MT29F128G08AUABAC5:B

Micron Technology, Inc. 8000 S. Federal Way PO Box 6 Boise, ID United States Product Change Notice Micron PCN: 30443 Date: 4/27/2011 Type of Change: End of Life Title of Change: M62B 34nm SLC NAND Flash Technology Change Description of Change: Micron's SLC NAND Flash devices described below are moving from 34nm to 25nm process technology. The 25nm process technology features a monolithic 32Gb device (M73A) that will be stacked to achieve densities up to 256Gb in a single package. Reason for Change: Optimization of Manufacturing Efficiency Contact Information: Marketing Contact COLLIN HOOVER Engineering Contact RYAN FISHER CHOOVER@MICRON.COM RFISHER@MICRON.COM Micron Technology, Inc. Micron Technology, Inc Product Affected: 16Gb monolithic device (M62B), 32Gb DDP packaged device (M62B), 64Gb QDP packaged device (M62B), 128Gb 8DP packaged device (M62B) Affected Micron Part Numbers Replacement Part Numbers MT29F16G08ABABAM62B3WC1 MT29F16G08ABACAM72A3WC1 MT29F16G08ABCBBM62B3WC1 MT29F16G08ABACAM72A3WC1 MT29F16G08ABEBBM62B3WC1 MT29F16G08ABACAM72A3WC1 Wafer Component MT29F128G08AUABAC5-IT:B MT29F128G08AMAAAC5-IT:A MT29F128G08AUABAC5:B MT29F128G08AMAAAC5:A MT29F128G08AUCBBH3-12:B MT29F128G08AMCABH2-10:A MT29F128G08AUCBBH3-12IT:B MT29F128G08AMCABH2-10IT:A MT29F16G08ABABAWC:B MT29F16G08ABACAWP:C MT29F16G08ABABAWP-IT:B MT29F16G08ABACAWP-IT:C MT29F16G08ABABAWP:B MT29F16G08ABACAWP:C MT29F16G08ABCBBH1-12:B MT29F16G08ABCCBH1-12:C MT29F16G08ABCBBH1-12IT:B MT29F16G08ABCCBH1-12IT:C MT29F32G08ADCBBH1-12:B MT29F32G08ABCABH1-10:A MT29F32G08AECBBH1-12:B MT29F32G08ABCABH1-10:A MT29F32G08AECBBH1-12IT:B MT29F32G08ABCABH1-10IT:A MT29F32G08AFABAWP-IT:B MT29F32G08ABAAAWP-IT:A MT29F32G08AFABAWP:B MT29F32G08ABAAAWP-IT:A MT29F64G08AJABAWP-IT:B MT29F64G08AFAAAWP-IT:A MT29F64G08AJABAWP:B MT29F64G08AFAAAWP:A MT29F64G08AKABAC5-IT:B MT29F64G08AEAAAC5-IT:A MT29F64G08AKABAC5:B MT29F64G08AEAAAC5:A MT29F64G08AKCBBH2-12:B MT29F64G08AECABH1-10:A MT29F64G08AKCBBH2-12IT:B MT29F64G08AECABH1-10IT:A MT29F64G08AKCBBH3-12:B MT29F64G08AECABH1-10:A Note: Per JEDEC Standard JESD46-C Section 3.2.3; lack of acknowledgment of this PCN within 30 days constitutes acceptance of change 1 of 2 Micron Confidential and Proprietary Information MT29F64G08AKCBBH3-12IT:B MT29F64G08AECABH1-10IT:A MT29F64G08AMABAC5-IT:B MT29F64G08AEAAAC5-IT:A MT29F64G08AMABAC5:B MT29F64G08AEAAAC5:A MT29F64G08AMCBBH2-12:B MT29F64G08AECABH1-10:A MT29F64G08AMCBBH2-12IT:B MT29F64G08AECABH1-10IT:A Method of Identification: Marketing part number. Please refer to the table above for differences between the part numbers affected by this technology change and recommended replacement marketing part numbers. All Sites Micron Sites Affected: 25nm Product (M73A) Product Ship Date: Samples Available: Qual Data Available: 34nm Product (M62B) Last Time Buy: Last Time Ship: Now Now Now 26-Oct-2011 26-Apr-2012 Qualification Plan: The 25nm process technology and stacked package was qualified according to Micron’s qualification procedure and best practices. The qualification plan is be available upon request. Note: Per JEDEC Standard JESD46-C Section 3.2.3; lack of acknowledgment of this PCN within 30 days constitutes acceptance of change 2 of 2 Micron Confidential and Proprietary Information