TC4432EPA

M Features TC4431/TC4432 Package Type 8-Pin PDIP/SOIC/CERDIP VDD 1 IN 2 LOCK DIS 3 GND 4 8 VDD 1.5A High-Speed 30V MOSFET Drivers • High Peak Output Current – 1.5A • Wide Operating Range - 4.5V to 30V • High Capacitive Load Drive Capability – 1000pF in 25nsec • Short Delay Times – 300mA Reverse Current • ESD Protected – 4kV TC4431 7 OUT 6 OUT 5 GND 7 6 2 Inverting VDD 1 IN 2 LOCK DIS 3 8 VDD TC4432 7 OUT 6 OUT 5 GND Applications • • • GND 4 2 7 6 Noninverting Device Selection Table Part Number TC4431COA TC4431CPA TC4431EJA TC4431EOA TC4431EPA TC4432COA TC4432CPA TC4432EJA TC4432EOA TC4432EPA NOTE: SOIC pinout is identical to DIP. Package 8-Pin SOIC 8-Pin PDIP 8-Pin CERDIP 8-Pin SOIC 8-Pin PDIP 8-Pin SOIC 8-Pin PDIP 8-Pin CERDIP 8-Pin SOIC 8-Pin PDIP Temp. Range 0°C to +70°C 0°C to +70°C -40°C to +85°C -40°C to +85°C -40°C to +85°C 0°C to +70°C 0°C to +70°C -40°C to +85°C -40°C to +85°C -40°C to +85°C General Description The TC4431/TC4432 are 30V CMOS buffer/drivers suitable for use in high-side driver applications. They will not latch up under any conditions within their power and voltage ratings. They can accept, without damage or logic upset, up to 300mA of reverse current (of either polarity) being forced back into their outputs. All terminals are fully protected against up to 4kV of electrostatic discharge. Under-voltage lockout circuitry forces the output to a "low" state when the input supply voltage drops below 7V. For operation in lower voltages, disable the lockout and start-up circuit by grounding pin 3 (LOCK DIS); for all other situations, pin 3 (LOCK DIS) should be left floating. The under-voltage lockout and start-up circuit gives brown out protection when driving MOSFETS.  2002 Microchip Technology Inc. DS21424B-page 1 TC4431/TC4432 Functional Block Diagram 8 VDD 3 LOCK DIS. 2mA Inverted TC4431 UV LOCK 7 6 Non-Inverted TC4432 OUT OUT Input 2 250mV TC4431/TC4432 Inverting/Noninverting GND 4, 5 Effective Input C = 10pF DS21424B-page 2  2002 Microchip Technology Inc. TC4431/TC4432 1.0 ELECTRICAL CHARACTERISTICS *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings* Supply Voltage....................................................... 36V Input Voltage (Note 1)....................VDD + 0.3V to GND Package Power Dissipation (TA ≤ 70°C) PDIP ........................................................ 730mW CERDIP ................................................... 800mW SOIC........................................................ 470mW Package Thermal Resistance CERDIP RθJ-A........................................ 150°C/W CERDIP RθJ-C ......................................... 50°C/W PDIP RθJ-A ............................................. 125°C/W PDIP RθJ-C ............................................... 42°C/W SOIC RθJ-A ............................................ 250°C/W SOIC RθJ-C .............................................. 75°C/W Operating Temperature Range C Version .........................................0°C to +70°C E Version ..................................... -40°C to +85°C Storage Temperature Range ............. -65°C to +150°C TC4431/TC4432 ELECTRICAL SPECIFICATIONS Electrical Characteristics: TA = +25°C, with 4.5V ≤ VDD ≤ 30V, unless otherwise noted.. Symbol Input VIH VIL IIN Output VOH VOL RO IPK IREV High Output Voltage Low Output Voltage Output Resistance Peak Output Current Latch-Up Protection Withstand Reverse Current Rise Time Fall Time Delay Time Delay Time Power Supply Current Start-up Threshold Drop-out Threshold 1: 2: 3: Parameter Min Typ Max Units Test Conditions Logic 1, High Input Voltage Logic 0, Low Input Voltage Input Current (Note 1) 2.4 — -1 VDD – 1.0 — — — — 0.3 — — — VDD – 0.8 — 7 3.0 1.5 — — 0.8 1 — 0.025 10 — — — V V µA 0V ≤ VIN ≤ 12V IOUT = 100mA IOUT = 10mA, VDD = 30V Source: VDD = 30V Sink: VDD = 30V Duty cycle ≤ 2%, t ≤ 300µsec V V Ω A A Switching Time (Note 2) tR tF tD1 tD2 IS VS VDO Note — — — — — — — 7 25 33 62 78 2.5 0.3 8.4 7.7 40 50 80 90 4 0.4 10 — nsec nsec nsec nsec mA V V Figure 3-1 Figure 3-1 Figure 3-1 Figure 3-1 VIN = 3V VIN = 0V Note 3 Power Supply For inputs >12V, add a 1kΩ resistor in series with the input. See “Typical Characteristics” graph for input current. Switching times are ensured by design. For operation below 7V, pin 3 (LOCK DIS) should be tied to ground to disable the lockout and start-up circuit, otherwise, pin 3 must be left floating.  2002 Microchip Technology Inc. DS21424B-page 3 TC4431/TC4432 TC4431/TC4432 ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: Over operating temperature range with 4.5V ≤ VDD ≤ 30V, unless otherwise noted. Symbol Input VIH VIL IIN Output VOH VOL RO tR tF tD1 tD2 IS VS VDO Note 1: 2: 3: Parameter Min Typ Max Units Test Conditions Logic 1, High Input Voltage Logic 0, Low Input Voltage Input Current (Note 1) High Output Voltage Low Output Voltage Output Resistance Rise Time Fall Time Delay Time Delay Time Power Supply Current Start-up Threshold Drop-out Threshold 2.4 — -1 VDD – 1.2 — — — — — — — — — 7 — — — — — — — — — — — — 8.4 7.7 — 0.8 1 — 0.025 10 60 70 100 110 6 0.7 10 — V V µA 0V ≤ VIN ≤ 12V IOUT = 100mA IOUT = 10mA, VDD = 30V Figure 3-1 Figure 3-1 Figure 3-1 Figure 3-1 VIN = 3V VIN = 0V Note 3 V V Ω Switching Time (Note 2) nsec nsec nsec nsec mA V V Power Supply For inputs >12V, add a 1kΩ resistor in series with the input. See “Typical Characteristics” graph for input current. Switching times are ensured by design. For operation below 7V, pin 3 (LOCK DIS) should be tied to ground to disable the lockout and start-up circuit, otherwise, pin 3 must be left floating. DS21424B-page 4  2002 Microchip Technology Inc. TC4431/TC4432 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: Pin No. (8-Pin PDIP, SOIC, CERDIP) 1 2 3 4 5 6 7 8 PIN FUNCTION TABLE Symbol VDD IN LOCK DIS GND GND OUT OUT VDD Ground. Ground. Description  2002 Microchip Technology Inc. DS21424B-page 5 TC4431/TC4432 3.0 APPLICATIONS INFORMATION SWITCHING TIME TEST CIRCUIT +5V Input VDD = 30V 0V VDD Output 7 Input 2 6 0V Output CL = 1000pF +5V LOCK DIS. 3 Input 0V VDD Input: 100kHz, square wave, tRISE = tFALL ≤ 10nsec Output 0V 10% 10% 90% tR 90% tD2 10% 10% 10% 10% tD1 tF 90% tD2 tR 90% 90% FIGURE 3-1: 4.7µF 1, 8 0.1µF Inverting Driver 90% 4, 5 tD1 tF Noninverting Driver DS21424B-page 6  2002 Microchip Technology Inc. TC4431/TC4432 4.0 Note: TYPICAL CHARACTERISTICS The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Supply Current vs. Capacitive Load 60 VDD = 12V 50 40 30 900kHz 20 10 0 100 200 kHz 20kHz 1000 CLOAD (pF) 10,000 600kHz 2MHz 125 100 75 50 25 0 3 6 tRISE tFALL Rise/Fall Time vs. VDD 150 CLOAD = 1000pF TA = +25°C ISUPPLY (mA) Time (nsec) 9 12 15 18 VDD (V) 21 24 27 30 Input Current vs. Input Voltage 50 45 TD1 and TD2 Delay vs. VDD 300 250 TD1 200 150 TD2 CLOAD = 1000pF TA = +25°C INPUT CURRENT (mA) 40 35 30 25 20 15 10 5 0 3 6 9 12 15 18 21 24 INPUT VOLTAGE (VIN) 27 30 WITH 1K RES. WITHOUT 1K RES. TIME (nsec) 100 50 0 3 6 9 12 15 18 VDD (V) 21 24 27 30  2002 Microchip Technology Inc. DS21424B-page 7 TC4431/TC4432 5.0 5.1 PACKAGING INFORMATION Package Dimensions Package marking data not available at this time. 8-Pin Plastic DIP PIN 1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92) .070 (1.78) .040 (1.02) .310 (7.87) .290 (7.37) .040 (1.02) .020 (0.51) .015 (0.38) .008 (0.20) .400 (10.16) .310 (7.87) 3° MIN. .110 (2.79) .090 (2.29) .022 (0.56) .015 (0.38) Dimensions: inches (mm) 8-Pin CDIP (Narrow) .110 (2.79) .090 (2.29) PIN 1 .300 (7.62) .230 (5.84) .055 (1.40) MAX. .400 (10.16) .370 (9.40) .200 (5.08) .160 (4.06) .200 (5.08) .125 (3.18) .020 (0.51) MIN. .320 (8.13) .290 (7.37) .040 (1.02) .020 (0.51) .015 (0.38) .008 (0.20) .400 (10.16) .320 (8.13) .065 (1.65) .020 (0.51) .045 (1.14) .016 (0.41) .150 (3.81) MIN. 3° MIN. Dimensions: inches (mm) DS21424B-page 8  2002 Microchip Technology Inc. TC4431/TC4432 Package Dimensions (Continued) 8-Pin SOIC PIN 1 .157 (3.99) .150 (3.81) .244 (6.20) .228 (5.79) .050 (1.27) TYP. .197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) 8° MAX. . .050 (1.27) .016 (0.40) Dimensions: inches (mm) .010 (0.25) .007 (0.18)  2002 Microchip Technology Inc. DS21424B-page 9 TC4431/TC4432 NOTES: DS21424B-page 10  2002 Microchip Technology Inc. TC4431/TC4432 Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.  2002 Microchip Technology Inc. DS21424B-page11 TC4431/TC4432 NOTES: DS21424B-page12  2002 Microchip Technology Inc. TC4431/TC4432 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.  2002 Microchip Technology Inc. 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