MT29F128G08CECABH1-12IT:A

Micron Technology, Inc. 8000 S. Federal Way PO Box 6 Boise, ID United States Product Change Notice Micron PCN: 30713 Date: 7/10/2012 Type of Change: Manufacturing Process Change Title of Change: Replacing PCN #30681 — 25nm NAND Flash Addition of Polyimide Die Coating for 16, 32 and 64Gb Based Products Description of Change: This PCN replaces PCN #30681, dated 6/1/2012. Changes to the list of affected part numbers in the "Products Affected" section have been highlighted. Also, dates specific to LGA parts have been provided in the “Product/Data Availability” section. Beginning approximately mid 2012, B74A, L72A, L73A, L74A, M72A, and M73A die will be manufactured with a polyimide die coating to improve manufacturability of multi-die packages and improve customer results for die-based products. Reason for Change: Better align industry standards, Optimization of Manufacturing Efficiency Contact Information: Marketing Contact MIKE SEIBERT Engineering Contact RYAN FISHER MSEIBERT@MICRON.COM RFISHER@MICRON.COM Micron Technology, Inc. Micron Technology, Inc. Product Affected: All B74A, L72A, L73A, L74A, M72A, and M73A based products (die/wafer and packaged devices) Affected Micron Part Numbers Replacement Part Numbers MT29F16G08ABACAM72A3WC1 MT29F16G08ABACAM72A3WC1P MT29F32G08ABAAAM73A3WC1 MT29F32G08ABAAAM73A3WC1P MT29F64G08CBAAAL74A3WC1 MT29F64G08CBAAAL74A3WC1P MT29F64G08CBCABH1-12:A MT29F64G08CBCABH1-12Z:A MT29F128G08CECABH1-12:A MT29F128G08CECABH1-12Z:A MT29F256G08CMCABH2-12:A MT29F256G08CMCABH2-12Z:A MT29F64G08CBAAAWP:A MT29F64G08CBAAAWP-Z:A MT29F256G08CKCABH2-12:A MT29F256G08CKCABH2-12Z:A MT29F512G08CUCABH3-12:A MT29F512G08CUCABH3-12Z:A MT29F128G08CFAAAWP:A MT29F128G08CFAAAWP-Z:A MT29F256G08CJAAAWP:A MT29F256G08CJAAAWP-Z:A MT29F128G08CEAAAC5:A MT29F128G08CEAAAC5-Z:A MT29F256G08CKAAAC5:A MT29F256G08CKAAAC5-Z:A MT29F256G08CMAAAC5:A MT29F256G08CMAAAC5-Z:A MT29F512G08CUAAAC5:A MT29F512G08CUAAAC5-Z:A MT29F32G08ABAAAWP:A MT29F32G08ABAAAWP-Z:A MT29F32G08ABAAAWP-IT:A MT29F32G08ABAAAWP-ITZ:A MT29F32G08CBACAL73A3WC1 MT29F32G08CBACAL73A3WC1P MT29F16G08ABACAWP:C MT29F16G08ABACAWP-Z:C MT29F16G08ABACAWP-IT:C MT29F16G08ABACAWP-ITZ:C MT29F32G08AFACAWP:C MT29F32G08AFACAWP-Z:C MT29F32G08AFACAWP-IT:C MT29F32G08AFACAWP-ITZ:C Note: Per JEDEC Standard JESD46-C Section 3.2.3; lack of acknowledgment of this PCN within 30 days constitutes acceptance of change 1 of 5 Micron Confidential and Proprietary Information MT29F64G08AFAAAWP:A MT29F64G08AFAAAWP-Z:A MT29F64G08AFAAAWP-IT:A MT29F64G08AFAAAWP-ITZ:A MT29F128G08AJAAAWP:A MT29F128G08AJAAAWP-Z:A MT29F128G08AJAAAWP-IT:A MT29F128G08AJAAAWP-ITZ:A MT29F128G08AKAAAC5:A MT29F128G08AKAAAC5-Z:A MT29F128G08AKAAAC5-IT:A MT29F128G08AKAAAC5-ITZ:A MT29F128G08AMAAAC5:A MT29F128G08AMAAAC5-Z:A MT29F128G08AMAAAC5-IT:A MT29F128G08AMAAAC5-ITZ:A MT29F256G08AUAAAC5:A MT29F256G08AUAAAC5-Z:A MT29F256G08AUAAAC5-IT:A MT29F256G08AUAAAC5-ITZ:A MT29F32G08CBACAWP:C MT29F32G08CBACAWP-Z:C MT29F64G08CFACAWP:C MT29F64G08CFACAWP-Z:C MT29F64G08CECCBH1-12:C MT29F64G08CECCBH1-12Z:C MT29F64G08CFACBWP-12:C MT29F64G08CFACBWP-12Z:C MT29F64G08CBAABWP-12:A MT29F64G08CBAABWP-12Z:A MT29F256G08CJAABWP-12:A MT29F256G08CJAABWP-12Z:A MT29F128G08CFAABWP-12:A MT29F128G08CFAABWP-12Z:A MT29F16G08ABCCBH1-10IT:C MT29F16G08ABCCBH1-10ITZ:C MT29F64G08CBEABL74A3WC1 MT29F64G08CBEABL74A3WC1P MT29F16G08ABCCBH1-10:C MT29F16G08ABCCBH1-10Z:C MT29F32G08CBACAWP-IT:C MT29F32G08CBACAWP-ITZ:C MT29F32G08CBECBL73A3WC1 MT29F32G08CBECBL73A3WC1P MT29F32G08CFACAWP:C MT29F32G08CFACAWP-Z:C MT29F16G08CBACAL72A3WC1 MT29F16G08CBACAL72A3WC1P MT29F16G08CBACAWP:C MT29F16G08CBACAWP-Z:C MT29F64G08EBAAAB74A3WC1 MT29F64G08EBAAAB74A3WC1P MT29F64G08EBAAAWP:A MT29F64G08EBAAAWP-Z:A MT29F64G08EBAABWP-12:A MT29F64G08EBAABWP-12Z:A MT29F128G08AMCABH2-10IT:A MT29F128G08AMCABH2-10ITZ:A MT29F128G08AKCABH2-10IT:A MT29F128G08AKCABH2-10ITZ:A MT29F256G08AUCABH3-10IT:A MT29F256G08AUCABH3-10ITZ:A MT29F32G08ABCABH1-10:A MT29F32G08ABCABH1-10Z:A MT29F128G08AKCABH2-10:A MT29F128G08AKCABH2-10Z:A MT29F32G08ABCABH1-10IT:A MT29F32G08ABCABH1-10ITZ:A MT29F128G08AMCABH2-10:A MT29F128G08AMCABH2-10Z:A MT29F64G08AECABH1-10:A MT29F64G08AECABH1-10Z:A MT29F256G08AUCABH3-10:A MT29F256G08AUCABH3-10Z:A MT29F64G08AECABH1-10IT:A MT29F64G08AECABH1-10ITZ:A MT29F64G08CBAAAWP-IT:A MT29F64G08CBAAAWP-ITZ:A MT29F16G08CBECBL72A3WC1 MT29F16G08CBECBL72A3WC1P MT29F128G08EFAAAWP:A MT29F128G08EFAAAWP-Z:A MT29F128G08CFAAAWP-IT:A MT29F128G08CFAAAWP-ITZ:A Note: Per JEDEC Standard JESD46-C Section 3.2.3; lack of acknowledgment of this PCN within 30 days constitutes acceptance of change 2 of 5 Micron Confidential and Proprietary Information MT29F128G08CECABH1-10:A MT29F128G08CECABH1-10Z:A MT29E128G08CECABJ1-10:A MT29E128G08CECABJ1-10Z:A MT29E256G08CMCABJ2-10:A MT29E256G08CMCABJ2-10Z:A MT29F16G08CBACAH5:C MT29F16G08CBACAH5-Z:C MT29F128G08AMCABK3-10:A MT29F128G08AMCABK3-10Z:A MT29F128G08AMCABK3-10IT:A MT29F128G08AMCABK3-10ITZ:A MT29F256G08AUCABK4-10:A MT29F256G08AUCABK4-10Z:A MT29F256G08AUCABK4-10IT:A MT29F256G08AUCABK4-10ITZ:A MT29F32G08AECCBH1-10IT:C MT29F32G08AECCBH1-10ITZ:C MT29F32G08AECCBH1-10:C MT29F32G08AECCBH1-10Z:C MT29F256G08CJAAAWP-P:A MT29F256G08CJAAAWP-PZ:A MT29F256G08CUCCBH3-12:C MT29F256G08CUCCBH3-12Z:C MT29F64G08CBCABH1-10:A MT29F64G08CBCABH1-10Z:A MT29F32G08CFACBWP-12:C MT29F32G08CFACBWP-12Z:C MT29F64G08CECCBH1-12IT:C MT29F64G08CECCBH1-12ITZ:C MT29F256G08CMCABH2-12IT:A MT29F256G08CMCABH2-12ITZ:A MT29F16G08CBACAWP-IT:C MT29F16G08CBACAWP-ITZ:C MT29F128G08CECABH1-12IT:A MT29F128G08CECABH1-12ITZ:A MT29F64G08AEAAAC5-IT:A MT29F64G08AEAAAC5-ITZ:A MT29F64G08AEAAAC5:A MT29F64G08AEAAAC5-Z:A MT29F256G08CMCABH2-10:A MT29F256G08CMCABH2-10Z:A MT29F256G08CKCABH2-10:A MT29F256G08CKCABH2-10Z:A MT29F256G08CMCABH2-10P:A MT29F256G08CMCABH2-10PZ:A MT29F64G08CBCABH1-10P:A MT29F64G08CBCABH1-10PZ:A MT29F256G08CKCABH2-10P:A MT29F256G08CKCABH2-10PZ:A MT29F128G08CECABH1-10P:A MT29F128G08CECABH1-10PZ:A MT29F512G08CUCABH3-10P:A MT29F512G08CUCABH3-10PZ:A MT29F256G08EJAAAWP:A MT29F256G08EJAAAWP-Z:A MT29F64G08EBEABB74A3WC1 MT29F64G08EBEABB74A3WC1P MT29F512G08CUCABH3-10:A MT29F512G08CUCABH3-10Z:A MT29E512G08CUCABJ3-10:A MT29E512G08CUCABJ3-10Z:A MT29F128G08CKCCBH2-12:C MT29F128G08CKCCBH2-12Z:C MT29F128G08CFAAAWP-R:A MT29F128G08CFAAAWP-RZ:A MT29F128G08CECABH1-10R:A MT29F128G08CECABH1-10RZ:A MT29F256G08CJAAAWP-R:A MT29F256G08CJAAAWP-RZ:A MT29F256G08CMCABH2-10R:A MT29F256G08CMCABH2-10RZ:A MT29F512G08CUCABH3-10R:A MT29F512G08CUCABH3-10RZ:A MT29F256G08CMCABK3-10:A MT29F256G08CMCABK3-10Z:A MT29F512G08CUCABK4-10:A MT29F512G08CUCABK4-10Z:A MT29F256G08CKCABH2-10R:A MT29F256G08CKCABH2-10RZ:A MT29F128G08EFAABWP-12:A MT29F128G08EFAABWP-12Z:A MT29F256G08EJAABWP-12:A MT29F256G08EJAABWP-12Z:A Note: Per JEDEC Standard JESD46-C Section 3.2.3; lack of acknowledgment of this PCN within 30 days constitutes acceptance of change 3 of 5 Micron Confidential and Proprietary Information MT29F256G08CUCCBK4-12:C MT29F256G08CUCCBK4-12Z:C MT29F128G08CKCCBK3-12:C MT29F128G08CKCCBK3-12Z:C MT29F16G08ABECBM72A3WC1 MT29F16G08ABECBM72A3WC1P MT29F32G08ABEABM73A3WC1 MT29F32G08ABEABM73A3WC1P MT29F16G08CBACBWP-12:C MT29F16G08CBACBWP-12Z:C MT29F64G08AKCCBH2-10:C MT29F64G08AKCCBH2-10Z:C MT29F64G08AKCCBH2-10IT:C MT29F64G08AKCCBH2-10ITZ:C MT29F64G08CBCABJ1-10:A MT29F64G08CBCABJ1-10Z:A MT29F128G08CECABJ1-10:A MT29F128G08CECABJ1-10Z:A MT29F256G08CMCABJ2-10:A MT29F256G08CMCABJ2-10Z:A MT29F512G08CUCABJ3-10:A MT29F512G08CUCABJ3-10Z:A MT29F32G08CBCCBH1-12:C MT29F32G08CBCCBH1-12Z:C MT29F512G08CUCABH3-10IT:A MT29F512G08CUCABH3-10ITZ:A MT29F64G08CBCABH6-10ITR:A MT29F64G08CBCABH6-10ITRZ:A MT29F512G08CUCABJ3-10R:A MT29F512G08CUCABJ3-10RZ:A MT29F128G08AMCABJ2-10:A MT29F128G08AMCABJ2-10Z:A MT29F256G08AUCABJ3-10:A MT29F256G08AUCABJ3-10Z:A MT29F128G08CECABJ1-10R:A MT29F128G08CECABJ1-10RZ:A MT29F256G08CMCABJ2-10R:A MT29F256G08CMCABJ2-10RZ:A MT29F64G08AECABJ1-10:A MT29F64G08AECABJ1-10-Z:A MT29F256G08CJAAAWP-IT:A MT29F256G08CJAAAWP-ITZ:A MT29F512G08CUCABH3-12IT:A MT29F512G08CUCABH3-12ITZ:A MT29F64G08CBCABH1-12IT:A MT29F64G08CBCABH1-12ITZ:A MT29F256G08CJAABWP-12R:A MT29F256G08CJAABWP-12RZ:A MT29F128G08CECABJ1-10ITR:A MT29F128G08CECABJ1-10ITRZ:A MT29E256G08CMCABJ2-10IT:A MT29E256G08CMCABJ2-10ITZ:A Method of Identification: New marketing part number Micron Sites Affected: All Sites Product/Data Availability BGA/TSOP/Wafer(die) With Polyimide Die Coat: Sample Availability*: Qual Data Availability**: Production Shipments*: May 2012 May 2012 October 2012 Without Polyimide Die Coat: Last Time Buy*: Last Time Ship*: 31-Oct-2012 30-Apr-2013 LGA Feb 2013 Feb 2013 June 2013 30-Jun-2013 31-Dec-2013 * Please contact factory for product availability dates pertinent to your specific product. ** Data packet demonstrating the intrinsic reliability of Micron’s polyimide die coating process is available upon request. Note: Per JEDEC Standard JESD46-C Section 3.2.3; lack of acknowledgment of this PCN within 30 days constitutes acceptance of change 4 of 5 Micron Confidential and Proprietary Information Qualification Plan: Addition of Polyimide Die Coating will be qualified according to Company qualification procedure and best practices. Qualification plan will be available upon request. Note: Per JEDEC Standard JESD46-C Section 3.2.3; lack of acknowledgment of this PCN within 30 days constitutes acceptance of change 5 of 5 Micron Confidential and Proprietary Information