (Note 1) tR tF tD1 tD2 IS Note — — — — — — 25 25 15 32 — — 30 30 30 50 4.5 0.4 nsec nsec nsec nsec mA Figure 3-1, CL = 1000pF Figure 3-1, CL = 1000pF Figure 3-1, CL = 1000pF Figure 3-1, CL = 1000pF VIN = 3V (Both Inputs) VIN = 0V (Both Inputs) Power Supply  2002 Microchip Technology Inc. DS21418B-page 3 TC4404/TC4405 TC4404/TC4405 ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: Over operating temperature range with 4.5V ≤ VDD ≤ 18V, unless otherwise noted. Symbol VIH VIL IIN Output VOH VOL RO IPK IDC IR High Output Voltage Low Output Voltage Output Resistance Peak Output Current (Any Drain) Continuous Output Current (Any Drain) Latch-Up Protection (Any Drain) Withstand Reverse Current Rise Time Fall Time Delay Time Delay Time Power Supply Current 1: Switching times ensured by design. Parameter Logic 1, High Input Voltage Logic 0, Low Input Voltage Input Current Min 2.4 — -10 VDD – 0.025 — — — — — Typ — — — — — 9 1.5 — >500 Max — 0.8 10 — 0.025 12 — 100 — Units V V µA Test Conditions 0V ≤ VIN ≤ VDD V V Ω IOUT = 10mA, VDD = 18V; Any Drain Duty cycle ≤ 2%, t ≤ 300µsec Duty cycle ≤ 2%, t ≤ 300µsec A mA mA Switching Time (Note 1) tR tF tD1 tD2 IS Note — — — — — — — — — — — — 40 40 40 60 8 0.6 nsec nsec nsec nsec mA Figure 3-1, CL = 1000pF Figure 3-1, CL = 1000pF Figure 3-1, CL = 1000pF Figure 3-1, CL = 1000pF VIN = 3V (Both Inputs) VIN = 0V (Both Inputs) Power Supply DS21418B-page 4  2002 Microchip Technology Inc. TC4404/TC4405 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: Pin No. (8-Pin PDIP, SOIC, CERDIP) 1 2 3 4 5 6 7 8 PIN FUNCTION TABLE Symbol VDD IN A IN B GND B BOTTOM B TOP A BOTTOM A TOP Supply input, 4.5V to 18V. Control input A, TTL/CMOS compatible input. Control input A, TTL/CMOS compatible input. Ground. Output B, pull down. Output B, pull up. Output A, pull down. Output A, pull up. Description  2002 Microchip Technology Inc. DS21418B-page 5 TC4404/TC4405 3.0 3.1 APPLICATIONS INFORMATION Circuit Layout Guidelines Avoid long power supply and ground traces (added inductance causes unwanted voltage transients). Use power and ground planes wherever possible. In addition, it is advisable that low ESR bypass capacitors (4.7µF or 10µF tantalum) be placed as close to the driver as possible. The driver should be physically located as close to the device it is driving as possible to minimize the length of the output trace. FIGURE 3-1: SWITCHING TIME TEST CIRCUITS +5V Input VDD = 18V 0V 18V Output 1 10% tD1 tF 4.7µF 0.1µF 90% tD2 tR 90% 90% Input 2 1 8,7 Output CL = 1000pF 0V 10% 10% Inverting Driver +5V Input 0V 18V 10% 90% tR 10% 90% tF 10% 2 90% 4 Input: 100kHz, square wave, tRISE = tFALL ≤ 10nsec tD1 Output 0V tD2 Noninverting Driver 3.2 Typical Applications ZERO CROSSOVER CURRENT TOTEM-POLE SWITCH FIGURE 3-3: VDD (4.5V - 18V) FIGURE 3-2: DRIVING BIPOLAR TRANSISTORS VDD (4.5V - 18V) From TTL RT TC4404 RT VOUT From TTL RIB TC4405 RIB GND GND DS21418B-page 6  2002 Microchip Technology Inc. TC4404/TC4405 FIGURE 3-4: +24V 47kΩ +12V 15V 0.1µF 15V 0.1µF 47kΩ SERVO MOTOR CONTROL Direction (TTL Level) Speed (PWM) RT Motor RT ISENSE GND TC4469 TC4404 FIGURE 3-5: REACH-UP AND REACH-DOWN DRIVING +12V +12V Switched +12V +5V +5V From TTL TC4404 GND GND Switched -12V -12V -12V  2002 Microchip Technology Inc. DS21418B-page 7 TC4404/TC4405 4.0 Note: TYPICAL CHARACTERISTICS The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Fall Time vs. Supply Voltage 100 2200 pF TA = +25°C Rise Time vs. Supply Voltage 100 Rise TIme vs. Capacitive Load 100 TA 2200 pF 80 tFALL (nsec) TA = +25°C °C VDD 80 tRISE (nsec) 1500 pF 1500 pF tRISE (nsec) 80 60 1000 p pF 40 470 pF 20 100 pF 0 4 6 8 10 12 14 16 18 60 1000 pF 40 470 p pF 20 100 pF 0 60 10V 15V 40 20 4 6 8 10 12 14 16 18 0 100 VDD (V) VDD (V) 1000 CLOAD (pF) 10,000 Fall Time vs. Capacitive Load 100 TA Rise and Fall Times vs. Temperature 60 60 Propagation Delay vs. Supply Voltage C 50 °C VDD = 5V 80 tFALL (nsec) 50 C = 1000pF VDD = 17.5V = 1000pF °C DELAY TIME (nsec) tD2 40 TIME (nsec) 60 10V 15V 40 40 30 tFALL 30 tD1 20 20 20 tRISE 0 100 1000 CLOAD (pF) 10,000 10 -55 -35 -15 5 25 45 65 85 105 125 °C) 10 4 6 8 10 12 14 VDD (V) 16 18 Effect of Input Amplitude on Delay Time 60 CLOAD = 1000pF Propagation Delay Time vs. Temperature 60 VDD = 17.5V V = 1000pF Quiescent Supply Current vs. Voltage 10 TA = +25°C 50 DELAY TIME (nsec) DELAY TIME (nsec) T °C 50 tD2 IQUIESCENT (mA) BOTH INPUTS = 1 1 40 tD2 40 30 30 20 tD1 20 tD1 BOTH INPUTS = 0 0.1 10 0 2 4 6 VDRIVE (V) 8 10 10 -55 -35 -15 5 25 45 65 85 105 125 °C) 4 6 8 10 12 VDD (V) 14 16 18 DS21418B-page 8  2002 Microchip Technology Inc. TC4404/TC4405 TYPICAL CHARACTERISTICS (CONTINUED) Quiescent Supply Current vs. Temperature 4.0 VDD = 18V BOTH INPUTS = 1 Pull-Up Output Resistance 25 25 Pull-Down Output Resistance IQUIESCENT (mA) 3.5 20 20 3.0 RDS(ON) (Ω) RDS(ON) (Ω) WORST CASE @ TJ = +150°C 15 WORST CASE @ TJ = +150°C 15 2.5 10 8 TYP @ +25°C 10 8 5 TYP @ +25°C 2.0 -55 -35 -15 5 5 25 45 65 85 105 125 4 6 8 10 12 14 16 18 VDD (V) 4 6 8 10 12 14 16 18 TEMPERATURE (°C) VDD (V)  2002 Microchip Technology Inc. DS21418B-page 9 TC4404/TC4405 5.0 5.1 PACKAGING INFORMATION Package Marking Information Package marking data not available at this time. 5.2 Package Dimensions 8-Pin Plastic DIP PIN 1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92) .070 (1.78) .040 (1.02) .310 (7.87) .290 (7.37) .040 (1.02) .020 (0.51) .015 (0.38) .008 (0.20) .400 (10.16) .310 (7.87) 3° MIN. .110 (2.79) .090 (2.29) .022 (0.56) .015 (0.38) Dimensions: inches (mm) DS21418B-page 10  2002 Microchip Technology Inc. TC4404/TC4405 Package Dimensions (Continued) 8-Pin CERDIP (Narrow) .110 (2.79) .090 (2.29) PIN 1 .300 (7.62) .230 (5.84) .055 (1.40) MAX. .400 (10.16) .370 (9.40) .200 (5.08) .160 (4.06) .200 (5.08) .125 (3.18) .020 (0.51) MIN. .320 (8.13) .290 (7.37) .040 (1.02) .020 (0.51) .015 (0.38) .008 (0.20) .400 (10.16) .320 (8.13) .065 (1.65) .020 (0.51) .045 (1.14) .016 (0.41) Dimensions: inches (mm) .150 (3.81) MIN. 3° MIN. 8-Pin SOIC PIN 1 .157 (3.99) .150 (3.81) .244 (6.20) .228 (5.79) .050 (1.27) TYP. .197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) 8° MAX. . .050 (1.27) .016 (0.40) Dimensions: inches (mm) .010 (0.25) .007 (0.18)  2002 Microchip Technology Inc. DS21418B-page 11 TC4404/TC4405 NOTES: DS21418B-page 12  2002 Microchip Technology Inc. TC4404/TC4405 Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.  2002 Microchip Technology Inc. DS21418B-page13 TC4404/TC4405 NOTES: DS21418B-page14  2002 Microchip Technology Inc. TC4404/TC4405 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.  2002 Microchip Technology Inc. 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