TC4426AM_05

TC4426AM/TC4427AM/TC4428AM 1.5A Dual High-Speed Power MOSFET Drivers Features • High Peak Output Current: 1.5A • Wide Input Supply Voltage Operating Range: - 4.5V to 18V • High Capacitive Load Drive Capability: - 1000 pF in 25 ns (typ.) • Short Delay Times: 30 ns (typ.) • Matched Rise, Fall and Delay Times • Low Supply Current: - With Logic ‘1’ Input – 1 mA (typ.) - With Logic ‘0’ Input – 100 µA (typ.) • Low Output Impedance: 7Ω (typ.) • Latch-Up Protected: Will Withstand 0.5A Reverse Current • Input: Will Withstand Negative Inputs Up to 5V • ESD Protected: 4 kV • Pin-compatible with the TC426M/TC427M/TC428M and TC4426M/TC4427M/TC4428M • Wide Operating Temperature Range: - -55°C to +125°C • See TC4426A/TC4427A/TC4428A Data Sheet (DS21423) for additional temperature range and packaging offerings General Description The TC4426AM/TC4427AM/TC4428AM are improved versions of the earlier TC4426M/TC4427M/TC4428M family of MOSFET drivers. In addition to matched rise and fall times, the TC4426AM/TC4427AM/TC4428AM devices have matched leading and falling edge propagation delay times. These devices are highly latch-up resistant under any conditions within their power and voltage ratings. They are not subject to damage when up to 5V of noise spiking (of either polarity) occurs on the ground pin. They can accept, without damage or logic upset, up to 500 mA of reverse current (of either polarity) being forced back into their outputs. All terminals are fully protected against Electrostatic Discharge (ESD) up to 4 kV. The TC4426AM/TC4427AM/TC4428AM MOSFET drivers can easily charge/discharge 1000 pF gate capacitances in under 30 ns, while providing low enough impedances in both the on and off states to ensure the MOSFET's intended state will not be affected, even by large transients. Package Types 8-Pin CERDIP TC4426AM TC4427AM TC4428AM NC 1 8 NC 7 OUT A 6 VDD 5 OUT B NC OUT A VDD OUT B NC OUT A VDD OUT B Applications • Switch-mode Power Supplies • Line Drivers • Pulse Transformer Drive IN A 2 GND 3 IN B 4 © 2005 Microchip Technology Inc. TC4426AM TC4427AM TC4428AM DS21939A-page 1 TC4426AM/TC4427AM/TC4428AM Functional Block Diagram Inverting 300 mV Output VDD Input Effective Input C = 12 pF (Each Input) GND(2) 4.7V Non-Inverting TC4426AM/TC4427AM/TC4428AM(1) Note 1: The TC4426AM has two inverting drivers; the TC4427AM has two non-inverting drivers; the TC4428AM has one inverting and one non-inverting driver. 2: Ground any unused driver input. DS21939A-page 2 © 2005 Microchip Technology Inc. TC4426AM/TC4427AM/TC4428AM 1.0 ELECTRICAL CHARACTERISTICS † Notice: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings† Supply Voltage ................................................................+22V Input Voltage, IN A or IN B .......... (VDD + 0.3V) to (GND – 5V) DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 18V. Parameters Input Logic ‘1’, High Input Voltage Logic ‘0’, Low Input Voltage Input Current Output High Output Voltage Low Output Voltage Output Resistance Peak Output Current Latch-Up Protection Withstand Reverse Current Switching Time (Note 1) Rise Time Fall Time Delay Time Delay Time Power Supply Power Supply Current Note 1: IS — — 1.0 0.1 2.0 0.2 mA VIN = 3V (Both inputs) VIN = 0V (Both inputs), VDD = 18V tR tF tD1 tD2 — — — — — — — — 25 30 25 30 30 38 30 38 35 40 35 40 35 50 35 50 ns ns ns ns TA = +25°C -55°C ≤ TA ≤ +125°C, Figure 4-1 TA = +25°C -55°C ≤ TA ≤ +125°C, Figure 4-1 TA = +25°C -55°C ≤ TA ≤ +125°C, Figure 4-1 TA = +25°C -55°C ≤ TA ≤ +125°C, Figure 4-1 VOH VOL RO IPK IREV VDD – 0.025 — — — — — — — 7 8 1.5 >0.5 — 0.025 9 12 — — A A V V Ω DC TEST DC TEST IOUT = 10 mA, VDD = 18V, TA = +25°C -55°C ≤ TA ≤ +125°C VDD = 18V Duty cycle ≤ 2%, t ≤ 300 µs VDD = 18V VIH VIL IIN 2.4 — -1.0 -10 — — — — — 0.8 +1.0 +10 V V µA 0V ≤ VIN ≤ VDD Sym Min Typ Max Units Conditions Switching times ensured by design. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 18V. Parameters Temperature Ranges Specified Temperature Range (M) Maximum Junction Temperature Storage Temperature Range Package Thermal Resistances Thermal Resistance, 8L-CERDIP θJA — 150 — ºC/W TA TJ TA -55 — -65 — — — +125 +150 +150 ºC ºC ºC Sym Min Typ Max Units Conditions © 2005 Microchip Technology Inc. DS21939A-page 3 TC4426AM/TC4427AM/TC4428AM 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 18V. 100 80 tRISE (nsec) CL = 2200 pF TA = +25°C 100 80 tFALL (nsec) CL = 2200pF CL = 2200 pF TA = +25°C 60 40 20 0 5.0 CL = 100 pF CL = 1500 pF CL = 1000 pF CL = 470 pF 60 40 20 CL= 100pF CL = 100 pF 0 5.0 7.5 CL = 1500 pF CL = 1000 pF CL = 470 pF 7.5 10.0 12.5 VDD (V) 15.0 17.5 10.0 12.5 VDD (V) 15.0 17.5 FIGURE 2-1: Voltage. Rise Time vs. Supply FIGURE 2-4: Voltage. Fall Time vs. Supply 110 100 90 80 70 60 50 40 30 20 1 2 Delay Time (nsec) tD1 60 Delay Time (nsec) CL = 1000 pF VDD = 10V 55 50 45 40 35 30 25 20 tD2 tD1 CL = 1000 pF tD2 3 4 5 6 7 Input Amplitude (V) 8 9 0 5 10 VDD (V) 15 20 FIGURE 2-2: Amplitude. Delay Time vs. Input FIGURE 2-5: Supply Voltage. Propagation Delay Time vs. 28 Delay Time (nsec) 26 Time (nsec) 24 22 20 18 16 14 -100 tRISE tFALL CL = 1000 pF VDD = 18V 40 35 30 25 tD2 CL = 1000 pF VDD = 18V 20 15 -100 tD1 -50 0 50 100 150 -50 0 50 100 150 TEMPERATURE (°C) TEMPERATURE (°C) FIGURE 2-3: Temperature. Rise and Fall Times vs. FIGURE 2-6: Temperature. Propagation Delay Time vs. DS21939A-page 4 © 2005 Microchip Technology Inc. TC4426AM/TC4427AM/TC4428AM Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 18V. 30 25 TA = +125°C TA = +25°C 30 25 TA = +125°C RDS(ON) (Ω) RDS(ON) (Ω) 20 15 10 5 0 0 20 15 10 5 0 TA = +25°C 5 10 VDD (V) 15 20 0 5 10 VDD (V) 15 20 FIGURE 2-7: Resistance. High-State Output FIGURE 2-10: Resistance. Low-State Output 60 50 ISUPPLY (mA) CL = 2200 pF 60 CL = 1500 pF CL = 1000 pF VDD = 18V CL = 100 pF 2 MHz VDD = 18V 50 ISUPPLY (mA) 900 kHz 40 30 20 10 0 0 500 1000 40 30 20 600 kHz 200 kHz 10 20 kHz 0 1500 2000 2500 0 500 FREQUENCY (kHz) 1000 1500 CLOAD (pF) 2000 2500 FIGURE 2-8: Frequency. Supply Current vs. FIGURE 2-11: Capacitive Load. Supply Current vs. 80 70 ISUPPLY (mA) VDD = 12V CL = 2200 pF 80 70 ISUPPLY (mA) VDD = 12V 2 MHz 60 50 40 30 20 10 0 0 500 1000 1500 CL = 1500 pF CL = 1000 pF CL = 100 pF 60 50 40 30 20 10 0 900 kHz 600 kHz 200 kHz 20 kHz 2000 2500 0 500 1000 FREQUENCY (kHz) 1500 CLOAD (pF) 2000 2500 FIGURE 2-9: Frequency. Supply Current vs. FIGURE 2-12: Capacitive Load. Supply Current vs. © 2005 Microchip Technology Inc. DS21939A-page 5 TC4426AM/TC4427AM/TC4428AM Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 18V. 40 35 ISUPPLY (mA) VDD = 6V CL = 2200 pF 40 35 ISUPPLY (mA) VDD = 6V 2 MHz 30 25 20 15 10 5 0 0 500 1000 1500 CL = 1500 pF CL = 1000 pF CL = 100 pF 30 25 20 15 10 5 0 900 kHz 600 kHz 200 kHz 20 kHz 2000 2500 0 500 1000 FREQUENCY (kHz) 1500 CLOAD (pF) 2000 2500 FIGURE 2-13: Frequency. Supply Current vs. FIGURE 2-15: Capacitive Load. Supply Current vs. IQUIESCENT (µA) TA = 25°C IQUIESCENT (µA) 900 800 BOTH INPUTS = 1 700 600 500 400 300 200 BOTH INPUTS = 0 100 0 0 5 10 VDD (V) 15 20 1100 1000 900 BOTH INPUTS = 1 800 700 600 500 400 300 200 BOTH INPUTS = 0 100 0 -100 -50 0 VDD = 18V 50 100 150 TEMPERATURE (°C) FIGURE 2-14: vs. Voltage. Quiescent Supply Current FIGURE 2-16: vs. Temperature. Quiescent Supply Current DS21939A-page 6 © 2005 Microchip Technology Inc. TC4426AM/TC4427AM/TC4428AM 3.0 PIN DESCRIPTIONS 3.3 Outputs A & B (OUT A and OUT B) The descriptions of the pins are listed in Table 3-1. MOSFET driver OUT A & B are low-impedance, CMOS, push-pull style outputs. The pull-down and pullup devices are of equal strength, making the rise and fall times equivalent. TABLE 3-1: PIN FUNCTION TABLE Description 8-Pin Symbol CERDIP 1 2 3 4 5 6 7 8 NC IN A GND IN B OUT B VDD OUT A NC Input A Ground Input B Output B 3.4 No connection Supply Input (VDD) Supply input Output A No connection The VDD input is the bias supply for the MOSFET driver and is rated for 4.5V to 18V, with respect to the ground pin. The VDD input should be bypassed with local ceramic capacitors. The value of these capacitors should be chosen based on the capacitive load that is being driven. 3.1 Inputs A & B (IN A and IN B) MOSFET driver IN A & B are high-impedance, TTL/CMOS-compatible inputs. These inputs also have 300 mV of hysteresis between the high and low thresholds, which prevents output glitching even when the rise and fall time of the input signal is very slow. 3.2 Ground (GND) The GND pin is the return path for both the bias current and the high peak current that discharges the external load capacitance. The ground pin should be tied into a ground plane or have a very short trace to the bias supply source return. © 2005 Microchip Technology Inc. DS21939A-page 7 TC4426AM/TC4427AM/TC4428AM 4.0 APPLICATIONS INFORMATION +5V Input VDD = 18V 0V 0.1 µF VDD Output 7 Output CL = 1000 pF 4 5 +5V Input 3 Input: 100 kHz, square wave, tRISE = tFALL ≤ 10 ns 0V VDD Output 0V 10% 10% tD190% tR tD2 90% tF 10% 0V 10% Inverting Driver 10% 10% tD1 tF 90% tD2 tR 90% 90% 4.7 µF 6 Input 2 90% Non-Inverting Driver FIGURE 4-1: Switching Time Test Circuit. DS21939A-page 8 © 2005 Microchip Technology Inc. TC4426AM/TC4427AM/TC4428AM 5.0 5.1 PACKAGING INFORMATION Package Marking Information 8-Lead CERDIP (300 mil) Example: XXXXXXXX XXXXXNNN YYWW TC4427A e3 MJA^^ 256 0543 Legend: XX...X Y YY WW NNN e3 * Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2005 Microchip Technology Inc. DS21939A-page 9 TC4426AM/TC4427AM/TC4428AM 8-Lead Ceramic Dual In-line – 300 mil (CERDIP) E1 2 n 1 D E A2 A c eB A1 B1 B p L Number of Pins Pitch Top to Seating Plane Standoff § Shoulder to Shoulder Width Ceramic Pkg. Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing *Controlling Parameter JEDEC Equivalent: MS-030 Drawing No. C04-010 Units Dimension Limits n p A A1 E E1 D L c B1 B eB MIN .160 .020 .290 .230 .370 .125 .008 .045 .016 .320 INCHES* NOM 8 .100 .180 .030 .305 .265 .385 .163 .012 .055 .018 .360 MAX MIN .200 .040 .320 .300 .400 .200 .015 .065 .020 .400 MILLIMETERS NOM 8 2.54 4.06 4.57 0.51 0.77 7.37 7.75 5.84 6.73 9.40 9.78 3.18 4.13 0.20 0.29 1.14 1.40 0.41 0.46 8.13 9.15 MAX 5.08 1.02 8.13 7.62 10.16 5.08 0.38 1.65 0.51 10.16 DS21939A-page 10 © 2005 Microchip Technology Inc. TC4426AM/TC4427AM/TC4428AM APPENDIX A: REVISION HISTORY Revision A (February 2005) • Original Release of this Document. © 2005 Microchip Technology Inc. DS21939A-page 11 TC4426AM/TC4427AM/TC4428AM NOTES: DS21939A-page 12 © 2005 Microchip Technology Inc. TC4426AM/TC4427AM/TC4428AM PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device and Temperature Range XX Package Examples: a) TC4426AMJA: 1.5A Dual MOSFET driver, Inverting, -55°C to +125°C 8LD CERDIP package. 1.5A Dual MOSFET driver, Non-Inverting -55°C to +125°C 8LD CERDIP package. 1.5A Dual MOSFET driver, Complementary, -55°C to +125°C 8LD CERDIP package. Device and Temperature Range: TC4426AM: 1.5A Dual MOSFET Driver, Inverting, -55°C to +125°C TC4427AM: 1.5A Dual MOSFET Driver, Non-Inverting, -55°C to +125°C TC4428AM: 1.5A Dual MOSFET Driver, Complementary, -55°C to +125°C a) TC4427AMJA: a) Package: JA = Ceramic Dual In-line (300 mil Body), 8-lead TC4428AMJA: © 2005 Microchip Technology Inc. DS21939A-page 13 TC4426AM/TC4427AM/TC4428AM NOTES: DS21939A-page 14 © 2005 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • • Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” • • • Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2005 Microchip Technology Inc. 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