TC552502ECB713

Obsolete Device TC55 1 µA Low Dropout Positive Voltage Regulator Features • Low Dropout Voltage: 120 mV (typ) at 100 mA, 380 mV (typ) at 200 mA • High Output Current: 250 mA (VOUT = 5.0V) • High Accuracy Output Voltage: ±2% (max) (±1% Semi-Custom Version) • Low Power Consumption: 1.1 µA (typ) • Low Temperature Drift: ±100 ppm/°C (typ) • Excellent Line Regulation: 0.2%/V (typ) • Package Options: 3-Pin SOT-23A, 3-Pin SOT-89 and 3-Pin TO-92 • Short-Circuit Protection • Standard Output Voltage Options: 1.2V, 1.8V, 2.5V, 3.0V, 3.3V, 5.0V General Description The TC55 Series is a collection of CMOS low dropout, positive voltage regulators that can source up to 250 mA of current, with an extremely low input-output voltage differential of 380 mV (typ) at 200 mA. The TC55’s low dropout voltage, combined with the low current consumption of only 1.1 µA (typ), makes it ideal for battery operation. The low voltage differential (dropout voltage) extends the battery operating lifetime. It also permits high currents in small packages when operated with minimum VIN – VOUT differentials. The circuit also incorporates short-circuit protection to ensure maximum reliability. Functional Block Diagram VIN VOUT Applications • • • • • Battery-Powered Devices Cameras and Portable Video Equipment Pagers and Cellular Phones Solar Powered Instruments Consumer Products Short-Circuit Protection – + Voltage Reference GND DS21435F-page 1 Package Types 3-Pin SOT-23A VIN 3 TC55 1 GND 2 VOUT TC55 1 2 3 GND VIN VOUT 3-Pin TO-92 123 3-Pin SOT-89 VIN Bottom View GND VIN VOUT Note: 3-Pin SOT-23A is equivalent to the EIAJ SC-59. © 2005 Microchip Technology Inc. TC55 1.0 ELECTRICAL CHARACTERISTICS † Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings† Input Voltage ........................................................+12V Output Current (Continuous) ......... PD/(VIN – VOUT)mA Output Current (peak) ..................................... 500 mA Output Voltage.................. (VSS – 0.3V) to (VIN + 0.3V) Continuous Power Dissipation: 3-Pin SOT-23A ..........................................240 mW 3-Pin SOT-89 ............................................500 mW 3-Pin TO-92...............................................440 mW PIN FUNCTION TABLE Symbol GND VOUT VIN Description Ground Terminal Regulated Voltage Output Unregulated Supply Input TC55RP50: ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise specified, VOUT(S) = 5.0V, TA = +25°C (see Note 1). Parameters Output Voltage Maximum Output Current Load Regulation I/O Voltage Difference Current Consumption Voltage Regulation Input Voltage Temperature Coefficient of Output Voltage Long-Term Stability Note 1: Sym VOUT(A) IOUTMAX ΔVOUT VDIF ISS VOUT(A)•100 ΔVIN•VOUT(S) VIN ΔVOUT(A)•106 VOUT(S)•ΔTA Min — 4.90 250 — — — — — — — — Typ — 5.0 — 40 120 380 1.1 0.2 — ±100 0.5 Max — 5.10 — 80 300 600 3.0 0.3 10 — — Units V mA mV mV µA %/V V Conditions IOUT = 40 mA VIN = 6.0V VIN = 6.0V, VOUT(A) ≥ 4.5V VIN = 6.0V, 1 mA ≤ IOUT ≤ 100 mA IOUT = 100 mA IOUT = 200 mA VIN = 6.0V IOUT = 40 mA, 6.0V ≤ VIN ≤ 10.0V ppm/°C IOUT = 40 mA, -40°C ≤ TA ≤ +85°C % TA = +125°C, 1000 Hours VOUT(S): Preset value of output voltage; VOUT(A): Actual value of output voltage; VDIF: Definition of I/O voltage difference = {VIN1 – VOUT(A)}; VOUT(A): Output voltage when IOUT is fixed and VIN = VOUT(S) + 1.0V; VIN1: Input voltage when the output voltage is 98% VOUT(A). TC55RP40: ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise specified, VOUT(S) = 4.0V, TA = +25°C (see Note 1). Parameters Output Voltage Maximum Output Current Load Regulation I/O Voltage Difference Current Consumption Voltage Regulation Input Voltage Temperature Coefficient of Output Voltage Long-Term Stability Note 1: Sym VOUT(A) IOUTMAX ΔVOUT VDIF ISS VOUT(A)•100 ΔVIN•VOUT(S) VIN ΔVOUT(A)•106 VOUT(S)•ΔTA Min — 3.92 200 — — — — — — — — Typ — 4.0 — 45 170 400 1.0 0.2 — ±100 0.5 Max — 4.08 — 90 330 630 2.9 0.3 10 — — Units V mA mV mV µA %/V V Conditions IOUT = 40 mA VIN = 5.0V VIN = 5.0V, VOUT(A) ≥ 3.6V VIN = 5.0V, 1 mA ≤ IOUT ≤ 100 mA IOUT = 100 mA IOUT = 200 mA VIN = 5.0V IOUT = 40 mA, 5.0V ≤ VIN ≤ 10.0V ppm/°C IOUT = 40 mA, -40°C ≤ TA ≤ +85°C % TA = +125°C, 1000 Hours VOUT(S): Preset value of output voltage; VOUT(A): Actual value of output voltage; VDIF: Definition of I/O voltage difference = {VIN1 – VOUT(A)}; VOUT(A): Output voltage when IOUT is fixed and VIN = VOUT(S) + 1.0V; VIN1: Input voltage when the output voltage is 98% VOUT(A). DS21435F-page 2 © 2005 Microchip Technology Inc. TC55 TC55RP33: ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise specified, VOUT(S) = 3.3V, TA = +25°C (see Note 1). Parameters Output Voltage Maximum Output Current Load Regulation I/O Voltage Difference Current Consumption Voltage Regulation Input Voltage Temperature Coefficient of Output Voltage Long-Term Stability Note 1: Sym VOUT(A) IOUTMAX ΔVOUT VDIF ISS VOUT(A)•100 ΔVIN•VOUT(S) VIN ΔVOUT(A)•106 VOUT(S)•ΔTA Min — 3.23 150 — — — — — — — — Typ — 3.30 — 45 180 400 1.0 0.2 — ±100 0.5 Max — 3.37 — 90 360 700 2.9 0.3 10 — — Units V mA mV mV µA %/V V Conditions IOUT = 40 mA VIN = 4.3V VIN = 4.3V, VOUT(A) ≥ 3.0V VIN = 4.3V, 1 mA ≤ IOUT ≤ 80 mA IOUT = 80 mA IOUT = 160 mA VIN = 4.3V IOUT = 40 mA, 4.3V ≤ IOUT ≤ 10.0V ppm/°C IOUT = 40 mA, -40°C ≤ TA ≤ +85°C % TA = +125°C, 1,000 Hours VOUT(S): Preset value of output voltage; VOUT(A): Actual value of output voltage; VDIF: Definition of I/O voltage difference = {VIN1 – VOUT(A)}; VOUT(A): Output voltage when IOUT is fixed and VIN = VOUT(S) + 1.0V; VIN1: Input voltage when the output voltage is 98% VOUT(A). TC55RP30: ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise specified, VOUT(S) = 3.0V, TA = +25°C (see Note 1). Parameters Output Voltage Maximum Output Current Load Regulation I/O Voltage Difference Current Consumption Voltage Regulation Input Voltage Temperature Coefficient of Output Voltage Long-Term Stability Note 1: Sym VOUT(A) IOUTMAX ΔVOUT VDIF ISS VOUT(A)•100 ΔVIN•VOUT(S) VIN ΔVOUT(A)•106 VOUT(S)•ΔTA Min — 2.94 150 — — — — — — — — Typ — 3.0 — 45 180 400 0.9 0.2 — ±100 0.5 Max — 3.06 — 90 360 700 2.8 0.3 10 — — Units V mA mV mV µA %/V V Conditions IOUT = 40 mA VIN = 4.0V VIN = 4.0V, VOUT(A) ≥ 2.7V VIN = 4.0V, 1 mA ≤ IOUT ≤ 80 mA IOUT = 80 mA IOUT = 160 mA VIN = 4.0V IOUT = 40 mA, 4.0V ≤ VIN ≤ 10.0V ppm/°C IOUT = 40 mA, -40°C ≤ TA ≤ +85°C % TA = +125°C, 1000 Hours VOUT(S): Preset value of output voltage; VOUT(A): Actual value of output voltage; VDIF: Definition of I/O voltage difference = {VIN1 – VOUT(A)}; VOUT(A): Output voltage when IOUT is fixed and VIN = VOUT(S) + 1.0V; VIN1: Input voltage when the output voltage is 98% VOUT(A). © 2005 Microchip Technology Inc. DS21435F-page 3 TC55 TC55RP25: ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise specified, VOUT(S) = 2.5V, TA = +25°C (see Note 1). Parameters Output Voltage Maximum Output Current Load Regulation I/O Voltage Difference Current Consumption Voltage Regulation Input Voltage Temperature Coefficient of Output Voltage Long-Term Stability Note 1: Sym VOUT(A) IOUTMAX ΔVOUT VDIF ISS VOUT(A)•100 ΔVIN•VOUT(S) VIN ΔVOUT(A)•106 VOUT(S)•ΔTA Min — 2.45 125 — — — — — — — Typ — 2.5 — 45 180 400 1.0 0.2 — ±100 0.5 Max — 2.55 — 90 360 700 2.8 0.3 10 — — Units V mA mV mV µA %/V V Conditions IOUT = 40 mA VIN = 3.5V VIN = 3.5V, VOUT(A) ≥ 2.25V VIN = 3.5V, 1 mA ≤ IOUT ≤ 60 mA IOUT = 60 mA IOUT = 120 mA VIN = 3.5V IOUT = 40 mA, 3.5V ≤ IOUT ≤ 10.0V ppm/°C IOUT = 40 mA, -30°C ≤ TA ≤ +80°C % TA = +125°C, 1,000 Hours VOUT(S): Preset value of output voltage; VOUT(A): Actual value of output voltage; VDIF: Definition of I/O voltage difference = {VIN1 – VOUT(A)}; VOUT(A): Output voltage when IOUT is fixed and VIN = VOUT(S) + 1.0V; VIN1: Input voltage when the output voltage is 98% VOUT(A). TC55RP18: ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise specified, VOUT(S) = 1.8V, TA = +25°C (see Note 1). Parameters Output Voltage Maximum Output Current Load Regulation I/O Voltage Difference Current Consumption Voltage Regulation Input Voltage Temperature Coefficient of Output Voltage Long-Term Stability Note 1: Sym VOUT(A) IOUTMAX ΔVOUT VDIF ISS VOUT(A)•100 ΔVIN•VOUT(S) VIN ΔVOUT(A)•106 VOUT(S)•ΔTA Min — 1.764 110 — — — — — — — Typ — 1.8 — — — — — — ±100 0.5 Max — 1.836 — 30 300 3.0 0.25 6.0 — — Units V mA mV mV µA %/V V Conditions IOUT = 0.5 mA VIN = 2.8V VIN = 2.8V, VOUT(A) ≥ 1.62V VIN = 2.8V, 1 mA ≤ IOUT ≤ 30 mA IOUT = 0.5 mA VIN = 2.8V IOUT = 0.5 mA, 2.8V ≤ IOUT ≤ 10.0V ppm/°C IOUT = 0.5 mA, -30°C ≤ TA ≤ +80°C % TA = +125°C, 1,000 Hours VOUT(S): Preset value of output voltage; VOUT(A): Actual value of output voltage; VDIF: Definition of I/O voltage difference = {VIN1 – VOUT(A)}; VOUT(A): Output voltage when IOUT is fixed and VIN = VOUT(S) + 1.0V; VIN1: Input voltage when the output voltage is 98% VOUT(A). DS21435F-page 4 © 2005 Microchip Technology Inc. TC55 TC55RP12: ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise specified, VOUT(S) = 1.2V, TA = +25°C (see Note 1). Parameters Output Voltage Maximum Output Current Load Regulation I/O Voltage Difference Current Consumption Voltage Regulation Input Voltage Temperature Coefficient of Output Voltage Long-Term Stability Note 1: Sym VOUT(A) IOUTMAX ΔVOUT VDIF ISS VOUT(A)•100 ΔVIN•VOUT(S) VIN ΔVOUT(A)•10 6 Min — 1.176 50 — — — — — — — Typ — 1.200 — — — — — — ±100 0.5 Max — 1.224 — 30 300 3.0 0.25 6.0 — — Units V mA mV mV µA %/V V Conditions IOUT = 0.5 mA VIN = 2.2V VIN = 2.2V, VOUT(A) ≥ 1.08V VIN = 2.2V, 1 mA ≤ IOUT ≤ 30 mA IOUT = 0.5 mA VIN = 2.2V IOUT = 0.5 , 2.2V ≤ IOUT ≤ 10.0V ppm/°C IOUT = 0.5 mA, -30°C ≤ TA ≤ +80°C % TA = +125°C, 1,000 Hours VOUT(S)•ΔTA VOUT(S): Preset value of output voltage; VOUT(A): Actual value of output voltage; VDIF: Definition of I/O voltage difference = {VIN1 – VOUT(A)}; VOUT(A): Output voltage when IOUT is fixed and VIN = VOUT(S) + 1.0V; VIN1: Input voltage when the output voltage is 98% VOUT(A). TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise specified, VOUT(S) = 5.0V, TA = +25°C. Parameters Temperature Ranges Specified Temperature Range (E) Storage Temperature Range Package Thermal Resistances Thermal Resistance, 3L-SOT-23A Thermal Resistance, 3L-SOT-89 Thermal Resistance, 3L-TO-92 θJA θJA θJA — — — 359 110 131.9 — — — ºC/W ºC/W ºC/W When mounted on 1 square inch of copper TA TA -40 -65 — — +85 +150 ºC ºC Sym Min Typ Max Units Conditions © 2005 Microchip Technology Inc. DS21435F-page 5 TC55 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Notes: Unless otherwise specified, VOUT(S) = 3.0V, 5.0V, TA = +25°C, CIN = 1 µF Tantalum, COUT = 1 µF Tantalum. 3.1 OUTPUT VOLTAGE VOUT (V) VIN = 4.0V DROPOUT VOLTAGE VDIF (V) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -0.2 3.0 -30°C 80°C 2.9 25°C 25°C 80°C -30°C 2.8 2.7 0 20 40 60 80 100 120 140 160 0 20 40 60 80 100 120 140 160 OUTPUT CURRENT IOUT (mA) OUTPUT CURRENT IOUT (mA) FIGURE 2-1: Output Voltage vs. Output Current (TC55RP3002). 3.2 OUTPUT VOLTAGE VOUT (V) FIGURE 2-4: Dropout Voltage vs. Output Current (TC55RP3002). 3.10 OUTPUT VOLTAGE VOUT (V) TOPR = 25°C 3.08 3.06 3.04 3.02 3.00 2.98 2.96 2.94 2.92 2.90 -40 VIN = 4.0V 3.0 IOUT = 1 mA 2.8 40 mA IOUT = 10 mA 40 mA 2.6 10 mA 2.4 2.2 2.5 3.0 INPUT VOLTAGE VIN (V) 3.5 -20 0 20 40 60 80 100 OPERATING TEMPERATURE (°C) FIGURE 2-2: Output Voltage vs. Input Voltage (TC55RP3002). 3.05 OUTPUT VOLTAGE VOUT (V) FIGURE 2-5: Output Voltage vs. Operating Temperature (TC55RP3002). 1.5 1.4 SUPPLY CURRENT ISS (μA) TOPR = 25°C TOPR = 25°C 3.04 3.03 3.02 3.01 3.00 2.99 2.98 2.97 2.96 2.95 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 IOUT = 1 mA 3 4 5 6 7 8 9 10 3 4 INPUT VOLTAGE VIN (V) 5 6 7 8 9 INPUT VOLTAGE VIN (V) 10 FIGURE 2-3: Output Voltage vs. Input Voltage (TC55RP3002). FIGURE 2-6: Supply Current vs. Input Voltage (TC55RP3002). DS21435F-page 6 © 2005 Microchip Technology Inc. TC55 Note: Unless otherwise indicated, VOUT(S) = 3.0V, 5.0V, TA = +25°C, CIN = 1 µF Tantalum, COUT = 1 µF Tantalum. 1.5 1.4 SUPPLY CURRENT ISS (μA) VIN = 4.0V OUTPUT VOLTAGE VOUT (V) 5.2 5.0 TOPR = 25°C 1.8 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 IOUT = 1 mA 4.8 40 mA 4.6 10 mA 4.4 4.2 -40 -20 0 20 40 60 80 100 4.5 5.0 INPUT VOLTAGE VIN (V) 5.5 OPERATING TEMPERATURE (°C) FIGURE 2-7: Supply Current vs. Operating Temperature (TC55RP3002). 5 OUTPUT VOLTAGE VOUT (V) FIGURE 2-10: Output Voltage vs. Input Voltage (TC55RP5002). 5.05 OUTPUT CURRENT IOUT (mA) OUTPUT VOLTAGE VOUT (V) TOPR = 25°C 200 160 Output Voltage 5.04 5.03 5.02 5.01 5.00 4.99 4.98 4.97 4.98 4.95 IOUT = 1 mA 4 3 120 2 80 Output Current 40 mA 1 mA TIME (2 msec/div) 1 0 40 0 5 6 7 8 9 10 INPUT VOLTAGE VIN (V) FIGURE 2-8: (TC55RP3002). 5.1 OUTPUT VOLTAGE VOUT (V) Load Transient Response FIGURE 2-11: Output Voltage vs. Input Voltage (TC55RP5002). 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -0.2 VIN = 6.0V DROPOUT VOLTAGE VDIF (V) 5.0 -30°C 80°C 4.9 25°C 25°C 80°C -30°C 0 40 80 120 160 200 4.8 4.7 0 40 80 120 160 200 OUTPUT CURRENT IOUT (mA) OUTPUT CURRENT IOUT (mA) FIGURE 2-9: Output Voltage vs. Output Current (TC55RP5002). FIGURE 2-12: Dropout Voltage vs. Output Current (TC55RP5002). © 2005 Microchip Technology Inc. DS21435F-page 7 TC55 Note: Unless otherwise indicated, VOUT(S) = 3.0V, 5.0V, TA = +25°C, CIN = 1 µF Tantalum, COUT = 1 µF Tantalum. VIN = 6.0V 5.10 OUTPUT VOLTAGE VOUT (V) 8.0 INPUT VOLTAGE VOUT (V) 5.08 5.06 5.04 5.02 5.00 4.98 4.96 4.94 4.92 4.90 -40 7.0 6.5 6.0 5.5 5.0 4.5 IOUT = 10 mA 40 mA Output Voltage 5.0 -20 0 20 40 60 80 100 4.0 OPERATING TEMPERATURE (°C) -1 0 1 TIME (msec) 2 3 FIGURE 2-13: Output Voltage vs. Operating Temperature (TC55RP5002). 2.0 1.9 SUPPLY CURRENT ISS (μA) FIGURE 2-16: Input Transient Response, 1 mA (TC55RP5002). 8.0 INPUT VOLTAGE VOUT (V) TOPR = 25°C 7.5 7.0 6.5 6.0 5.5 5.0 4.5 1.8 1.7 1.6 1.4 1.3 1.2 1.1 1.0 0.5 Output Voltage 5 7 8 9 6 INPUT VOLTAGE VIN (V) 10 4.0 -1 0 1 TIME (msec) 2 3 FIGURE 2-14: Supply Current vs. Input Voltage (TC55RP5002). 2.0 1.9 SUPPLY CURRENT ISS (μA) FIGURE 2-17: Input Transient Response, 10 mA (TC55RP5002). 7 OUTPUT VOLTAGE VOUT (V) VIN = 6.0V 200 160 Output Voltage OUTPUT CURRENT IOUT (mA) 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1.0 6 5 120 4 80 Output Current 40 mA 1 mA TIME (2 msec/div) 3 2 40 0 -40 -20 0 20 40 60 80 100 OPERATING TEMPERATURE (°C) FIGURE 2-15: Supply Current vs. Operating Temperature (TC55RP5002). FIGURE 2-18: (TC55RP5002). Load Transient Response DS21435F-page 8 © 2005 Microchip Technology Inc. OUTPUT VOLTAGE VOUT (V) IOUT = 10 mA Input Voltage OUTPUT VOLTAGE VIN (V) 7.5 IOUT = 1 mA Input Voltage TC55 3.0 PIN DESCRIPTIONS 4.0 DETAILED DESCRIPTION The descriptions of the pins are listed in Table 3-1. The TC55 is a low quiescent current, precision, fixedoutput voltage LDO. Unlike bipolar regulators, the TC55 supply current does not increase proportionally with load current. TABLE 3-1: Pin No. 1 2 3 PIN FUNCTION TABLE Description Ground Terminal Regulated Voltage Output Unregulated Supply Input GND VOUT VIN Symbol 4.1 Output Capacitor 3.1 Ground Terminal (GND) Regulator ground. Tie GND to the negative side of the output and the negative side of the input capacitor. Only the LDO bias current (1 µA typical) flows out of this pin, there is no high current. The LDO output regulation is referenced to this pin. Minimize voltage drops between this pin and the minus side of the load. A minimum of 1 µF output capacitor is required. The output capacitor should have an effective series resistance (esr) greater than 0.1Ω and less than 5Ω, plus a resonant frequency above 1 MHz. Larger output capacitors can be used to improve supply noise rejection and transient response. Care should be taken when increasing COUT to ensure that the input impedance is not high enough to cause high input impedance oscillation. 4.2 Input Capacitor 3.2 Regulated Voltage Output (VOUT) Connect VOUT to the positive side of the load and the positive terminal of the output capacitor. The positive side of the output capacitor should be physically located as close to the LDO VOUT pin as is practical. The current flowing out of this pin is equal to the DC load current. A 1 µF input capacitor is recommended for most applications when the input impedance is on the order of 10Ω. Larger input capacitance may be required for stability when operating off of a battery input, or if there is a large distance from the input source to the LDO. When large values of output capacitance are used, the input capacitance should be increased to prevent high source impedance oscillations. 3.3 Unregulated Supply Input (VIN) Connect the input supply voltage and the positive side of the input capacitor to VIN. The input capacitor should be physically located as close as is practical to VIN. The current flow into this pin is equal to the DC load current, plus the LDO bias current (1 µA typical.) © 2005 Microchip Technology Inc. DS21435F-page 9 TC55 5.0 5.1 THERMAL CONSIDERATIONS Power Dissipation EQUATION PD = (VINMAX – VOUTMIN) x IOUTMAX Given: VIN IOUT = 3.3V to 4.1V = 1 mA to 100 mA VOUT = 3.0 V ± 2% TAMAX = 55°C PMAX = (4.1V – (3.0V x 0.98)) x 100 mA PMAX = 116.0 milliwatts To determine the junction temperature of the device, the thermal resistance from junction-to-ambient must be known. The 3-pin SOT-23 thermal resistance from junction-to-air (RθJA) is estimated to be approximately 359°C/W. The SOT-89 RθJA is estimated to be approximately 110°C/W when mounted on 1 square inch of copper. The TO-92 RθJA is estimated to be 131.9°C/W. The RθJA will vary with physical layout, airflow and other application-specific conditions. The device junction temperature is determined by calculating the junction temperature rise above ambient, then adding the rise to the ambient temperature. The amount of power dissipated internal to the low dropout linear regulator is the sum of the power dissipation within the linear pass device (P-Channel MOSFET) and the quiescent current required to bias the internal reference and error amplifier. The internal linear pass device power dissipation is calculated by multiplying the voltage across the linear device by the current through the device. EQUATION PD (Pass Device) = (VIN – VOUT) x IOUT The internal power dissipation, as a result of the bias current for the LDO internal reference and error amplifier, is calculated by multiplying the ground or quiescent current by the input voltage. EQUATION PD (Bias) = VIN x IGND The total internal power dissipation is the sum of PD (Pass Device) and PD (Bias). EQUATION PTOTAL = PD (Pass Device) + PD (Bias) For the TC55, the internal quiescent bias current is so low (1 µA typical) that the PD (Bias) term of the power dissipation equation can be ignored. The maximum power dissipation can be estimated by using the maximum input voltage and the minimum output voltage to obtain a maximum voltage differential between input and output. The next step would be to multiply the maximum voltage differential by the maximum output current. EQUATION Junction Temperature SOT-23 Example: TJ = PDMAX x RθJA + TA TJ = 116.0 milliwatts x 359°C/W + 55°C TJ = 96.6°C SOT-89 Example: TJ = 116.0 milliwatts x 110°C/W + 55°C TJ = 67.8°C TO-92 Example: TJ = 116.0 milliwatts x 131.9°C/W + 55°C TJ = 70.3°C DS21435F-page 10 © 2005 Microchip Technology Inc. TC55 6.0 6.1 PACKAGING INFORMATION Package Marking Information 3-Pin SOT-23A 3-Pin SOT-89 3-Pin TO-92 2 1 2 3 4 1 4 1234 5678 9 10 11 12 3 1 represents first voltage digit 2V, 3V, 4V, 5V, 6V Ex: 3.xV = 3 1, 2, 3 & 4 = 55RP (fixed) 5 represents first voltage digit (2-6) represents first voltage decimal (0-9) represents extra feature code: fixed: 0 represents regulation accuracy 1 = ±1.0% (custom), 2 = ±2.0% (standard) represents assembly lot number 2 represents first decimal place voltage (x.0 - x.9) 6 Ex: 3.4V = Symbol A B C D E 3 3 E Voltage x.0 x.1 x.2 x.3 x.4 Symbol F H K L M Voltage x.5 x.6 x.7 x.8 x.9 7 8 9 , 10, 11 & 12 represents polarity 0 = Positive (fixed) represents assembly lot number 4 © 2005 Microchip Technology Inc. DS21435F-page 11 TC55 3-Lead Plastic Small Outline Transistor (CB) (SOT23) E E1 2 B n p p1 D 1 α c A A2 φ β L A1 Units Dimension Limits n Number of Pins p Pitch p1 Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D L φ c B α β MIN INCHES* NOM 3 .038 .076 .040 .037 .002 .093 .051 .115 .018 5 .006 .017 5 5 MAX MIN .035 .035 .000 .083 .047 .110 .014 0 .004 .015 0 0 .044 .040 .004 .104 .055 .120 .022 10 .007 .020 10 10 MILLIMETERS NOM 3 0.96 1.92 0.89 1.01 0.88 0.95 0.01 0.06 2.10 2.37 1.20 1.30 2.80 2.92 0.35 0.45 0 5 0.09 0.14 0.37 0.44 0 5 0 5 MAX 1.12 1.02 0.10 2.64 1.40 3.04 0.55 10 0.18 0.51 10 10 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: TO-236 Drawing No. C04-104 DS21435F-page 12 © 2005 Microchip Technology Inc. TC55 3-Lead Plastic Small Outline Transistor (MB) (SOT89) H E B1 3 B D D1 2 p p1 1 B1 L E1 A C Pitch Outside lead pitch (basic) Overall Height Overall Width Molded Package Width at Base Molded Package Width at Top Overall Length Tab Length Foot Length Lead Thickness Lead 2 Width Leads 1 & 3 Width Units Dimension Limits p p1 A H E E1 D D1 L c B B1 INCHES MIN MAX .059 BSC .118 BSC .055 .063 .155 .167 .090 .102 .084 .090 .173 .181 .064 .072 .035 .047 .014 .017 .017 .022 .014 .019 MILLIMETERS* MIN MAX 1.50 BSC 3.00 BSC 1.40 1.60 3.94 4.25 2.29 2.60 2.13 2.29 4.40 4.60 1.62 1.83 0.89 1.20 0.35 0.44 0.44 0.56 0.36 0.48 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEDEC Equivalent: TO-243 Drawing No. C04-29 © 2005 Microchip Technology Inc. DS21435F-page 13 TC55 3-Lead Plastic Transistor Outline (ZB) (TO-92) E1 D 1 n L 1 2 3 B p c α A R β INCHES* NOM MILLIMETERS NOM 3 1.27 3.30 3.62 4.45 4.71 4.32 4.64 2.16 2.29 12.70 14.10 0.36 0.43 0.41 0.48 4 5 2 3 Number of Pins 3 Pitch .050 Bottom to Package Flat A .130 .143 .155 Overall Width E1 .175 .186 .195 Overall Length D .170 .183 .195 Molded Package Radius R .085 .090 .095 Tip to Seating Plane L .500 .555 .610 c Lead Thickness .014 .017 .020 Lead Width B .016 .019 .022 α 4 5 6 Mold Draft Angle Top β Mold Draft Angle Bottom 2 3 4 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: TO-92 Drawing No. C04-101 Units Dimension Limits n p MIN MAX MIN MAX 3.94 4.95 4.95 2.41 15.49 0.51 0.56 6 4 DS21435F-page 14 © 2005 Microchip Technology Inc. TC55 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device XX X X X XX XX Examples: a) TC55RP1802ECB713: 1.8V LDO Positive Voltage Regulator, 2% Tolerance SOT23-A-3 package. TC55RP2502EMB713: 1.8V LDO Positive Voltage Regulator, 2% Tolerance. SOT89-3 package. TC55RP2502ECB713: 2.5V LDO Positive Voltage Regulator, 2% Tolerance. SOT23-A-3 package. TC55RP3002ECB713: 3.0V LDO Positive Voltage Regulator, 2% Tolerance. SOT23-A-3 package. TC55RP3002EMB713: 3.0V LDO Positive Voltage Regulator, 2% Tolerance. SOT89-3 package. TC55RP3302ECB713: 3.3V LDO Positive Voltage Regulator, 2% Tolerance. SOT23-A-3 package. TC55RP3302EMB713: 3.3V LDO Positive Voltage Regulator, 2% Tolerance. SOT89-3 package. TC55RP5002ECB713: 5.0V LDO Positive Voltage Regulator, 2% Tolerance. SOT23-A-3 package. TC55RP5002EMB713: 5.0V LDO Positive Voltage Regulator, 2% Tolerance. SOT89-3 package. Output Feature Tolerance Temp. Package Taping Voltage Code Direction b) Device: TC55: 1 µA Low Dropout Positive Voltage Regulator Output Voltage: 12 18 25 30 33 50 = = = = = = 1.2V "Standard" 1.8V "Standard" 2.5V "Standard" 3.0V "Standard" 3.3V "Standard" 5.0V "Standard" c) d) e) Extra Feature Code: 0 = Fixed Tolerance: 1 2 = 1.0% (Custom) = 2.0% (Standard) = -40°C to +85°C f) Temperature: E g) Package Type: CB = 3-Pin SOT-23A (equivalent to EIAJ SC-59) MB = 3-Pin SOT-89 ZB = 3-Pin TO-92 h) Taping Direction: TR = Standard 713 = Standard i) Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. © 2005 Microchip Technology Inc. DS21435F-page 15 TC55 NOTES: DS21435F-page 16 © 2005 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • • Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” • • • Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2005 Microchip Technology Inc. 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