CC1A-T1A

CC1A-T1A AT Crystal 8 MHz – 30 MHz DIMENSIONS Package: Recommended Solder Pad: 8,0 1,2 2,7 1,2 2,3 4,0 2,3 3,7 max.1,75 100% leadfree, RoHS - compliant Small SMT ceramic package Package height 1.75 mm Fundamental mode frequencies SMD-package in Tape and Reel Ind. and Ext. temperature ranges High stability Low aging High shock and vibration resistance DESCRIPTION: All dimensions in mm typical This SMD ceramic package has been specially designed for small industrial, telecom and electronic applications. All frequencies are generated in fundamental mode. The crystals are supplied in special trays (100 crystals per tray). For pick-and-place equipment, the parts are available in 16 mm tapes: 7” (178 mm) reel with 1’000 crystals 10” (254 mm) reel with 2’000 crystals 13” (330 mm) reel with 4’000 crystals ELECTRICAL CHARACTERISTICS AT 25oC: Frequency Range Load capacitance Frequency tolerance at 25°C Frequency versus temperature –40°C to +85°C Drive level max. Insulation resistance min. Aging first year max. 1) 2) FL CL ΔF/F ΔF/F0 P Ri ΔF/F 8–30 20.0 +/-50 +/-50 500 500 +/-3 4,2 MHz pF ppm ppm μW MΩ ppm Frequency Example Series resistance typ./max. Motional capacitance typ. Static capacitance typ. 3) FL RS C1 C0 10.000 35 / 75 5.2 2.2 16.384 20 / 50 7.2 2.8 24.000 20 / 50 11.5 3.6 MHz Ω fF pF 1) Other load capacitances on request. 2) Tighter and wider frequency tolerances on request. 3) Values for other frequencies consult factory. Version 4.1/07.2007 STANDARD FREQUENCIES: 8.0000 14.3181 10.0000 16.0000 Frequency MHz 10.1506 16.3840 11.0592 20.0000 12.0000 24.0000 Other frequencies between 8 MHz and 30 MHz on request ENVIRONMENTAL CHARACTERISTICS: Storage temp. range Industrial operating temp. range Extended operating temp. range Shock resistance Vibration resistance ΔF/F ΔF/F Conditions –55 to +125°C –40 to +85°C –55 to +125°C 5000 g, 0.3 ms, ½ sine 20 g / 10–2000 Hz Max. Dev. +/-5 ppm +/-5 ppm TERMINATIONS AND PROCESSING: Type CC1A-T1A Termination For SMD mounting Au flashed pads For SMD mounting Sn/Ag/Cu plated Processing Reflow soldering 260°C / 20 s max. Reflow soldering 260°C / 20 s max. CC1A-T3A PART NUMBER/ ORDERING INFORMATION EXAMPLE: Crystal package C = Crystal in ceramic package Package lid C = Ceramic lid CC 1 A-T 1 A 24.000 MHz 20.0 pF +/-50 ppm Frequency tolerance Load capacitance CL Frequency FL Package pad form A = Pads on both ends Pad plating 1 = Au flashed pads 3 = Sn/Ag/Cu plated Package type T = For SMD mounting 07.07 Package size 1 = 8.0 x 3.7 x 1.75 mm Blank A = AT All specifications subject to change without notice. Micro Crystal Div. of ETA SA Mühlestrasse 14 CH-2540 Grenchen Switzerland Tel. +41 32 655 82 82 Fax +41 32 655 82 83 sales@microcrystal.ch www.microcrystal.com Version 4.1/07.2007