TC4432EOA713

M Features • High Peak Output Current – 1.5A • Wide Input Supply Voltage Operating Range: - 4.5V to 30V • High Capacitive Load Drive Capability: - 1000 pF in 25 nsec • Short Delay Times – 300 mA Reverse Current • ESD Protected – 4 kV TC4431/TC4432 General Description The TC4431/TC4432 are 30V CMOS buffer/drivers suitable for use in high-side driver applications. They will not latch-up under any conditions within their power and voltage ratings. They can accept, without damage or logic upset, up to 300 mA of reverse current (of either polarity) being forced back into their outputs. All terminals are fully protected against up to 4 kV of electrostatic discharge. Undervoltage lockout circuitry forces the output to a ‘low’ state when the input supply voltage drops below 7V. For operation at lower voltages, disable the lockout and start-up circuit by grounding pin 3 (LOCK DIS ); for all other situations, pin 3 should be left floating. The under-voltage lockout and start-up circuit gives brownout protection when driving MOSFETS. 1.5A High-Speed 30V MOSFET Drivers Applications • Small Motor Drive • Power MOSFET Driver • Driving Bipolar Transistors Package Types 8-Pin PDIP/SOIC/CERDIP VDD 1 8 VDD IN 2 7 OUT TC4431 LOCK DIS 3 6 OUT GND 4 5 GND 2 7 Inverting 6 VDD 1 8 VDD IN 2 7 OUT TC4432 LOCK DIS 3 6 OUT GND 4 5 GND 2 7 6 Non Inverting  2003 Microchip Technology Inc. DS21424C-page 1 TC4431/TC4432 Functional Block Diagram 8V DD 3 LOCK DIS 2 mA Inverting TC4431 7 OUT OUT 6 2 Input 4, 5 GND Non-Inverting TC4432 TC4431/TC4432 Inverting/Non Inverting Effective Input C = 10 pF UV LOCK 250 mV DS21424C-page 2  2003 Microchip Technology Inc. TC4431/TC4432 1.0 ELECTRICAL CHARACTERISTICS † Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings† Supply Voltage ....................................................... 36V Input Voltage (Note 1)................... VDD + 0.3V to GND Package Power Dissipation (TA ≤ 70°C) PDIP ............................................................ 730 mW CERDIP ....................................................... 800 mW SOIC............................................................ 470 mW Maximum Junction Temperature, TJ ................ +150°C Storage Temperature Range.............. -65°C to +150°C DC CHARACTERISTICS Electrical Specifications: U nless otherwise noted, TA = +25ºC with 4.5V ≤ VDD ≤ 30V. Parameters Input Logic ‘1’, High Input Voltage Logic ‘0’, Low Input Voltage Input Current (Note 1) Output High Output Voltage Low Output Voltage Output Resistance Peak Output Current Latch-Up Protection Withstand Reverse Current Switching Time (Note 2) Rise Time Fall Time Delay Time Delay Time Power Supply Power Supply Current Start-up Threshold Drop-out Threshold Note 1: 2: 3: IS VS VDO — — — 7 2.5 0.3 8.4 7.7 4 0.4 10 — mA V V Note 3 VIN = 3V VIN = 0V tR tF tD1 tD2 — — — — 25 33 62 78 40 50 80 90 nsec Figure 4-1 nsec Figure 4-1 nsec Figure 4-1 nsec Figure 4-1 VOH VOL RO IPK IREV VDD – 1.0 — — — — — VDD – 0.8 — 7 3.0 1.5 0.3 — 0.025 10 — — — V V Ω A A IOUT = 10 mA, VDD = 30V Source: VDD = 30V Sink: VDD = 30V Duty cycle ≤ 2%, t ≤ 300 µsec IOUT = 100 mA VIH VIL IIN 2.4 — -1 — — — — 0.8 1 V V µA 0V ≤ VIN ≤ 12V Sym Min Typ Max Units Conditions For inputs >12V, add a 1 kΩ resistor in series with the input. See “Typical Characteristics” graph for input current. Switching times are ensured by design. For operation below 7V, pin 3 (LOCK DIS) should be tied to ground to disable the lockout and start-up circuit, otherwise, pin 3 must be left floating.  2003 Microchip Technology Inc. DS21424C-page 3 TC4431/TC4432 DC CHARACTERISTICS (Continued) Electrical Specifications: U nless otherwise noted, Over operating temperature range with 4.5V ≤ VDD ≤ 30V. Parameters Input Logic ‘1’, High Input Voltage Logic ‘0’, Low Input Voltage Input Current (Note 1) Output High Output Voltage Low Output Voltage Output Resistance Switching Time (Note 2) Rise Time Fall Time Delay Time Delay Time Power Supply Power Supply Current Start-up Threshold Drop-out Threshold Note 1: 2: 3: IS VS VDO — — — 7 — — 8.4 7.7 6 0.7 10 — mA V V Note 3 VIN = 3V VIN = 0V tR tF tD1 tD2 — — — — — — — — 60 70 100 110 nsec Figure 4-1 nsec Figure 4-1 nsec Figure 4-1 nsec Figure 4-1 VOH VOL RO VDD – 1.2 — — — — — — 0.025 12 V V Ω IOUT = 10 mA, VDD = 30V IOUT = 100 mA VIH VIL IIN 2.4 — -10 — — — — 0.8 10 V V µA 0V ≤ VIN ≤ 12V Sym Min Typ Max Units Conditions For inputs >12V, add a 1 kΩ resistor in series with the input. See “Typical Characteristics” graph for input current. Switching times are ensured by design. For operation below 7V, pin 3 (LOCK DIS) should be tied to ground to disable the lockout and start-up circuit, otherwise, pin 3 must be left floating. TEMPERATURE CHARACTERISTICS Electrical Specifications: U nless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 30V. Parameters Temperature Ranges Specified Temperature Range (C) Specified Temperature Range (E) Maximum Junction Temperature Storage Temperature Range Package Thermal Resistances Thermal Resistance, 8L-SOIC Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-CERDIP θJA θJA θJA — — — 155 125 150 — — — ºC/W ºC/W ºC/W TA TA TJ TA 0 -40 — -65 — — — — +70 +85 +150 +150 ºC ºC ºC ºC Sym Min Typ Max Units Conditions DS21424C-page 4  2003 Microchip Technology Inc. TC4431/TC4432 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, TA = +25ºC with 4.5V ≤ V DD ≤ 30V. 60 VDD = 12V 50 40 30 900 kHz 20 10 0 100 200 kHz 20 kHz 1000 CLOAD (pF) 10,000 600 kHz 2 MHz 125 100 75 50 25 0 3 6 9 12 15 18 VDD (V) 21 24 27 30 tRISE tFALL 150 CLOAD = 1000 pF TA = +25°C ISUPPLY (mA) Time (nsec) FIGURE 2-1: Capacitive Load. 50 45 Supply Current vs. FIGURE 2-3: Rise/Fall Time vs. VDD. 300 250 tD1 200 150 tD2 CLOAD = 1000 pF TA = +25°C INPUT CURRENT (mA) 40 35 30 25 20 15 10 5 0 3 6 9 12 15 18 21 24 INPUT VOLTAGE (VIN) 27 30 WITH 1 K RES. WITHOUT 1 K RES. TIME (nsec) 100 50 0 3 6 9 12 15 18 VDD (V) 21 24 27 30 FIGURE 2-2: Voltage. Input Current vs. Input FIGURE 2-4: tD1 and tD2 Delay vs. VDD.  2003 Microchip Technology Inc. DS21424C-page 5 TC4431/TC4432 3.0 PIN DESCRIPTIONS 3.3 Lockout Disable (LOCK DIS) The descriptions of the pins are listed in Table 3-1. The lockout pin enables/disables the undervoltage lock-out feature of the device. If undervoltage lockout is desired (output is not enabled until the bias voltage reaches 8.4V (typical) on the rising edge and is disabled when the bias voltage reaches 7.7V (typical) on the falling edge), the lockout pin should be left floating. If operation below 7V is desired, the lockout pin should be tied to ground. TABLE 3-1: Pin No. 1 2 3 4 5 6 7 8 PIN FUNCTION TABLE Description Supply Input, 4.5V to 30V TTL/CMOS Compatible Input Input Pin, Enable/Disable for UV Lockout Ground Ground Drive Output, Pull Down Drive Output, Pull Up Supply Input, 4.5V to 30V VDD IN Symbol LOCK DIS GND GND 3.4 Ground (GND) OUT OUT VDD The ground pins are the return path for the bias current and for the high peak currents which discharge the load capacitor. Both ground pins should be used to ensure proper operation. The ground pins should be tied into a ground plane or have short traces to the bias supply source return. 3.1 Supply Input (VDD) The V DD input is the bias supply input for the MOSFET driver and is rated for 4.5V to 30V with respect to the ground pins. The VDD input should be bypassed to ground with a local ceramic capacitor. The value of this capacitor should be chosen based on the capacitive load that is being driven. 3.5 Drive Output (OUT) 3.2 Control Input (IN) The TC4431/TC4432 devices have individual source and sink output pins. This feature can be used to adjust the rise and fall time independently by adding separate charge and discharge resistors external to the device. Pin 7 (source output) can source 3A peak currents into capacitive loads and pin 6 (sink output) can sink 1.5A peak currents from a capacitive load. The MOSFET driver input is a TTL/CMOS compatible input with 250 mV of hysteresis between the high and low threshold voltages. If an input signal level of greater than 12V is applied to the device, a series current limiting resistor is recommended. DS21424C-page 6  2003 Microchip Technology Inc. TC4431/TC4432 4.0 APPLICATIONS INFORMATION +5V Input VDD = 30V 4.7 µF 1, 8 Input 2 7 Output 6 C L= 1000 pF +5V LOCK DIS 3 Input 4, 5 Input: 100 kHz, square wave, tRISE = tFALL ≤ 10 nsec 0V VDD Output 0V 10% 10% tD1 90% 90% tD2 10% 0.1 µF 0V VDD Output 0V 10% 10% 10% tD1 90% tF tD2 tR 90% 90% Inverting Driver 90% tR tF Non-Inverting Driver FIGURE 4-1: Switching Time Test Circuit.  2003 Microchip Technology Inc. DS21424C-page 7 TC4431/TC4432 5.0 5.1 PACKAGING INFORMATION Package Marking Information 8-Lead PDIP (300 mil) Example: XXXXXXXX XXXXXNNN YYWW TC4431 CPA256 0302 8-Lead SOIC (150 mil) Example: XXXXXXXX XXXXYYWW NNN TC4431 COA0302 256 8-Lead CERDIP (300 mil) Example: XXXXXXXX XXXXXNNN YYWW TC4431 EJA256 0302 Legend: XX...X YY WW NNN Customer specific information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Note : In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard OTP marking consists of Microchip part number, year code, week code, and traceability code. DS21424C-page 8  2003 Microchip Technology Inc. TC4431/TC4432 8-Lead Plastic Dual In-line (P) – 300 mil (PDIP) E1 D 2 n 1 α E A A2 c L A1 β eB B1 p B Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic Units Dimension Limits n p A A2 A1 E E1 D L c B1 B eB α β MIN INCHES* NOM 8 .100 .155 .130 .313 .250 .373 .130 .012 .058 .018 .370 10 10 MAX MIN § .140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5 .170 .145 .325 .260 .385 .135 .015 .070 .022 .430 15 15 MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MAX 4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018  2003 Microchip Technology Inc. DS21424C-page 9 TC4431/TC4432 8-Lead Ceramic Dual In-line (JA) – 300 mil (CERDIP) E1 2 n 1 D E A2 A c eB A1 B1 B p L Number of Pins Pitch Top to Seating Plane Standoff § Shoulder to Shoulder Width Ceramic Pkg. Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing *Controlling Parameter JEDEC Equivalent: MS-030 Drawing No. C04-010 Units Dimension Limits n p A A1 E E1 D L c B1 B eB MIN .160 .020 .290 .230 .370 .125 .008 .045 .016 .320 INCHES* NOM 8 .100 .180 .030 .305 .265 .385 .163 .012 .055 .018 .360 MAX MIN .200 .040 .320 .300 .400 .200 .015 .065 .020 .400 MILLIMETERS NOM 8 2.54 4.06 4.57 0.51 0.77 7.37 7.75 5.84 6.73 9.40 9.78 3.18 4.13 0.20 0.29 1.14 1.40 0.41 0.46 8.13 9.15 MAX 5.08 1.02 8.13 7.62 10.16 5.08 0.38 1.65 0.51 10.16 DS21424C-page 10  2003 Microchip Technology Inc. TC4431/TC4432 8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 45° h α c A A2 φ β L A1 Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic Units Dimension Limits n p A A2 A1 E E1 D h L φ c B α β MIN .053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0 INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12 MAX MIN .069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15 MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12 MAX 1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 8 0.25 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057  2003 Microchip Technology Inc. DS21424C-page 11 TC4431/TC4432 NOTES: DS21424C-page 12  2003 Microchip Technology Inc. TC4431/TC4432 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range TC4431: TC4432: /XX Package Examples: a) b) TC4431COA: 1.5A MOSFET driver, SOIC package, 0°C to +70°C. TC4431EJA: 1.5A MOSFET driver, CERDIP package, -40ºC to +85ºC. Device: 1.5A High-Speed 30V MOSFET Driver, Inverting 1.5A High-Speed 30V MOSFET Driver, Non Inverting 0°C to +70°C -40°C to +85°C a) b) Temperature Range: C E = = TC4432CPA: 1.5A MOSFET driver, PDIP package, 0°C to +70°C. TC4432EPA: 1.5A MOSFET driver, PDIP package, -40°C to +85°C. Package: JA = Ceramic Dual In-line (300 mil Body), 8-lead * OA = Plastic SOIC, (150 mil Body), 8-lead OA713 = Plastic SOIC, (150 mil Body), 8-lead (Tape and Reel) PA = Plastic DIP (300 mil Body), 8-lead * Offered in E-temp range only. Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.  2003 Microchip Technology Inc. DS21424C-page 13 TC4431/TC4432 NOTES: DS21424C-page 14  2003 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • • • Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” • • Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE and PowerSmart are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Accuron, Application Maestro, dsPIC, dsPICDEM, dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode, SmartSensor, SmartShunt, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2003, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro® 8 -bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.  2003 Microchip Technology Inc. DS21424C-page 15 DSTEMP DS21424C-page 16  2003 Microchip Technology Inc. M WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com ASIA/PACIFIC Australia Microchip Technology Australia Pty Ltd Marketing Support Division Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 Japan Microchip Technology Japan K.K. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Atlanta 3780 Mansell Road, Suite 130 Alpharetta, GA 30022 Tel: 770-640-0034 Fax: 770-640-0307 Korea Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5934 China - Beijing Microchip Technology Consulting (Shanghai) Co., Ltd., Beijing Liaison Office Unit 915 Bei Hai Wan Tai Bldg. No. 6 Chaoyangmen Beidajie Beijing, 100027, No. China Tel: 86-10-85282100 Fax: 86-10-85282104 Boston 2 Lan Drive, Suite 120 Westford, MA 01886 Tel: 978-692-3848 Fax: 978-692-3821 Singapore Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850 Chicago 333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075 China - Chengdu Microchip Technology Consulting (Shanghai) Co., Ltd., Chengdu Liaison Office Rm. 2401-2402, 24th Floor, Ming Xing Financial Tower No. 88 TIDU Street Chengdu 610016, China Tel: 86-28-86766200 Fax: 86-28-86766599 Taiwan Microchip Technology (Barbados) Inc., Taiwan Branch 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 Dallas 4570 Westgrove Drive, Suite 160 Addison, TX 75001 Tel: 972-818-7423 Fax: 972-818-2924 Detroit Tri-Atria Office Building 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Tel: 248-538-2250 Fax: 248-538-2260 China - Fuzhou Microchip Technology Consulting (Shanghai) Co., Ltd., Fuzhou Liaison Office Unit 28F, World Trade Plaza No. 71 Wusi Road Fuzhou 350001, China Tel: 86-591-7503506 Fax: 86-591-7503521 EUROPE Austria Microchip Technology Austria GmbH Durisolstrasse 2 A-4600 Wels Austria Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Kokomo 2767 S. Albright Road Kokomo, IN 46902 Tel: 765-864-8360 Fax: 765-864-8387 China - Hong Kong SAR Microchip Technology Hongkong Ltd. Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Los Angeles 18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338 Denmark Microchip Technology Nordic ApS Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45-4420-9895 Fax: 45-4420-9910 China - Shanghai Microchip Technology Consulting (Shanghai) Co., Ltd. Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 Phoenix 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7966 Fax: 480-792-4338 France Microchip Technology SARL Parc d’Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 San Jose Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955 China - Shenzhen Microchip Technology Consulting (Shanghai) Co., Ltd., Shenzhen Liaison Office Rm. 1812, 18/F, Building A, United Plaza No. 5022 Binhe Road, Futian District Shenzhen 518033, China Tel: 86-755-82901380 Fax: 86-755-8295-1393 Toronto 6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 Germany Microchip Technology GmbH Steinheilstrasse 10 D-85737 Ismaning, Germany Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 China - Qingdao Rm. B505A, Fullhope Plaza, No. 12 Hong Kong Central Rd. Qingdao 266071, China Tel: 86-532-5027355 Fax: 86-532-5027205 Italy Microchip Technology SRL Via Quasimodo, 12 20025 Legnano (MI) Milan, Italy Tel: 39-0331-742611 Fax: 39-0331-466781 India Microchip Technology Inc. India Liaison Office Marketing Support Division Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O’Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 United Kingdom Microchip Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44-118-921-5869 Fax: 44-118-921-5820 05/30/03 DS21424C-page 17  2003 Microchip Technology Inc.