TC4428AVOA713

TC4426A/TC4427A/TC4428A 1.5A Dual High-Speed Power MOSFET Drivers Features: • High Peak Output Current – 1.5A • Wide Input Supply Voltage Operating Range: - 4.5V to 18V • High Capacitive Load Drive Capability – 1000 pF in 25 ns (typ.) • Short Delay Times – 30 ns (typ.) • Matched Rise, Fall and Delay Times • Low Supply Current: - With Logic ‘1’ Input – 1 mA (typ.) - With Logic ‘0’ Input – 100 μA (typ.) • Low Output Impedance – 7Ω (typ.) • Latch-Up Protected: Will Withstand 0.5A Reverse Current • Input Will Withstand Negative Inputs Up to 5V • ESD Protected – 4 kV • Pin-compatible with TC426/TC427/TC428 and TC4426/TC4427/TC4428 • Space-saving 8-Pin MSOP and 8-Pin 6x5 DFN Packages General Description: The TC4426A/TC4427A/TC4428A are improved versions of the earlier TC4426/TC4427/TC4428 family of MOSFET drivers. In addition to matched rise and fall times, the TC4426A/TC4427A/TC4428A devices have matched leading and falling edge propagation delay times. These devices are highly latch-up resistant under any conditions within their power and voltage ratings. They are not subject to damage when up to 5V of noise spiking (of either polarity) occurs on the ground pin. They can accept, without damage or logic upset, up to 500 mA of reverse current (of either polarity) being forced back into their outputs. All terminals are fully protected against Electrostatic Discharge (ESD) up to 4 kV. The TC4426A/TC4427A/TC4428A MOSFET drivers can easily charge/discharge 1000 pF gate capacitances in under 30 ns. These devices provide low enough impedances in both the on and off states to ensure the MOSFET’s intended state will not be affected, even by large transients. Applications: • Switch Mode Power Supplies • Line Drivers • Pulse Transformer Drive Package Types 8-Pin MSOP/ PDIP/SOIC TC4426A TC4427A TC4428A NC IN A GND IN B 1 8 NC 2 TC4426A 7 OUT A 3 TC4427A 6 VDD 4 TC4428A 5 OUT B 8-Pin DFN(1) TC4426A TC4427A TC4428A NC 1 IN A 2 GND 3 IN B 4 TC4426A TC4427A TC4428A 8 7 6 5 NC OUT A VDD OUT B NC OUT A VDD OUT B NC OUT A VDD OUT B NC OUT A VDD OUT B NC OUT A VDD OUT B Note 1: Exposed pad of the DFN package is electrically isolated. © 2006 Microchip Technology Inc. DS21423F-page 1 TC4426A/TC4427A/TC4428A Functional Block Diagram Inverting 500 μA 300 mV Output VDD Input Effective Input C = 12 pF (Each Input) GND 4.7V Non-Inverting TC4426A/TC4427A/TC4428A Note 1: TC4426A has two inverting drivers, while the TC4427A has two non-inverting drivers. The TC4428A has one inverting and one non-inverting driver. 2: Ground any unused driver input. DS21423F-page 2 © 2006 Microchip Technology Inc. TC4426A/TC4427A/TC4428A 1.0 ELECTRICAL CHARACTERISTICS † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings† Supply Voltage ..................................................... +22V Input Voltage, IN A or IN B ..................................... (VDD + 0.3V) to (GND – 5V) Package Power Dissipation (TA ≤ 70°C) DFN .............................................................. Note 2 MSOP .......................................................... 340 mW PDIP ............................................................ 730 mW SOIC............................................................ 470 mW DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 18V. Parameters Input Logic ‘1’, High Input Voltage Logic ‘0’, Low Input Voltage Input Current Output High Output Voltage Low Output Voltage Output Resistance VOH VOL RO VDD – 0.025 — — — — — — — — — 7 7 8 8 1.5 > 0.5 — 0.025 9 10 11 12 — — V V Ω DC Test DC Test IOUT = 10 mA, VDD = 18V, TA = +25°C 0°C ≤ TA ≤ +70°C -40°C ≤ TA ≤ +85°C -40°C ≤ TA ≤ +125°C VDD = 18V Duty cycle ≤ 2%, t ≤ 300 μsec VDD = 18V TA = +25°C 0°C ≤ TA ≤ +70°C -40°C ≤ TA ≤ +85°C -40°C ≤ TA ≤ +125°C, Figure 4-1 TA = +25°C 0°C ≤ TA ≤ +70°C -40°C ≤ TA ≤ +85°C -40°C ≤ TA ≤ +125°C, Figure 4-1 TA = +25°C 0°C ≤ TA ≤ +70°C -40°C ≤ TA ≤ +85°C -40°C ≤ TA ≤ +125°C, Figure 4-1 TA = +25°C 0°C ≤ TA ≤ +70°C -40°C ≤ TA ≤ +85°C -40°C ≤ TA ≤ +125°C, Figure 4-1 VIN = 3V (Both inputs) VIN = 0V (Both inputs), VDD = 18V VIH VIL IIN 2.4 — –1.0 –10 — — — — — 0.8 +1.0 +10 V V μA 0V ≤ VIN ≤ VDD Sym Min Typ Max Units Conditions Peak Output Current Latch-Up Protection Withstand Reverse Current Switching Time (Note 1) Rise Time IPK IREV A A tR — — — — — — — — — — — — — — — — — — 25 27 29 30 25 27 29 30 30 33 35 38 30 33 35 38 1.0 0.1 35 40 40 40 35 40 40 40 35 40 45 50 35 40 45 50 2.0 0.2 ns Fall Time tF ns Delay Time tD1 ns Delay Time tD2 ns Power Supply Power Supply Current Note 1: 2: IS mA Switching times ensured by design. Package power dissipation is dependent on the copper pad area on the PCB. © 2006 Microchip Technology Inc. DS21423F-page 3 TC4426A/TC4427A/TC4428A TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 18V. Parameters Temperature Ranges Specified Temperature Range (C) Specified Temperature Range (E) Specified Temperature Range (V) Maximum Junction Temperature Storage Temperature Range Package Thermal Resistances Thermal Resistance, 8L-6x5 DFN Thermal Resistance, 8L-MSOP Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC θJA θJA θJA θJA — — — — 33.2 206 125 155 — — — — °C/W °C/W °C/W °C/W TA TA TA TJ TA 0 -40 -40 — -65 — — — — — +70 +85 +125 +150 +150 °C °C °C °C °C Sym Min Typ Max Units Conditions DS21423F-page 4 © 2006 Microchip Technology Inc. TC4426A/TC4427A/TC4428A 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 18V. 100 80 tRISE (nsec) CL = 2200 pF TA = +25°C 100 80 tFALL (nsec) CL = 2200pF CL = 2200 pF TA = +25°C 60 40 20 0 5.0 CL = 100 pF CL = 1500 pF CL = 1000 pF CL = 470 pF 60 40 20 CL= 100pF CL = 100 pF 0 5.0 7.5 CL = 1500 pF CL = 1000 pF CL = 470 pF 7.5 10.0 12.5 VDD (V) 15.0 17.5 10.0 12.5 VDD (V) 15.0 17.5 FIGURE 2-1: Voltage. Rise Time vs. Supply FIGURE 2-4: Voltage. Fall Time vs. Supply 110 100 90 80 70 60 50 40 30 20 1 2 Delay Time (nsec) tD1 60 Delay Time (nsec) CL = 1000 pF VDD = 10V 55 50 45 40 35 30 25 20 tD2 tD1 CL = 1000 pF tD2 3 4 5 6 7 Input Amplitude (V) 8 9 0 5 10 VDD (V) 15 20 FIGURE 2-2: Amplitude. Delay Time vs. Input FIGURE 2-5: Supply Voltage. Propagation Delay Time vs. 28 Delay Time (nsec) 26 Time (nsec) 24 22 20 18 16 14 -100 tRISE tFALL CL = 1000 pF VDD = 18V 40 35 30 25 tD2 CL = 1000 pF VDD = 18V 20 15 -100 tD1 -50 0 50 100 150 -50 0 50 100 150 TEMPERATURE (°C) TEMPERATURE (°C) FIGURE 2-3: Temperature. Rise and Fall Times vs. FIGURE 2-6: Temperature. Propagation Delay Time vs. © 2006 Microchip Technology Inc. DS21423F-page 5 TC4426A/TC4427A/TC4428A Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 18V. 30 25 TA = +125°C TA = +25°C 30 25 TA = +125°C RDS(ON) (Ω) RDS(ON) (Ω) 20 15 10 5 0 0 20 15 10 5 0 TA = +25°C 5 10 VDD (V) 15 20 0 5 10 VDD (V) 15 20 FIGURE 2-7: Resistance. High-State Output FIGURE 2-10: Resistance. Low-State Output 60 50 ISUPPLY (mA) CL = 2200 pF 60 CL = 1500 pF CL = 1000 pF VDD = 18V CL = 100 pF 2 MHz VDD = 18V 50 ISUPPLY (mA) 900 kHz 40 30 20 10 0 0 500 1000 40 30 20 600 kHz 200 kHz 10 20 kHz 0 1500 2000 2500 0 500 FREQUENCY (kHz) 1000 1500 CLOAD (pF) 2000 2500 FIGURE 2-8: Frequency. Supply Current vs. FIGURE 2-11: Capacitive Load. Supply Current vs. 80 70 ISUPPLY (mA) VDD = 12V CL = 2200 pF 80 70 ISUPPLY (mA) VDD = 12V 2 MHz 60 50 40 30 20 10 0 0 500 1000 1500 CL = 1500 pF CL = 1000 pF CL = 100 pF 60 50 40 30 20 10 0 900 kHz 600 kHz 200 kHz 20 kHz 2000 2500 0 500 1000 FREQUENCY (kHz) 1500 CLOAD (pF) 2000 2500 FIGURE 2-9: Frequency. Supply Current vs. FIGURE 2-12: Capacitive Load. Supply Current vs. DS21423F-page 6 © 2006 Microchip Technology Inc. TC4426A/TC4427A/TC4428A Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 18V. 40 35 ISUPPLY (mA) VDD = 6V CL = 2200 pF 40 35 ISUPPLY (mA) VDD = 6V 2 MHz 30 25 20 15 10 5 0 0 500 1000 1500 CL = 1500 pF CL = 1000 pF CL = 100 pF 30 25 20 15 10 5 0 900 kHz 600 kHz 200 kHz 20 kHz 2000 2500 0 500 1000 FREQUENCY (kHz) 1500 CLOAD (pF) 2000 2500 FIGURE 2-13: Frequency. Supply Current vs. FIGURE 2-15: Capacitive Load. Supply Current vs. IQUIESCENT (µA) TA = 25°C IQUIESCENT (µA) 900 800 BOTH INPUTS = 1 700 600 500 400 300 200 BOTH INPUTS = 0 100 0 0 5 10 VDD (V) 15 20 1100 1000 900 BOTH INPUTS = 1 800 700 600 500 400 300 200 BOTH INPUTS = 0 100 0 -100 -50 0 VDD = 18V 50 100 150 TEMPERATURE (°C) FIGURE 2-14: vs. Voltage. Quiescent Supply Current FIGURE 2-16: vs. Temperature. Quiescent Supply Current © 2006 Microchip Technology Inc. DS21423F-page 7 TC4426A/TC4427A/TC4428A 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: 8-Pin PDIP/ MSOP/SOIC 1 2 3 4 5 6 7 8 — Note 1: PIN FUNCTION TABLE 8-Pin DFN 1 2 3 4 5 6 7 8 PAD Symbol NC IN A GND IN B OUT B VDD OUT A NC NC No connection Input A Ground Input B Output B Supply input Output A No connection Exposed Metal Pad Description Duplicate pins must be connected for proper operation. 3.1 Inputs A and B 3.4 Supply Input (VDD) MOSFET driver inputs A and B are high-impedance, TTL/CMOS compatible inputs. These inputs also have 300 mV of hysteresis between the high and low thresholds that prevents output glitching, even when the rise and fall time of the input signal is very slow. The VDD input is the bias supply for the MOSFET driver and is rated for 4.5V to 18V, with respect to the ground pin. The VDD input should be bypassed with local ceramic capacitors. The value of these capacitors should be chosen based on the capacitive load that is being driven. 3.2 Ground (GND) 3.5 Exposed Metal Pad The exposed metal pad of the 6x5 DFN package is not internally connected to any potential. Therefore, this pad can be connected to a ground plane or other copper plane on a printed circuit board, to aid in heat removal from the package. The ground pin is the return path for both the bias current and the high peak current that discharges the external load capacitance. The ground pin should be tied into a ground plane or have a very short trace to the bias supply source return. 3.3 Output A and B MOSFET driver outputs A and B are low-impedance, CMOS push-pull style outputs. The pull-down and pullup devices are of equal strength, making the rise and fall times equivalent. DS21423F-page 8 © 2006 Microchip Technology Inc. TC4426A/TC4427A/TC4428A 4.0 APPLICATIONS INFORMATION +5V Input VDD = 18V 4.7 μF 6 Input 2 7 Output CL = 1000 pF 4 5 +5V Input 3 Input: 100 kHz, square wave, tRISE = tFALL ≤ 10 ns 0V VDD Output 0V 10% 10% tD190% tR tD2 90% tF 10% 0.1 μF 0V VDD Output 0V 10% 10% 10% tD1 tF 90% tD2 tR 90% 90% Inverting Driver (TC4426A, 1/2 TC4428A) 90% Non-Inverting Driver (TC4427A, 1/2 TC4428A) FIGURE 4-1: Switching Time Test Circuit. © 2006 Microchip Technology Inc. DS21423F-page 9 TC4426A/TC4427A/TC4428A 5.0 5.1 PACKAGING INFORMATION Package Marking Information 8-Lead DFN Example: XXXXXXX XXXXXXX XXYYWW NNN TC4426A EMF 0420 256 8-Lead MSOP Example: XXXXX YWWNNN 4426AE 420256 8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW Example: TC4427A EPA256 0420 8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW NNN Example: TC4428A COA0420 256 Legend: XX...X YY WW NNN Customer specific information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard marking consists of Microchip part number, year code, week code, traceability code (facility code, mask rev#, and assembly code). DS21423F-page 10 © 2006 Microchip Technology Inc. TC4426A/TC4427A/TC4428A 8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S) – Saw Singulated © 2006 Microchip Technology Inc. DS21423F-page 11 TC4426A/TC4427A/TC4428A 8-Lead Plastic Micro Small Outline Package (UA) (MSOP) E E1 p D 2 B n 1 α A c φ A1 (F) β A2 L Number of Pins Pitch A .043 Overall Height A2 .030 .037 Molded Package Thickness .000 .006 A1 Standoff E Overall Width E1 Molded Package Width D Overall Length L .016 .031 Foot Length Footprint (Reference) F φ Foot Angle 0° 8° c Lead Thickness .003 .009 .009 .016 Lead Width B α Mold Draft Angle Top 5° 15° β 5° 15° Mold Draft Angle Bottom *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-187 Drawing No. C04-111 Units Dimension Limits n p MIN INCHES NOM 8 .026 BSC .033 .193 TYP. .118 BSC .118 BSC .024 .037 REF .006 .012 - MAX MIN MILLIMETERS* NOM 8 0.65 BSC 0.75 0.85 0.00 4.90 BSC 3.00 BSC 3.00 BSC 0.40 0.60 0.95 REF 0° 0.08 0.22 5° 5° - MAX 1.10 0.95 0.15 0.80 8° 0.23 0.40 15° 15° DS21423F-page 12 © 2006 Microchip Technology Inc. TC4426A/TC4427A/TC4428A 8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP) E1 D 2 n 1 α E A A2 c L A1 β eB B1 p B MAX Number of Pins Pitch Top to Seating Plane A .140 .170 4.32 Molded Package Thickness A2 .115 .145 3.68 Base to Seating Plane A1 .015 Shoulder to Shoulder Width E .300 .313 .325 8.26 Molded Package Width E1 .240 .250 .260 6.60 Overall Length D .360 .373 .385 9.78 Tip to Seating Plane L .125 .130 .135 3.43 c Lead Thickness .008 .012 .015 0.38 Upper Lead Width B1 .045 .058 .070 1.78 Lower Lead Width B .014 .018 .022 0.56 Overall Row Spacing § eB .310 .370 .430 10.92 α Mold Draft Angle Top 5 10 15 15 β Mold Draft Angle Bottom 5 10 15 15 * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 Units Dimension Limits n p MIN INCHES* NOM 8 .100 .155 .130 MAX MIN MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 © 2006 Microchip Technology Inc. DS21423F-page 13 TC4426A/TC4427A/TC4428A 8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 45° h α c A A2 φ β L A1 MAX Number of Pins Pitch Overall Height A .053 .069 1.75 Molded Package Thickness A2 .052 .061 1.55 Standoff § A1 .004 .010 0.25 Overall Width E .228 .244 6.20 Molded Package Width E1 .146 .157 3.99 Overall Length D .189 .197 5.00 Chamfer Distance h .010 .020 0.51 Foot Length L .019 .030 0.76 φ Foot Angle 0 8 8 c Lead Thickness .008 .010 0.25 Lead Width B .013 .020 0.51 α Mold Draft Angle Top 0 15 15 β Mold Draft Angle Bottom 0 15 15 * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 Units Dimension Limits n p MIN INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12 MAX MIN MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12 DS21423F-page 14 © 2006 Microchip Technology Inc. TC4426A/TC4427A/TC4428A PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range XX Package XXX Tape & Reel X PB Free Examples: a) TC4426ACOA: 1.5A Dual Inverting MOSFET driver, 0°C to +70°C, 8LD SOIC package. b) TC4426AEOA: 1.5A Dual Inverting MOSFET driver, -40°C to +85°C, 8LD SOIC package. c) TC4426AEMF: 1.5A Dual Inverting MOSFET driver, -40°C to +85°C, 8LD DFN package. a) TC4427ACPA: 1.5A Dual Non-Inverting MOSFET driver, 0°C to +70°C, 8LD PDIP package. b) TC4427AEPA: 1.5A Dual Non-Inverting MOSFET driver, -40°C to +85°C, 8LD PDIP package. c) TC4427AVMF713: 1.5A Dual Non-Inverting MOSFET driver, -40°C to +125°C, 8LD DFN package, Tape and Reel. a) TC4428AEPA: 1.5A Dual Complementary MOSFET driver, -40°C to +85°C, 8LD PDIP package. b) TC4428ACOA713: 1.5A Dual Complementary MOSFET driver, 0°C to +70°C 8LD SOIC package, Tape and Reel. c) TC4428AVMF: 1.5A Dual Complementary MOSFET driver, -40°C to +125°C, 8LD DFN package. Device: TC4426A: 1.5A Dual MOSFET Driver, Inverting TC4427A: 1.5A Dual MOSFET Driver, Non-Inverting TC4428A: 1.5A Dual MOSFET Driver, Complementary Temperature Range: C E V = 0°C to +70°C (PDIP & SOIC Only) = -40°C to +85°C = -40ºC to +125°C Package: MF = Dual, Flat, No-Lead (6X5 mm Body), 8-lead MF713 = Dual, Flat, No-Lead (6X5 mm Body), 8-lead (Tape and Reel) PA = Plastic DIP (300 mil Body), 8-lead OA = Plastic SOIC, (150 mil Body), 8-lead OA713 = Plastic SOIC, (150 mil Body), 8-lead (Tape and Reel) UA = Plastic Micro Small Outline (MSOP), 8-lead UA713 = Plastic Micro Small Outline (MSOP), 8-lead (Tape and Reel) Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. © 2006 Microchip Technology Inc. DS21423F-page 15 TC4426A/TC4427A/TC4428A NOTES: DS21423F-page 16 © 2006 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • • Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” • • • Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. 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Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, Real ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and Zena are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2006 Microchip Technology Inc. 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