64Mb: 3V Embedded Parallel NOR Flash
Features
Parallel NOR Flash Embedded Memory
M29W640FT, M29W640FB
Features
• UNLOCK BYPASS PROGRAM command
– Faster production/batch programming
• VPP/WP# pin for fast program and write protect
• Temporary block unprotection mode
• Common Flash interface
– 64-bit security code
• Extended memory block
– Extra block used as security block or to store additional information
• Low power consumption
– Standby and automatic standby
• 100,000 PROGRAM/ERASE cycles per block
• Electronic signature
– Manufacturer code: 0020h
– Device code M29W640FT: 22EDh
– Device code M29W640FB: 22FDh
• RoHS-compliant packages
– 48-pin TSOP (N) 12mm x 20mm
– 48-ball TFBGA (ZA) 6mm x 8mm
• Supply voltage
– VCC = 2.7–3.6V (program, erase, read)
– VPP = 12V for fast program (optional)
• Asynchronous random/page read
– Page width: 4 words
– Page access: 25ns
– Random access: 60ns, 70ns
• Program time
– 10µs per byte/word TYP
– 4 words/8 bytes program
• Memory organization
– 135 memory blocks
– 1 boot block and 7 parameter blocks, 8KB each
(top or bottom)
– 127 main blocks, 64KB each
• Program/erase controller
– Embedded byte/word program algorithms
• Program/erase suspend and resume
– Read from any block during a PROGRAM SUSPEND operation
– Read or program another block during an ERASE
SUSPEND operation
Part Numbering Information
Available with extended memory block prelocked by Micron. Devices are shipped from the factory with memory
content bits erased to 1. For available options, such as packages or speed, or for further information, contact your
Micron sales representative. Part numbers can be verified at www.micron.com. Feature and specification comparison by device type is available at www.micron.com/products. Contact the factory for devices not found.
Table 1: Part Number Information
Part Number
Category
Category Details
Device Type
M29 = Parallel Flash memory
Operating Voltage
W = VCC = 2.7 to 3.6V
Device Function
640F = 64Mb (x8/x16) boot block
Array Matrix
T = Top boot
B = Bottom boot
Speed
60 = 60ns
70 = 70ns
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
64Mb: 3V Embedded Parallel NOR Flash
Features
Table 1: Part Number Information (Continued)
Part Number
Category
Package
Category Details
N = 48-pin TSOP: 12mm x 20mm
ZA = 48-ball TFBGA, 6mm x 8mm, 0.80mm pitch
Temperature Range
6 = –40°C to 85°C
Shipping Options
E = RoHS-compliant package, standard packing
F = RoHS-compliant package, tape and reel packing
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Features
Contents
Important Notes and Warnings ......................................................................................................................... 7
General Description ......................................................................................................................................... 8
Signal Assignments ......................................................................................................................................... 10
Signal Descriptions ......................................................................................................................................... 12
Memory Organization .................................................................................................................................... 15
Memory Configuration ............................................................................................................................... 15
x8 Memory Map – 64Mb Density ................................................................................................................. 15
x16 Memory Map – 64Mb Density ............................................................................................................... 17
Bus Operations ............................................................................................................................................... 18
Read .......................................................................................................................................................... 18
Write .......................................................................................................................................................... 18
Standby and Automatic Standby ................................................................................................................. 18
Output Disable ........................................................................................................................................... 19
Status Register ................................................................................................................................................ 20
Data Polling Bit (DQ7) ................................................................................................................................ 20
Toggle Bit (DQ6) ......................................................................................................................................... 20
Error Bit (DQ5) ........................................................................................................................................... 20
Erase Timer Bit (DQ3) ................................................................................................................................. 21
Alternative Toggle Bit (DQ2) ........................................................................................................................ 21
READ Operations ........................................................................................................................................... 23
READ/RESET Command ............................................................................................................................ 23
READ CFI Command .................................................................................................................................. 24
AUTO SELECT Operations .............................................................................................................................. 25
AUTO SELECT Command ........................................................................................................................... 25
Command Interface ....................................................................................................................................... 27
READ/RESET Command ............................................................................................................................ 27
AUTO SELECT Command ........................................................................................................................... 27
READ CFI QUERY Command ...................................................................................................................... 27
PROGRAM Command ................................................................................................................................ 28
PROGRAM SUSPEND Command ................................................................................................................ 28
PROGRAM RESUME Command .................................................................................................................. 29
Fast Program Commands ............................................................................................................................ 29
DOUBLE BYTE PROGRAM Command ......................................................................................................... 29
QUADRUPLE BYTE PROGRAM Command .................................................................................................. 29
OCTUPLE BYTE PROGRAM Command ....................................................................................................... 29
DOUBLE WORD PROGRAM Command ....................................................................................................... 30
QUADRUPLE WORD PROGRAM Command ................................................................................................ 30
UNLOCK BYPASS Command ...................................................................................................................... 31
UNLOCK BYPASS PROGRAM Command ..................................................................................................... 31
UNLOCK BYPASS RESET Command ............................................................................................................ 31
CHIP ERASE Command .............................................................................................................................. 31
BLOCK ERASE Command ........................................................................................................................... 32
ERASE SUSPEND Command ....................................................................................................................... 32
ERASE RESUME Command ........................................................................................................................ 33
ENTER EXTENDED BLOCK Command ....................................................................................................... 33
EXIT EXTENDED BLOCK Command ........................................................................................................... 33
BLOCK PROTECT and CHIP UNPROTECT Commands ................................................................................ 33
BLOCK PROTECT Command ...................................................................................................................... 33
Programmer Technique .............................................................................................................................. 34
In-System Technique .................................................................................................................................. 37
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Features
Common Flash Interface ................................................................................................................................
Absolute Ratings and Operating Conditions .....................................................................................................
DC Characteristics ..........................................................................................................................................
Read AC Characteristics ..................................................................................................................................
Write AC Characteristics .................................................................................................................................
Program/Erase Characteristics ........................................................................................................................
Reset Characteristics ......................................................................................................................................
Package Dimensions .......................................................................................................................................
Revision History .............................................................................................................................................
Rev. C – 2/18 ...............................................................................................................................................
Rev. B – 01/16 .............................................................................................................................................
Rev. A – 07/13 .............................................................................................................................................
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
4
42
46
48
49
52
56
57
58
60
60
60
60
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Features
List of Figures
Figure 1: Logic Diagram ................................................................................................................................... 9
Figure 2: 48-Pin TSOP Pinout ......................................................................................................................... 10
Figure 3: 48-Ball TFBGA Ballout ..................................................................................................................... 11
Figure 4: Data Polling Flowchart .................................................................................................................... 22
Figure 5: Data Toggle Flowchart ..................................................................................................................... 23
Figure 6: Programmer Equipment Block Protect Flowchart ............................................................................. 35
Figure 7: Programmer Equipment Chip Unprotect Flowchart .......................................................................... 36
Figure 8: In-System Equipment Block Protect Flowchart ................................................................................. 38
Figure 9: In-System Equipment Chip Protect Flowchart .................................................................................. 39
Figure 10: AC Measurement Load Circuit ....................................................................................................... 47
Figure 11: AC Measurement I/O Waveform ..................................................................................................... 47
Figure 12: Random AC Timing ....................................................................................................................... 50
Figure 13: Page Read AC Timing ..................................................................................................................... 51
Figure 14: WE#-Controlled AC Timing ............................................................................................................ 53
Figure 15: CE#-Controlled AC Timing ............................................................................................................. 55
Figure 16: Reset/block Temporary Unprotect AC Waveforms ........................................................................... 57
Figure 17: Accelerated Program Timing Waveforms ........................................................................................ 57
Figure 18: 48-Pin TSOP – 12mm x 20mm ........................................................................................................ 58
Figure 19: 48-Ball TFBGA – 6mm x 8mm ......................................................................................................... 59
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Features
List of Tables
Table 1: Part Number Information ................................................................................................................... 1
Table 2: Signal Names ...................................................................................................................................... 9
Table 3: Signal Descriptions ........................................................................................................................... 12
Table 4: Hardware Protection ......................................................................................................................... 14
Table 5: x8 Top Boot – Blocks [134:0] .............................................................................................................. 15
Table 6: x8 Bottom Boot – Blocks [134:0] ......................................................................................................... 15
Table 7: x16 Top Boot – Blocks [134:0] ............................................................................................................. 17
Table 8: x16 Bottom Boot – Blocks [134:0] ....................................................................................................... 17
Table 9: Bus Operations ................................................................................................................................. 18
Table 10: Status Register Bits .......................................................................................................................... 21
Table 11: Read Electronic Signature ............................................................................................................... 25
Table 12: Block Protection ............................................................................................................................. 26
Table 13: Programmer Technique Bus Operations ........................................................................................... 37
Table 14: Commands – 16-Bit Mode (BYTE# = V IH) .......................................................................................... 40
Table 15: Commands – 8-Bit Mode (BYTE# = V IL) ............................................................................................ 41
Table 16: Query Structure Overview ............................................................................................................... 42
Table 17: CFI Query Identification String ........................................................................................................ 42
Table 18: CFI Query System Interface Information .......................................................................................... 43
Table 19: Device Geometry Definition ............................................................................................................ 43
Table 20: Primary Algorithm-Specific Extended Query Table ........................................................................... 44
Table 21: Security Code Area .......................................................................................................................... 45
Table 22: Absolute Maximum/Minimum Ratings ............................................................................................ 46
Table 23: Operating Conditions ...................................................................................................................... 46
Table 24: Input/Output Capacitance .............................................................................................................. 47
Table 25: DC Current Characteristics .............................................................................................................. 48
Table 26: DC Voltage Characteristics .............................................................................................................. 48
Table 27: Read AC Characteristics .................................................................................................................. 49
Table 28: WE#-Controlled Write AC Characteristics ......................................................................................... 52
Table 29: CE#-Controlled Write AC Characteristics ......................................................................................... 54
Table 30: Program/Erase Times and Endurance Cycles ................................................................................... 56
Table 31: Reset/Block Temporary Unprotect AC Characteristics ...................................................................... 57
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
6
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Important Notes and Warnings
Important Notes and Warnings
Micron Technology, Inc. ("Micron") reserves the right to make changes to information published in this document,
including without limitation specifications and product descriptions. This document supersedes and replaces all
information supplied prior to the publication hereof. You may not rely on any information set forth in this document if you obtain the product described herein from any unauthorized distributor or other source not authorized
by Micron.
Automotive Applications. Products are not designed or intended for use in automotive applications unless specifically designated by Micron as automotive-grade by their respective data sheets. Distributor and customer/distributor shall assume the sole risk and liability for and shall indemnify and hold Micron harmless against all claims,
costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of
product liability, personal injury, death, or property damage resulting directly or indirectly from any use of nonautomotive-grade products in automotive applications. Customer/distributor shall ensure that the terms and conditions of sale between customer/distributor and any customer of distributor/customer (1) state that Micron
products are not designed or intended for use in automotive applications unless specifically designated by Micron
as automotive-grade by their respective data sheets and (2) require such customer of distributor/customer to indemnify and hold Micron harmless against all claims, costs, damages, and expenses and reasonable attorneys'
fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damage
resulting from any use of non-automotive-grade products in automotive applications.
Critical Applications. Products are not authorized for use in applications in which failure of the Micron component could result, directly or indirectly in death, personal injury, or severe property or environmental damage
("Critical Applications"). Customer must protect against death, personal injury, and severe property and environmental damage by incorporating safety design measures into customer's applications to ensure that failure of the
Micron component will not result in such harms. Should customer or distributor purchase, use, or sell any Micron
component for any critical application, customer and distributor shall indemnify and hold harmless Micron and
its subsidiaries, subcontractors, and affiliates and the directors, officers, and employees of each against all claims,
costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of
product liability, personal injury, or death arising in any way out of such critical application, whether or not Micron or its subsidiaries, subcontractors, or affiliates were negligent in the design, manufacture, or warning of the
Micron product.
Customer Responsibility. Customers are responsible for the design, manufacture, and operation of their systems,
applications, and products using Micron products. ALL SEMICONDUCTOR PRODUCTS HAVE INHERENT FAILURE RATES AND LIMITED USEFUL LIVES. IT IS THE CUSTOMER'S SOLE RESPONSIBILITY TO DETERMINE
WHETHER THE MICRON PRODUCT IS SUITABLE AND FIT FOR THE CUSTOMER'S SYSTEM, APPLICATION, OR
PRODUCT. Customers must ensure that adequate design, manufacturing, and operating safeguards are included
in customer's applications and products to eliminate the risk that personal injury, death, or severe property or environmental damages will result from failure of any semiconductor component.
Limited Warranty. In no event shall Micron be liable for any indirect, incidental, punitive, special or consequential
damages (including without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such damages are based on tort, warranty,
breach of contract or other legal theory, unless explicitly stated in a written agreement executed by Micron's duly
authorized representative.
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
7
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
General Description
General Description
The M29W640F is a 64Mb (8Mb x8 or 4Mb x16) nonvolatile memory that can be read,
erased, and reprogrammed. These operations can be performed using a single low voltage (2.7–3.6V) supply. On power-up, the memory defaults to read mode.
The memory is divided into blocks that can be erased independently so that valid data
can be preserved while old data is erased. Blocks can be protected in units of 256KB
(typically, groups of four 64KB blocks), to prevent accidental PROGRAM or ERASE commands from modifying the memory. PROGRAM and ERASE commands are written to
the command interface. An on-chip program/erase controller simplifies the process of
programming or erasing the memory by taking care of all of the special operations that
are required to update the memory contents. The end of a PROGRAM or ERASE operation can be detected and any error conditions identified. The command set required to
control the memory is consistent with JEDEC standards.
The device features an asymmetrical blocked architecture. The device has an array of
135 blocks: 8 parameters blocks of 8KB each (or 4 K words each) and 127 main blocks of
64KB each (or 32K words each)
M29W640FT contains the parameter blocks at the top of the memory address space.
The M29W640FB contains the parameter blocks starting from the bottom.
The M29W640F has an extra block, the extended block, of 128 words in x16 mode, or of
256 bytes in x8 mode, that can be accessed using a dedicated command. The extended
block can be protected. It is useful for storing security information. However, the protection is not reversible. Once protected, the protection cannot be undone.
CE#, OE#, and WE# signals control the bus operation of the memory. They enable simple connection to most microprocessors, often without additional logic.
VPP/WP enables faster programming of the device, enabling multiple word/byte programming. If this signal is held at V SS, the boot block and its adjacent parameter block
are protected from PROGRAM and ERASE operations.
The device supports asynchronous random read and page read from all blocks of the
memory array.
In order to meet environmental requirements, Micron offers the M29W640FT and the
M29W640FB in RoHS packages (lead-free). The category of second-level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC-Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the
inner box label.
The memory is delivered with all the bits erased (set to 1).
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
8
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
General Description
Figure 1: Logic Diagram
VCC
VPP/WP#
15
22
DQ[14:0]
A[21:0]
DQ15/A-1
WE#
CE#
BYTE#
OE#
RY/BY#
RST#
VSS
Table 2: Signal Names
Name
Type
Description
A[21:0]
Input
Address inputs
CE#
Input
Chip enable
OE#
Input
Output enable
WE#
Input
Write enable
RST#
Input
Reset/block temporary unprotect
RY/BY#
Input
Ready/busy
BYTE#
Input
Byte/word organization select
DQ[7:0]
I/O
Data input/outputs
DQ[14:8]
I/O
Data input/outputs
DQ15A-1 (or DQ15)
I/O
Data input/output or address input (or data I/O)
VCC
Supply voltage
Supply voltage
VPP/WP#
Supply voltage
Supply voltage for FAST PROGRAM (optional) or WRITE
PROTECT operations
VSS
–
Ground
NC
–
Not connected internally
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
9
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Signal Assignments
Signal Assignments
Figure 2: 48-Pin TSOP Pinout
A15
A14
A13
A12
A11
A10
A9
A8
A19
A20
WE#
RST#
A21
VPP/WP#
RY/BY#
A18
A17
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Note:
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A16
BYTE#
VSS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
OE#
VSS
CE#
A0
1. RFU = reserved for future use.
10
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Signal Assignments
Figure 3: 48-Ball TFBGA Ballout
1
2
3
4
5
6
6
5
4
3
2
1
A
A
A3
A7 RY/BY# WE#
A9
A13
A13
A9
WE# RY/BY# A7
A3
B
B
A4
A17 VPP/WP# RST#
A8
A12
A12
A8
RST# VPP/WP# A17
A4
C
C
A2
A6
A18
A21
A10
A14
A14
A10
A21
A18
A6
A2
D
D
A1
A5
A20
A19
A11
A15
A15
A11
A19
A20
A5
A1
E
E
A0
D0
D2
D5
D7
A16
A16
D7
D5
D2
D0
A0
F
F
CE#
D8
D10
D12
D14 BYTE#
BYTE# D14
D12
D10
D8
CE#
G
G
OE#
D9
D11
VCC
D13 D15/A-1
D15/A-1 D13
VCC
D11
D9
OE#
H
H
VSS
D1
D3
D4
D6
VSS
VSS
Top view – ball side down
Note:
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
D6
D4
D3
D1
VSS
Bottom view – ball side up
1. RFU = reserved for future use.
11
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Signal Descriptions
Signal Descriptions
The signal description table below is a comprehensive list of signals for this device family. All signals listed may not be supported on this device. See Signal Assignments for information specific to this device.
Table 3: Signal Descriptions
Name
Type
Description
A[MAX:0]
Input
Address: Select the cells in the memory array to access during bus READ operations. During
bus WRITE operations they control the commands sent to the command interface of the program/erase controller.
CE#
Input
Chip enable: Activates the memory, allowing bus READ and bus WRTE operations to be performed. When CE# is HIGH, all other pins are ignored.
OE#
Input
Output enable: Controls the bus READ operation of the memory.
WE#
Input
Write enable: Controls the bus write operation of the memory’s command interface.
VPP/WP#
Input
VPP/WP#: Provides two functions: VPP enables the memory to use an external high-voltage
power supply to reduce the time required for UNLOCK BYPASS PROGRAM operations. WP#
performs hardware protection by protection the last block at the end of the addressable area
(M29W640GH) or the first block at the beginning of the addressable area (M29W640GL). It
protects the last two blocks at the end of the addressable area (M29W640GT) and the first
two boot blocks at the beginning of the addressable area (M29W640GB).
VPP/WP# may be left floating or unconnected (see DC Characteristics). When VPP/WP# is LOW,
the last or first block in the M29W640GH and M29W640GL, respectively, and the last or first
two blocks in the M29W640GT and M29W640GB, respectively, are protected. PROGRAM and
ERASE operations in this block are ignored while VPP/WP# is LOW, even when RST# is at VID.
When VPP/WP# is HIGH, VIH, the device reverts to the previous protection status of the outermost blocks. PROGRAM and ERASE operations can now modify the data in the outermost
blocks unless the block is protected using block protection.
Applying 12V to VPP/WP# will temporarily unprotect any block previously protected (including the outermost blocks) using a high-voltage block protection technique (in-system or programmer technique). (See Hardware Protection for details. When VPP/WP# is raised to VPP,
the device automatically enters the unlock bypass mode. When VPP/WP# returns to VIH or VIL,
normal operation resumes. During UNLOCK BYPASS PROGRAM operations, the device draws
IPP from the pin to supply the programming circuits. (See UNLOCK BYPASS Command.) The
transitions from VIH to VPP and from VPP to VIH must be slower than tVHVPP (See the Accelerated Program Timing waveforms).
Never raise VPP/WP# to VPP from any mode except read mode; otherwise, the device may be
left in an indeterminate state.
A 0.1µF capacitor should be connected between VPP/WP# and the VSS ground pin to decouple
the current surges from the power supply. The PCB track widths must be sufficient to carry
the currents required during an UNLOCK BYPASS PROGRAM operation, IPP.
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
12
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Signal Descriptions
Table 3: Signal Descriptions (Continued)
Name
Type
Description
RST#
Input
Reset/Block temporary unprotect: Applies a hardware reset to the memory or temporarily
unprotect all blocks that have been protected.
Note that if VPP/WP is at VIL, then the last and the first block in the M29W640GH and
M29W640GL, respectively, and the last two and first two blocks in the M29W640GT and
M29W640GB, respectively, will remain protected, even if RST# is at VID.
A hardware reset is achieved by holding RST# LOW for at least tPLPX. After RST# goes HIGH,
the memory will be ready for bus READ and bus WRITE operations after tPHEL or tRHEL,
whichever occurs last. (See Reset Characteristics for more details.)
Holding RST# at VID will temporarily unprotect the protected blocks in the memory. PROGRAM and ERASE operations on all blocks will be possible. The transition from VIH to VID
must be slower than tPHPHH.
DQ15/A-1
I/O
Data I/O or address input: When HIGH, behaves as a data I/o pin (as DQ8–DQ14). When
LOW, behaves as an address pin; DQ15A–1 LOW will select the LSB of the addressed word;
DQ15A–1 HIGH will select the MSB. Throughout the text, consider references to the data I/O
to include this pin when BYTE# is HIGH and references to the address inputs to include this
pin when BYTE# is LOW, except when stated explicitly otherwise.
DQ[14:8]
I/O
Data I/O: Outputs the data stored at the selected address during a bus READ operation
when BYTE# is HIGH. When BYTE# is LOW, these pins are not used and are High-Z. During
bus WRITE operations, the command register does not use these bits. When reading the status register these bits should be ignored.
DQ[7:0]
I/O
Data I/O: Outputs the data stored at the selected address during a bus READ operation. During bus WRITE operations, they represent the commands sent to the command interface of
the program/erase controller.
RY/BY#
Output
Ready busy: Open-drain output that identifies when the device is performing a PROGRAM
or ERASE operation. During PROGRAM or ERASE operations, RY/BY# is LOW, and is High-Z
during read mode, auto select mode, and erase suspend mode.
After a hardware reset, bus READ and WRITE operations cannot begin until RY/BY# becomes
High-Z. (See Reset Characteristics for more details.)
The use of an open-drain output enables RY/BY# pins from several devices to be connected
to a single pull-up resistor. A LOW will then indicate that one, or more, of the devices is busy.
BYTE#
Input
VCC
Supply
BYTE#/Word organization select: Switches between the x8 and x16 bus modes of the device. When LOW, the device is in x8 mode; when HIGH, it is in x16 mode.
Supply voltage: Provides the power supply for all operations (READ, PROGRAM, and
ERASE).
The command interface is disabled when the VCC supply voltage is less than the lockout voltage, VLKO. This prevents bus WRITE operations from accidentally damaging the data during
power-up, power-down, and power surges. If the program/erase controller is programming
or erasing during this time, then the operation aborts and the memory contents being altered will be invalid.
A 0.1 µF capacitor should be connected between the VCC supply voltage pin and the VSS
ground pin to decouple the current surges from the power supply. The PCB track widths must
be sufficient to carry the currents required during PROGRAM and ERASE operations, ICC3.
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
13
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Signal Descriptions
Table 3: Signal Descriptions (Continued)
Name
Type
VSS
Supply
RFU
–
Description
Ground: Reference for all voltage measurements. The device features two VSS pins which
must be both connected to the system ground.
Reserved for future use: RFUs should be not connected.
Table 4: Hardware Protection
VPP/WP#
RST#
VIL
VIH
Two outermost parameter blocks protected from PROGRAM or ERASE
operations
VID
All blocks unprotected temporarily except the two outermost blocks
VIH or VID
VID
All blocks unprotected temporarily
VPPH
VIH or VID
All blocks unprotected temporarily
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
Function
14
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Memory Organization
Memory Organization
Memory Configuration
The main memory array is divided into 64KB blocks.
The blocks in the memory are asymmetrically arranged. The first or last 64KB of memory has been divided into eight 8KB parameter blocks.
x8 Memory Map – 64Mb Density
Table 5: x8 Top Boot – Blocks [134:0]
Address Range
Block
Block Size
134
8KB
133
8KB
132
8KB
007F A000
007F BFFF
131
8KB
007F 8000
007F 9FFF
130
8KB
007F 6000
007F 7FFF
129
8KB
007F 4000
007F 5FFF
128
8KB
007F 2000
007F 3FFF
127
8KB
007F 0000
007F 1FFF
126
64KB
007E 0000
007E FFFF
⋮
⋮
⋮
⋮
2
64KB
0002 0000
0002 FFFF
1
64KB
0001 0000
0001 FFFF
0
64KB
0000 0000
0000 FFFF
Note:
Start
End
Notes
007F E000
007F FFFF
1
007F C000
007F DFFF
1. Used as the extended block addresses when the device is in extended block mode.
Table 6: x8 Bottom Boot – Blocks [134:0]
Address Range
Block
Block Size
Start
End
134
64KB
007F 0000
007F FFFF
133
64KB
007E 0000
007E FFFF
132
64KB
007D 0000
007D FFFF
⋮
⋮
⋮
⋮
8
64KB
0001 0000
0001 FFFF
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
15
Notes
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Memory Organization
Table 6: x8 Bottom Boot – Blocks [134:0] (Continued)
Address Range
Block
Block Size
Start
End
Notes
7
8KB
0000 E000
0000 FFFF
1
6
8KB
0000 C000
0000 DFFF
5
8KB
0000 A000
0000 BFFF
4
8KB
0000 8000
0000 9FFF
3
8KB
0000 6000
0000 7FFF
2
8KB
0000 4000
0000 5FFF
1
8KB
0000 2000
0000 3FFF
0
8KB
0000 0000
0000 1FFF
Note:
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
1. Used as the extended block addresses when the device is in extended block mode.
16
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Memory Organization
x16 Memory Map – 64Mb Density
Table 7: x16 Top Boot – Blocks [134:0]
Address Range
Block
Block Size
Start
End
Notes
134
8KW
003F F000
003F FFFF
1
133
8KW
003F E000
003F EFFF
132
8KW
003F D000
003F DFFF
131
8KW
003F C000
003F CFFF
130
8KW
003F B000
003F BFFF
129
8KW
003F A000
003F AFFF
128
8KW
003F 9000
003F 9FFF
127
8KW
003F 8000
003F 8FFF
126
32KW
003F 0000
003F 7FFF
⋮
⋮
⋮
⋮
2
32KW
0001 0000
0001 7FFF
1
32KW
0000 8000
0000 FFFF
0
32KW
0000 0000
0000 7FFF
Note:
1. Used as the extended block addresses when the device is in extended block mode.
Table 8: x16 Bottom Boot – Blocks [134:0]
Address Range
Block
Block Size
Start
End
134
32KW
003F 8000
003F FFFF
133
32KW
003F 0000
003F 7FFF
132
32KW
003E 8000
003E FFFF
⋮
⋮
⋮
⋮
8
32KW
0000 8000
000F FFFF
7
8KW
0000 7000
0007 7FFF
6
8KW
0000 6000
0006 6FFF
5
8KW
0000 5000
0005 5FFF
4
8KW
0000 4000
0004 4FFF
3
8KW
0000 3000
0003 3FFF
2
8KW
0000 2000
0002 2FFF
1
8KW
0000 1000
0001 1FFF
0
8KW
0000 0000
0000 7FFF
Note:
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
Notes
1
1. Used as the extended block addresses when the device is in extended block mode.
17
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Bus Operations
Bus Operations
Table 9: Bus Operations
Notes 1 and 2 apply to entire table
8-Bit Mode
Operation
READ
CE# OE#
L
16-Bit Mode
WE#
A[MAX:0],
DQ15/A-1
DQ[14:8]
DQ[7:0]
A[MAX:0]
DQ15/A-1,
DQ[14:0]
H
Cell address
High-Z
Data output
Cell address
Data output
input4
Command address
Data input4
L
WRITE
L
H
L
Command address
High-Z
STANDBY
H
X
X
X
High-Z
High-Z
X
High-Z
OUTPUT
DISABLE
X
H
H
X
High-Z
High-Z
X
High-Z
Notes:
Data
1. Typical glitches of less than 5ns on CE# and WE# are ignored by the device and do not
affect bus operations.
2. H = Logic level HIGH (VIH); L = Logic level LOW (VIL); X = HIGH or LOW.
3. If WP# = LOW, the highest/lowest block remains protected, depending on the line item.
4. Data input is required when issuing a command sequence or performing data polling or
block protection.
Read
Bus READ operations read from the memory cells, registers, or CFI space. A valid READ
operation requires setting the appropriate address on the address inputs, taking CE#
and OE# LOW and holding WE# HIGH. Data I/O signals output the value.
Write
Bus WRITE operations write to the command interface. A valid WRITE operation requires setting the appropriate address on the address inputs. These are latched by the
command interface on the falling edge of CE# or WE#, whichever occurs last. Values on
data I/O signals are latched by the command interface on the rising edge of CE# or
WE#, whichever occurs first. OE# must remain HIGH during the entire operation.
Standby and Automatic Standby
When the device is in read mode, driving CE# HIGH places the device in standby mode
and drives data I/Os to High-Z. Supply current is reduced to standby (ICC2), by holding
CE# within V CC ±0.2V.
During PROGRAM or ERASE operations, the device continues to use the program/erase
supply current (ICC3) until the operation completes.
Automatic standby enables low power consumption during read mode. When CMOS
levels (VCC ± 0.2 V) drive the bus, and following a READ operation and a period of inactivity specified in DC Characteristics, the memory enters automatic standby as internal
supply current is reduced to ICC2. Data I/O signals still output data if a READ operation
is in progress.
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
18
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Bus Operations
Output Disable
Data I/Os are High-Z when OE# is HIGH.
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
19
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Status Register
Status Register
Bus READ operations from any address always read the status register during PROGRAM and ERASE operations. It is also read during ERASE SUSPEND operations when
an address within a block being erased is accessed. The bits in the status register are
summarized in the Status Register Bits table.
Data Polling Bit (DQ7)
The data polling bit can be used to identify whether the program/erase controller has
successfully completed its operation or if it has responded to an ERASE SUSPEND operation. The data polling bit is output on DQ7 when the status register is read.
During PROGRAM operations, the data polling bit outputs the complement of the bit
being programmed to DQ7. After successful completion of the PROGRAM operation,
the memory returns to read mode, and bus READ operations from the address just programmed output DQ7, not its complement.
During ERASE operations, the data polling bit outputs 0, the complement of the erased
state of DQ7. After successful completion of the ERASE operation, the memory returns
to read mode.
In erase suspend mode, the data polling bit will output a 1 during a bus READ operation
within a block being erased. The data polling bit will change from a 0 to a 1 when the
program/erase controller has suspended the ERASE operation. The Data Polling Flowchart gives an example of how to use the data polling bit. A valid address is the address
being programmed or an address within the block being erased.
Toggle Bit (DQ6)
The toggle bit can be used to identify whether the program/erase controller has successfully completed its operation or if it has responded to an ERASE SUSPEND command. The toggle bit is output on DQ6 when the status register is read.
During PROGRAM and ERASE operations, the toggle bit changes from 0 to 1 to 0, etc.,
with successive bus READ operations at any address. After successful completion of the
operation, the memory returns to read mode.
During erase suspend mode, the toggle bit will output when addressing a cell within a
block being erased. The toggle bit will stop toggling when the program/erase controller
has suspended the ERASE operation.
If any attempt is made to erase a protected block, the operation is aborted, no error is
signaled, and DQ6 toggles for approximately 100µs. If any attempt is made to program a
protected block or a suspended block, the operation is aborted, no error is signaled, and
DQ6 toggles for approximately 1µs. The Data Toggle Flowchart gives an example of how
to use the data toggle bit.
Error Bit (DQ5)
The error bit can be used to identify errors detected by the program/erase controller.
The error bit is set to 1 when a PROGRAM, BLOCK ERASE, or CHIP ERASE operation
fails to write the correct data to the memory. If the error bit is set, a READ/RESET command must be issued before other commands are issued. The error bit is output on
DQ5 when the status register is read.
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
20
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Status Register
Note that the PROGRAM command cannot change a bit set to 0 back to 1, and attempting to do so will set DQ5 to 1. A bus READ operation to that address will show the bit is
still 0. One of the ERASE commands must be used to set all the bits in a block or in the
whole memory from 0 to 1.
Erase Timer Bit (DQ3)
The erase timer bit can be used to identify the start of program/erase controller operation during a BLOCK ERASE command. When the program/erase controller starts erasing, the erase timer bit is set to 1. Before the program/erase controller starts, the erase
timer bit is set to 0, and additional blocks to be erased may be written to the command
interface. The erase timer bit is output on DQ3 when the status register is read.
Alternative Toggle Bit (DQ2)
The alternative toggle bit can be used to monitor the program/erase controller during
ERASE operations. It is output on DQ2 when the status register is read.
During CHIP ERASE and BLOCK ERASE operations, the toggle bit changes from 0 to 1 to
0, etc., with successive bus READ operations from addresses within the blocks being
erased. A protected block is treated the same as a block not being erased. After the operation completes, the memory returns to read mode.
During an ERASE SUSPEND operation, the alternative toggle bit changes from 0 to 1 to
0, etc., with successive bus READ operations from addresses within the blocks being
erased. Bus READ operations to addresses within blocks not being erased will output
the memory cell data as if in read mode.
After an ERASE operation that causes the error bit to be set, the alternative toggle bit
can be used to identify which block or blocks have caused the error. The alternative toggle bit changes from 0 to 1 to 0, etc., with successive bus READ operations from addresses within blocks that have not erased correctly. The alternative toggle bit does not
change if the addressed block has erased correctly.
Table 10: Status Register Bits
Operation
Address
DQ7
DQ6
DQ5
DQ3
DQ2
RY/BY#
PROGRAM
Any address
DQ7#
Toggle
0
–
–
0
PROGRAM DURING
ERASE SUSPEND
Any address
DQ7#
Toggle
0
–
–
0
PROGRAM ERROR
Any address
DQ7#
Toggle
1
–
–
0
CHIP ERASE
Any address
0
Toggle
0
1
Toggle
0
BLOCK ERASE BEFORE
TIMEOUT
Erasing block
0
Toggle
0
0
Toggle
0
Non-erasing block
0
Toggle
0
0
No Toggle
0
Erasing block
0
Toggle
0
1
Toggle
0
Non-erasing block
0
Toggle
0
1
No Toggle
0
Erasing block
1
No Toggle
0
–
Toggle
1
BLOCK ERASE
ERASE SUSPEND
Non-erasing block
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
Data read as normal
21
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Status Register
Table 10: Status Register Bits (Continued)
Operation
ERASE ERROR
Address
DQ7
DQ6
DQ5
DQ3
DQ2
RY/BY#
Good block address
0
Toggle
1
1
No Toggle
0
Faulty block address
0
Toggle
1
1
Toggle
0
Note:
1. Unspecified data bits should be ignored.
Figure 4: Data Polling Flowchart
Start
Read DQ7 and DQ5 at valid
1 address
Yes
DQ7 = Data
No
No
DQ5 = 1
Yes
Read DQ7 at valid address
DQ7 = Data
Yes
No
Failure
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
Success
22
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
READ Operations
Figure 5: Data Toggle Flowchart
Start
Read DQ6 at valid address
Read DQ6 and DQ5 at valid address
DQ6 = Toggle
No
Yes
No
DQ5 = 1
Yes
Read DQ6 (twice) at valid address
DQ6 = Toggle
No
Yes
Failure
Success
READ Operations
READ/RESET Command
The READ/RESET (F0h) command returns the device to read mode and resets the errors
in the status register. One or three bus WRITE operations can be used to issue the
READ/RESET command.
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
23
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
READ Operations
To return the device to read mode, this command can be issued between bus WRITE
cycles before the start of a PROGRAM or ERASE operation. If the READ/RESET command is issued during the timeout of a BLOCK ERASE operation, the device requires up
to 10μs to abort, during which time no valid data can be read.
READ CFI Command
The READ CFI (98h) command puts the device in read CFI mode and is valid only when
the device is in read array or auto select mode. One bus WRITE cycle is required to issue
the command.
Once in read CFI mode, bus READ operations will output data from the CFI memory
area. A READ/RESET command must be issued to return the device to the previous
mode (read array or auto select ). A second READ/RESET command is required to put
the device in read array mode from auto select mode.
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
24
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
AUTO SELECT Operations
AUTO SELECT Operations
AUTO SELECT Command
At power-up or after a hardware reset, the device is in read mode. It can then be put in
auto select mode by issuing an AUTO SELECT (90h) command or by applying V ID to A9.
Auto select mode enables the following device information to be read:
• Electronic signature, which includes manufacturer and device code information.
• Block protection, which includes the block protection status and extended memory
block protection indicator.
Electronic signature or block protection information is read by executing a READ operation with control signals and addresses set.
Auto select mode can be used by the programming equipment to automatically match a
device with the application code to be programmed.
Three consecutive bus WRITE operations are required to issue an AUTO SELECT command. The device remains in auto select mode until a READ/RESET or READ CFI command is issued.
The device cannot enter auto select mode when a PROGRAM or ERASE operation is in
progress (RY/BY# LOW). However, auto select mode can be entered if the PROGRAM or
ERASE operation has been suspended by issuing a PROGRAM SUSPEND or ERASE SUSPEND command.
To enter auto select mode by applying V ID to A9 (see the following tables).
Auto select mode is exited by performing a reset. The device returns to read mode unless it entered auto select mode after an ERASE SUSPEND or PROGRAM SUSPEND
command, in which case it returns to erase or program suspend mode.
Table 11: Read Electronic Signature
Note 1 applies to entire table
READ Cycle
Device Code 2
Device Code 3
Manufacturer
Code
Device Code 1
GH/GL
GT/GB
GH/GT
GL/GB
CE#
L
L
L
L
L
L
OE#
L
L
L
L
L
L
WE#
H
H
H
H
H
H
X
X
X
X
X
X
A9
VID
VID
VID
VID
VID
VID
A8
X
X
X
X
A[7:5]
L
L
L
L
A4
X
X
X
X
A[3:1]
L
L
H
H
A0
L
H
L
H
Signal
Notes
Address Input, 8-Bit and 16-Bit
A[MAX:10]
2
Address Input, 8-Bit Only
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
25
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
AUTO SELECT Operations
Table 11: Read Electronic Signature (Continued)
Note 1 applies to entire table
READ Cycle
Device Code 2
Device Code 3
Notes
Manufacturer
Code
Device Code 1
X
X
X
X
DQ[14:8]
X
X
X
X
DQ[7:0]
20h
7Eh
0Ch
10h
01h
00h
0020h
227Eh
220Ch
2210h
2201h
2200h
Signal
DQ[15]/A-1
GH/GL
GT/GB
GH/GT
GL/GB
Data I/O, 8-Bit Only
Data I/O, 16-Bit Only
DQ[15]/A-1, and DQ[14:0]
1. H = Logic level HIGH (VIH); L = Logic level LOW (VIL); X = HIGH or LOW.
2. When using the AUTO SELECT command to enter auto select mode, applying VID to A9 is
not required. A9 can be either VIL or VIH.
Notes:
Table 12: Block Protection
Note 1 applies to entire table
Address Input
Operation
CE# OE#
BLOCK
PROTECT
(Group)
WE#
L
VID
LP
CHIP
UNPROTECT
VID
VID
LP
VERIFY
BLOCK
PROTECTION
L
L
H
VERIFY
BLOCK
UNPROTECT
L
L
H
Note:
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
A[MAX] A15
A[14:13]
A[11:10],
A[8:7],
DQ15/A-1,
A12
A[5:4]
A9 A6 A[3:2] A1 A0 DQ[14:0]
Block address
X
Data I/O
X
VID
X
X
X
VID
X
X
Block address
X
VID
L
L
H
L
Pass =
xx01h
Retry=
xx00h
Block address
X
VID
H
L
H
L
Retry =
xx01h
Pass=
xx00h
H
X
H
1. H = Logic level HIGH (VIH); L = Logic level LOW (VIL); LP = L pulse; X = HIGH or LOW.
26
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Command Interface
Command Interface
All bus WRITE operations to the memory are interpreted by the command interface.
Commands consist of one or more sequential bus WRITE operations. Failure to observe
a valid sequence of bus WRITE operations will result in the memory returning to read
mode. The long command sequences are imposed to maximize data security.
The address used for the commands changes, depending on whether the memory is in
16-bit or 8-bit mode. See the x8 and x16 command tables, depending on the configuration that is being used, for a summary of the commands.
READ/RESET Command
The READ/RESET command returns the memory to read mode. It also resets the errors
in the status register. Either one or three bus WRITE operations can be used to issue the
READ/RESET command.
The READ/RESET command can be issued, between bus WRITE cycles before the start
of a PROGRAM or ERASE operation, to return the device to read mode. If the READ/
RESET command is issued during the timeout of a BLOCK ERASE operation, then the
device will take up to 10µs to abort. During the abort period, no valid data can be read
from the device. The READ/RESET command will not abort an ERASE operation when
issued while in erase suspend.
AUTO SELECT Command
The AUTO SELECT command is used to read the manufacturer code, the device code,
the block protection status, and the extended memory block verify code. Three consecutive bus WRITE operations are required to issue the AUTO SELECT command. After
the AUTO SELECT command is issued, the memory remains in auto select mode until a
READ/RESET command is issued. READ CFI QUERY and READ/RESET commands are
accepted in auto select mode; all other commands are ignored.
In auto select mode, the manufacturer code and the device code can be read by using a
bus READ operation with addresses and control signals set, as shown Bus Operations,
except for A9 (which is "Don’t Care").
The block protection status of each block can be read using a bus READ operation with
addresses and control signals set, as shown in Bus Operations, except for A9 (which is
"Don’t Care"). If the addressed block is protected, then 01h is output on DQ0–DQ7; otherwise, 00h is output (in 8-bit mode).
The protection status of the extended memory block, or extended memory block verify
code, can be read using a bus READ operation with addresses and control signals, except for A9 (which is "Don’t Care"). If the extended block is "factory-locked." then 80h is
output on DQ0–DQ7; otherwise, 00h is output (8-bit mode).
READ CFI QUERY Command
The READ CFI QUERY command is used to read data from the CFI. This command is
valid when the device is in the read array mode, or when the device is in auto select
mode.
One bus WRITE cycle is required to issue the READ CFI QUERY command. After the
command is issued, subsequent bus READ operations read from the CFI.
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
27
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Command Interface
The READ/RESET command must be issued to return the device to the previous mode
(the read array mode or auto select mode). A second READ/RESET command would be
needed if the device is to be put in the read array mode from auto selected mode.
PROGRAM Command
The PROGRAM command can be used to program a value to one address in the memory array at a time. The command requires four bus WRITE operations; the final WRITE
operation latches the address and data, and starts the program/erase controller.
Programming can be suspended and then resumed by issuing a PROGRAM SUSPEND
command and a PROGRAM RESUME command, respectively.
If the address falls in a protected block, then the PROGRAM command is ignored, the
data remains unchanged. The status register is never read and no error condition is given.
During a PROGRAM operation, the memory will ignore all commands. It is not possible
to issue any command to abort or pause the operation. Bus READ operations during the
PROGRAM operation will output the status register on the data I/Os. (See Status Register for more details.)
After the PROGRAM operation has completed, the memory will return to the read
mode, unless an error has occurred. When an error occurs, the memory will continue to
output the status register. A READ/RESET command must be issued to reset the error
condition and return to read mode.
Note that the PROGRAM command cannot change a bit set to 0 back to 1. One of the
ERASE commands must be used to set all the bits in a block or in the whole memory
from 0 to 1. (Refer to Program/Erase Characteristics.)
PROGRAM SUSPEND Command
The PROGRAM SUSPEND command allows the system to interrupt a PROGRAM operation so that data can be read from any block. When the PROGRAM SUSPEND command
is issued during a PROGRAM operation, the device suspends the PROGRAM operation
within the program suspend latency time and updates the status register bits (see Program/Erase Characteristics).
After the PROGRAM operation has been suspended, the system can read array data
from any address. However, data read from program-suspended addresses is not valid.
The PROGRAM SUSPEND command may also be issued during a PROGRAM operation
while an erase is suspended. In this case, data may be read from any addresses not in
ERASE SUSPEND or PROGRAM SUSPEND. If a read is needed from the extended block
area (one-time program area), the user must use the proper command sequences to enter and exit this region.
The system may also issue the AUTO SELECT command sequence when the device is in
the program suspend mode. The system can read as many auto select codes as required. When the device exits the auto select mode, the device reverts to the program
suspend mode, and is ready for another valid operation.
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
28
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Command Interface
PROGRAM RESUME Command
After the PROGRAM RESUME command is issued, the device reverts to programming.
The controller can determine the status of the PROGRAM operation using the DQ7 or
DQ6 status bits, just as in the standard PROGRAM operation.
The system must write the PROGRAM RESUME command, to exit the program suspend
mode and to continue the programming operation.
Further issuing of the RESUME command is ignored. Another PROGRAM SUSPEND
command can be written after the device has resumed programming.
Fast Program Commands
There are five fast program commands available to improve the programming throughput, by writing several adjacent words or bytes in parallel:
• QUADRUPLE and OCTUPLE BYE PROGRAM, available for x8 operations
• DOUBLE and QUADRUPLE WORD PROGRAM, available for x16 operations
Fast program commands can be suspended and then resumed by issuing a PROGRAM
SUSPEND command and a PROGRAM RESUME command, respectively.
To perform some of the fast program commands, V PPH must be applied V PP/WP#. Note
that doing so will temporarily unprotect any protected block.
DOUBLE BYTE PROGRAM Command
The DOUBLE BYTE PROGRAM command is used to write a page of two adjacent bytes
in parallel. The two bytes must differ only in DQ15A-1. Three bus WRITE cycles are necessary to issue the DOUBLE BYTE PROGRAM command:
The first bus cycle sets up the DOUBLE BYTE PROGRAM command; the second bus cycle latches the address and the data of the first byte to be written; and the third bus cycle latches the address and the data of the second byte to be written.
QUADRUPLE BYTE PROGRAM Command
The QUADRUPLE BYTE PROGRAM command is used to write a page of four adjacent
bytes in parallel. The four bytes must differ only for addresses A0, DQ15A-1. Five bus
write cycles are necessary to issue the QUADRUPLE BYTE PROGRAM command:
The first bus cycle sets up the QUADRUPLE BYTE PROGRAM command; the second bus
cycle latches the address and the data of the first byte to be written; the third bus cycle
latches the address and the data of the second byte to be written; the fourth bus cycle
latches the address and the data of the third byte to be written; and the fifth bus cycle
latches the address and the data of the fourth byte to be written and starts the program/
erase controller.
OCTUPLE BYTE PROGRAM Command
This is used to write eight adjacent bytes, in x8 mode, simultaneously. The addresses of
the eight bytes must differ only in A1, A0 and DQ15A-1.
12V must be applied to V PP/Wp# prior to issuing an OCTUPLE BYTE PROGRAM command. Care must be taken because applying a 12V voltage to V PP/WP#, because it will
temporarily unprotect any protected block.
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
29
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Command Interface
Nine bus WRITE cycles are necessary to issue the command:
The first bus cycle sets up the command; the second bus cycle latches the address and
the data of the first byte to be written; the third bus cycle latches the address and the
data of the second byte to be written; the fourth bus cycle latches the address and the
data of the third byte to be written, the fifth bus cycle latches the address and the data
of the fourth byte to be written; the sixth bus cycle latches the address and the data of
the fifth byte to be written; the seventh bus cycle latches the address and the data of the
sixth byte to be written; the eighth bus cycle latches the address and the data of the seventh byte to be written; and the ninth bus cycle latches the address and the data of the
eighth byte to be written and starts the program/erase controller.
DOUBLE WORD PROGRAM Command
The DOUBLE WORD PROGRAM command is used to write a page of two adjacent
words in parallel. The two words must differ only for the address A0.
Three bus WRITE cycles are necessary to issue the DOUBLE WORD PROGRAM command:
The first bus cycle sets up the DOUBLE WORD PROGRAM command; the second bus
cycle latches the address and the data of the first word to be written; and the third bus
cycle latches the address and the data of the second word to be written and starts the
program/erase controller.
After the PROGRAM operation has completed, the memory will return to the read
mode, unless an error has occurred. When an error occurs, bus READ operations will
continue to output the status register. A READ/RESET command must be issued to reset
the error condition and return to read mode.
Note that the fast program commands cannot change a bit set to 0 back to 1. One of the
ERASE commands must be used to set all the bits in a block or in the whole memory
from 0 to 1.
Typical program times are given in Program/Erase Characteristics.
Note: It is not necessary to raise V PP/WP# to 12V before issuing this command.
QUADRUPLE WORD PROGRAM Command
This is used to write a page of four adjacent words (or 8 adjacent bytes), in x16 mode,
simultaneously. The addresses of the four words must differ only in A1 and A0.
12V must be applied to V PP/WP# prior to issuing a QUADRUPLE BYTE PROGRAM command. Care must be taken because applying a 12V voltage to V PP/WP#, because it will
temporarily unprotect any protected block.
Five bus WRITE cycles are necessary to issue the command:
The first bus cycle sets up the command; the second bus cycle latches the address and
the data of the first word to be written; the third bus cycle latches the address and the
data of the second word to be written; the fourth bus cycle latches the address and the
data of the third word to be written; and the fifth bus cycle latches the address and the
data of the fourth word to be written and starts the program/erase controller.
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
30
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Command Interface
UNLOCK BYPASS Command
The UNLOCK BYPASS command is used in conjunction with the UNLOCK BYPASS
PROGRAM command to program the memory faster than with the standard PROGRAM
commands. When the cycle time to the device is long, considerable time saving can be
made by using these commands. Three bus WRITE operations are required to issue the
UNLOCK BYPASS command.
After the UNLOCK BYPASS command has been issued, the memory will only accept the
UNLOCK BYPASS PROGRAM command and the UNLOCK BYPASS RESET command.
The memory can be read as if in read mode.
When V PP is applied to V PP/WP#, the memory automatically enters the unlock bypass
mode and the UNLOCK BYPASS PROGRAM command can be issued immediately.
UNLOCK BYPASS PROGRAM Command
The UNLOCK BYPASS command is used in conjunction with the UNLOCK BYPASS
PROGRAM command to program the memory. When the cycle time to the device is
long, considerable time saving can be made by using these commands. Three bus
WRITE operations are required to issue the UNLOCK BYPASS command.
After the UNLOCK BYPASS command has been issued, the memory will only accept the
UNLOCK BYPASS PROGRAM command and the UNLOCK BYPASS RESET command.
The memory can be read as if in read mode.
The memory offers accelerated PROGRAM operations through V PP/WP#. When the system asserts V PP on V PP/WP#, the memory automatically enters the unlock bypass mode.
The system may then write the two-cycle UNLOCK BYPASS PROGRAM command sequence. The memory uses the higher voltage on V PP/WP# to accelerate the UNLOCK
BYPASS PROGRAM operation.
Never raise V PP/WP# to V PP from any mode except read mode; otherwise, the memory
may be left in an indeterminate state.
UNLOCK BYPASS RESET Command
The UNLOCK BYPASS RESET command can be used to return to read/reset mode from
unlock bypass mode. Two bus WRITE operations are required to issue the UNLOCK BYPASS RESET command. A READ/RESET command does not exit from unlock bypass
mode.
CHIP ERASE Command
The CHIP ERASE command can be used to erase the entire chip. Six bus WRITE operations are required to issue the CHIP ERASE command and start the program/erase controller.
If any blocks are protected, then these are ignored and all the other blocks are erased. If
all of the blocks are protected the CHIP ERASE operation appears to start but will terminate within about 100µs, leaving the data unchanged. No error condition is given when
protected blocks are ignored.
During the ERASE operation, the memory will ignore all commands, including the
ERASE SUSPEND command. It is not possible to issue any command to abort the oper-
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
31
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Command Interface
ation. All bus READ operations during the CHIP ERASE operation will output the status
register on the data I/Os.
After the CHIP ERASE operation has completed, the memory will return to the read
mode, unless an error has occurred. When an error occurs, the memory will continue to
output the status register. A READ/RESET command must be issued to reset the error
condition and return to read mode.
The CHIP ERASE command sets all of the bits in unprotected blocks of the memory to
1. All previous data is lost.
BLOCK ERASE Command
The BLOCK ERASE command can be used to erase a list of one or more blocks. Six bus
WRITE operations are required to select the first block in the list. Each additional block
in the list can be selected by repeating the sixth bus WRITE operation using the address
of the additional block. The BLOCK ERASE operation starts the program/erase controller about 50µs after the last bus WRITE operation. After the program/erase controller
starts, it is not possible to select any more blocks. Each additional block must therefore
be selected within 50µs of the last block. The 50µs timer restarts when an additional
block is selected. The status register can be read after the sixth bus WRITE operation.
( See the status register section for details on how to identify whether the program/
erase controller has started the BLOCK ERASE operation.)
If any selected blocks are protected, then these are ignored and all the other selected
blocks are erased. If all of the selected blocks are protected, the BLOCK ERASE operation appears to start but will terminate within about 100µs, leaving the data unchanged.
No error condition is given when protected blocks are ignored.
During the BLOCK ERASE operation, the memory will ignore all commands except the
ERASE SUSPEND command. (Typical block erase times are given in the Program/Erase
Characteristics.) All bus READ operations during the BLOCK ERASE operation will output the status register on the data I/Os.
After the BLOCK ERASE operation has completed, the memory will return to the read
mode, unless an error has occurred. When an error occurs, the memory will continue to
output the status register. A READ/RESET command must be issued to reset the error
condition and return to read mode.
The BLOCK ERASE command sets all of the bits in the unprotected selected blocks to 1.
All previous data in the selected blocks is lost.
ERASE SUSPEND Command
The ERASE SUSPEND command may be used to temporarily suspend a BLOCK ERASE
operation and return the memory to read mode. The command requires one bus
WRITE operation.
The program/erase controller will suspend within the erase suspend latency time of the
ERASE SUSPEND command being issued. After the program/erase controller has stopped, the memory will be set to read mode and the erase will be suspended. If the ERASE
SUSPEND command is issued during the period when the memory is waiting for an additional block (before the program/erase controller starts), then the erase is suspended
immediately and will start immediately when the ERASE RESUME command is issued.
It is not possible to select any further blocks to erase after the ERASE RESUME.
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
32
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Command Interface
During ERASE SUSPEND, it is possible to read and program cells in blocks that are not
being erased; both READ and PROGRAM operations behave as normal on these blocks.
If any attempt is made to program in a protected block or in the suspended block, then
the PROGRAM command is ignored and the data remains unchanged. The status register is not read and no error condition is given. Reading from blocks that are being
erased will output the status register.
It is also possible to issue the AUTO SELECT, READ CFI QUERY, and UNLOCK BYPASS
commands during an ERASE SUSPEND. The READ/RESET command must be issued to
return the device to read array mode before the RESUME command will be accepted.
ERASE RESUME Command
The ERASE RESUME command must be used to restart the program/erase controller after an erase suspend. The device must be in read array mode before the RESUME command will be accepted. An erase can be suspended and resumed more than once.
ENTER EXTENDED BLOCK Command
The device has an extra 256-byte block (extended block) that can only be accessed using
the ENTER EXTENDED BLOCK command. Three bus WRITE cycles are required to issue the ENTER EXTENDED BLOCK command. After the command has been issued, the
device enters extended block mode where all bus READ or WRITE operations to the
boot block addresses access the extended block. The extended block (with the same address as the boot blocks) cannot be erased, and can be treated as OTP memory. In extended block mode, the boot blocks are not accessible.
The extended block can be protected; however, once protected, the protection cannot
be undone.
EXIT EXTENDED BLOCK Command
The EXIT EXTENDED BLOCK command is used to exit from the extended block mode
and return the device to read mode. Four bus WRITE operations are required to issue
the command.
BLOCK PROTECT and CHIP UNPROTECT Commands
Groups of blocks can be protected against accidental program or erase. (See Memory
Organization for the protection groups.) The whole chip can be unprotected to allow
the data inside the blocks to be changed.
BLOCK PROTECT Command
Block protection can be used to prevent any operation from modifying the data stored
in the Flash. Each block can be protected individually. Once protected, PROGRAM and
ERASE operations on the block fail to change the data.
There are three techniques that can be used to control block protection. These are programmer technique, in-system technique, and temporary unprotect. Temporary unprotect is controlled by RST#.
Unlike the command interface of the program/erase controller, the techniques for protecting and unprotecting blocks change between different Flash memory suppliers.
Care should be taken when changing drivers for one part to work on another.
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
33
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Command Interface
Programmer Technique
The programmer technique uses high voltage levels (VID) on some of the bus pins.
These cannot be achieved using a standard microprocessor bus; therefore, the technique is recommended only for use in programming equipment.
To protect a block, follow the steps in the following figure. To unprotect the whole chip,
it is necessary to protect all of the blocks first, then all blocks can be unprotected at the
same time. (See the Programmer Equipment Chip Protect Flowchart.)
The timing on these flowcharts is critical. Care should be taken to ensure that, where a
pause is specified, it is followed as closely as possible. Do not abort the procedure before reaching the end. Chip unprotect can take several seconds and a user message
should be provided to show that the operation is progressing.
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
34
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Command Interface
Figure 6: Programmer Equipment Block Protect Flowchart
START
Set-up
ADDRESS = BLOCK ADDRESS
WE# = VIH
n=0
OE#, A9 = VID ,
CE# = V IL
Protect
Wait 4 µs
WE# = VIL
Wait 100 µs
WE# = VIH
CE#, OE# = VIH ;
A0, A2, A3, A6 = V IL ;
A1 = VIH ; A9 = V ID ; others = X
CE# = VIL
Wait 4 µs
Verify
OE# = V IL
Wait 60ns
Read DATA
DATA
=
01h
NO
YES
A9 = V IH
CE#, OE# = V IH
++n
= 25
NO
End
YES
PASS
A9 = V IH
CE#, OE# = VIH
FAIL
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
35
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Command Interface
Figure 7: Programmer Equipment Chip Unprotect Flowchart
START
Set-up
PROTECT ALL BLOCKS
n=0
CURRENT BLOCK = 0
A6, A12, A15 = V IH
CE#, OE#, A9 = V ID
Unprotect
Wait 4µs
WE# = V IL
Wait 10ms
WE# = V IH
CE#, OE# = V IH
ADDRESS = CURRENT BLOCK ADDRESS
A0, A2, A3 = V IL ; A1, A6 = V IH ; A9 = VID ; Others = X
CE# = VIL
Wait 4µs
OE# = VIL
INCREMENT
CURRENT BLOCK
Verify
Wait 60ns
Read DATA
NO
NO
DATA
=
00h
LAST
++n
YES
YES
End
NO
BLOCK
= 1000
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
YES
A9 = VIH
CE#, OE# = V IH
A9 = VIH
CE#, OE# = V IH
FAIL
PASS
36
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Command Interface
Table 13: Programmer Technique Bus Operations
Notes 1 and 2 apply to entire table
Operation
Address Inputs
Data I/O
CE#
OE#
WE#
A[MAX:0]
DQ15/A-1, DQ[14:0]
BLOCK PROTECT
L
VID
L pulse
A9 = VID
A[21:12] block addresses
others = X
X
CHIP UNPROTECT
VID
VID
L pulse
A9 = VID
A12 = VIH
A15 = VIH
others = X
X
BLOCK
PROTECTION
VERIFY
L
L
VIH
A0, A2, A3 = VIL
A1 = VIH
A6 = VIL
A9 = VID
A[21:12] block addresses
others = X
Pass = XX01h
Retry = XX00h
BLOCK
UNPROTECT
VERIFY
L
L
VIH
A0, A2, A3 = VIL
A1 = VIH
A6 = VIH
A9 = VID
A[21:12] block addresses
others = X
Retry = XX01h
Pass = XX00h
1. Typical glitches of less than 5ns on CE# and WE# are ignored by the device and do not
affect bus operations.
2. H = Logic level HIGH (VIH); L = Logic level LOW (VIL); X = HIGH or LOW.
Notes:
In-System Technique
The in-system technique requires a high-voltage level on RST#. This can be achieved
without violating the maximum ratings of the components on the microprocessor bus;
therefore, this technique is suitable for use after the Flash has been fitted to the system.
To protect a block, follow the steps in the following figure. To unprotect the whole chip,
it is necessary to protect all of the blocks first, then all the blocks can be unprotected at
the same time. (See the In-System Equipment Chip Unprotect Flowchart.)
The timing on these flowcharts is critical. Care should be taken to ensure that, where a
pause is specified, it is followed as closely as possible. Do not allow the microprocessor
to service interrupts that will upset the timing and do not abort the procedure before
reaching the end. Chip unprotect can take several seconds and a user message should
be provided to show that the operation is progressing.
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
37
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Command Interface
Figure 8: In-System Equipment Block Protect Flowchart
Set-up
START
n=0
RST# = VID
WRITE 60h
ADDRESS = BLOCK ADDRESS
A0, A2, A3 = VIL ; A1 = VIH ; A6 = VIL
Protect
WRITE 60h
ADDRESS = BLOCK ADDRESS
A0, A2, A3 = VIL ; A1 = VIH ; A6 = VIL
Wait 100µs
WRITE 40h
ADDRESS = BLOCK ADDRESS
Verify
A0, A2, A3 = VIL ; A1 = VIH ; A6 = VIL
Wait 4µs
READ DATA
ADDRESS = BLOCK ADDRESS
A0, A2, A3 = VIL ; A1 = VIH ; A6 = VIL
DATA
=
01h
NO
YES
++n
End
RST# = VIH
ISSUE READ/RESET
COMMAND
PASS
NO
= 25
YES
RST# = VIH
ISSUE READ/RESET
COMMAND
FAIL
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
38
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Command Interface
Figure 9: In-System Equipment Chip Protect Flowchart
START
PROTECT ALL BLOCKS
Set-up
n=0
CURRENT BLOCK = 0
RST# = VID
WRITE 60h
ANY ADDRESS WITH
A0, A2, A3 = VIL ; A1 = VIH ; A6 = VIH
WRITE 60h
Unprotect
ANY ADDRESS WITH
A0, A2, A3 = VIL ; A1 = VIH ; A6 = VIH
Wait 10ms
WRITE 40h
ADDRESS = CURRENT BLOCK ADDRESS
Verify
A0, A2, A3 = VIL ; A1 = VIH ; A6 = VIH
Wait 4µs
INCREMENT
CURRENT BLOCK
READ DATA
ADDRESS = CURRENT BLOCK ADDRESS
A0, A2, A3 = VIL ; A1 = VIH ; A6 = VIH
NO
End
NO
DATA
=
00h
++n
LAST
= 1000
BLOCK
YES
NO
YES
RST# = VIH
RST# = VIH
ISSUE READ/RESET
COMMAND
ISSUE READ/RESET
COMMAND
PASS
FAIL
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
YES
39
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Command Interface
Table 14: Commands – 16-Bit Mode (BYTE# = VIH)
Bus WRITE Operations
1st
2nd
Command
Length
Addr
Data
READ/RESET
1
X
F0
3rd
Addr
Data
Addr
4th
Data
5th
Addr
Data
PA
PD
PA2
6th
Addr
Data
PD2
PA3
PD3
Addr
Data
3
555
AA
2AA
55
X
F0
AUTO SELECT
3
555
AA
2AA
55
555
90
READ CFI
QUERY
1
555
98
PROGRAM
4
55
AA
2AA
55
555
A0
Double Word
Program
3
555
50
PA0
PD0
PA1
PD1
Quadruple
Word Program
5
555
56
PA0
PD0
PA1
PD1
UNLOCK BYPASS
3
555
AA
2AA
55
555
20
UNLOCK BYPASS PROGRAM
2
X
A0
PA
PD
UNLOCK BYPASS RESET
2
X
90
X
00
CHIP ERASE
6
555
AA
2AA
55
555
80
555
AA
2AA
55
555
10
BLOCK ERASE
6
555
AA
2AA
55
555
80
555
AA
2AA
55
BA
30
PROGRAM/
ERASE SUSPEND
1
X
B0
PROGRAM/
ERASE RESUME
1
X
30
ENTER EXTENDED BLOCK
3
555
AA
2AA
55
555
88
EXIT EXTENDED BLOCK
4
555
AA
2AA
55
555
90
X
00
Note:
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
1. X = " Don’t Care;" PA = Program address; PD = Program data; BA = Any address in the
block. All values in the table are in hexadecimal. The command interface only uses A-1;
A0–A10 and DQ0–DQ7 to verify the commands; A11–A20, DQ8–DQ14 and DQ15 are
"Don't Care." DQ15A-1 is A-1 when BYTE# is VIL or DQ15 when BYTE# is VIH.
40
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Command Interface
Table 15: Commands – 8-Bit Mode (BYTE# = VIL)
Bus WRITE Operations
1st
Command
Length Addr
2nd
4th
Addr
Data
Addr
Data
AA
555
55
X
F0
AAA
AA
555
55
AAA
90
1
AA
98
PROGRAM
4
AAA
AA
555
55
AAA
A0
DOUBLE BYTE
PROGRAM
3
AAA
50
PA0
PD0
PA1
PD1
QUADRUPLE
BYTE PROGRAM
5
AAA
56
PA0
PD0
PA1
OCTUPLE BYTE
PROGRAM
9
AAA
8B
PA0
PD0
UNLOCK BYPASS
3
AAA
AA
555
55
UNLOCK BYPASS PROGRAM
2
X
A0
PA
PD
UNLOCK BYPASS RESET
2
X
90
X
00
CHIP ERASE
6
AAA
AA
555
BLOCK ERASE
6+
AAA
AA
555
PROGRAM/
ERASE SUSPEND
1
X
B0
PROGRAM/
ERASE RESUME
1
X
30
ENTER EXTENDED BLOCK
3
AAA
AA
EXIT EXTENDED BLOCK
4
AAA
AA
READ/RESET
Data
3rd
1
X
F0
3
AAA
AUTO SELECT
3
READ CFI
QUERY
Notes:
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
5th
Addr
Data
PA
PD
PD1
PA2
PA1
PD1
AAA
20
55
AAA
55
AAA
555
55
AAA
88
555
55
AAA
90
6th
Addr
Data
Addr
Data
PD2
PA3
PD3
PA2
PD2
PA3
PD3
PA4
PD4 2
80
AAA
AA
80
AAA
AA
555
55
AAA
10
555
55
BA
30
X
00
1. X = " Don’t Care;" PA = Program address; PD = Program data; BA = Any address in the
block. All values in the table are in hexadecimal. The command interface only uses A-1,
A0–A10, and DQ0–DQ7 to verify the commands; A11–A20, DQ8–DQ14, and DQ15 are
"Don't Care." DQ15A-1 is A-1 when BYTE# is VIL or DQ15 when BYTE# is VIH.
2. The following is content for address and Data cycles 7 through 9: PA5-PD5, PA6-PD6,
PA7-PD7
41
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Common Flash Interface
Common Flash Interface
The common Flash interface (CFI) is a JEDEC-approved, standardized data structure
that can be read from the Flash memory device. It allows a system's software to query
the device to determine various electrical and timing parameters, density information,
and functions supported by the memory. The system can interface easily with the device, enabling the software to upgrade itself when necessary.
When the READ CFI command is issued, the device enters CFI query mode and the data
structure is read from memory. The following tables show the addresses (A-1, A[7:0])
used to retrieve the data. The query data is always presented on the lowest order data
outputs (DQ[7:0]), and the other data outputs (DQ[15:8]) are set to 0.
Table 16: Query Structure Overview
Note 1 applies to the entire table
Address
x16
x8
Subsection Name
Description
10h
20h
CFI query identification string
Command set ID and algorithm data offset
1Bh
36h
System interface information
Device timing and voltage information
27h
4Eh
Device geometry definition
Flash device layout
40h
80h
Primary algorithm-specific extended query table
Additional information specific to the primary algorithm (optional)
61h
C2h
Security code area
64-bit unique device number
Note:
1. Query data are always presented on the lowest order data outputs (DQ[7:0]). DQ[15:8]
are set to 0.
Table 17: CFI Query Identification String
Note 1 applies to the entire table
Address
x16
x8
Data
Description
10h
20h
0051h
Query unique ASCII string "QRY"
11h
22h
0052h
"R"
12h
24h
0059h
"Y"
13h
14h
26h
28h
0002h
0000h
Primary algorithm command set and control interface ID code 16-bit ID
code defining a specific algorithm
15h
16h
2Ah
2Ch
0040h
0000h
Address for primary algorithm extended query table (see the Primary Algorithm-Specific Extended Query Table)
17h
18h
2Eh
30h
0000h
0000h
Alternate vendor command set and control interface ID code second vendor-specified algorithm supported
–
19h
1Ah
32h
34h
0000h
0000h
Address for alternate algorithm extended query table
–
Note:
1. Query data are always presented on the lowest order data outputs (DQ[7:0]). DQ[15:8]
are set to 0.
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
Value
42
"Q"
AMD compatible
P = 40h
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Common Flash Interface
Table 18: CFI Query System Interface Information
Note 1 applies to the entire table
Address
x16
x8
Data
Description
Value
1Bh
36h
0027h
VCC logic supply minimum program/erase voltage
Bits[7:4] BCD value in volts
Bits[3:0] BCD value in 100mV
2.7V
1Ch
38h
0036h
VCC logic supply maximum program/erase voltage
Bits[7:4] BCD value in volts
Bits[3:0] BCD value in 100mV
3.6V
1Dh
3Ah
00B5h
VPPH (programming) supply minimum program/erase voltage
Bits[7:4] hex value in volts
Bits[3:0] BCD value in 100mV
11.5V
1Eh
3Ch
00C5h
VPPH (programming) supply maximum program/erase voltage
Bits[7:4] hex value in volts
Bits[3:0] BCD value in 100mV
12.5V
1Fh
3Eh
0004h
Typical timeout for single byte/word program = 2nμs
16µs
20h
40h
0000h
Typical timeout for maximum size buffer program =
21h
42h
000Ah
Typical timeout per individual block erase = 2nms
22h
23h
44h
46h
0000h
0004h
Typical timeout for full chip erase =
2nμs
2nms
2n
times typical
24h
48h
0004h
Maximum timeout for buffer program =
25h
4Ah
0003h
Maximum timeout per individual block erase = 2n times typical
26h
4Ch
0000h
Note:
Maximum timeout for chip erase =
2n
1s
NA
Maximum timeout for byte/word program =
2n
NA
times typical
times typical
256µs
200µs
8s
NA
1. The values in this table are valid for both packages.
Table 19: Device Geometry Definition
Address
x16
x8
Data
Description
27h
4Eh
0017h
Device size = 2n in number of bytes
Value
28h
29h
50h
52h
0002h
0000h
Flash device interface code description
2Ah
2Bh
54h
56h
0004h
0000h
Maximum number of bytes in multi-byte program or page =
2n
16B
2Ch
58h
0002h
Number of erase block regions. It specifies the number of
regions containing contiguous erase blocks of the same size.
2
8
8MB
x8, x16
asynchronous
Erase block region 1 information
2Dh
2Eh
5Ah
5Ch
0007h
0000h
Number of identical-size erase blocks = 00FFh + 1
2Fh
30h
5Eh
60h
0020h
000h
Block size = 0200h × 256 bytes
8KB
Erase block region 2 information
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
43
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Common Flash Interface
Table 19: Device Geometry Definition (Continued)
Address
x16
x8
Data
Description
Value
31h
32h
62h
64h
007Eh
0000h
Number of erase blocks of identical size = 007Eh + 1
33h
34h
66h
68h
0000h
0000h
Block size = 0100h x 256 byte
127
64KB
Erase block region 3 information
35h
36h
6Ah
6Ch
0000h
0000h
Number of erase blocks of identical size = 007Fh+1
0
37h
38h
6Eh
70h
0000h
0000h
Block size = 0000h x 256 byte
0
Erase block region 4 information
39h
3Ah
72h
74h
0000h
0000h
Number of erase blocks of identical size = 007Fh + 1
0
3Bh
3Ch
76h
78h
0000h
0000h
Block size in region 4 = 0000h x 256 byte
0
Note:
1. Bottom boot device, erase block region address locations: region 1 is address 000000h to
007FFFh; region 2 is address 008000h to 3FFFFFh. Top boot device, erase block region address locations: region 1 is address 000000h to 3F7FFFh; region 2 is address 3F8000h to
3FFFFFh.
Table 20: Primary Algorithm-Specific Extended Query Table
Note 1 applies to the entire table
Address
x16
x8
Data
Description
40h
80h
0050h
Primary algorithm extended query table unique ASCII string “PRI”
41h
82h
0052h
"R"
42h
84h
0049h
"I"
43h
86h
0031h
Major version number, ASCII
"1"
44h
88h
0033h
Minor version number, ASCII
"3"
45h
8Ah
0000h
Address sensitive unlock (bits[1:0]):
00 = Required
01 = Not required
Silicon revision number (bits[7:2])
46h
8Ch
0002h
Erase suspend:
00 = Not supported
01 = Read only
02 = Read and write
2
47h
8Eh
0004h
Block protection:
00 = Not supported
x = Number of blocks per group
4
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
Value
44
"P"
Yes
65nm
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Common Flash Interface
Table 20: Primary Algorithm-Specific Extended Query Table (Continued)
Note 1 applies to the entire table
Address
x16
x8
Data
Description
48h
90h
0001h
Temporary block unprotect:
00 = Not supported
01 = Supported
Yes
49h
92h
0004h
Block protect/unprotect:
04=M29W640F
04
4Ah
94h
0000h
Simultaneous operations:
00h = Not supported
No
4Bh
96h
0000h
Burst mode:
00 = Not supported
01 = Supported
No
4Ch
98h
0001h
Page mode:
00 = Not supported
01 = 4-word page
02 = 8-word page
Yes
4Dh
9Ah
00B5h
VPPH supply minimum program/erase voltage:
Bits[7:4] hex value in volts
Bits[3:0] BCD value in 100mV
11.5V
4Eh
9Ch
00C5h
VPPH supply maximum program/erase voltage:
Bits[7:4] hex value in volts
Bits[3:0] BCD value in 100mV
12.5V
4Fh
9Eh
00xxh
Top/bottom boot block flag:
02h = Bottom boot device
03h = Top boot device
50h
A0h
0001h
Program suspend:
00 = Not supported
01 = Supported
Note:
Value
Uniform +
VPP/WP# protecting highest or
lowest block
01
1. The values in this table are valid for both packages.
Table 21: Security Code Area
Address
x16
x8
Data
Description
61h
C3h, C2h
XXXX
64-bit unique device number
62h
C5h, C4h
XXXX
63h
C7h, C6h
XXXX
64h
C9h, C8h
XXXX
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
45
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Absolute Ratings and Operating Conditions
Absolute Ratings and Operating Conditions
Stresses greater than those listed may cause permanent damage to the device. This is a
stress rating only, and functional operation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability.
Table 22: Absolute Maximum/Minimum Ratings
Parameter
Symbol
Min
Max
Unit
Temperature under bias
TBIAS
–50
125
°C
Storage temperature
TSTG
–65
150
°C
Input/output voltage
VIO
–0.6
VCC + 0.6
V
Supply voltage
VCC
–0.6
4
V
Program voltage
VPP
–0.6
13.5
V
Identification voltage
VID
–0.6
13.5
V
Notes:
Notes
1, 2
1. During signal transitions, minimum voltage may undershoot to −2V for periods less than
20ns.
2. During signal transitions, maximum voltage may overshoot to VCC + 2V for periods less
than 20ns.
Table 23: Operating Conditions
Parameter
Symbol
M29W640FT/B
Min
Max
Unit
Supply voltage
VCC
2.7
3.6
V
Ambient operating temperature
TA
-40
85
°C
Load capacitance
CL
Input rise and fall times
–
30
–
pF
10
ns
Input pulse voltages
–
0 to VCC
V
I/O timing reference voltages
–
VCC/2
V
Note:
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
1. 85°C = industrial part; 125°C = automotive grade part.
46
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Absolute Ratings and Operating Conditions
Figure 10: AC Measurement Load Circuit
VCC
VCC
VPP
25kΩ
Device
under
test
CL
0.1µF
Note:
25kΩ
0.1µF
1. CL includes jig capacitance.
Figure 11: AC Measurement I/O Waveform
VCCQ
VCCQ/2
0V
Table 24: Input/Output Capacitance
Parameter
Input capacitance
Output capacitance
Note:
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
Symbol
Test Condition
Min
Max
Unit
CIN
VIN = 0V
–
6
pF
COUT
VOUT = 0V
–
12
pF
1. Sampled only, not 100% tested.
47
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
DC Characteristics
DC Characteristics
Table 25: DC Current Characteristics
Parameter
Input leakage current
Symbol
Conditions
Typ
Max
Unit
ILI
0V ≤ VIN ≤ VCC
–
±1
µA
–
Notes
Output leakage current
ILO
0V ≤ VOUT ≤ VCC
±1
µA
Read current
ICC1
CE# = VIL, OE# = VIH,
f = 6 MHz
10
mA
1
Standby current
ICC2
CE# = VCC ±0.2V
RP# = VCC ±0.2V
100
µA
2
Program/erase current
ICC3
Program/erase controller
active: VPP/WP# = VIL or VIH;
VPP/WP# = VPP
–
20
mA
1, 3
Current for VPP/WP# program
acceleration
IPP
VCC = 2.7V ±10%
–
15
mA
Notes:
1. In dual operations, the supply current will be the sum of ICC1 (READ operation) and ICC3
(PROGRAM/ERASE operation).
2. When the bus is inactive for 300ns or more, the memory enters automatic standby.
3. Sampled only; not 100% tested.
Table 26: DC Voltage Characteristics
Parameter
Input LOW voltage
Symbol
Conditions
Min
Max
Unit
VIL
–
–0.5
0.8
V
Input HIGH voltage
VIH
–
0.7 VCCQ
VCC + 0.3
V
Voltage for VPP/WP# program acceleration
VPP
VCC = 2.7V ±10%
11.5
12.5
V
Output LOW voltage
VOL
IOL = 1.8mA
–
0.45
V
Output HIGH voltage
VOH
IOH = –100µA
VCC - 0.4
–
V
Identification voltage
VID
–
11.5
12.5
V
Program/erase lockout
supply voltage
VLKO
–
1.8
2.3
V
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
48
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Read AC Characteristics
Read AC Characteristics
Table 27: Read AC Characteristics
Symbol
Parameter
60
70
Legacy
JEDEC
Condition
Min
Max
Min
Max
Unit
Address valid to next address
valid
tRC
tAVAV
CE# = VIL,
OE# = VIL
60
–
70
–
ns
Address valid to output valid
tACC
tAVQV
CE# = VIL,
OE# = VIL
–
60
–
70
ns
Address valid to output valid
(page)
tPAGE
tAVQV1
CE# = VIL,
OE# = VIL
–
25
–
25
ns
CE# LOW to output transition
tLZ
tELQX
OE# = VIL
0
–
0
–
ns
tE
tELQV
OE# = VIL
–
60
–
70
ns
tOLZ
tGLQX
CE# = VIL
0
–
0
–
ns
OE# LOW to output valid
tOE
tGLQV
CE# = VIL
–
25
–
25
ns
CE# HIGH to output High-Z
tHZ
tEHQZ
OE# = VIL
–
25
–
25
ns
1
OE# HIGH to output High-Z
tDF
tGHQZ
CE# = VIL
–
25
–
25
ns
1
CE#, OE#, or address transition
to output transition
tOH
tEHQX,
–
0
–
0
–
ns
CE# LOW to output valid
OE# LOW to output transition
Notes
1
1
tGHQX,
tAXQX
CE# to BYTE# LOW
tELFL
tELBL
–
–
5
–
5
ns
CE# to BYTE# HIGH
tELFH
tELBH
–
–
5
–
5
ns
BYTE# LOW to output HIgh-Z
tFLQZ
tBLQZ
–
–
25
–
25
ns
BYTE# HIGH to output valid
tFHQV
tBHQV
–
–
30
–
30
ns
Note:
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
1. Sampled only; not 100% tested.
49
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Read AC Characteristics
Figure 12: Random AC Timing
tRC
A[MAX:0]/
A–1
Valid
tACC
tOH
CE#
tOH
tE
tHZ
tLZ
OE#
tOLZ
tOH
tOE
DQ[7:0]
DQ[15:8]
tDF
Valid
tFLQV
BYTE#
tFLQZ
tELFH/tELFH
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
50
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Read AC Characteristics
Figure 13: Page Read AC Timing
A[MAX:2]
A[1:0]
Valid
Valid
Valid
Valid
Valid
tACC
CE#
tE
tOH
tHZ
OE#
tOH
tOE
DQ[15:0]
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
tPAGE
Valid
tDF
Valid
51
Valid
Valid
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Write AC Characteristics
Write AC Characteristics
Table 28: WE#-Controlled Write AC Characteristics
Symbol
Parameter
60
70
Legacy
JEDEC
Min
Max
Min
Max
Unit
tWC
tAVAV
60
–
70
–
ns
CE# LOW to WE# LOW
tCS
tELWL
0
–
0
–
ns
WE# LOW to WE# HIGH
tWP
tWLWH
45
–
45
–
ns
Input valid to WE# HIGH
tDS
tDVWH
45
–
45
–
ns
WE# HIGH to input transition
tDH
tWHDX
0
–
0
–
ns
WE# HIGH to CE# HIGH
tCH
tWHEH
0
–
0
–
ns
WE# HIGH to WE# LOW
tWPH
tWHWL
30
–
30
–
ns
Address valid to WE# LOW
tAS
tAVWL
0
–
0
–
ns
WE# LOW to address transition
tAH
tWLAX
45
–
45
–
ns
OE# HIGH to WE# LOW
–
tGHWL
0
–
0
–
ns
WE# HIGH to OE# LOW
tOEH
tWHGL
0
–
0
–
ns
Program/erase valid to RY/BY#
LOW
tBUSY
tWHRL
–
30
–
30
ns
tVCS
tVCHEL
50
–
50
–
µs
Address valid to next address valid
VCC HIGH to CE# LOW
Note:
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
Notes
1
1. Sampled only; not 100% tested.
52
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Write AC Characteristics
Figure 14: WE#-Controlled AC Timing
tWC
A[MAX:0]/
A-1
Valid
tAH
tAVWL
tCH
CE#
tCS
OE#
tGHWL
tOEH
tWP
WE#
tWPH
tDS
DQ[7:0]/
DQ[15:8]
VCC
tDH
Valid
tVCS
RY/BY#
tBUSY
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
53
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Write AC Characteristics
Table 29: CE#-Controlled Write AC Characteristics
Symbol
Parameter
60
70
Legacy
JEDEC
Min
Max
Min
Max
Unit
Address valid to next address valid
tWC
tAVAV
60
–
70
–
ns
WE# LOW to CE# LOW
tWS
tWLEL
0
–
0
–
ns
CE# LOW to CE# HIGH
tCP
tELEH
45
–
45
–
ns
Input valid to CE# HIGH
tDS
tDVEH
45
–
45
–
ns
CE# HIGH to input transition
tDH
tEHDX
0
–
0
–
ns
CE# HIGH to WE# HIGH
tWH
tEHWH
0
–
0
–
ns
CE# HIGH to CE# LOW
tCPH
tEHEL
30
–
30
–
ns
Address valid to CE# LOW
tAS
tAVEL
0
–
0
–
ns
CE# LOW to address transition
tAH
tELAX
45
–
45
–
ns
OE# HIGH to CE# LOW
–
tGHEL
0
–
0
–
ns
CE# HIGH to OE# LOW
tOEH
tEHGL
0
–
0
–
ns
Program/erase valid to RY/BY# LOW
tBUSY
tEHRL
–
30
–
30
ns
tVCS
tVCHWL
50
–
50
–
ns
VCC HIGH to WE# LOW
Note:
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
Notes
1
1. Sampled only; not 100% tested.
54
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Write AC Characteristics
Figure 15: CE#-Controlled AC Timing
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
55
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Program/Erase Characteristics
Program/Erase Characteristics
Table 30: Program/Erase Times and Endurance Cycles
Notes 1 and 2 apply to the entire table
Parameter
Min
Typ
Max
Unit
Notes
Chip erase
–
80
400
s
3
Block erase (64KB)
–
0.8
6
s
4
Erase suspend latency time
–
–
50
µs
4
Program (byte or word)
–
10
200
µs
3
Double byte
–
10
200
µs
Double word /quadruple byte program
10
200
µs
3
Quadruple word/octuple byte program
10
200
µs
3
Chip program (byte by byte)
–
80
400
s
3
Chip program (word by word)
–
40
200
s
3
Chip program (double word/quadruple byte
program)
–
20
100
s
3
Chip program (quadruple word/octuple byte
program)
–
10
50
s
3
Program suspend latency time
–
–
4
µs
100,000
–
–
cycles
20
–
–
years
PROGRAM/ERASE cycles (per block)
Data retention
Notes:
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
1. Typical values measured at room temperature and nominal voltages.
2. Sampled, but not 100% tested.
3. Maximum value measured at worst case conditions for both temperature and VCC after
100,000 PROGRAM/ERASE cycles.
4. Maximum value measured at worst case conditions for both temperature and VCC.
56
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Reset Characteristics
Reset Characteristics
Table 31: Reset/Block Temporary Unprotect AC Characteristics
Symbol
Condition/Parameter
RST# HIGH to WE# LOW, CE# LOW, OE#
LOW
M29W640FT/B
Legacy
JEDEC
60
70
Unit
Notes
tRH
tPHWL
50
50
ns
1
0
0
ns
1
Min
tPHEL
tPHGL
RY/BY# HIGH to WE# LOW, CE# LOW,
OE# LOW
tRB
Min
tRHWL
tRHEL
tRHGL
RST# pulse width
RST# LOW to read mode
RST# rise time to VID
Min
tRP
tPLPX
500
500
ns
Max
tREADY
tPLYH
50
50
µs
Min
tVIDR
tPHPHH
tVHVPP
VPP rise and fall time
Note:
1
500
500
ns
1
250
250
ns
1
1. Sampled only; not 100% tested.
Figure 16: Reset/block Temporary Unprotect AC Waveforms
WE#, CE#,
OE#
tRH
RY/BY#
tRB
tRP
RST#
tVIDR
tREADY
Figure 17: Accelerated Program Timing Waveforms
VPP/WP#
VPPH
VIL or VIH
tVHVPP
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
57
tVHVPP
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Package Dimensions
Package Dimensions
Figure 18: 48-Pin TSOP – 12mm x 20mm
1
48
0.50 TYP
12.00 + 0.10
0.22 + 0.05
24
0.80 TYP
25
1.00 + 0.05
18.40 + 0.10
1.20 MAX
20.00 + 0.20
0.10 + 0.05
Die
0.10 MIN/
0.21 MAX
o
3 o+ 2 o
3
0.60 + 0.10
0.10 MAX
Note:
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
1. All dimensions are in millimeters.
58
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Package Dimensions
Figure 19: 48-Ball TFBGA – 6mm x 8mm
6.00 + 0.10
4.00 TYP
0.40 TYP
1.00 TYP
1.20 TYP
0.40 TYP
8.00 + 0.10
Ball A1
5.60 TYP
0.10 MAX
0.80 TYP
0.80 TYP
0.35 MIN/
0.45 MAX
0.90 MAX
1.20 MAX
Note:
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
0.26 MIN
1. All dimensions are in millimeters.
59
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
64Mb: 3V Embedded Parallel NOR Flash
Revision History
Revision History
Rev. C – 2/18
• Added Important Notes and Warnings section for further clarification aligning to industry standards
Rev. B – 01/16
• Updated Commands tables for 16-Bit Mode and 8-Bit Mode in Command Interface
Rev. A – 07/13
• Initial Micron brand release
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-4000
www.micron.com/products/support Sales inquiries: 800-932-4992
Micron and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.
Although considered final, these specifications are subject to change, as further product development and data characterization sometimes occur.
PDF: 09005aef8551a2ac
m29w_640f.pdf - Rev. C 2/18 EN
60
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
工商网监
湘ICP备2023018690号
