MT28F160C3

ADVANCE‡ 1 MEG x 16 3V ENHANCED+ BOOT BLOCK FLASH MEMORY FLASH MEMORY FEATURES • Thirty-nine erase blocks: Eight 4K-word parameter blocks Thirty-one 32K-word main memory blocks • VCC, VCCQ and VPP voltages: 2.7V–3.3V VCC 2.7V–3.3V VCCQ* 1.65V–3.3V and 12V VPP • Address access times: 90ns, 110ns at 2.7V–3.3V • Low power consumption: Standby and deep power-down mode < 1µA (typical ICC) Automatic power saving feature (APS mode) • Enhanced WRITE/ERASE SUSPEND (1µs typical) • 128-bit OTP area for security purposes • Industry-standard command set compatibility • Software/hardware block protection MT28F160C3 Low Voltage, Extended Temperature BALL ASSIGNMENT (Top View) 46-Ball FBGA 1 A B C D E F A13 2 A11 3 A8 4 VPP 5 WP# 6 A19 7 A7 8 A4 A14 A10 WE# RP# A18 A17 A5 A2 A15 A12 A9 A6 A3 A1 A16 DQ14 DQ5 DQ11 DQ2 DQ8 CE# A0 VCCQ DQ15 DQ6 DQ12 DQ3 DQ9 DQ0 VSS VSS DQ7 DQ13 DQ4 VCC DQ10 DQ1 OE# OPTIONS • Timing 90ns access 110ns access • Boot Block Starting Address Top (FFFFFH) Bottom (00000H) • Package 46-ball FBGA (6 x 8 ball grid) • Temperature Range Commercial (0°C to +70°C) Extended (-40°C to +85°C) *Lower VCCQ ranges are available upon request. Part Number Example: NUMBER -9 -11 T B FD None ET (Ball Down) NOTE: See page 3 for Ball Description Table. See last page for mechanical drawing. MT28F160C3FD-11 TET has an I/O supply of 2.7V (MIN). Programming in production is accomplished by using high voltage which can be supplied on a separate line. The embedded WORD WRITE and BLOCK ERASE functions are fully automated by an on-chip write state machine (WSM), which simplifies these operations and relieves the system processor of secondary tasks. The WSM status can be monitored by an on-chip status register to determine the progress of program/erase tasks. The device is equipped with 128 bits of one time programmable (OTP) area. The soft protection feature for blocks will mark them as read-only by configuring soft protection registers with command sequences. Please refer to Micron’s Web site (www.micron.com/ flash) for the latest data sheet. GENERAL DESCRIPTION The MT28F160C3 is a nonvolatile, electrically blockerasable (flash), programmable, read-only memory containing 16,777,216 bits organized as 1,048,576 words (16 bits). The MT28F160C3 is manufactured on 0.22µm process technology in a 48-ball FBGA package. The device 1 Meg x 16 3V Enhanced+ Boot Block Flash Memory MT28F160C3_3.p65 – Rev. 3, Pub. 8/01 DEVICE MARKING Due to the size of the package, Micron’s standard part number is not printed on the top of each device. Instead, an abbreviated device mark comprised of a five-digit alphanumeric code is used. The abbreviated device marks are cross referenced to Micron part numbers in Table 1. 1 ©2001, Micron Technology, Inc. ‡PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE FOR EVALUATION AND REFERENCE PURPOSES ONLY AND ARE SUBJECT TO CHANGE BY MICRON WITHOUT NOTICE. PRODUCTS ARE ONLY WARRANTED BY MICRON TO MEET MICRON’S PRODUCTION DATA SHEET SPECIFICATIONS. ADVANCE 1 MEG x 16 3V ENHANCED+ BOOT BLOCK FLASH MEMORY ARCHITECTURE The MT28F160C3 flash contains eight 4K-word parameter blocks and thirty-one 32K-word blocks. Memory is organized by using a blocked architecture to allow independent erasure of selected memory blocks. Any address within a block address range selects that block for the required READ, WRITE, or ERASE operation (see Figures 1 and 2). Table 1 Cross Reference for Abbreviated Device Marks1 PART NUMBER MT28F160C3FD-9 BET MT28F160C3FD-9 TET MT28F160C3FD-11 BET MT28F160C3FD-11 TET PRODUCT MARKING FW610 FW611 FW612 FW613 SAMPLE MARKING FX610 FX611 FX612 FX613 NOTE: 1. The mechanical sample marking is FY610. FUNCTIONAL BLOCK DIAGRAM DQ0–DQ15 X DEC Data Input Buffer Data Register RP# CE# WE# OE# Y/Z DEC Bank a Blocks Y/Z Gating/Sensing ID Reg. CSM Status Reg. WSM Program/ Erase Change Pump Voltage Switch Output Multiplexer DQ0–DQ15 Output Buffer I/O Logic Data Comparator A0–A19 Address Input Buffer APS Control Address CNT WSM Address Multiplexer Y/Z DEC X DEC Y/Z Gating/Sensing Bank b Blocks Address Latch 1 Meg x 16 3V Enhanced+ Boot Block Flash Memory MT28F160C3_3.p65 – Rev. 3, Pub. 8/01 2 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2001, Micron Technology, Inc. ADVANCE 1 MEG x 16 3V ENHANCED+ BOOT BLOCK FLASH MEMORY BALL DESCRIPTIONS 46-BALL FBGA NUMBERS SYMBOL 3B WE# TYPE Input DESCRIPTION Write Enable: Determines if a given cycle is a WRITE cycle. If WE# is LOW, the cycle is either a WRITE to the command state machine (CSM) or to the memory array. Write Protect: Unlocks the soft-protected blocks when HIGH if V PP = 1.65V–3.3V or 12V and RP# = VIH for WRITE or ERASE. Does not affect WRITE or ERASE operation on other blocks. Chip Enable: Activates the device when LOW. When CE# is HIGH, the device is disabled and goes into standby power mode. Reset/Power-Down: When LOW, RP# clears the status register, sets the write state machine (WSM) to the array read mode and places the device in deep power-down mode. All inputs, including CE#, are “Don’t Care,” and all outputs are High-Z. RP# must be held at VIH during all other modes of operation. Output Enable: Enables data output buffers when LOW. When OE# is HIGH, the output buffers are disabled. Address Inputs: These address inputs select a unique, 16-bit word out of the 1,048,576 available. 5A WP# Input 7D 4B CE# RP# Input Input 8F 1A, 1B, 1C, 1D, 2A, 2B, 2C, 3A, 3C, 5B, 6A, 6B, 6C, 7A, 7B, 7C, 8A, 8B, 8C, 8D OE# A0-A19 Input Input 2D, 2E, 2F, 3D, DQ0-DQ15 3E, 3F, 4D, 4E, 4F, 5D, 5E, 6D, 6E, 6F, 7E, 7F 4A VPP Input/ Output Data I/O: These data I/O are data output lines during any READ operation or data input lines during a WRITE. Data I/O are used to input commands to the CSM. Write/Erase Supply Voltage: From a WRITE or ERASE CONFIRM until completion of the operation, VPP must be 1.65V–3.3V or 12V. VPP = “Don’t Care” during all other operations. Power Supply: 2.7V–3.3V. I/O Supply Voltage: 2.7V–3.3V. Ground. Supply 5F 1E 1F, 8E VCC VCCQ VSS Supply Supply Supply 1 Meg x 16 3V Enhanced+ Boot Block Flash Memory MT28F160C3_3.p65 – Rev. 3, Pub. 8/01 3 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2001, Micron Technology, Inc. ADVANCE 1 MEG x 16 3V ENHANCED+ BOOT BLOCK FLASH MEMORY TRUTH TABLE1 FUNCTION Standby RESET READING READ Output Disable WRITE/ERASE (EXCEPT SOFT PROTECTED BLOCKS)2 ERASE SETUP ERASE CONFIRM3 WRITE SETUP WRITE4 READ ARRAY5 WRITE/ERASE (SOFT-PROTECTED BLOCKS)2 ERASE SETUP ERASE CONFIRM3 WRITE SETUP WRITE4 READ ARRAY5 DEVICE IDENTIFICATION6 Manufacturer Device (top boot) Device (bottom boot) NOTE: 1. 2. 3. 4. 5. 6. RP# H L H H H H H H H H H H H H H H H CE# H X L L L L L L L L L L L L L L L OE# X X L H H H H H H H H H H H L L L WE# X X H H L L L L L L L L L L H H H WP# X X X X X X X X X X H X H X X X X VPP X X X X X VPPH X VPPH X X VPPH X VPPH X X X X A0 X X X X X X X X X X X X X X L H H DQ0-DQ7 DQ8-DQ15 High-Z High-Z Data-Out High-Z 20H D0H 10H/40H Data-In FFH 20H D0H 10H/40H Data-In FFH 2CH 92H 93H High-Z High-Z Data-Out High-Z X X X Data-In X X X X Data-In X 00H 44H 44H L = VIL (LOW), H = VIH (HIGH), X = VIL or VIH (“Don’t Care”). VPPH1 = 1.65V–3.3V and VPPH2 = 12V. Operation must be preceded by ERASE SETUP command. Operation must be preceded by WRITE SETUP command. The READ ARRAY command must be issued before reading the array after writing or erasing. See Table 3 for the IDENTIFY DEVICE command. 1 Meg x 16 3V Enhanced+ Boot Block Flash Memory MT28F160C3_3.p65 – Rev. 3, Pub. 8/01 4 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2001, Micron Technology, Inc. ADVANCE 1 MEG x 16 3V ENHANCED+ BOOT BLOCK FLASH MEMORY Figure 1 Top Boot Block Memory Address Map ADDRESS RANGE FFFFFh F8000h F7FFFh F0000h EFFFFh E8000h E7FFFh E0000h DFFFFh D8000h D7FFFh D0000h CFFFFh C8000h C7FFFh C0000h BFFFFh B8000h B7FFFh B0000h AFFFFh A8000h A7FFFh A0000h 9FFFFh 98000h 97FFFh 90000h 8FFFFh 88000h 87FFFh 80000h 7FFFFh 78000h 77FFFh 70000h 6FFFFh 68000h 67FFFh 60000h 5FFFFh 58000h 57FFFh 50000h 4FFFFh 48000h 47FFFh 40000h 3FFFFh 38000h 37FFFh 30000h 2FFFFh 28000h 27FFFh 20000h 1FFFFh 18000h 17FFFh 10000h 0FFFFh 08000h 07FFFh 00000h 8 x 4K-Word Blocks 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 4K-Word Block Parameter Blocks 4K-Word Block 4K-Word Block 4K-Word Block 4K-Word Block 4K-Word Block 4K-Word Block 4K-Word Block FFFFFh FF000h FEFFFh FE000h FDFFFh FD000h FCFFFh FC000h FBFFFh FB000h FAFFFh FA000h F9FFFh F9000h F8FFFh F8000h 1 Meg x 16 3V Enhanced+ Boot Block Flash Memory MT28F160C3_3.p65 – Rev. 3, Pub. 8/01 5 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2001, Micron Technology, Inc. ADVANCE 1 MEG x 16 3V ENHANCED+ BOOT BLOCK FLASH MEMORY Figure 2 Bottom Boot Block Memory Address Map ADDRESS RANGE FFFFFh F8000h F7FFFh F0000h EFFFFh E8000h E7FFFh E0000h DFFFFh D8000h D7FFFh D0000h CFFFFh C8000h C7FFFh C0000h BFFFFh B8000h B7FFFh B0000h AFFFFh A8000h A7FFFh A0000h 9FFFFh 98000h 97FFFh 90000h 8FFFFh 88000h 87FFFh 80000h 7FFFFh 78000h 77FFFh 70000h 6FFFFh 68000h 67FFFh 60000h 5FFFFh 58000h 57FFFh 50000h 4FFFFh 48000h 47FFFh 40000h 3FFFFh 38000h 37FFFh 30000h 2FFFFh 28000h 27FFFh 20000h 1FFFFh 18000h 17FFFh 10000h 0FFFFh 08000h 07FFFh 00000h 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 32K-Word Block 8 x 4K-Word Blocks 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 07FFFh 07000h 06FFFh 06000h 05FFFh 05000h 04FFFh 04000h 03FFFh 03000h 02FFFh 02000h 01FFFh 01000h 00FFFh 00000h 4K-Word Block 4K-Word Block 4K-Word Block 4K-Word Block 4K-Word Block 4K-Word Block Parameter Blocks 4K-Word Block 4K-Word Block 1 Meg x 16 3V Enhanced+ Boot Block Flash Memory MT28F160C3_3.p65 – Rev. 3, Pub. 8/01 6 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2001, Micron Technology, Inc. ADVANCE 1 MEG x 16 3V ENHANCED+ BOOT BLOCK FLASH MEMORY MEMORY ORGANIZATION The MT28F160C3 memory array is segmented into 31 blocks of 32K words, along with eight 4K-word parameter blocks. The device is available with block architecture mapped in either of the two configurations: the parameter blocks located at the top or at the bottom of the memory array, as required by different microprocessors. The MT28F160C3 top boot configuration with the blocks and address ranges is shown in Figure 1 and the bottom boot configuration in Figure 2. circuitry initializes the chip to a read array mode of operation. Changing the mode of operation requires that a command code be entered into the CSM. The on-chip status register allows the progress of various operations to be monitored. The status register is interrogated by entering a READ STATUS REGISTER command onto the CSM (cycle 1) and reading the register data on I/Os DQ0DQ7 (cycle 2). Status register bits SR0-SR7 correspond to DQ0-DQ7 (see Table 3). COMMAND STATE MACHINE Commands are issued to the command state machine (CSM) using standard microprocessor write timings. The CSM acts as an interface between the external microprocessor and the internal write state machine (WSM). The available commands are listed in Table 2, and the descriptions of these commands are shown in Table 3. Program and erase algorithms are automated by an on-chip WSM. Once a valid program/erase command sequence is entered, the WSM executes the appropriate algorithm, which generates the necessary timing signals to control the device internally to accomplish the requested operation. A command is valid only if the exact sequence of WRITEs is completed. After the WSM completes its task, the WSM status bit (SR7) is set to a logic HIGH level (1), allowing the CSM to respond to the full command set again. Table 2 Command State Machine Codes for Device Mode Selection COMMAND DQ0–DQ7 10h/40h 20h 50h 70h 90h 0Fh B0h D0h CODE ON DEVICE MODE Write setup/alternate write setup Block erase setup Clear status register Read status register Identify device Soft protection Program/erase suspend Program/erase resume Erase confirm Read array/OTP exit OTP entry Reserved OPERATION Device operations are selected by entering standard JEDEC 8-bit command codes with conventional microprocessor timings into an on-chip CSM through I/Os DQ0-DQ7. When the device is powered up, internal reset FFh AFh 60h 1 Meg x 16 3V Enhanced+ Boot Block Flash Memory MT28F160C3_3.p65 – Rev. 3, Pub. 8/01 7 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2001, Micron Technology, Inc. ADVANCE 1 MEG x 16 3V ENHANCED+ BOOT BLOCK FLASH MEMORY COMMAND DEFINITIONS Once a specific command code has been entered, the WSM executes an internal algorithm generating the necessary timing signals to program, erase, and verify data. See Table 3 for the CSM command definitions and data for each of the bus cycles. Table 3 Command Definitions FIRST CYCLE COMMAND READ ARRAY IDENTIFY DEVICE READ STATUS REGISTER WORD PROGRAM BLOCK ERASE PROGRAM/ERASE SUSPEND PROGRAM/ERASE RESUME CLEAR STATUS REGISTER SOFT PROTECTION OTP ENTRY OTP EXIT NOTE: 1. 2. 3. 4. 5. 6. 7. 8. 9. SECOND CYCLE CSM/INPUT FFh 90h 70h 10h/40h 20h B0h D0h 50h 0Fh AFh FFh WRITE WRITE WRITE BA X X SPC AFh FFh OPERATION READ READ READ WRITE WRITE ADDRESS WA IA BA WA BA DATA AD ID SRD PD D0h OPERATION WRITE WRITE WRITE WRITE WRITE WRITE WRITE WRITE WRITE WRITE WRITE ADDRESS X X X X X X X X X X X The command data is written through DQ0-DQ7 ID = Manufacturer ID: 002Ch; Device ID (Top Boot): 4492h; Device ID (Bottom Boot): 4493h IA = Identify address: 00000h for manufacturer code and 00001h for device code BA = Any address within the block to be selected WA = Word address AD = Array data SRD = Data read from status register PD = Data to be written at location WA SPC = Soft protect command: 00h = Clear all soft protection FFh = Set all soft protection F0h = Clear addressed block soft protection 0Fh = Set addressed block soft protection 10. X = Don’t Care 1 Meg x 16 3V Enhanced+ Boot Block Flash Memory MT28F160C3_3.p65 – Rev. 3, Pub. 8/01 8 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2001, Micron Technology, Inc. ADVANCE 1 MEG x 16 3V ENHANCED+ BOOT BLOCK FLASH MEMORY STATUS REGISTER The status register allows the user to determine whether the state of a PROGRAM/ERASE operation is pending or complete. The status register is monitored by toggling OE# and CE# and by reading the resulting status code on I/Os DQ0-DQ7. The high-order I/Os (DQ8-DQ15) are set to 00h internally, so only the low-order I/Os (DQ0DQ7) need interpreting. Register data is updated on the falling edge of OE# or CE#. The latest falling edge of either of these two signals updates the latch within a given READ cycle. Latching the data prevents errors from occurring if the register input changes during a status register monitoring. To ensure that the status register output contains updated status data, CE# or OE# must be toggled for each subsequent STATUS READ. The status register provides the internal state of the WSM to the external microprocessor. During periods when the WSM is active, the status register can be polled to determine the WSM status. Table 4 defines the status register bits. After monitoring the status register during a PROGRAM/ERASE, the data appearing on DQ0-DQ7 remains as status register data until a new command is issued to the CSM. To return the device to other modes of operation, a new command must be issued to the CSM. CLEAR STATUS REGISTER The WSM can set to “1” the block lock status bit (SR1), the VPP status bit (SR3), the program status bit (SR4), and the erase status bit (SR5) of the status register. The CLEAR STATUS REGISTER command (50h) allows the external microprocessor to clear these status bits and synchronize to internal operations. After issuing this command, the status bits are cleared and the device returns to the read array mode. READ OPERATIONS Three READ operations are available: read array, read device identification code, and read status register. READ ARRAY The array is read by entering the command code FFh on DQ0-DQ7. Control signals CE# and OE# must be at a logic LOW level (VIL) and WE# and RP# must be at a logic HIGH level (VIH) to read data from the array. Data is available on DQ0-DQ15. Any valid address within any of the blocks selects that address and allows data to be read from that address. Upon initial power-up, the device defaults to the read array mode. READ DEVICE IDENTIFICATION CODE Device identification codes are read by entering command code 90h on DQ0-DQ7. Two bus cycles are required for this operation, the first to enter the command code and the second to read the selected code. Control signals CE# and OE# must be at a logic LOW level (VIL) and WE# and RP# must be at a logic HIGH level (VIH). The manufacturer code is obtained on DQ0-DQ15 in the second cycle, after the identify address 00000h is latched. The device code is obtained on DQ0-DQ15 in the second cycle, after the identify address 00001h is latched (see Table 3). READ STATUS REGISTER The status register is read by entering the command code 70h on DQ0-DQ7. Control signals CE# and OE# must be at a logic LOW level (VIL), and WE# and RP# must be at a logic HIGH level (VIH). Two bus cycles are required for this operation: one to enter the command code, and one to read the status register. The status register contents are updated on the falling edge of CE# or OE#, whichever occurs last within the cycle. COMMAND STATE MACHINE OPERATIONS The CSM decodes instructions for read, read device identification code, read status register, clear status register, program, erase, erase suspend, erase resume, program suspend, program resume, soft protection, and OTP entry/exit. The 8-bit command code is input to the device on DQ0-DQ7 (see Table 2 for CSM codes). During a PROGRAM or ERASE cycle, the CSM informs the WSM that a PROGRAM or ERASE cycle has been requested. During a PROGRAM cycle, the WSM controls the program sequences and the CSM responds to a PROGRAM SUSPEND command only. During an ERASE cycle, the CSM responds to an ERASE SUSPEND command only. When the WSM has completed its task, the WSM status bit (SR7) is set to a logic HIGH level and the CSM responds to the full command set. The CSM stays in the current command state until the microprocessor issues another command. The WSM successfully initiates an ERASE or PROGRAM operation only when VPP is within its correct voltage range. For data protection, it is required that RP# be held at a logic LOW level during a CPU reset. 1 Meg x 16 3V Enhanced+ Boot Block Flash Memory MT28F160C3_3.p65 – Rev. 3, Pub. 8/01 9 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2001, Micron Technology, Inc. ADVANCE 1 MEG x 16 3V ENHANCED+ BOOT BLOCK FLASH MEMORY Table 4 Status Register STATUS BIT # SR7 STATUS REGISTER BIT WRITE STATE MACHINE STATUS (WSM) 1 = Ready 0 = Busy ERASE SUSPEND STATUS 1 = ERASE SUSPEND 0 = ERASE in progress or ERASE complete ERASE STATUS 1 = BLOCK ERASE error 0 = BLOCK ERASE successful PROGRAM STATUS 1 = PROGRAM error 0 = PROGRAM successful VPP STATUS 1 = Program abort VPP range error 0 = VPP good PROGRAM SUSPEND STATUS 1 = PROGRAM suspended 0 = PROGRAM in progress or PROGRAM complete BLOCK LOCK STATUS 1 = Block locked 0 = Block not locked RESERVED DESCRIPTION If SR7 = 0 (busy), the WSM has not completed an ERASE or PROGRAM operation. If SR7 = 1 (ready), other operations can be performed. If SR6 = 1, WSM halts execution, indicating that the ERASE operation has been suspended. SR6 remains “1” until an ERASE RESUME command is issued. SR5 = 0 indicates that a BLOCK ERASE has been successful. SR5 = 1 indicates that an erase has failed; therefore, the WSM has completed the maximum allowable erase pulses determined by the internal algorithm but which were insufficient to completely erase the device. SR4 = 0 indicates successful programming has occurred at the address location. SR4 = 1 indicates the WSM was unable to correctly program the addressed location. SR3 provides status of VPP during programming. SR6 SR5 SR4 SR3 SR2 If SR2 = 1, WSM halts execution, indicating the PROGRAM operation has been suspended. SR2 stays “1” until a PROGRAM RESUME command is issued. SR1 = 1 indicates that the address block is locked when WP# = VIL. Any attempt to program/erase this block will abort the operation and the device will return to read status mode. SR1 SR0 NOTE: 1. After a PROGRAM/ERASE command is issued and confirmed, status bit SR7 goes LOW to indicate that the operation is in progress. If SR7 = 1 (ready), other polling operations can be performed. Until this occurs, the other status bits are not valid. SR7 is not updated automatically at the completion of a WSM task; therefore, if the WSM status bit shows busy (0), OE# and CE# must be toggled periodically to determine when the WSM has completed an operation (SR7 = 1). 2. When an ERASE SUSPEND command is issued, the WSM halts execution and sets SR6 = 1, indicating that the ERASE operation has been suspended. The WSM status bit is also set to HIGH (SR7 = 1), indicating that the ERASE SUSPEND operation has been completed successfully. 3. During an ERASE error, the SR5 bit is set (SR5 = 1), while SR5 = 0 indicates that a successful block erasure has occurred. 4. If the WSM is unable to program the addressed location correctly, the SR4 bit is set (SR4 = 1) and SR4 = 0 indicates that a successful programming operation has occurred at the addressed block location. Information concerning the status of VPP during programming/erasure is provided by SR3. If VPP is lower than VPPLK after a PROGRAM/ERASE command has been issued, SR3 is set to a “1,” indicating that the PROGRAM/ERASE operation has aborted due to a low VPP. 5. During a PROGRAM SUSPEND command, the WSM halts execution and the SR2 bit is set, indicating that the PROGRAM operation has been suspended. This bit remains ”1” until a PROGRAM RESUME command is issued. The WSM status bit is also set to HIGH (SR7 = 1), indicating that the PROGRAM SUSPEND operation has been completed successfully. 6. A proper block address must be provided in an ERASE operation. If that addressed block is protected, then the SR1 bit is set (SR1 = 1) when WP# = VIL. If that block is not protected, then SR1 = 0. 1 Meg x 16 3V Enhanced+ Boot Block Flash Memory MT28F160C3_3.p65 – Rev. 3, Pub. 8/01 10 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2001, Micron Technology, Inc. ADVANCE 1 MEG x 16 3V ENHANCED+ BOOT BLOCK FLASH MEMORY PROGRAMMING OPERATIONS There are two CSM commands for programming: program setup and alternate program setup (see Table 2). After the desired command code is entered, the WSM takes over and correctly sequences the device to complete the program operation. Monitoring of the WRITE operation is possible through the status register (see the Status Register section). During this time, the CSM responds only to a PROGRAM SUSPEND command until the PROGRAM operation has been completed, after which all commands to the CSM become valid again. (See Figure 4 for programming operation.) During programming, V PP m ust remain in the appropriate VPP voltage range as shown in the recommended operating conditions table. Different combinations of RP#, WP#, and VPP voltage levels ensure that data in certain blocks are secure and therefore cannot be programmed (see Table 5 for a list of combinations). Only “0s” are written and compared during a PROGRAM operation. If “1s” are programmed, the memory cell contents do not change and no error occurs. PROGRAM SUSPENSION The PROGRAM operation can be suspended by issuing a PROGRAM SUSPEND command (B0h). The PROGRAM SUSPEND command typically takes 1µs to execute, and the device is then in program suspend mode. Once the WSM has reached the suspend state, it allows the CSM to respond only to READ ARRAY, READ STATUS REGISTER, and PROGRAM RESUME commands. During the PROGRAM SUSPEND operation, array data should be read from an address other than the one being programmed. To resume the PROGRAM operation, a PROGRAM RESUME command (D0h) must be issued to cause the CSM to clear the suspend state previously set. (See Figure 7 for PROGRAM SUSPEND and PROGRAM RESUME.) ERASE OPERATIONS An ERASE operation must be used to initialize all bits in an array block to “1s.” After BLOCK ERASE CONFIRM is issued, the CSM responds only to an ERASE SUSPEND command until the WSM completes its task. Block erasure inside the memory array sets all bits within the addressed block to logic 1s. Erase is accomplished only by blocks; data at single address locations within the array cannot be erased individually. The block to be erased is selected by using any valid address within that block. Note that different combinations of RP#, WP# and VPP voltage levels ensure that data in certain blocks are secure and therefore cannot be erased (see Table 5 for a list of combinations). Block erasure is initiated by a command sequence to the CSM: block erase setup (20h) followed by block erase confirm (D0h) (see Figure 5). A two-command erase sequence protects against accidental erasure of memory contents. When the BLOCK ERASE CONFIRM command is complete, the WSM automatically executes a sequence of events to complete the block erasure. During this sequence, the block is programmed with logic 0s, data is verified, all bits in the block are erased, and finally verification is performed to ensure that all bits are correctly erased. Monitoring of the ERASE operation is possible through the status register (see the Status Register section). ERASE SUSPENSION During the execution of an ERASE operation, the ERASE SUSPEND command (B0h) can be entered to direct the WSM to suspend the ERASE operation. The ERASE SUSPEND command typically takes 1µs to execute, and the device is then in erase suspend mode. Once the WSM has reached the suspend state, it allows the CSM to respond only to the READ ARRAY, READ STATUS REGISTER, ERASE RESUME and PROGRAM commands. Dur- Table 5 Data Protection Combinations DATA PROTECTION PROVIDED All blocks locked All blocks locked All blocks unlocked Soft-protected blocks locked VPP ≤ VPPLK X VPPLK VPPLK RP# X VIL VIH VIH WP# X X VIH VIL 1 Meg x 16 3V Enhanced+ Boot Block Flash Memory MT28F160C3_3.p65 – Rev. 3, Pub. 8/01 11 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2001, Micron Technology, Inc. ADVANCE 1 MEG x 16 3V ENHANCED+ BOOT BLOCK FLASH MEMORY ing the ERASE SUSPEND operation, array data must be read from a block other than the one being erased. To resume the ERASE operation, an ERASE RESUME command (D0h) must be issued to cause the CSM to clear the suspend state previously set. It is also possible that an ERASE in any block can be suspended and a WRITE to another block can be initiated. After the completion of WRITE, the ERASE can be resumed by writing an ERASE RESUME command (see Figure 6). It is also possible to suspend the WRITE operation and read from another block. The other 64-bit OTP area is left blank to program for customer design requirements if needed. Protection of the user-programmable, 64-bit contents is provided, after the area is programmed, by programming the lockbit. To program the OTP area, two “AFh” commands must be written, followed by two WRITE cycles of the normal program sequences. When in the OTP mode, the WSM programs the OTP area and not the array. During programming, a read can acquire only the WSM status (status register output). When the programming is complete, the device remains in the OTP mode and only the status can be read in the OTP area. Writing two “FFh” commands exits the OTP mode and causes the device to go into the read array mode. To read the OTP area after programming, the OTP mode must be re-entered. To read the OTP area contents, two “AFh” commands must be written, followed by a READ. Writing two “FFh” commands exits the OTP mode and causes the device to go into the read array mode. After programming the 64-bit OTP area, the lock-bit can be programmed. The lock-bit is at address 00040H and is on DQ15. Once the lock-bit is programmed to a “0,” the 64-bit, user-programmable area is permanently protected (see Figure 3). The lock- bit can be read in OTP mode, as described above. AUTOMATIC POWER-SAVING MODE Substantial power savings are realized during periods when the device is not accessed while in the active mode. During this time, the device switches to the automatic power saving (APS) mode. When the device switches to this mode, ICC is reduced to 1µA typically. This mode is entered automatically if no address or control lines toggle within approximately a 300ns time-out period. At least one transition on CE# must occur after power-up to activate this mode’s availability. The device remains in this mode and the I/O lines retain the data from the last access until a new read address is issued or another operation is initiated. RESET/ DEEP POWER-DOWN MODE Very low levels of power consumption can be attained by using a special ball, RP#, to disable internal device circuitry. When RP# is at a logic LOW level of 0.0V ±0.2V, a much lower ICC current consumption is achieved, typically 1µA. This is important in portable applications where extended battery life is a major concern. A recovery time is required when exiting from deep power-down mode. A minimum of tRS is required before a CSM command can be recognized. With RP# at ground, the WSM is reset and the status register is cleared, effectively eliminating accidental programming to the array during system reset. After restoration of power, the device will be disabled until RP# is returned to VIH. If RP# goes LOW during a PROGRAM or ERASE operation, the device powers down and becomes nonfunctional. Data being written or erased at that time becomes invalid or indeterminate, requiring that the operation be performed again after power restoration. When RP# is set at logic LOW, all internal circuits will be reset. Setting RP# LOW during a PROGRAM or ERASE operation is not recommended. Figure 3 OTP Area Map 00000h 00002h 4 Words 00004h Factory-Programmed1 00006h 00020h 00022h 00024h 00026h 00040h DQ15 4 Words User-Programmed2 NOTE: 1. Always locked. 2. Locked by programming DQ15 at address 00040H. OTP MODE The device has 128 bits of OTP (one time programmable) area. There are 64 bits that are programmed at the factory with a unique 64-bit code that is not modifiable. 1 Meg x 16 3V Enhanced+ Boot Block Flash Memory MT28F160C3_3.p65 – Rev. 3, Pub. 8/01 12 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2001, Micron Technology, Inc. ADVANCE 1 MEG x 16 3V ENHANCED+ BOOT BLOCK FLASH MEMORY STANDBY MODE ICC supply current is reduced by applying a logic HIGH level on CE# and RP# to enter the standby mode. In the standby mode, the outputs are placed in the high-impedance state. Applying a logic HIGH level (VCCQ) on CE# and RP# reduces the current to 1µA typically. If the device is deselected during an ERASE operation or during programming, the device continues to draw active current until the operation is complete. monitor the block lock status of any block, the read status register command 70h can be used. On the command’s second cycle, any address within a block is issued and SR1 will indicate the block lock status for that block. When monitoring the block lock status bit SR1, the correct status can only be obtained with WP# LOW. POWER-UP During a power-up, it is not necessary to sequence VCC Q, VCC and VPP. However, it is recommended that RP# be held LOW during power-up for additional protection while VCC is ramping above VLKO to a stable operative level. After a power-up or RESET, the status register is reset, and the device will enter the array read mode. POWER-UP PROTECTION The likelihood of unwanted WRITE or ERASE operations is minimized since two consecutive cycles are required to execute either operation. When VCC < VLKO, the device does not accept any WRITE cycles, and noise pulses < 5ns on CE# or WE# do not initiate a WRITE cycle. SOFT BLOCK DATA PROTECTION Soft protection is available with CSM command 0Fh (see Table 3). The protection bit for each block can be set and cleared individually, or all at once. After the soft protection bit of a block is set, the block is protected when VPP VPPLK, RP# is HIGH, and WP# is LOW. When VPP ≤ VPPLK the block is protected (locked) as well. A block is unlocked when WP# is HIGH, even if its soft protection bit is set (see Table 5). When the device is powered down or RP# reset, the soft protection blocks will be set to the protected state. So, if WP# goes LOW after first power-up, RP# reset, or power-down, all blocks will be protected. The CSM command 0Fh is needed to clear the soft protected blocks. When WP# goes LOW the cleared blocks will be unprotected. The block lock status bit SR1 is used to monitor the individual block lock status after the second WRITE cycle of the soft protection CSM command. Additionally, to POWER SUPPLY DECOUPLING For decoupling purposes, each device should have a 0.1µF ceramic capacitor connected between VCC and VSS, VPP and VSS, and between VCCQ and VSS. The capacitor should be as close as possible to the device balls. 1 Meg x 16 3V Enhanced+ Boot Block Flash Memory MT28F160C3_3.p65 – Rev. 3, Pub. 8/01 13 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2001, Micron Technology, Inc. ADVANCE 1 MEG x 16 3V ENHANCED+ BOOT BLOCK FLASH MEMORY Figure 4 Automated Word Programming Flowchart Start BUS OPERATION COMMAND WRITE WRITE WRITE SETUP WRITE DATA COMMENTS Data = 40h or 10h Addr = Don’t Care Data = Word to be programmed Addr = Address of word to be programmed Status register data Toggle OE# or CE# to update status register. Check SR7 1 = Ready, 0 = Busy Issue WRITE SETUP Command READ Issue Word Address and Word Data Standby Read Status Register Bits NO NO SR7 = 1? YES Full Status Register Check (optional)1 PROGRAM SUSPEND? PROGRAM SUSPEND Loop Repeat for subsequent words. Write FFh after the last word programming operation to reset the device to read array mode. YES Word Program Completed FULL STATUS REGISTER CHECK FLOW Read Status Register Bits BUS OPERATION COMMAND Standby COMMENTS Check SR1 1 = Detect locked block Check SR32 1 = Detect VPP low Check SR43 1 = Word program error SR1 = 0? YES NO PROGRAM Attempted on a Locked Block Standby Standby NO SR3 = 0? YES NO SR4 = 0? YES Word Program Passed VPP Range Error Word Program Failed NOTE: 1. Full status register check can be done after each word or after a sequence of words. 2. SR3 must be cleared before attempting additional PROGRAM/ERASE operations. 3. SR4 is cleared only by the CLEAR STATUS REGISTER command, but it does not prevent additional program operation attempts. 1 Meg x 16 3V Enhanced+ Boot Block Flash Memory MT28F160C3_3.p65 – Rev. 3, Pub. 8/01 14 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2001, Micron Technology, Inc. ADVANCE 1 MEG x 16 3V ENHANCED+ BOOT BLOCK FLASH MEMORY Figure 5 Automated BLOCK ERASE Flowchart Start Issue ERASE SETUP Command BUS OPERATION COMMAND WRITE WRITE ERASE SETUP ERASE COMMENTS Data = 20h Addr = Don’t Care Data = D0h Block Addr = Address within block to be erased Status register data Toggle OE# or CE# to update status register. Check SR7 1 = Ready, 0 = Busy WRITE Issue Block Address and ERASE CONFIRM Command READ Read Status Register Bits NO NO SR7 = 1? YES Full Status Register Check (optional)1 ERASE SUSPEND? ERASE SUSPEND Loop Standby Repeat for subsequent blocks. Write FFh after the last BLOCK ERASE operation to reset the device to read array mode. YES BLOCK ERASE Completed FULL STATUS REGISTER CHECK FLOW Read Status Register Bits BUS OPERATION COMMAND Standby NO COMMENTS Check SR1 1 = Detect locked block Check SR32 1 = Detect VPP low Check SR4 and SR5 1 = BLOCK ERASE command error Check SR53 1 = BLOCK ERASE error SR1 = 0? YES NO SR3 = 0? YES SR4 = 1 and SR5 = 1? NO NO SR5 = 0? YES BLOCK ERASE Passed YES ERASE Attempted on a Locked Block Standby Standby VPP Range Error Standby Command Sequence Error BLOCK ERASE Failed NOTE: 1. Full status register check can be done after each block or after a sequence of blocks. 2. SR3 must be cleared before attempting additional PROGRAM/ERASE operations. 3. SR5 is cleared only by the CLEAR STATUS REGISTER command in cases where multiple blocks are erased before full status is checked. 1 Meg x 16 3V Enhanced+ Boot Block Flash Memory MT28F160C3_3.p65 – Rev. 3, Pub. 8/01 15 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2001, Micron Technology, Inc. ADVANCE 1 MEG x 16 3V ENHANCED+ BOOT BLOCK FLASH MEMORY Figure 6 ERASE SUSPEND/ERASE RESUME Flowchart Start BUS OPERATION COMMAND WRITE READ ERASE SUSPEND COMMENTS Data = B0h Status register data Toggle OE# or CE# to update status register Check SR7 1 = Ready Check SR6 1 = Suspended Issue ERASE SUSPEND Command Standby Standby Read Status Register Bits WRITE or WRITE READ READ MEMORY WRITE SETUP Data = FFh NO SR7 = 1? YES NO SR6 = 1? YES ERASE Complete PROGRAM Data = 40h or 10h Addr = Don’t Care Read data from block other than that being erased or WRITE WRITE DATA Data = Word to be programmed Addr = Address of word to be programmed Data = D0h Addr = Don’t Care WRITE ERASE RESUME READ or PROGRAM? READ Issue READ MEMORY Command PROGRAM Loop NO READ or PROGRAM Complete? YES Issue ERASE RESUME Command (Note 2) ERASE Continued1 NOTE: 1. See BLOCK ERASE Flowchart for complete erasure procedure. 2. See Word Programming Flowchart for complete programming procedure. 1 Meg x 16 3V Enhanced+ Boot Block Flash Memory MT28F160C3_3.p65 – Rev. 3, Pub. 8/01 16 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2001, Micron Technology, Inc. ADVANCE 1 MEG x 16 3V ENHANCED+ BOOT BLOCK FLASH MEMORY Figure 7 PROGRAM SUSPEND/ PROGRAM RESUME Flowchart Start BUS OPERATION COMMAND WRITE READ PROGRAM SUSPEND COMMENTS Data = B0h Status register data Toggle OE# or CE# to update status register Check SR7 1 = Ready Check SR2 1 = Suspended READ MEMORY Data = FFh Read data from block other than that being programmed PROGRAM RESUME Data = D0h Addr = Don’t Care Issue PROGRAM SUSPEND Command Standby Standby Read Status Register Bits WRITE READ WRITE NO SR7 = 1? YES NO SR2 = 1? YES Issue READ MEMORY Command PROGRAM Complete Finished Reading ? YES Issue PROGRAM RESUME Command NO PROGRAM Resumed 1 Meg x 16 3V Enhanced+ Boot Block Flash Memory MT28F160C3_3.p65 – Rev. 3, Pub. 8/01 17 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2001, Micron Technology, Inc. ADVANCE 1 MEG x 16 3V ENHANCED+ BOOT BLOCK FLASH MEMORY ABSOLUTE MAXIMUM RATINGS1, 2 Supply Voltage Range, Supply Voltage Range, Input Voltage Range ................................... -0.6V to +4.0V Output Voltage Range .............................. -0.6V to +4.0V4 Storage Temperature Range, TSTG ........ -65°C to +150°C VCC ....................... -0.6V to +4.0V3 VPP ..................... -0.6V to +13.0V3 1Stresses greater than those listed under “Absolute Maxi- mum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2All voltage values are with respect to VSS. 3The voltage can undershoot to -1V for periods < 20ns. 4The voltage on any output can overshoot to 4.6V for periods < 20ns. ELECTRICAL CHARACTERISTICS AND RECOMMENDED DC OPERATING CONDITIONS (-40°C £ TA £ +85°C) PARAMETER/CONDITION Supply Voltage (during program/read/erase/suspend) I/O Supply Voltage Supply Voltage (during program/erase operations) Input High (Logic 1) Voltage, all inputs Input Low (Logic 0) Voltage, all inputs OUTPUT VOLTAGE LEVELS VCC = VCC (MIN), VCCQ = VCCQ (MIN) Output High Voltage (IOH = -0.1mA) Output Low Voltage (IOL = 0.1mA) INPUT LEAKAGE CURRENT VCC = VCC (MAX), VCCQ = VCCQ (MAX) Any input (0V £ VIN £ VCCQ); All other balls not under test = 0V OUTPUT LEAKAGE CURRENT VCC = VCC (MAX), VCCQ = VCCQ (MAX) (DOUT is disabled; 0V £ VOUT £ VCCQ) BLOCK ERASE cycling NOTE: 5. All voltages referenced to VSS. 6. VCCQ must be less than or equal to VCC. 7. 12V VPP is allowable for production only. SYMBOL VCC VCCQ VPP1 VPP2 VIH VIL VOH VOL MIN 2.7 2.7 1.65 11.4 -0.2 VCCQ - 0.1 – MAX 3.3 3.3 3.3 12.6 0.2 – 0.1 UNITS NOTES V V V V V V V 5 V 5 5, 6 5 5, 7 5 5 VCCQ - 0.2 VCCQ + 0.2 IL -1 1 µA IOZ – -10 100K 10 – µA Cyc 1 Meg x 16 3V Enhanced+ Boot Block Flash Memory MT28F160C3_3.p65 – Rev. 3, Pub. 8/01 18 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2001, Micron Technology, Inc. ADVANCE 1 MEG x 16 3V ENHANCED+ BOOT BLOCK FLASH MEMORY CAPACITANCE (TA = +25°C; f = 1 MHz) PARAMETER/CONDITION Input Capacitance Output Capacitance SYMBOL CI CO MAX 8 12 UNITS NOTES pF pF READ, STANDBY AND DEEP POWER-DOWN CURRENT DRAIN (-40°C £ TA £ +85°C; VCC = 2.7V–3.3V) PARAMETER/CONDITION READ CURRENT: VCC = VCC (MAX), VCCQ = VCCQ (MAX) (CE# = VIL; OE# = VIH; RP# = VIH; f = 5 MHz; Other inputs VIH or VIL) STANDBY CURRENT: VCC SUPPLY VCC = VCC (MAX); (CE# = RP# = VCCQ) DEEP POWER-DOWN CURRENT: VCC SUPPLY VCC = VCC (MAX); VCCQ = VCCQ (MAX) (RP# = VIL; Other inputs VCCQ or VSS) READ CURRENT: VPP SUPPLY DEEP POWER-DOWN CURRENT: VPP SUPPLY (RP# = VIL; VPP £ VCC) STANDBY CURRENT: VPP SUPPLY (VPP £ VCC) VPP £ VCC VPP > VCC SYMBOL ICC1 ICC2 TYP – 1 MAX 20 10 UNITS NOTES mA µA 1, 2 ICC3 IPP1 IPP2 IPP3 IPP4 1 2 50 1 1 10 ±15 200 10 10 µA µA µA µA µA NOTE: 1. ICC is dependent on cycle rates. 2. Automatic power savings (APS) mode reduces ICC1 to standby current level ICC2 for static operation. 1 Meg x 16 3V Enhanced+ Boot Block Flash Memory MT28F160C3_3.p65 – Rev. 3, Pub. 8/01 19 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2001, Micron Technology, Inc. ADVANCE 1 MEG x 16 3V ENHANCED+ BOOT BLOCK FLASH MEMORY AC TEST CONDITIONS Input pulse levels ................................................. 0V to VCCQ Input rise and fall times ................................................