TC4428COA713

TC4426/TC4427/TC4428 1.5A Dual High-Speed Power MOSFET Drivers Features: • High Peak Output Current – 1.5A • Wide Input Supply Voltage Operating Range: - 4.5V to 18V • High Capacitive Load Drive Capability – 1000 pF in 25 ns (typ.) • Short Delay Times – 40 ns (typ.) • Matched Rise and Fall Times • Low Supply Current: - With Logic ‘1’ Input – 4 mA - With Logic ‘0’ Input – 400 μA • Low Output Impedance – 7Ω • Latch-Up Protected: Will Withstand 0.5A Reverse Current • Input Will Withstand Negative Inputs Up to 5V • ESD Protected – 4 kV • Pin-compatible with the TC426/TC427/TC428 • Space-saving 8-Pin MSOP and 8-Pin 6x5 DFN Packages General Description: The TC4426/TC4427/TC4428 are improved versions of the earlier TC426/TC427/TC428 family of MOSFET drivers. The TC4426/TC4427/TC4428 devices have matched rise and fall times when charging and discharging the gate of a MOSFET. These devices are highly latch-up resistant under any conditions within their power and voltage ratings. They are not subject to damage when up to 5V of noise spiking (of either polarity) occurs on the ground pin. They can accept, without damage or logic upset, up to 500 mA of reverse current (of either polarity) being forced back into their outputs. All terminals are fully protected against Electrostatic Discharge (ESD) up to 4 kV. The TC4426/TC4427/TC4428 MOSFET drivers can easily charge/discharge 1000 pF gate capacitances in under 30 ns. These devices provide low enough impedances in both the on and off states to ensure the MOSFET’s intended state will not be affected, even by large transients. Other compatible drivers are the TC4426A/TC4427A/ TC4428A family of devices. The TC4426A/TC4427A/ TC4428A devices have matched leading and falling edge input-to-output delay times, in addition to the matched rise and fall times of the TC4426/TC4427/ TC4428 devices. Applications: • Switch Mode Power Supplies • Line Drivers • Pulse Transformer Drive Package Types 8-Pin MSOP/ PDIP/SOIC TC4426 TC4427 TC4428 NC IN A GND IN B 1 8 NC 2 TC4426 7 OUT A 3 TC4427 6 VDD 4 TC4428 5 OUT B 8-Pin DFN(1) NC 1 8 TC4426 TC4427 TC4428 NC OUT A VDD OUT B NC OUT A VDD OUT B NC OUT A VDD OUT B NC OUT A VDD OUT B NC OUT A VDD OUT B IN A 2 GND 3 TC4426 TC4427 TC4428 7 6 5 IN B 4 Note 1: Exposed pad of the DFN package is electrically isolated. © 2006 Microchip Technology Inc. DS21422D-page 1 TC4426/TC4427/TC4428 Functional Block Diagram Inverting 1.5 mA 300 mV Output VDD Input Effective Input C = 12 pF (Each Input) GND 4.7V Non-Inverting TC4426/TC4427/TC4428 Note 1: TC4426 has two inverting drivers, while the TC4427 has two non-inverting drivers. The TC4428 has one inverting and one non-inverting driver. 2: Ground any unused driver input. DS21422D-page 2 © 2006 Microchip Technology Inc. TC4426/TC4427/TC4428 1.0 ELECTRICAL CHARACTERISTICS PIN FUNCTION TABLE Name NC IN A GND IN B OUT B VDD OUT A NC Input A Ground Input B Output B Supply Input Output A No Connection Function No Connection Absolute Maximum Ratings † Supply Voltage ..................................................... +22V Input Voltage, IN A or IN B ..................................... (VDD + 0.3V) to (GND – 5V) Package Power Dissipation (TA ≤ 70°C) DFN .............................................................. Note 3 MSOP .......................................................... 340 mW PDIP ............................................................ 730 mW SOIC............................................................ 470 mW Storage Temperature Range.............. -65°C to +150°C Maximum Junction Temperature ...................... +150°C † Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, TA = +25ºC with 4.5V ≤ VDD ≤ 18V. Parameters Input Logic ‘1’, High Input Voltage Logic ‘0’, Low Input Voltage Input Current Output High Output Voltage Low Output Voltage Output Resistance Peak Output Current Latch-Up Protection Withstand Reverse Current Switching Time (Note 1) Rise Time Fall Time Delay Time Delay Time Power Supply Power Supply Current Note 1: 2: 3: IS — — — — 4.5 0.4 mA VIN = 3V (Both inputs) VIN = 0V (Both inputs) tR tF tD1 tD2 — — — — 19 19 20 40 30 30 30 50 ns ns ns ns Figure 4-1 Figure 4-1 Figure 4-1 Figure 4-1 VOH VOL RO IPK IREV VDD – 0.025 — — — — — — 7 1.5 > 0.5 — 0.025 10 — — V V Ω A A DC Test DC Test IOUT = 10 mA, VDD = 18V VDD = 18V Duty cycle ≤ 2%, t ≤ 300 μs VDD = 18V VIH VIL IIN 2.4 — -1.0 — — — — 0.8 +1.0 V V μA 0V ≤ VIN ≤ VDD Note 2 Sym Min Typ Max Units Conditions Switching times ensured by design. For V temperature range devices, the VIH (Min) limit is 2.0V. Package power dissipation is dependent on the copper pad area on the PCB. © 2006 Microchip Technology Inc. DS21422D-page 3 TC4426/TC4427/TC4428 DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE) Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 18V. Parameters Input Logic ‘1’, High Input Voltage Logic ‘0’, Low Input Voltage Input Current Output High Output Voltage Low Output Voltage Output Resistance Peak Output Current Latch-Up Protection Withstand Reverse Current Switching Time (Note 1) Rise Time Fall Time Delay Time Delay Time Power Supply Power Supply Current Note 1: 2: IS — — — — 8.0 0.6 mA VIN = 3V (Both inputs) VIN = 0V (Both inputs) tR tF tD1 tD2 — — — — — — — — 40 40 40 60 ns ns ns ns Figure 4-1 Figure 4-1 Figure 4-1 Figure 4-1 VOH VOL RO IPK IREV VDD – 0.025 — — — — — — 9 1.5 >0.5 — 0.025 12 — — V V Ω A A DC Test DC Test IOUT = 10 mA, VDD = 18V VDD = 18V Duty cycle ≤ 2%, t ≤ 300 μs VDD = 18V VIH VIL IIN 2.4 — -10 — — — — 0.8 +10 V V μA 0V ≤ VIN ≤ VDD Note 2 Sym Min Typ Max Units Conditions Switching times ensured by design. For V temperature range devices, the VIH (Min) limit is 2.0V. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 18V. Parameters Temperature Ranges Specified Temperature Range (C) Specified Temperature Range (E) Specified Temperature Range (V) Maximum Junction Temperature Storage Temperature Range Package Thermal Resistances Thermal Resistance, 8L-6x5 DFN Thermal Resistance, 8L-MSOP Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC θJA θJA θJA θJA — — — — 33.2 206 125 155 — — — — °C/W °C/W °C/W °C/W TA TA TA TJ TA 0 -40 -40 — -65 — — — — — +70 +85 +125 +150 +150 °C °C °C °C °C Sym Min Typ Max Units Conditions DS21422D-page 4 © 2006 Microchip Technology Inc. TC4426/TC4427/TC4428 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, TA = +25ºC with 4.5V ≤ VDD ≤ 18V. 100 100 2200 pF 80 2200 pF 80 1500 pF tFALL (nsec) 1500 pF 60 tRISE (nsec) 60 1000 pF 40 1000 pF 40 470 pF 20 20 470 pF 100 pF 100 pF 0 0 4 6 8 10 12 VDD (V) 14 16 18 4 6 8 10 12 VDD (V) 14 16 18 FIGURE 2-1: Voltage. 100 Rise Time vs. Supply FIGURE 2-4: Voltage. 100 Fall Time vs. Supply 5V 5V 80 80 10V 15V 40 tFALL (nsec) tRISE (nsec) 60 60 10V 15V 40 20 20 0 100 1000 CLOAD (pF) 10,000 0 100 1000 CLOAD (pF) 10,000 FIGURE 2-2: Load. 60 Rise Time vs. Capacitive FIGURE 2-5: Load. 80 75 70 65 60 55 50 45 40 35 30 25 20 4 6 8 Fall Time vs. Capacitive Propagation Delay (nsec) C LOAD = 1000 pF CLOAD = 1000 pF VIN = 5V 50 Time (nsec) VDD = 17.5V 40 tD2 30 tFALL 20 tRISE tD1 10 –55 –35 –15 10 12 14 16 18 5 25 45 65 Temperature (˚C) 85 105 125 VDD (V) FIGURE 2-3: Temperature. Rise and Fall Times vs. FIGURE 2-6: Supply Voltage. Propagation Delay Time vs. © 2006 Microchip Technology Inc. DS21422D-page 5 TC4426/TC4427/TC4428 Note: Unless otherwise indicated, TA = +25ºC with 4.5V ≤ VDD ≤ 18V. 60 CLOAD = 1000 pF VDD = 12V 45 40 Delay Time (nsec) 35 30 25 20 15 10 -55 -35 -15 5 25 45 65 85 105 125 tD1 CLOAD = 1000 pF VIN = 5V VDD = 18V tD2 Propagation Delay (nsec) 55 50 45 40 35 30 25 20 15 10 0 1 2 3 4 5 6 7 8 tD1 tD2 9 10 11 12 Input Amplitude (V) Temperature (ºC) FIGURE 2-7: Input Amplitude. Propagation Delay Time vs. FIGURE 2-10: Temperature. 4.0 V DD = 18V Propagation Delay Time vs. IQUIESCENT (mA) 3.5 IQUIESCENT (mA) Both Inputs = 1 1 3.0 Both Inputs = 1 2.5 Both Inputs = 0 0.1 4 6 8 10 12 VDD 14 16 18 2.0 –55 –35 –15 5 25 45 TA (˚C) 65 85 105 125 FIGURE 2-8: Voltage. 25 Supply Current vs. Supply FIGURE 2-11: Temperature. 25 Supply Current vs. 20 Worst Case @ TJ = +150˚C 20 Worst Case @ TJ = +150˚C RDS(ON) (Ω) RDS(ON) (Ω) 15 15 10 Typical @ TA = +25˚C 10 Typical @ TA = +25˚C 5 5 4 6 8 10 VDD 12 14 16 18 4 6 8 10 VDD 12 14 16 18 FIGURE 2-9: Supply Voltage. Output Resistance (ROH) vs. FIGURE 2-12: Supply Voltage. Output Resistance (ROL) vs. DS21422D-page 6 © 2006 Microchip Technology Inc. TC4426/TC4427/TC4428 Note: Unless otherwise indicated, TA = +25ºC with 4.5V ≤ VDD ≤ 18V. 60 VDD = 18V 50 900 kHz ISUPPLY (mA) 60 2 MHz VDD = 18V 50 1000 pF 2200 pF ISUPPLY (mA) 40 30 20 10 0 100 200 kHz 20 kHz 1000 CLOAD (pF) 10,000 600 kHz 40 100 pF 30 20 10 0 10 100 1000 FREQUENCY (kHz) FIGURE 2-13: Capacitive Load. 60 VDD = 12V 50 ISUPPLY (mA) Supply Current vs. FIGURE 2-16: Frequency. 60 Supply Current vs. 2 MHz VDD = 12V 50 2200 pF ISUPPLY (mA) 40 30 900 kHz 20 10 0 100 200 kHz 20 kHz 1000 CLOAD (pF) 10,000 600 kHz 40 30 20 10 0 10 1000 pF 100 pF 100 1000 FREQUENCY (kHz) FIGURE 2-14: Capacitive Load. 60 VDD = 6V 50 ISUPPLY (mA) Supply Current vs. FIGURE 2-17: Frequency. 60 VDD = 6V 50 Supply Current vs. ISUPPLY (mA) 40 30 20 10 0 100 900 kHz 600 kHz 200 kHz 20 kHz 1000 CLOAD (pF) 10,000 40 30 20 10 0 10 100 1000 FREQUENCY (kHz) 1000 pF 2200 pF 2 MHz 100 pF FIGURE 2-15: Capacitive Load. Supply Current vs. FIGURE 2-18: Frequency. Supply Current vs. © 2006 Microchip Technology Inc. DS21422D-page 7 TC4426/TC4427/TC4428 Note: Unless otherwise indicated, TA = +25ºC with 4.5V ≤ VDD ≤ 18V. 10 –8 9 8 7 6 5 A • sec 10 4 3 2 –9 4 6 8 10 12 VDD 14 16 18 Note: The values on this graph represent the loss seen by both drivers in a package during one complete cycle. For a single driver, divide the stated values by 2. For a single transition of a single driver, divide the stated value by 4. FIGURE 2-19: Supply Voltage. Crossover Energy vs. DS21422D-page 8 © 2006 Microchip Technology Inc. TC4426/TC4427/TC4428 3.0 PIN DESCRIPTIONS PIN FUNCTION TABLE (1) 8-Pin DFN 1 2 3 4 5 6 7 8 PAD Symbol NC IN A GND IN B OUT B VDD OUT A NC NC No connection Input A Ground Input B Output B Supply input Output A No connection Exposed Metal Pad Description The descriptions of the pins are listed in Table 3-1. TABLE 3-1: 8-Pin PDIP/ MSOP/SOIC 1 2 3 4 5 6 7 8 — Note 1: Duplicate pins must be connected for proper operation. 3.1 Inputs A and B 3.4 Supply Input (VDD) MOSFET driver inputs A and B are high-impedance, TTL/CMOS compatible inputs. These inputs also have 300 mV of hysteresis between the high and low thresholds that prevents output glitching even when the rise and fall time of the input signal is very slow. The VDD input is the bias supply for the MOSFET driver and is rated for 4.5V to 18V with respect to the ground pin. The VDD input should be bypassed with local ceramic capacitors. The value of these capacitors should be chosen based on the capacitive load that is being driven. A value of 1.0 μF is suggested. 3.2 Ground (GND) 3.5 Exposed Metal Pad The exposed metal pad of the 6x5 DFN package is not internally connected to any potential. Therefore, this pad can be connected to a ground plane or other copper plane on a printed circuit board, to aid in heat removal from the package. Ground is the device return pin. The ground pin(s) should have a low-impedance connection to the bias supply source return. High peak currents will flow out the ground pin(s) when the capacitive load is being discharged. 3.3 Output A and B MOSFET driver outputs A and B are low-impedance, CMOS push-pull style outputs. The pull-down and pullup devices are of equal strength, making the rise and fall times equivalent. © 2006 Microchip Technology Inc. DS21422D-page 9 TC4426/TC4427/TC4428 4.0 APPLICATIONS INFORMATION +5V Input VDD = 18V 4.7 μF 6 Input 2 7 Output CL = 1000 pF 4 5 +5V Input 3 Input: 100 kHz, square wave, tRISE = tFALL ≤ 10 ns 0V VDD Output 0V 10% 10% tD1 90% tR 90% tD2 10% 0.1 μF 0V VDD Output 0V 10% 10% 10% tD1 tF 90% tD2 tR 90% 90% Inverting Driver 90% tF Non-Inverting Driver FIGURE 4-1: Switching Time Test Circuit. DS21422D-page 10 © 2006 Microchip Technology Inc. TC4426/TC4427/TC4428 5.0 5.1 PACKAGING INFORMATION Package Marking Information 8-Lead DFN Example: XXXXXXX XXXXXXX XXYYWW NNN TC4426 EMF 0420 256 8-Lead MSOP Example: XXXXX YWWNNN 4426C 420256 8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW Example: TC4427 CPA256 0420 8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW NNN Example: TC4428 COA0420 256 Legend: XX...X Y YY WW NNN Note: Customer specific information* Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard device marking consists of Microchip part number, year code, week code, and traceability code. © 2006 Microchip Technology Inc. DS21422D-page 11 TC4426/TC4427/TC4428 8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S) – Saw Singulated DS21422D-page 12 © 2006 Microchip Technology Inc. TC4426/TC4427/TC4428 8-Lead Plastic Micro Small Outline Package (MS) (MSOP) E E1 p D 2 n 1 B α c φ A A2 F β Units Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint (Reference) Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom n p A A2 A1 E E1 D L F φ c B α β .016 .030 .000 MIN L A1 INCHES NOM 8 MAX MIN MILLIMETERS* NOM 8 0.65 BSC .043 .037 .006 0.75 0.00 4.90 BSC 3.00 BSC 3.00 BSC .031 8° .009 .016 15° 15° 0.40 0° 0.08 0.22 5° 5° 0.60 0.95 REF 8° 0.23 0.40 15° 15° 0.80 0.85 1.10 0.95 0.15 MAX .026 BSC .033 .193 BSC .118 BSC .118 BSC .024 .037 REF 0° .003 .009 5° 5° .006 .012 - * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. BSC: Basic Dimension. Theoretically exact value shown without tolerances. See ASME Y14.5M REF: Reference Dimension, usually without tolerance, for information purposes only. See ASME Y14.5M JEDEC Equivalent: MO-187 Drawing No. C04-111 Revised 07-21-05 © 2006 Microchip Technology Inc. DS21422D-page 13 TC4426/TC4427/TC4428 8-Lead Plastic Dual In-line (P) – 300 mil (PDIP) E1 D 2 n 1 α E A A2 c L A1 β eB B1 p B MAX Number of Pins Pitch Top to Seating Plane A .140 .170 4.32 Molded Package Thickness A2 .115 .145 3.68 Base to Seating Plane A1 .015 Shoulder to Shoulder Width E .300 .313 .325 8.26 Molded Package Width E1 .240 .250 .260 6.60 Overall Length D .360 .373 .385 9.78 Tip to Seating Plane L .125 .130 .135 3.43 c Lead Thickness .008 .012 .015 0.38 Upper Lead Width B1 .045 .058 .070 1.78 Lower Lead Width B .014 .018 .022 0.56 § eB .310 .370 .430 10.92 Overall Row Spacing α Mold Draft Angle Top 5 10 15 15 β Mold Draft Angle Bottom 5 10 15 15 * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 Units Dimension Limits n p MIN INCHES* NOM 8 .100 .155 .130 MAX MIN MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 DS21422D-page 14 © 2006 Microchip Technology Inc. TC4426/TC4427/TC4428 8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 45° h α c A A2 φ β L A1 MAX Number of Pins Pitch Overall Height A .053 .069 1.75 Molded Package Thickness A2 .052 .061 1.55 Standoff A1 .004 .010 0.25 § Overall Width E .228 .244 6.20 Molded Package Width E1 .146 .157 3.99 Overall Length D .189 .197 5.00 Chamfer Distance h .010 .020 0.51 Foot Length L .019 .030 0.76 φ Foot Angle 0 8 8 c Lead Thickness .008 .010 0.25 Lead Width B .013 .020 0.51 α Mold Draft Angle Top 0 15 15 β Mold Draft Angle Bottom 0 15 15 * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 Units Dimension Limits n p MIN INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12 MAX MIN MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12 © 2006 Microchip Technology Inc. DS21422D-page 15 TC4426/TC4427/TC4428 NOTES: DS21422D-page 16 © 2006 Microchip Technology Inc. TC4426/TC4427/TC4428 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range XX Package XXX Tape & Reel X PB Free Examples: a) TC4426COA: 1.5A Dual Inverting MOSFET driver, 0°C to +70°C SOIC package. 1.5A Dual Inverting MOSFET driver, -40°C to +85°C. MSOP package. 1.5A Dual Inverting MOSFET driver, -40°C to +85°C, DFN package. 1.5A Dual Non-Inverting MOSFET driver, 0°C to +70°C PDIP package. 1.5A Dual Non-Inverting MOSFET driver, -40°C to +85°C PDIP package. MOSFET driver, 0°C to +70°C, SOIC package, Tape and Reel. Device: TC4426: TC4427: TC4428: 1.5A Dual MOSFET Driver, Inverting 1.5A Dual MOSFET Driver, Non-Inverting 1.5A Dual MOSFET Driver, Complementary b) TC4426EUA: Temperature Range: C E V = = = 0°C to +70°C (PDIP and SOIC only) -40°C to +85°C -40°C to +125°C c) TC4426EMF: Package: MF = Dual, Flat, No-Lead (6X5 mm Body), 8-lead MF713 = Dual, Flat, No-Lead (6X5 mm Body), 8-lead (Tape and Reel) OA = Plastic SOIC, (150 mil Body), 8-lead OA713 = Plastic SOIC, (150 mil Body), 8-lead (Tape and Reel) PA = Plastic DIP (300 mil Body), 8-lead UA = Plastic Micro Small Outline (MSOP), 8-lead UA713 = Plastic Micro Small Outline (MSOP), 8-lead (Tape and Reel) a) TC4427CPA: b) TC4427EPA: a) TC4428COA713:1.5A Dual Complementary b) TC4428EMF: 1.5A Dual Complementary, MOSFET driver, -40°C to +85°C DFN package. Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. © 2006 Microchip Technology Inc. DS21422D-page 17 TC4426/TC4427/TC4428 NOTES: DS21422D-page 18 © 2006 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • • Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” • • • Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, Real ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and Zena are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2006 Microchip Technology Inc. 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