MT29F1G01ABAFDWB-IT:F

Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Features NAND Flash Memory Serial Peripheral Interface (SPI) MT29F1G01ABAFDSF, MT29F1G01ABAFD12, MT29F1G01ABAFDWB Features • Device initialization – Automatic device initialization after power-up • Security – Blocks 7:0 are valid when shipped from factory with ECC enabled – Software write protection with lock register – Hardware write protection to freeze BP bits – Lock tight to freeze BP bits during one power cycle • Permanent block lock protection – OTP Space: 10 pages one-time programmable NAND Flash memory area • Operating voltage range – VCC = 2.7–3.6V • Operating temperature – Industrial: –40°C to +85°C • Quality and reliability – Data retention: JESD47H-compliant; see qualification report – Additional: Uncycled data retention: 10 years 24/7 @85°C – Endurance: 100,000 PROGRAM/ERASE cycles • Package – 6-pin SOP, 300 mils – 8-pin U-PDFN, 8mm x 6mm x 0.65mm (MLP8) – 24-ball T-PBGA, 05/6mm x 8mm (5 x 5 array) • Single-level cell (SLC) technology • 1Gb density • Organization – Page size x1: 2176 bytes (2048 + 128 bytes) – Block size: 64 pages (128K + 8K bytes) – Plane size: 1Gb (1 plane, 1024 blocks per plane) • Standard and extended SPI-compatible serial bus interface – Instruction, address on 1 pin; data out on 1, 2, or 4 pins – Instruction on 1 pin; address, data out on 2 or 4 pins – Instruction, address on 1 pin; data in on 1 or 4 pins • User-selectable internal ECC supported – 8 bits/sector • Array performance – 133 MHz clock frequency (MAX) – Page read: 25µs (MAX) with on-die ECC disabled; 70µs (MAX) with on-die ECC enabled – Page program: 200µs (TYP) with on-die ECC disabled; 220µs (TYP) with on-die ECC enabled – Block erase: 2ms (TYP) • Advanced features – Read page cache mode – Read unique ID – Read parameter page CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 1 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Features Part Numbering Information Micron NAND Flash devices are available in different configurations and densities. Verify valid part numbers by using Micron’s part catalog search at www.micron.com. To compare features and specifications by device type, visit www.micron.com/products. Contact the factory for devices not found. Figure 1: Part Number Chart MT 29F 2G 01 A B A G D 12 IT ES :F Micron Technology Design Revision (shrink) Product Family Production Status 29F = NAND Flash memory Blank = Production ES = Engineering sample Density Special Options xG = xGb Blank Device Width Operating Temperature Range x = x bits IT = Industrial (–40°C to +85°C) AAT = Automotive (–40°C to +105°C) Level A = SLC Speed Grade Blank if no speed grade is defined Classification B = Discrete, 1 chip select Package Code Operating Voltage Range SF = 16-pin SOP (300 mils) WB = 8-pin U-PDFN (8mm x 6mm x 0.65mm) 12 = 24-ball T-PBGA (6mm x 8mm) A = 3.3V (2.7–3.6V) B = 1.8V (1.7–1.95V) Interface Generation Feature Set CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 D = SPI 2 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Contents Important Notes and Warnings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Memory Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Array Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Bus Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 SPI Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 SPI Protocols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 SPI NAND Command Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 RESET Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 WRITE Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 WRITE ENABLE (06h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 WRITE DISABLE (04h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 READ Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 PAGE READ (13h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 READ FROM CACHE x1 (03h or 0Bh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 READ FROM CACHE x2 (3Bh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 READ FROM CACHE x4 (6Bh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 READ FROM CACHE Dual I/O (BBh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 READ FROM CACHE Quad I/O (EBh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 READ PAGE CACHE RANDOM (30h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 READ PAGE CACHE LAST (3Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 READ ID (9Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Parameter Page . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Parameter Page Data Structure Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Unique ID Page . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Program Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 PAGE PROGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 PROGRAM LOAD x1 (02h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 PROGRAM EXECUTE (10h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 RANDOM DATA PROGRAM x1 (84h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 PROGRAM LOAD x4 (32h) and PROGRAM LOAD RANDOM DATA x4 (34h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 INTERNAL DATA MOVE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Block Erase Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Features Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 GET FEATURE (0Fh) and SET FEATURE (1Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Feature Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Security – Volatile Block Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Security – Block Protection Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Security – Hardware Write Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Security – Device Lock Tight . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Permanent Block Lock Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 PROTECTION Command (2Ch) Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Permanent Block Lock Protection Disable Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Security – One Time Programmable (OTP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Enable OTP Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 OTP Configuration States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 OTP Protection and Program Prevention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Exit OTP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 3 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 ECC Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Error Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 SPI NOR Read Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Power-Up and Power-Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Rev. H – 02/22 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Rev. G – 11/16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Rev. F – 10/16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Rev. E – 06/16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Rev. D – 05/16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Rev. C – 01/16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Rev. B – 09/15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Rev. A – 06/15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 4 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory List of Figures Figure 1: Part Number Chart. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Figure 2: Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 3: 8-Pin, U-PDFN (Top View). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 4: 16-Pin, SOP2 (Top View). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 5: 24-Ball T-PBGA, 5 x 5 (Balls Down) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 6: Memory Map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 7: Array Organization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 8: SPI Modes Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 9: RESET (FFh) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 10: WRITE ENABLE (06h) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 11: WRITE DISABLE (04h) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 12: PAGE READ (13h) Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 13: READ FROM CACHE (03h or 0Bh) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 14: READ FROM CACHE x2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 15: READ FROM CACHE x4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Figure 16: READ FROM CACHE Dual I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Figure 17: READ FROM CACHE Quad I/O. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figure 18: READ PAGE CACHE RANDOM Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Figure 19: READ ID (9Fh) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Figure 20: PROGRAM LOAD (02h) Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Figure 21: PROGRAM EXECUTE (10h) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Figure 22: PROGRAM LOAD RANDOM DATA (84h) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Figure 23: PROGRAM LOAD x4 (32h) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Figure 24: BLOCK ERASE (D8h) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Figure 25: GET FEATURE (0Fh) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Figure 26: SET FEATURE (1Fh) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Figure 27: PROTECT Command Cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Figure 28: Read from Cache (03h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 Figure 29: Fast Read from Cache (0Bh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 Figure 30: SPI Power-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Figure 31: Automatic Device Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Figure 32: AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Figure 33: WP# Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Figure 34: Serial Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Figure 35: Serial Output Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Figure 36: 16-pin SOP (300 mils body width) – Package Code: SF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Figure 37: 8-pin U-PDFN (MLP8) 8mm x 6mm x 0.65mm – Package Code: WB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Figure 38: 24-Pin T-PBGA (5 x 5 Ball Grid Array) 6mm x 8mm – Package Code: 12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 5 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory List of Tables Table 1: SPI Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 2: SPI NAND Command Set. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Table 3: READ ID Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Table 4: Parameter Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Table 5: Feature Address Settings and Data Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Table 6: Block Lock Register Block Protection Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Table 7: Configuration Registers for Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Table 8: Status Register Bit Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Table 9: ECC Status Register Bit Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Table 10: ECC Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Table 11: Error Management Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Table 12: Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Table 13: Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Table 14: AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Table 15: Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Table 16: DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Table 17: AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Table 18: PROGRAM/READ/ERASE Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 6 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Important Notes and Warnings Important Notes and Warnings Micron Technology, Inc. ("Micron") reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions. This document supersedes and replaces all information supplied prior to the publication hereof. You may not rely on any information set forth in this document if you obtain the product described herein from any unauthorized distributor or other source not authorized by Micron. Automotive Applications. Products are not designed or intended for use in automotive applications unless specifically designated by Micron as automotive-grade by their respective data sheets. Distributor and customer/distributor shall assume the sole risk and liability for and shall indemnify and hold Micron harmless against all claims, costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damage resulting directly or indirectly from any use of non-automotive-grade products in automotive applications. Customer/distributor shall ensure that the terms and conditions of sale between customer/distributor and any customer of distributor/customer (1) state that Micron products are not designed or intended for use in automotive applications unless specifically designated by Micron as automotive-grade by their respective data sheets and (2) require such customer of distributor/customer to indemnify and hold Micron harmless against all claims, costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damage resulting from any use of non-automotive-grade products in automotive applications. Critical Applications. Products are not authorized for use in applications in which failure of the Micron component could result, directly or indirectly in death, personal injury, or severe property or environmental damage ("Critical Applications"). Customer must protect against death, personal injury, and severe property and environmental damage by incorporating safety design measures into customer's applications to ensure that failure of the Micron component will not result in such harms. Should customer or distributor purchase, use, or sell any Micron component for any critical application, customer and distributor shall indemnify and hold harmless Micron and its subsidiaries, subcontractors, and affiliates and the directors, officers, and employees of each against all claims, costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of product liability, personal injury, or death arising in any way out of such critical application, whether or not Micron or its subsidiaries, subcontractors, or affiliates were negligent in the design, manufacture, or warning of the Micron product. Customer Responsibility. Customers are responsible for the design, manufacture, and operation of their systems, applications, and products using Micron products. ALL SEMICONDUCTOR PRODUCTS HAVE INHERENT FAILURE RATES AND LIMITED USEFUL LIVES. IT IS THE CUSTOMER'S SOLE RESPONSIBILITY TO DETERMINE WHETHER THE MICRON PRODUCT IS SUITABLE AND FIT FOR THE CUSTOMER'S SYSTEM, APPLICATION, OR PRODUCT. Customers must ensure that adequate design, manufacturing, and operating safeguards are included in customer's applications and products to eliminate the risk that personal injury, death, or severe property or environmental damages will result from failure of any semiconductor component. Limited Warranty. In no event shall Micron be liable for any indirect, incidental, punitive, special or consequential damages (including without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort, warranty, breach of contract or other legal theory, unless explicitly stated in a written agreement executed by Micron's duly authorized representative. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 7 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory General Description General Description Serial peripheral interface (SPI) NAND is an SLC NAND Flash memory device that provides a cost-effective nonvolatile memory storage solution where pin count must be kept to a minimum. It is also an alternative solution to SPI NOR, offering superior write performance and cost per bit over SPI NOR. The hardware interface creates a low pin-count device with a standard pinout that remains the same from one density to another and supports future upgrades to higher densities without board redesign. The serial electrical interface follows the industry-standard serial peripheral interface. New command protocols and registers are defined for SPI operation. The command set resembles common SPI-NOR command sets, modified to handle NAND specific functions and additional new features. New features include user-selectable internal ECC and first page auto-load on power-up. SPI NAND Flash devices have six signal lines plus VCC and ground (GND). The signal lines are SCK (serial clock), SI, SO (for command/response and data input/output), and control signals CS, HOLD#, WP#. This hardware interface creates a low pin-count device with a standard pinout that remains the same from one density to another, supporting future upgrades to higher densities without board redesign. Each block of the serial NAND Flash device is divided into 64 programmable pages, each page consisting of 2176 bytes. Each page is further divided into a 2048-byte data storage region and a 128-byte spare area. The 128-byte area is typically used for memory and error management functions. With internal ECC enabled as the default after power on, ECC code is generated internally when a page is written to the memory core. The ECC code is stored in the spare area of each page. When a page is read to the cache register, the ECC code is calculated again and compared with the stored value. Errors are corrected if necessary. The device either outputs corrected data or returns an ECC error status. The internal ECC can be configured off after device initialization. Contact Micron representative if ECC is required to be default off after power on. The first eight blocks are valid when shipped from factory. Security functions are also provided including software block protection: Lock tight and hardware protection modes avoid array data corruption. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 8 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Architecture Architecture The devices use an industry-standard NAND Flash memory core organized by page/block. The standard parallel NAND Flash electrical interface and I/O logic are replaced by an SPI interface. The new command protocol set is a modification of the SPI NOR command set available in the industry. The modifications are specifically to handle functions related to NAND Flash architecture. The interface supports page and random read/write and internal data move functions. The device also includes an internal ECC feature. Data is transferred to or from the NAND Flash memory array, page-by-page, to a cache register and a data register. The cache register is closest to I/O control circuits and acts as a data buffer for the I/O data; the data register is closest to the memory array and acts as a data buffer for the NAND Flash memory array operation. The NAND Flash memory array is programmed and read in page-based operations; it is erased in block-based operations. The cache register functions as the buffer memory to enable random data READ/WRITE operations. These devices also use a new SPI status register that reports the status of device operation. Figure 2: Functional Block Diagram SCK SI/ IO0 SO/ IO1 CS# HOLD#/ IO3 WP#/ IO2 Serial NAND controller Cache and data registers VCC VSS NAND memory core ECC and status registers CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 9 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Pin Assignments Pin Assignments Figure 3: 8-Pin, U-PDFN (Top View) CS# 1 8 VCC SO/IO1 2 7 HOLD#/IO3 WP#/IO2 3 6 SCK VSS 4 5 SI/IO0 Figure 4: 16-Pin, SOP2 (Top View) HOLD#/IO3 1 16 SCK VCC 2 15 SI/IO0 DNU 3 14 NC NC 4 13 NC NC 5 12 NC NC 6 11 NC CS# 7 10 VSS SO/IO1 8 9 WP#/IO2 Figure 5: 24-Ball T-PBGA, 5 x 5 (Balls Down) 1 2 3 4 5 NC NC NC NC NC SCK VSS VCC NC DNU CS# NC WP#/IO2 NC NC S0/IO1 S1/IO0 HOLD#/IO3 NC NC NC NC NC NC A B C D E CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 10 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Pin Descriptions Pin Descriptions Table 1: SPI Pin Descriptions Symbol Type Description CS# Input Chip select: Places the device in active power mode when driven LOW. Deselects the device and places SO at High-Z when HIGH. After power-up, the device requires a falling edge on CS# before any command can be written. The device goes into standby mode when no PROGRAM, ERASE, or WRITE STATUS REGISTER operation is in progress. In the case of write-type instructions, CS# must be driven HIGH after a whole sequence is completed. Single command and address sequences and array-based operations are registered on CS#. SCK Input Serial clock: Provides serial interface timing. Latches commands, addresses, and data on SI on the rising edge of SCK. Triggers output on SO after the falling edge of SCK. While CS# is HIGH, keep SCK at VCC or GND (determined by mode 0 or mode 3). Do not begin toggling SCK until after CS# is driven LOW. WP# Input Write protect: When LOW, prevents overwriting block lock bits (BP[3:0] and TB) if the block register write disable (BRWD) bit is set. WP# must not be driven by the host during a x4 READ operation. If the device is deselected, this pin defaults as an input pin. HOLD# Input Hold: Hold functionality is disabled by default except the special part numbers. Contact Micron Sales representatives for details. When enabled, the external pull-up resistor is necessary to avoid accidental operation being placed on hold. HOLD# pauses any serial communication with the device without deselecting it. To start the HOLD condition, the device must be selected, with CS# driven LOW. During HOLD status (HOLD# driven LOW), SO is High-Z and all inputs at SI and SCK are ignored. Hold mode starts at the falling edge of HOLD#, provided SCK is also LOW. If SCK is HIGH when HOLD# goes LOW, hold mode is kicked off at the next falling edge of SCK. Similarly, hold mode is exited at the rising edge of HOLD#, provided SCK is also LOW. If SCK is HIGH, hold mode ends after the next falling edge of SCK. HOLD# must not be driven by the host during the x4 READ operation. SI/IO0, SO/IO1, IO2, IO3 I/O Serial I/O: The bidirectional I/O signals transfer address, data, and command information. The device latches commands, addresses, and data on the rising edge of SCK, and data is shifted out on the falling edge of the SCK. If the device is deselected, IO[0,2] defaults as an input pin and IO[1,3] defaults as an output pin. SI must not be driven by the host during x2 or x4 READ operations. VCC Supply VCC: Supply voltage VSS Supply VSS: Ground DNU – Do not use: Must be grounded or left floating. NC – No connect: Not internal connection; can be driven or floated. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 11 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Memory Mapping Memory Mapping Figure 6: Memory Map Blocks RA[15:6] 0 1 Pages RA[5:0] 0 1 Bytes CA[11:0] 0 1 2 • • • • • • • • • • • • 1023 • • • • • • 2 63 • • • • • • • • • • • • • • • • • • • • • • • • 2175 Note: 1. The 12-bit column address is capable of addressing from 0 to 4095 bytes; however, only bytes 0 through 2175 are valid. Bytes 2176 through 4095 of each page are “out of bounds,” do not exist in the device, and cannot be addressed. Array Organization Figure 7: Array Organization Logical Unit (LUN) 2176 bytes Cache Registers 2048 128 Data Registers 2048 128 8-bit data 1 page = (2K + 128) bytes 1 block = (2K + 128) bytes x 64 pages = (128K + 8K) bytes 1024 blocks per plane 2048 blocks per LUN 1 Block 1 LUN = (128K + 8K) bytes x 1024 blocks = 1088Mb CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 12 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Bus Operation Bus Operation SPI Modes The device can be driven by a microcontroller with its SPI running in either of two modes depending on clock polarity (CPOL) and clock phase (CPHA) settings: • CPOL = 0, CPHA = 0 (Mode 0) • CPOL = 1, CPHA = 1 (Mode 3) Input data is latched in on the rising edge of SCK, and output data is available from the falling edge of SCK for both modes. The difference between the two modes, shown here, is the clock polarity when the bus master is in standby mode and not transferring data. • SCK remains at 0 for CPOL = 0, CPHA = 0 (Mode 0) • SCK remains at 1 for CPOL = 1, CPHA = 1 (Mode 3) Figure 8: SPI Modes Timing CPOL CPHA 0 0 SCK 1 1 SCK SI MSB LSB MSB SO LSB CS# Notes: 1. While CS# is HIGH, keep SCK at VCC or GND (determined by mode 0 or mode 3). Do not begin toggling SCK until after CS# is driven LOW. 2. All timing diagrams shown in this data sheet are mode 0. SPI Protocols Standard SPI: Command, address, and data are transmitted on a single data line. Input on SI is latched in on the rising edge of SCK. Output on SO is available on the falling edge of SCK. Extended SPI: An extension of the standard SPI protocol. Command and address are transmitted on a single data line through SI. Data are transmitted on two or four data lines, IO[3:0], depending on the command. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 13 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory SPI NAND Command Definitions SPI NAND Command Definitions Table 2: SPI NAND Command Set Command Op Code Address Dummy Bytes Bytes Data Bytes Comments RESET FFh 0 0 0 Reset the device GET FEATURES 0Fh 1 0 1 Get features SET FEATURES 1Fh 1 0 1 Set features READ ID 9Fh 0 1 2 Read device ID PAGE READ 13h 3 0 0 Array read READ PAGE CACHE RANDOM 30h 3 0 0 Cache read READ PAGE CACHE LAST 3Fh 0 0 0 Ending of cache read READ FROM CACHE x1 03h, 0Bh 2 1 1 to 2176 Output cache data at column address READ FROM CACHE x2 3Bh 2 1 1 to 2176 Output cache data on IO[1:0] READ FROM CACHE x4 6Bh 2 1 1 to 2176 Output cache data on IO[3:0] READ FROM CACHE Dual I/O BBh 2 1 1 to 2176 Input address/Output cache data on IO[1:0] READ FROM CACHE Quad I/O EBh 2 2 1 to 2176 Input address/Output cache data on IO[3:0] WRITE ENABLE 06h 0 0 0 Sets the WEL bit in the status register to 1; required to enable operations that change the content of the memory array WRITE DISABLE 04h 0 0 0 Clears the WEL bit in the status register to 0; required to disable operations that change the content of the memory array BLOCK ERASE D8h 3 0 0 Block erase PROGRAM EXECUTE 10h 3 0 0 Array program PROGRAM LOAD x1 02h 2 0 1 to 2176 Load program data into cache register on SI PROGRAM LOAD x4 32h 2 0 1 to 2176 Load program data into cache register on SO[3:0] PROGRAM LOAD RANDOM DATA x1 84h 2 0 1 to 2176 Overwrite cache register with input data on SI PROGRAM LOAD RANDOM DATA x4 34h 2 0 1 to 2176 Overwrite cache register with input data on SO[3:0] PERMANENT BLOCK LOCK PROTECTION 2Ch 3 0 CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 0 14 Permanently protect a specific group of blocks Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory RESET Operation RESET Operation The RESET (FFh) command is used to put the memory device into a known condition and to abort the command sequence in progress. READ, PROGRAM, and ERASE commands can be aborted while the device is in the busy state. Once the RESET command is issued to the device, it will take tRST to reset. During this period, the GET FEATURE command could be issued to monitor the status (OIP) except for the stacked devices. While the device is busy after sending the RESET Command, READ ID command can be issued to read the device ID. For the stacked devices, no command should be issued until tRST. The contents of the memory location being programmed or the block being erased are no longer valid. The first page data of block 0 is auto-loaded to the cache register. For dual die, Die 0 is selected as default and the first page of block 0 is loaded to the cache All other status register bits will be cleared. The ECC status register bits will be updated after a reset. The configuration register bits CFG[2:0] will be cleared after a reset. All the other configuration register bits will not be reset. The block lock register bits will not be cleared after reset until the device is power cycled or is written to by SET FEATURE command. Figure 9: RESET (FFh) Timing 0 1 2 3 4 5 6 7 SCK Command (FFh) CS# OFh or 9Fh SI SO CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 High-Z 15 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory WRITE Operations WRITE Operations WRITE ENABLE (06h) The WRITE ENABLE (06h) command sets the WEL bit in the status register to 1. Write enable is required in the following operations that change the contents of the memory array: • PAGE PROGRAM • OTP AREA PROGRAM • BLOCK ERASE Figure 10: WRITE ENABLE (06h) Timing 0 1 2 3 4 5 6 7 SCK CS# Command (06h) SI WRITE DISABLE (04h) The WRITE DISABLE (04h) command clears the WEL bit in the status register to 0, disabling the following operations: • PAGE PROGRAM • OTP AREA PROGRAM • BLOCK ERASE Figure 11: WRITE DISABLE (04h) Timing 0 1 2 3 4 5 6 7 SCK CS# Command (04h) SI CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 16 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory READ Operations READ Operations PAGE READ (13h) The PAGE READ (13h) command transfers data from the NAND Flash array to the cache register. It requires a 24-bit address consisting of 7 dummy bits and a 17-bit block/page address (8 dummy bits followed by an 16-bit block/page address for 1Gb). After the block/page address is registered, the device starts the transfer from the main array to the cache register. During this data transfer busy time of tRD, the GET FEATURES command can be issued to monitor the operation. Following successful completion of PAGE READ, the READ FROM CACHE command must be issued to read data out of cache. The command sequence is as follows to transfer data from array to output: • 13h (PAGE READ command to cache) • 0Fh (GET FEATURES command to read the status) • 03h or 0Bh (READ FROM CACHE) • 3Bh (READ FROM CACHE x2) • 6Bh (READ FROM CACHE x4) • BBh (READ FROM CACHE Dual I/O) • EBh (READ FROM CACHE Quad I/O) CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 17 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory READ Operations Figure 12: PAGE READ (13h) Timing 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 SCK CS# Command (13h) Address bits 23 SI 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 High-Z SO 1 23 24 25 26 27 28 29 30 0 31 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 1 0 SCK CS# t CS Address bits SI 8 7 6 5 4 3 2 1 Status register address (C0h) GET FEATURE (0Fh) 7 0 6 5 4 3 2 MSB High-Z SO 1 13 2 14 15 1 0 16 17 18 19 20 21 22 23 SCK CS# SI 2 Status register data out 0 7 SO 6 0 MSB 5 4 3 2 Status register data out 1 0 7 6 4 3 2 1 0 MSB 2 CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 5 Don’t Care 18 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory READ Operations READ FROM CACHE x1 (03h or 0Bh) The READ FROM CACHE x1 command enables sequentially reading one or more data bytes from the cache buffer. The command is initiated by driving CS# LOW, shifting in command opcode 03h/0Bh, followed by a 16 bit column address and 8-bit dummy clocks. Both the commands run at fast mode. Data is returned from the addressed cache buffer, MSB first, on SO at the falling edge of SCK. The address is automatically incremented to the next higher address after each byte of data is shifted out, enabling a continuous stream of data. This command is completed by driving CS# HIGH. Figure 13: READ FROM CACHE (03h or 0Bh) Timing 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 SCK CS# Command (03h or 0Bh) 12-bit column address 3 dummy bits 0 SI 0 0 12 11 10 9 8 7 6 5 1 dummy byte 4 3 2 1 0 MSB Plane select High-Z SO 1 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 17431... 17439 SCK CS# 1 dummy byte SI High-Z 0 Data out 2176 Data out 1 SO High-Z 7 6 5 4 3 MSB 2 1 0 7 6 5 4 3 2 1 0 MSB 1 Don’t Care Note: 1. Plane select is a dummy bit for 1Gb devices. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 19 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory READ Operations READ FROM CACHE x2 (3Bh) The READ FROM CACHE x2 (3Bh) command is similar to READ FROM CACHE x1 (03h or 0Bh) except that data is output on the following two pins, enabling data transfer at twice the rate: IO0(SI) and IO1(SO). Figure 14: READ FROM CACHE x2 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 SCK CS# 3 dummy bits Command (3Bh) 0 SI 0 12-bit column address 0 12 Plane select 11 10 9 8 7 6 5 4 1 dummy byte 3 2 1 0 MSB High-Z SO 1 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 8727... 8735 SCK CS# 1 dummy byte SI High-Z SO High-Z 1 SI switches from input to output 6 4 2 0 6 4 2 0 6 4 2 0 6 4 2 0 7 5 3 1 7 5 3 1 7 5 3 1 7 5 3 1 Data out 1 Data out 2 Data out 2175 Data out 2176 Note: 1. Plane select is a dummy bit for 1Gb devices. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 20 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory READ Operations READ FROM CACHE x4 (6Bh) The READ FROM CACHE x4 (6Bh) command is similar to READ FROM CACHE x1 command, but with the capability to output data across four data lines. Figure 15: READ FROM CACHE x4 0 SCK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 CS# Command 12-bit column address 3 dummy bits SI/ IO0 0 0 0 12 11 10 9 8 7 6 5 4 1 dummy byte 3 2 1 0 MSB Plane select SO/ IO1 High-Z WP#/ IO2 High-Z HOLD#/ IO3 High-Z 1 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 SCK CS# 1 dummy byte SI/ IO0 High-Z SO/ IO1 High-Z WP#/ IO2 High-Z HOLD#/ IO3 High-Z SI switches from input to output 4 0 4 0 4 0 4 0 4 5 1 5 1 5 1 5 1 5 6 2 6 2 6 2 6 2 6 7 3 7 3 7 3 7 3 7 Byte 1 Byte 2 Byte 3 Byte 4 1 Note: 1. Plane select is a dummy bit for 1Gb devices. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 21 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory READ Operations READ FROM CACHE Dual I/O (BBh) The READ FROM CACHE Dual I/O (BBh) command enables improved random access while maintaining two IO pins, IO0 and IO1. It is similar to the READ FROM CACHE x2 (3Bh) command but with capability to input either the column address or the dummy clocks two bits per clock, thereby reducing command overhead. Refer to the Electrical Specifications for the supported frequency. Figure 16: READ FROM CACHE Dual I/O 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 SCK Command (BBh) CS# Plane select SI IO0 12 SO IO1 4 dummy cycles data out 1 10 8 6 4 2 0 6 4 2 11 9 7 5 3 1 7 5 3 3 dummy bits 12-bit column address 8717 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 . . . . . . 8716 8719 8718 8721 8720 8723 8722 8724 SCK CS# data out 2 data out 1 data out 3 data out 4 data out 2175 data out x data out 2176 SI IO0 0 6 4 2 0 6 4 2 0 6 4 2 0 6 4 2 0 6 4 2 0 6 4 2 0 6 SO IO1 1 7 5 3 1 7 5 3 1 7 5 3 1 7 5 3 1 7 5 3 1 7 5 3 1 6 Don’t Care Note: 1. Plane select is a dummy bit for 1Gb devices. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 22 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory READ Operations READ FROM CACHE Quad I/O (EBh) The READ FROM CACHE Quad I/O (EBh) command is similar to the READ FROM CACHE Dual I/O (BBh) command except that address and data bits are input and output through four pins: IO0, IO1, IO2, and IO3. The quad I/O dramatically reduces command overhead, enabling faster random access to the cache buffer. Refer to the Electrical Specifications for the supported frequency. Figure 17: READ FROM CACHE Quad I/O 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 SCK data out 1 Command CS# Plane select S1 IO0 data out 2 data out 3 data out 4 4 dummy cycles 8 4 0 4 0 4 0 4 0 4 S0 IO1 9 5 1 5 1 5 1 5 1 5 WP# IO2 10 6 2 6 2 6 2 6 2 6 HOLD# IO3 11 7 3 7 3 7 3 7 3 7 12 3 dummy bits 12-bit column address 4364 23 24 25 26 27 . . . . 4363 4366 4365 4367 SCK data out 4 data out 5 data out 5 data out x data out 2175 CS# SI IO0 data out 2176 4 0 4 0 4 0 4 0 4 0 4 SO IO1 1 5 1 5 1 5 1 5 1 5 1 5 WP# IO2 2 6 2 6 2 6 2 6 2 6 2 6 HOLD# IO3 3 7 3 7 3 7 3 7 3 7 3 7 Don’t Care Note: 1. Plane select is a dummy bit for 1Gb devices. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 23 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory READ Operations READ PAGE CACHE RANDOM (30h) The READ PAGE CACHE RANDOM (30h) command reads the specified block and page into the data register while the previous page is output from the cache register. This command is accepted by the die when it is ready (OIP = 0, CRBSY = 0). This command is used to improve the read throughput as follows: 1. 13h – PAGE READ to cache 2. 0Fh – GET FEATURE command to the read status until OIP status bit is changed from 1 to 0 3. 30h – READ PAGE CACHE RANDOM command to transfer data from data register to cache register and kick off the next page transfer from array to data register 4. 0Fh – GET FEATURE command to read the status until OIP status bit is changed from 1 to 0 5. 03h, 0Bh, 3Bh, 6Bh, BBh, or EBh – READ FROM CACHE TO OUTPUT command 6. 0Fh – GET FEATURE command to read the status until CRBSY = 0 7. Repeat step 3 to step 6 to read out all expected pages until last page 8. 3Fh – READ PAGE CACHE LAST command to end the read page cache sequence and copy a last page from the data register to the cache register 9. 0Fh – GET FEATURE command to read the status until OIP status bit is changed from 1 to 0 10.03h, 0Bh, 3Bh, 6Bh, BBh, or EBh – READ FROM CACHE TO OUTPUT command to read out last page from cache register to output The READ PAGE CACHE RANDOM command requires a 24-bit address consisting of 8 dummy bits followed by a 16-bit block/page address for 1Gb device or 7 dummy bits followed by a 17-bit block/page address for 2Gb or higher devices. After the block/page addresses are registered, the device starts to transfer data from data register to cache register for tRCBSY. AftertRCBSY, OIP bit (through GET FEATURE command to check this status bit) goes to 0 from 1, indicating that the cache register is available and that the specified page in the READ PAGE CACHE RANDOM command is copying from the the Flash array to the data register. At this point, data can be output from the cache register beginning at the column address specified by READ FROM CACHE commands. The status register CRBSY bit value remains at 1, indicating that the specified page in READ PAGE CACHE RANDOM command is copying from the Flash array to the data register; CRBSY returns to 0 to indicating the copying from array is completed. During tRCBSY, the error check and correction is also performed. Note:With an on-die ECC-enabled die, ECC is executed after data is transferred from the data register to the cache register; Therefore, tRCBSY includes this ECC time, which must be factored in when checking the OIP status. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 24 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 25 SO SI CS# SCK SO SI CS# SCK SO SI CS# SCK SO SI CS# SCK 7 MSB 7 MSB 2 6 6 5 5 0 0 4 4 2 2 30h 3 13h 3 1 2 3 2 Page Y data 2 3 Page x data 2 1 1 1 1 4 4 0 0 5 6 7 MSB 7 MSB 5 6 6 6 7 5 5 23 8 23 7 4 4 22 9 22 8 3 3 21 10 21 9 2 2 20 11 20 10 12 13 18 18 17 1 1 0 0 14 17 13 Page x data n 19 Page y 12 19 Page x 11 16 15 16 14 28 3 15 3 29 2 28 2 0 1 0 30 29 1 1 1 31 0 30 Figure 18: READ PAGE CACHE RANDOM Sequence 2 2 3 4 30h 3 tRCBSY 4 tRD 5 5 3Fh Read page cache last 0 31 6 0 6 7 2 8 23 Page Z 7 1 22 9 03h 3 10 11 20 5 tRCBSY 21 4 12 19 6 7 0 26 1 27 03h 4 8 3 9 6 28 2 10 7 29 1 8 0 31 12 11 30 11 1 22 29 24 7 MSB 30 tRCBSY 0 23 30 6 31 0 7 6 6 7 32 5 0 7 Page Z data 1 03h 1 31 MSB Dummy byte 25 29 1 2 0 7 6 Page Z data 2 8 3 30 Page x data 1 4 1 31 0 0 7 7 2 7 6 MSB 6 1 Don’t Care 0 Page Z data n 0 Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory READ Operations Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory READ Operations READ PAGE CACHE LAST (3Fh) The READ PAGE CACHE LAST (3Fh) command ends the READ PAGE CACHE RANDOM sequence and copies a page from the data register to the cache register. This command is accepted by the die when it is ready (OIP = 0, CRBSY = 0). After this command is issued, the status register bit OIP goes HIGH and the device is busy (CRBSY = 0, OIP = 1) for tRCBSY. Address is not applied in this command sequence. When data is completely copied to cache register, OIP goes LOW and READ FROM CACHE commands could be issued to output data. READ ID (9Fh) READ ID reads the 2-byte identifier code programmed into the device, which includes ID and device configuration data as shown in the table below. Table 3: READ ID Table Byte Description 7 6 5 4 3 2 1 0 Value Byte 0 Manufacturer ID (Micron) 0 0 1 0 1 1 0 0 2Ch Byte 1 1Gb 3.3V Device ID 0 0 0 1 0 1 0 0 14h Byte 1 2Gb 3.3V Device ID 0 0 1 0 0 1 0 0 24h Byte 1 4Gb 3.3V Device ID 0 0 1 1 0 1 1 0 36h Byte 1 8Gb 3.3V Device ID 0 1 0 0 0 1 1 0 46h Figure 19: READ ID (9Fh) Timing 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 0 0 0 16 17 18 19 20 21 22 23 24 25 SCK CS# Dummy byte Command (9Fh) 0 SI 0 0 0 0 Manufacturer ID High-Z SO Device ID 7 6 MSB 23 24 25 26 27 28 29 30 1 31 SCK CS# SI Device ID SO 7 6 5 4 3 2 1 0 MSB Don’t Care 1 CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 26 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Parameter Page Parameter Page The following command flow must be issued by the memory controller to access the parameter page contained within Micron SPI devices: 1. 1Fh – SET FEATURE command with a feature address of B0h and data value for CFG[2:0] = 010b (to access OTP/Parameter/Unique ID pages). 2. 13h – PAGE READ command with a block/page address of 0x01h, and then check the status of the read completion using the GET FEATUR ES (0Fh) command with a feature address of C0h. 3. 03h – READ FROM CACHE command with an address of 0x00h to read the data out of the NAND device (see the following Parameter Page Data Structure table for a description of the contents of the parameter page). 4. 1Fh – SET FEATURE command with a feature address of B0h and data value of 00h to exit the parameter page reading. Parameter Page Data Structure Table Table 4: Parameter Table Byte Description Value (hex) 0-3 Parameter page signature 4Fh, 4Eh, 46h, 49h 4-5 Revision number 00h 6-7 Feature support 00h 8-9 Optional commands support 06h, 00h 10-31 Reserved 00h 32-43 Device manufacturer 4Dh, 49h, 43h, 52h, 4Fh, 4Eh, 20h, 20h, 20h, 20h, 20h, 20h 44-63 Device model: MT29F1G01ABAFDSF 4Dh, 54h, 32h, 39h, 46h, 31h, 47h, 30h, 31h, 41h, 42h, 41h, 46h, 44h, 53h, 46h, 20h, 20h, 20h, 20h 44-63 Device model: MT29F1G01ABAFD12 4Dh, 54h, 32h, 39h, 46h, 31h, 47h, 30h, 31h, 41h, 42h, 41h, 46h, 44h, 31h, 32h, 20h, 20h, 20h, 20h 44-63 Device model: MT29F1G01ABAFDWB 4Dh, 54h, 32h, 39h, 46h, 31h, 47h, 30h, 31h, 41h, 42h, 41h, 46h, 44h, 57h, 42h, 20h, 20h, 20h, 20h 64 Manufacturer ID 2Ch 65-66 Date code 00h 67-79 Reserved 00h 80-83 Number of data bytes per page 00h, 08h, 00h, 00h 84-85 Number of spare bytes per page 80h, 00h 86-89 Number of data bytes per partial page 00h, 02h, 00h, 00h 90-91 Number of spare bytes per partial page 20h, 00h 92-95 Number of pages per block 40h, 00h, 00h, 00h 96-99 Number of blocks per unit 00h, 04h, 00h, 00h 100 Number of logical units 01h 101 Number of address cycles 00h 102 Number of bits per cell 01h 103-104 Bad blocks maximum per unit 14h, 00h CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 27 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Unique ID Page Table 4: Parameter Table (Continued) Byte Description Value (hex) 105-106 Block endurance 01h, 05h 107 Guaranteed valid blocks at beginning of target 08h 108-109 Block endurance for guaranteed valid blocks 00h 110 Number of programs per page 04h 111 Partial programming attributes 00h 112 Number of ECC bits 00h 113 Number of interleaved address bits 00h 114 Interleaved operation attributes 00h 115-127 Reserved 00h 128 I/O pin capacitance 08h 129-130 Timing mode support 00h 131-132 Program cache timing 00h 133-134 t 58h, 02h 135-136 t 10h, 27h 137-138 tR 139-140 tCCS 141-163 Reserved 00h 164-165 Vendor-specific revision number 00h 166-179 Vendor specific 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 02h, 02h, B0h, 0Ah, B0h 180-247 Reserved 00h 248 ECC maximum correct ability 08h 249 Die select feature 00h 250-253 Reserved 00h 254-255 Integrity CRC Set at Test 256-512 2nd copy of the parameter table 513-768 3rd copy of the parameter table 769-2048 Additional redundant parameter pages PROG maximum page program time ERS maximum block erase time maximum page read time minimum 46h, 00h 00h Unique ID Page The following command flow must be issued by the memory controller to access the unique ID page contained within the device: 1. Issue a SET FEATURE (1Fh) command on a feature address of B0h and data value of 40h (Access to OTP, Parameter, Unique ID pages, ECC disable). 2. Issue a PAGE READ (13h) command on a block/page address of 0x00h, and then poll the status register OIP bit until device ready using the GET FEATURE (0Fh) command issued on a feature address of C0h. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 28 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Unique ID Page 3. Issue a READ FROM CACHE (03h) command on an address of 0x00h to read the unique ID data out of the NAND device. 4. To exit reading the unique ID page, issue a SET FEATURE (1Fh) command with a feature address of B0h and data value of 10h or 00h (main array READ, ECC enable/disable). The device stores 16 copies of the unique ID data. Each copy is 32 bytes: the first 16 bytes are unique data, and the second 16 bytes are the complement of the first 16 bytes. The host should XOR the first 16 bytes with the second 16 bytes. If the result is 16 bytes of FFh, that copy of the unique ID data is correct. If a non-FFh result is returned, the host can repeat the XOR operation on a subsequent copy of the unique ID data. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 29 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Program Operations Program Operations PAGE PROGRAM A PAGE PROGRAM operation sequence enables the host to input 1 byte to 2176 bytes of data within a page to a cache register, and moves the data from the cache register to the specified block and page address in the array. Only four partial-page programs are allowed on a single page. If more than 2176 bytes are loaded, then those additional bytes are ignored by the cache register. The page program sequence is as follows: • 06h (WRITE ENABLE command) • 02h (PROGRAM LOAD command) • 10h (PROGRAM EXECUTE command) • 0Fh (GET FEATURES command to read the status) PROGRAM LOAD x1 (02h) Prior to performing the PROGRAM LOAD operation, a WRITE ENABLE (06h) command must be issued. As with any command that changes the memory contents, the WRITE ENABLE command must be executed in order to set the WEL bit. WRITE ENABLE is followed by a PROGRAM LOAD (02h) command. The PROGRAM LOAD command consists of an 8-bit op code, followed by 3 dummy bits, followed by a plane select (if available) and a 12-bit column address, and then the data bytes to be programmed. The data bytes are loaded into a cache register that is 2176 bytes long. Only four partial-page programs are allowed on a single page. If more than 2176 bytes are loaded, those additional bytes are ignored by the cache register. The command sequence ends when CS# goes from LOW to HIGH. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 30 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Program Operations Figure 20: PROGRAM LOAD (02h) Timing 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 SCK CS# 3 dummy bits Command (02h) SI 0 0 0 12-bit column address 12 11 10 9 8 7 6 5 4 Data byte 1 3 2 1 0 7 6 MSB Plane select 1 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 17424… 17431 SCK CS# Data byte 1 SI 7 6 5 4 3 Data byte 2 2 1 0 7 6 5 4 3 Data byte 2176 2 1 0 7 6 5 4 3 2 1 0 Don’t Care 1 Note: 1. Plane select is a dummy bit in 1Gb device. PROGRAM EXECUTE (10h) The PROGRAM EXECUTE command consists of an 8-bit op code, followed by a 24-bit address. After the page/block address is registered, the device starts the transfer from the cache register to the main array and is busy for tPROG time. During this busy time, the status register can be polled to monitor the status of the operation (refer to the status register section). When the operation completes successfully, the next series of data can be loaded with the PROGRAM LOAD command. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 31 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Program Operations Figure 21: PROGRAM EXECUTE (10h) Timing 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 SCK CS# Command (10h) Address bits 23 SI 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 High-Z SO 1 23 24 25 26 27 28 29 30 0 31 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SCK CS# GET FFEATURE (0Fh) Address bits SI 7 6 5 4 3 2 1 Status register address (C0h) 0 7 6 5 4 3 2 1 0 MSB High-Z SO 2 1 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 1 0 SCK CS# Status register address SI 2 1 0 Status register data out Status register data out SO High-Z 7 6 5 4 3 2 1 0 7 MSB 6 5 4 3 2 MSB 2 Don’t Care RANDOM DATA PROGRAM x1 (84h) The RANDOM DATA PROGRAM operation programs or replaces data in a page with existing data. The random data program sequence is as follows: • 06h (WRITE ENABLE command) CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 32 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Program Operations • 84h (PROGRAM LOAD RANDOM DATA command) • 10h (PROGRAM EXECUTE command) • 0Fh (GET FEATURES command to read the status) The PROGRAM LOAD RANDOM DATA x1 (84h) operation is similar to PROGRAM LOAD x1 (02h). The difference is that PROGRAM LOAD X1command will reset the cache buffer to an all FFh value, while PROGRAM LOAD RANDOM DATA X1command will only update the data bytes that are specified by the command input sequence, and the rest of data in the cache buffer will remain unchanged. If the random data is not sequential, then another PROGRAM LOAD RANDOM DATA x1 (84h) command must be issued with a new column address. After the data is loaded, a PROGRAM EXECUTE (10h) command can be issued to start the programming operation. Figure 22: PROGRAM LOAD RANDOM DATA (84h) Timing 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 SCK CS# Command (84h) 12-bit column address 3 dummy bits 0 SI 0 0 12 11 10 9 8 7 6 5 4 Data byte 1 3 2 1 0 7 6 MSB Plane select 23 24 25 26 27 28 29 30 31 32 33 34 35 36 1 37 38 39 17424… 17431 SCK CS# Data byte 1 SI 7 6 5 4 3 Data byte 2 2 1 0 7 6 5 4 3 Data byte 2176 2 1 0 7 6 5 4 3 2 1 0 1 Don’t Care Note: 1. Plane select is a dummy bit in 1Gb device. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 33 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Program Operations PROGRAM LOAD x4 (32h) and PROGRAM LOAD RANDOM DATA x4 (34h) The PROGRAM LOAD x4 (32h) and RANDOM DATA x4 (34h) is similar to PROGRAM LOAD x1 (02h) command and RANDOM DATA x1 (84h), but with the capability to input the data across four data lines. Figure 23: PROGRAM LOAD x4 (32h) Timing 0 1 2 3 4 5 6 7 8 9 10 20 21 22 23 24 25 26 27 28 29 43 44 45 46 47 SCK CS# Dummy bits and plane select1 Command (32h) column address bits A[11:0] IO0 15 14 13 3 2 1 0 4 0 4 0 4 0 0 4 0 4 0 0 4 0 4 0 IO1 5 1 5 1 5 1 1 5 1 5 1 1 5 1 5 1 IO2 6 2 6 2 6 2 2 6 2 6 2 2 6 2 6 2 IO3 7 3 7 3 7 3 3 7 3 7 3 3 7 3 7 3 Byte 1 Byte 2 Byte 11 Byte 12 Byte 2175 Byte 2176 Don’t Care Note: 1. Number of dummy bits are different for the different densities, and plane select is not available in 1Gb. Plane select is a dummy bit in 1Gb device. INTERNAL DATA MOVE The INTERNAL DATA MOVE command programs or replaces data in a page with existing data. The internal data move command sequence is as follows: • 13h (PAGE READ command to cache) • 06h (WRITE ENABLE command) • 84h (PROGRAM LOAD RANDOM DATA command) • 10h (PROGRAM EXECUTE command) • 0Fh (GET FEATURES command to read the status) Note:If the random data is not sequential, another PROGRAM LOAD RANDOM DATA (84h) command must be issued with the new column address. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 34 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Block Erase Operations Block Erase Operations The BLOCK ERASE (D8h) command is used to erase at the block level. The blocks are organized as 64 pages per block, 2176 bytes per page (2048 + 128 bytes). Each block is 136KB. The BLOCK ERASE command (D8h) operates on one block at a time. The command sequence for the BLOCK ERASE operation is as follows: • 06h (WRITE ENABLE command) • D8h (BLOCK ERASE command) • 0Fh (GET FEATURES command to read the status register) Prior to performing the BLOCK ERASE operation, a WRITE ENABLE (06h) command must be issued. As with any command that changes the memory contents, the WRITE ENABLE command must be executed in order to set the WEL bit. If the WRITE ENABLE command is not issued, then the rest of the erase sequence is ignored. A WRITE ENABLE command must be followed by a BLOCK ERASE (D8h) command. This command requires a 24-bit address consisting of dummy bits followed by a valid block address. After the address is registered, the control logic automatically controls timing and ERASE and VERIFY operations. The device is busy fortERS time during the BLOCK ERASE operation. The GET FEATURES (0Fh) command can be used to monitor the status of the operation. (See the following figure.) CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 35 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Block Erase Operations Figure 24: BLOCK ERASE (D8h) Timing 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 SCK CS# Command (D8h) Address bits SI 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 High-Z SO 1 23 24 26 25 27 28 29 30 0 31 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SCK CS# Address bits SI 7 6 5 4 GET FEATURE (0Fh) 3 2 1 Status register address (C0h) 0 6 7 5 4 3 2 1 0 MSB High-Z SO 2 1 12 13 14 15 16 17 18 19 20 21 22 23 SCK CS# SI 2 1 0 Status register data out Status register data out SO High-Z 7 6 5 4 3 2 1 0 7 MSB 2 CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 6 5 4 3 2 1 0 MSB Don’t Care 36 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Features Operations Features Operations GET FEATURE (0Fh) and SET FEATURE (1Fh) The GET FEATURE (0Fh) and SET FEATURE (1Fh) commands either monitor the device status or alter the device configuration from the default at power-on. These commands use a 1-byte feature address to determine which feature is to be read or modified. Features such as OTP protect, block locking, SPI NOR like protocol configuration, and ECC correction can be managed by setting specific bits in feature addresses. Typically, the status register at feature address C0h is read to check the device status, except WEL, which is a writable bit with the WRITE ENABLE (06h) command. When a feature is set, it remains active until the device is power cycled or the feature is written to. Unless specified otherwise, when the device is set, it remains set even if a RESET (FFh) command is issued. CFG[2:0] will be cleared to 000 after a reset and the device is back to normal operation. Figure 25: GET FEATURE (0Fh) Timing 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 2 1 15 16 17 18 19 20 21 22 23 SCK CS# 1 byte address Command (0Fh) 7 SI 6 5 4 3 0 MSB SO Data byte High-Z 7 6 5 4 3 2 1 0 MSB Don’t Care Figure 26: SET FEATURE (1Fh) Timing 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 SCK CS# 1 byte address Command (1Fh) SI 7 6 5 4 MSB 3 Data byte 2 1 0 7 6 5 4 3 2 1 0 MSB Don’t Care CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 37 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Feature Settings Feature Settings Table 5: Feature Address Settings and Data Bits Register Feature Address Feature Data Bits 7 6 5 4 3 2 1 0 Notes Block lock Address = A0h; Access = R/W BRWD BP3 BP2 BP1 BP0 TB WP#/HOLD# Disable – 1, 2 Configuration Address = B0h; Access = R/W CFG2 CFG1 LOT_EN ECC_EN – – CFG0 – 1 Status Address = C0h; Access = R CRBSY ECCS2 ECCS1 ECCS0 P_Fail E_Fail WEL OIP 1 Die select Address = D0h; Access = R/W – DS0 – – – – – – 3 Notes: 1. See the corresponding register bit description in Security Features, ECC Protection, Status Register, and Read Protocol – Similar to SPI NOR sections. 2. When the WP#/HOLD# disable bit is at the default value of 0, and with BRWD set to 1 and WP# LOW, block lock registers [7:2] cannot be changed. 3. Die Select only available in 4Gb or greater stacked die devices . CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 38 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Security – Volatile Block Protection Security – Volatile Block Protection The block lock feature protects the entire device or ranges of device blocks from the PROGRAM and ERASE operations. The SET FEATURE command must be issued to alter the state of block protection. After power-up, the device is in the locked state by default; block lock register bits BP[3:0] and TB are 1. Reset will not modify the block protection state. When a PROGRAM/ERASE command is issued to a locked block, a status register P_Fail bit or E_Fail bit will be set to indicate the operation failure. The following command sequence unlocks all blocks after power-up: The SET FEATURE REGISTER WRITE (1Fh) operation is issued, followed by the feature address (A0h). Then, 00h is issued on data bits to unlock all blocks. Security – Block Protection Bits Table 6: Block Lock Register Block Protection Bits TB BP3 BP2 BP1 BP0 Protected Portion Protected Blocks 0 0 0 0 0 None – all unlocked None 0 0 0 0 1 Upper 1/1024 locked 1023 0 0 0 1 0 Upper 1/512 locked 1022:1023 0 0 0 1 1 Upper 1/256 locked 1020:1023 0 0 1 0 0 Upper 1/128 locked 1016:1023 0 0 1 0 1 Upper 1/64 locked 1008:1023 0 0 1 1 0 Upper 1/32 locked 992:1023 0 0 1 1 1 Upper 1/16 locked 960:1023 0 1 0 0 0 Upper 1/8 locked 896:1023 0 1 0 0 1 Upper 1/4 locked 768:1023 0 1 0 1 0 Upper 1/2 locked 512:1023 1 0 0 0 0 All unlocked None All locked 0:1023 All others 1 0 0 0 1 Lower 1/1024 locked 0 1 0 0 1 0 Lower 1/512 locked 0:1 1 0 0 1 1 Lower 1/256 locked 0:3 1 0 1 0 0 Lower 1/128 locked 0:7 1 0 1 0 1 Lower 1/64 locked 0:15 1 0 1 1 0 Lower 1/32 locked 0:31 1 0 1 1 1 Lower 1/16 locked 0:63 CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 39 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Security – Hardware Write Protection Table 6: Block Lock Register Block Protection Bits (Continued) TB BP3 BP2 BP1 BP0 Protected Portion Protected Blocks 1 1 0 0 0 Lower 1/8 locked 0:127 1 1 0 0 1 Lower 1/4 locked 0:255 1 1 0 1 0 Lower 1/2 locked 0:511 1 1 1 1 1 All locked (default) 0:1023 Security – Hardware Write Protection Hardware write protection prevents the block protection state from hardware modifications. In order to utilize this feature, SET FEATURE command is issued on the feature address A0h and WP#/HOLD# disable bit state is set to 0. The BRWD bit is operated in conjunction with WP#/HOLD# disable bit. When BRWD is set to 1 and WP# is LOW, none of the other block lock register bits [7:2] can be set. The block lock state cannot be changed, regardless of what is unlocked or locked. Also, when the WP#/HOLD# disable bit is set to 1, the hardware protected mode is disabled. The default value of BRWD and WP#/HOLD# disable bits = 0 after power up. Security – Device Lock Tight The lock tight (LOT) mode prevents the block protection state from software modifications. After it is enabled, this mode cannot be disabled by a software command. Also, BP, TB, and BRWD bits are protected from further software changes. Only another power cycle can disable the lock tight mode. The following command sequence enables the lock tight mode: The SET FEATURE REGISTER WRITE (1Fh) operation is issued, followed by the feature address (B0h). Then, data bits are set to enable LOT (LOT_EN bit = 1). When the hardware write protection mode is disabled during quad or ×4 mode, lock tight can be used to prevent a block protection state change. Permanent Block Lock Protection 48 blocks per die (0 to 47) can be permanently locked using PROTECT command. The PROTECT command provides nonvolatile, irreversible protection of up to twelve groups (48 blocks). Implementation of the protection is group-based, which means that a minimum of one group (4 blocks) is protected when the PROTECT command is issued. Because block protection is nonvolatile, a power-on or power-off sequence does not affect the block status after the PROTECT command is issued. The device is shipped from the factory with no blocks protected so that users can program or erase the blocks before issuing the PROTECT command. Block protection is also irreversible in that when protection is enabled by issuing the PROTECT command, the protected blocks can no longer be programmed or erased. If permanent lock is disabled, PROTECT command would be ignored. As with any command that changes the memory contents, the WRITE ENABLE must be executed. If this command is not issued, then the protection command is ignored. WRITE ENABLE must be followed by a PROTECTION command (2Ch). The following PROTECT sequence is used: • 06h (WRITE ENABLE) • 2Ch (PERMANENT BLOCK LOCK PROTECTION) CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 40 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Security – One Time Programmable (OTP) • 24-bit address (see the PROTECTION Command Details) • After tPROG time, use GET FEATURE command (0Fh) with feature address C0h to verify P_Fail bit Figure 27: PROTECT Command Cycle 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 28 29 30 31 SCK CS# tPROG Page Y SI 2Ch 23 22 21 20 19 18 17 16 3 2 1 0 SO Don’t Care PROTECTION Command (2Ch) Details To enable protection, the PROTECTION command consists of an 8-bit command code, followed by a 24-bit address (7 dummy bits and an 17-bit page/ block address). Row address bits 11, 10, 9, 8 (named as Y) input the targeted block group information. Where Y defines the group of blocks to be protected. There are 12 Groups Y where Y = 0000b-1011b: • Y = 0000 protects Group0 = blks 0, 1, 2, 3. • Y = 0001 protects Group1 = blks 4, 5, 6, 7. • ...... • Y = 1011 protects Group11 = blks 44, 45, 46, 47. After tPROG, the targeted block groups are protected. Upon PROTECT operation failure, the status register reports a value of 0Ch (P_FAIL = 1 and WEL = 1). Upon PROTECT operation success, the status register reports a value of 00h. Note:There is no status register to check the PROTECT status of a block or a group. A permanent blocks table should be maintained and updated after a group is protected. Permanent Block Lock Protection Disable Mode This mode disables the ability to accept the PROTECTION command. Running this command sequence ensures no more groups can ever be permanently locked. The following disable PROTECT sequence is used • SET FEATURE command (1Fh) with B0h mode and data value C2h • 06h (WRITE ENABLE) • 10h (Execute with block/page address as 0) • After tPROG time, use GET FEATURE command (0Fh) with feature address C0h to verify P_Fail bit Security – One Time Programmable (OTP) This device offers a protected, one-time programmable NAND Flash memory area. Ten full pages per die are available, and the entire range is guaranteed. Customers can choose how to use the OTP area, such as programming serial numbers or other data for permanent storage. The OTP area can't be CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 41 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Security – One Time Programmable (OTP) erased. When ECC is enabled, data written in the OTP area is ECC protected. Besides some additional configuration bits are described in this section. Enable OTP Access OTP access needs to be enabled in order to read and write to the OTP region. When the die is in OTP operation mode, all subsequent page program or page read commands are applied to the OTP area. SET FEATURES command (1Fh) with feature address B0h and data 50h (OTP operation mode with ECC enabled ) or 40h (OTP operation mode with ECC disabled ) are used to enable the OTP access. After OTP access is enabled, the following sequence is used to program one or more pages • WRITE ENABLE command (06h) • PROGRAM EXECUTE command (10h) with the row address of page (OTP page address range 02h-0Bh) • Verify until OIP bit not busy using GET FEATURE command (0Fh) with feature address C0h • Using GET FEATURE command (0Fh) with feature address C0h, verify if P_FAIL bit is 0 for the successful operation. After OTP access is enabled, the following sequence is used to read one or more pages • PAGE READ command (13h) with the page address (02h-0Bh) • Verify until OIP bit is not busy using GET FEATURE command (0Fh) with feature address C0h • Page data using READ FROM CACHE command (03h). OTP Configuration States To check the status of OTP data protect, SPI NOR read enable, or permanent block Lock protection, the following sequence is used • SET FEATURES command (1Fh) with feature address B0h and data (C0h for OTP data protect bit, 82h for NOR read protocol enable bit, C2h for permanent block lock disable bit) • PAGE READ command (13h) with address 0 • Verify until OIP bit not busy using GET FEATURE command (0Fh) with feature address C0h • READ FROM CACHE command (03h) with address 0 • Expect the read from cache data all 1 for the mode disabled or all 0 for enabled. Note: Configuration status of CFG[2:0] can be read using GET FEATURE command (0Fh) with feature address B0h. OTP Protection and Program Prevention This mode is used to prevent further programming of the pages in the OTP area. To protect and prevent programming the OTP area, the following sequence is used • • • • SET FEATURES command (1Fh) with feature address B0h and data C0h (CFG[2:0] = 110b) WRITE ENABLE command (06h) PROGRAM EXECUTE command (10h) with the row address 00h Verify until OIP bit not busy and P_FAIL bit 0 using GET FEATURE command (0Fh) with status register address C0h. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 42 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Security – One Time Programmable (OTP) Exit OTP To exit from OTP operation mode and return the device to normal array operation mode, the SET FEATURES command (1Fh) is issued. This is followed by setting the feature address = B0h and data CFG[2:0] = 000b. Last, the RESET (FFh) command is issued. Table 7: Configuration Registers for Security CFG2 CFG1 CFG0 0 0 0 Normal operation 0 1 0 Access OTP area/Parameter/Unique ID 1 1 0 Access to OTP data protection bit to lock OTP area 1 0 1 Access to SPI NOR read protocol enable mode 1 1 1 Access to permanent block lock protection disable mode CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 State 43 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Status Register Status Register The device has an 8-bit status register that software can read during the device operation. All bits are read-only register except WEL, which could be changed by WRITE DISABLE (04h) and WRITE ENABLE (06h) commands. None of bits can be changed by SET FEATURE (1Fh) command. The status register can be read by issuing the GET FEATURE (0Fh) command, followed by the feature address (C0h). The status register will output the status of the operation. Table 8: Status Register Bit Descriptions Bit Bit Name 7 Cache read busy (CRBSY) This bit is set (CRBSY = 1) when READ PAGE CACHE RANDOM command is executing; this bit remains a 1 until the page specified at READ PAGE CACHE RANDOM command is transferred from array to data register. When the bit is 0, the device is in the ready state and background READ PAGE CACHE operation is completed. RESET command is acceptable during CRBSY = 1 and could halt background READ PAGE CACHE operation and download first page at block 0 into cache register at default. 6 ECC status register (ECCS2) 5 ECC status register (ECCS1) 4 ECC status register (ECCS0) See ECC Protection for the ECC status definition. ECC status is set to 000b either following a RESET or at the beginning of the READ. It is then updated after the device completes a valid READ operation. ECC status is invalid if ECC is disabled (via a SET FEATURE command to get access the configuration register). After a power-up RESET, ECC status is set to reflect the contents of block 0, page 0. 3 Program fail (P_Fail) 2 Erase fail (E_Fail) Indicates that an erase failure has occurred (E_Fail = 1). This bit will also be set if the user attempts to erase a locked region or if the ERASE operation fails. This bit is cleared (E_Fail = 0) at the start of the BLOCK ERASE command sequence or a RESET command. 1 Write enable latch (WEL) Indicates the current status of the write enable latch (WEL) and must be set (WEL = 1) prior to issuing a PROGRAM EXECUTE or BLOCK ERASE command. It is set by issuing the WRITE ENABLE command. WEL can also be cleared (WEL = 0) by issuing the WRITE DISABLE command or a successful PROGRAM/ERASE operation. 0 Description Indicates that a program failure has occurred (P_Fail = 1). This bit will also be set if the user attempts to program a locked or protected region, including the OTP area. This bit is cleared during the PROGRAM EXECUTE command sequence or a RESET command (P_Fail = 0). Operation in progress This bit is set (OIP = 1 ) when a PROGRAM EXECUTE, PAGE READ, READ PAGE CACHE LAST, (OIP) BLOCK ERASE, READ PAGE CACHE RANDOM (within tRCBSY to wait for cache register readiness), RESET command, or a power-up initialization is executing; the device is busy. When the bit is 0, the interface is in the ready state. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 44 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory ECC Protection ECC Protection The device offers an 8-bit data corruption protection by offering internal ECC to obtain the data integrity. The internal ECC can be enabled or disabled by setting the ECC_EN bit in the configuration register. ECC is enabled after device power-up by default. The READ and PROGRAM commands operate with internal ECC by default. Reset will not change the existing configuration. To enable/disable ECC after power on, perform the following command sequence: • Issue the SET FEATURES command (1Fh) • Issue configuration register address (B0h) • Then: To enable ECC, set bit 4 (ECC enable) to 1; To disable ECC, clear bit 4 (ECC enable) to 0 During a PROGRAM operation, the device calculates an expected ECC code on the ECC-protected bytes in the cache register, before the page is written to the NAND Flash array. The ECC code is stored in the spare area of the page. During a READ operation, the page data is read from the array to the cache register, where the ECC code is calculated and compared with the expected ECC code value read from the array. If a 1–8-bit error is detected, the error is corrected in the cache register. Only corrected data is output on the I/O bus. The ECC status register bit indicates whether or not the error correction is successful. The table below describes the ECC protection scheme used throughout a page. Note:The unique ID and parameter page are not ECC-protected areas. Multiple copies are provided for parameter page to obtain the data integrity. XOR method is provided for unique ID to verify the data. With internal ECC, users must accommodate the following (details provided in table below): • Spare area definitions • WRITEs are supported for main and spare areas (user meta data I and II). WRITEs to the ECC area are prohibited When using partial-page programming, the following conditions must both be met: • In the main user area and user meta data area I, single partial-page programming operations must be used • Within a page, a maximum of four partial-page programming operations can be performed Table 9: ECC Status Register Bit Descriptions Bit 2 Bit 1 Bit 0 Description 0 0 0 No errors 0 0 1 1-3 bit errors detected and corrected 0 1 0 Bit errors greater than 8 bits detected and not corrected 0 1 1 4-6 bit errors detected and corrected. Indicates data refreshment might be taken 1 0 1 7-8 bit errors detected and corrected. Indicates data refreshment must be taken to guarantee data retention Others Reserved Table 10: ECC Protection Max Byte Address Min Byte Address ECC Protected Area Description 1FFh 000h Yes Main 0 User Main data 0 3FFh 200h Yes Main 1 User Main data 1 CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 45 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory ECC Protection Table 10: ECC Protection (Continued) Max Byte Address Min Byte Address ECC Protected Area Description 5FFh 400h Yes Main 2 User Main data 2 7FFh 600h Yes Main 3 User Main data 3 803h 800h No Spare 0 Reserved (bad block data) 807h 804h No Spare 1 User meta data II 80Bh 808h No Spare 2 User meta data II 80Fh 80Ch No Spare 3 User meta data II 813h 810h No Spare 0 User meta data II 817h 814h No Spare 1 81Bh 818h No Spare 2 81Fh 81Ch No Spare 3 827h 820h Yes Spare 0 82Fh 828h Yes Spare 1 837h 830h Yes Spare 2 83Fh 838h Yes Spare 3 84Fh 840h Yes Spare 0 ECC for Main/Spare 0 85Fh 850h Yes Spare 1 ECC for Main/Spare 1 86Fh 860h Yes Spare 2 ECC for Main/Spare 2 87Fh 870h Yes Spare 3 ECC for Main/Spare 3 CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 46 User meta data I Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Error Management Error Management This NAND Flash device is specified to have the minimum number of valid blocks (NVB) of the total available blocks per die shown in the table below. This means the devices may have blocks that are invalid when shipped from the factory. An invalid block is one that contains at least one page that has more bad bits than can be corrected by the minimum required ECC. Additional bad blocks may develop with use. However, the total number of available blocks will not fall below NVB during the endurance life of the product. Although NAND Flash memory devices may contain bad blocks, they can be used reliably in systems that provide bad-block management and error-correction algorithms. This ensures data integrity. Internal circuitry isolates each block from other blocks, so the presence of a bad block does not affect the operation of the rest of the NAND Flash array. NAND Flash devices are shipped from the factory erased. The factory identifies invalid blocks before shipping by attempting to program the bad-block mark into every location in the first page of each invalid block. It may not be possible to program every location in an invalid block with the bad-block mark. However, the first spare area location in each bad block is guaranteed to contain the bad-block mark. This method is compliant with ONFI factory defect mapping requirements. See the following table for the bad-block mark. System software should initially check the first spare area location for non-FFh data on the first page of each block prior to performing any program or erase operations on the NAND Flash device. A bad-block table can then be created, enabling system software to map around these areas. Factory testing is performed under worst-case conditions. Because invalid blocks may be marginal, it may not be possible to recover the bad-block marking if the block is erased. Table 11: Error Management Details Description Requirement Minimum number of valid blocks (NVB) 1004 Total available blocks 1024 First spare area location in the first page of each block Byte 2048 Value programmed for bad block at the first byte of spare area 00h Minimum required ECC 8-bit ECC per sector (544) bytes of data Minimum ECC with internal ECC enabled 8-bit ECC per 512 bytes (user data) + 8 bytes (Spare) + 16 bytes (ECC data) CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 47 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory SPI NOR Read Configuration SPI NOR Read Configuration Some chipset vendors may have already designed in SPI NOR IP to support system boot; address allocation on clock cycle in SPI NAND read from cache protocol will cause incompatibility. To be drop-in compatible to SPI NOR read protocol, this device offers an alternative solution to implement 03h/0Bh commands, as are done with SPI NOR. Refer to the Electrical Specifications for detail timing requirement. This solution would be enabled using the following command sequence: • SET FEATURE command (1Fh) with feature address B0h and CFG bits[2:0] = 101b (access SPI NOR read protocol enable mode) • WRITE ENABLE command (06h) • PROGRAM EXECUTE command (10h) with block/page address all 0 • GET FEATURE command (0Fh) with status register address C0h to check until device is ready (OIP bit clear) and verify that P_FAIL bit is not set • SET FEATURE command (1Fh) with feature address B0h and CFG bits[2:0] = 000b (return to normal operation mode) • GET FEATURE command (0Fh) at address B0h and CFG bits[2:0] = 101b to verify all 0; all 1 indicates SPI NOR mode not enabled. It is a nonvolatile configuration setting and power cycle will not recover it back to SPI NAND default mode. The rest of the SPI NAND commands still work in this configuration. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 48 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory SPI NOR Read Configuration Figure 28: Read from Cache (03h) 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 SCK 11 dummy bits 12-bit column address Plane select (bit 12) Command (03h) CS# 12 SI 11 10 9 SO 1 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 16,919 16,927 SCK CS# SI 12-bit column address 7 8 7 6 5 4 3 2 1 0 data out 1 SO 7 6 5 4 3 data out 2176 2 1 0 7 6 5 4 3 2 1 0 7 6 1 Don’t Care Note: 1. SPI NOR compatible. Plane select bit not available in 1Gb device and can be used as a dummy bit. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 49 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory SPI NOR Read Configuration Figure 29: Fast Read from Cache (0Bh) 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 SCK 11 dummy bits 12-bit column address Plane select (bit 12) Command (0Bh) CS# 12 SI 11 10 9 SO 1 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 SCK CS# SI 12-bit column address 7 8 7 6 5 4 3 1 dummy byte 2 1 data out 1 0 SO 7 6 5 4 3 2 1 1 0 7 6 Don’t Care Note: 1. SPI NOR compatible. Plane select bit not available in 1Gb device and can be used as a dummy bit. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 50 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Power-Up and Power-Down Power-Up and Power-Down During the power-up and power-down, the device must not be selected; that is, CS# must follow the voltage applied on VCC until VCC reaches the correct values: VCC, min at power-up and VSS at power-down. Micron NAND Flash devices are designed to prevent data corruption during power transitions. VCC is internally monitored. After the device VCC has reached the VCC, min, GET FEATURE command can be issued to poll the status register (OIP) before the first access. Normal precautions must be taken for supply line decoupling to stabilize the VCC supply. Each device in a system should have the VCC line decoupled by a suitable capacitor (recommended 4.7µF + 0.1µF) close to the package pins. Note: For power cycle testing, the system must not initiate the power-up sequence until VCC drops down to 0V. Figure 30: SPI Power-Up VCC VCC,max Chip selection not allowed VCC,min Chip reset VWI tPOR Polling allowed Device fully accessible Status register OIP bit 0 Time This device supports default device initialization that does not require RESET (FFh) command. When device VCC has reached the write inhibit voltage, the device automatically starts the initialization. At default setting, first page data is automatically loaded into cache register. During the initialization, GET FEATURE command can be issued to poll the status register (OIP) before the first access; Or, the first access can occur 1.25ms (for 3.3V) or 2ms (for 1.8V) after VCC reaches VCC,min. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 51 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Power-Up and Power-Down Figure 31: Automatic Device Initialization Mode 3 SCK Mode 0 VCC,min = 1.7V VCC WP# Power-up: 1st page autoload = 1.25ms1 CS# SI SO Read from cache (03h, 3Bh, or 6Bh) High-Z Don’t Care Notes: 1. A = 1.25ms for 3.3V, 2ms for 1.8V. 2. B = 2.7V for 3.3V, 1.7V for 1.8V. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 52 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Electrical Specifications Electrical Specifications Stresses greater than those listed can cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions above values in this specification is not guaranteed. Exposure to absolute maximum rating conditions for extended periods can affect reliability. Table 12: Absolute Maximum Ratings Parameter Symbol Min Max Unit Supply voltage (SPI) VCC –0.6 4.6 V I/O voltage VCC –0.6 4.6 V Operating temperature (ambient) TA –40 85 Storage temperature TS –65 150 °C °C Notes: 1. During infrequent, nonperiodic transitions and for periods less than 20ns, voltage potential between VSS and VCC may undershoot to –2.0V or overshoot to VCC_MAX + 2.0V. Table 13: Operating Conditions Parameter Symbol Min Typ Max Unit Supply voltage VCC 2.7 3.3 3.6 V Ambient operating temperature (industrial) TA –40 25 85 °C Table 14: AC Measurement Conditions Parameter Symbol Min Max Unit 30/10 pF Load Capacitance CL Input rise and fall time – – 5 ns Input rise and fall time (>100 MHz) – – 1.5 ns Input pulse voltage1 – 0.2 VCC 0.8 VCC V Input timing reference voltages – 0.3 VCC 0.7 VCC V Output timing reference voltages – VCC/2 V Notes: 1. These are Min/Max specifications for dual/quad operations. Figure 32: AC Measurement I/O Waveform I/O timing reference levels Input levels 0.8 VCC 0.7 VCC 0.5 VCC 0.3 VCC 0.2 VCC Table 15: Capacitance Description Symbol Test Conditions Min Max Unit CIN VOUT = 0V – 9 pF Input/output capacitance (IO0, IO1, IO2, IO3) CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 53 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Electrical Specifications Table 15: Capacitance (Continued) Description Symbol Test Conditions Min Max Unit CIN VIN = 0V – 9 pF Input capacitance (other pins) Notes: 1. These parameters are verified in device characterization and are not 100% tested. 2. The value includes the silicon and package together. Table 16: DC Characteristics Parameter Symbol Conditions Min Typ Max Unit Input high voltage VIH – – VCC + 0.4 V Input low voltage VIL – 0.7 × VCC –0.5 – V Output high voltage VOH IOH = –100µA VCC - 0.2 – 0.3 × VCC – V Output low voltage VOL IOL = 1.6mA – – 0.4 V Input leakage current ILI – – – Output leakage current ILO – – – ±10 Sequential READ current, 3.3V Vcc(x1) ICC2 SCK = 0.1VCC / 0.9VCC at 133MHz, SO = open ±10 µA TBD mA Continuous Read, 3.3v Vcc (x1) ICC2 SCK = 0.1VCC / 0.9VCC at 133 MHz TBD mA Page read current ICC3 – – 25 35 mA Program current ICC4 – – 20 25 mA Erase current ICC5 – – 20 25 mA Standby current ICC1 CE# = VCC; VIN = VSS or VCC – 15 50 µA µA Notes: 1. Typical values are given for TA = 25 °C. 2. These parameters are verified in device characterization and are not 100% tested. 3. Continuous read currents is average current measured over any complete block read. No Load, random data pattern. Table 17: AC Characteristics Parameter Clock Symbol frequency1, 2 Min Max Unit C – 133 MHz f Clock LOW time t WL 3.375 – ns Clock HIGH time tWH 3.375 – ns Clock LOW time (SPI NOR read 03h mode at 20 MHz) tWL 22.5 – ns Clock HIGH time (SPI NOR read 03h mode at 20 MHz) t WH 22.5 – ns Clock rise time tCRT 1.3 – V/ns Clock fall time t CFT 1.3 tCS 30 – ns tCSS/tCSH 3.375 – ns Command deselect time Chip select# active setup/hold time relative to SCK CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 54 V/ns Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Electrical Specifications Table 17: AC Characteristics (Continued) Parameter Symbol Min Max Unit Chip select# non-active setup/hold time relative to SCK tCSH 2.5 – ns Output disable time tDIS – 6 ns Data input setup time tSUDAT 2.5 – ns Data input hold time tHDDAT 1.75 – ns Clock LOW to output valid (30pF) t V – 6 ns Clock LOW to output valid (10pF) tV – 5 ns Clock LOW to output valid (similar to SPI NOR 20 MHz read 30pF) tV – 30 ns Clock LOW to output valid (similar to SPI NOR 20 MHz read 10pF) tV – 28 ns Output hold time (30pF) tHO 2 – ns Output hold time (10pF) t 1.5 – ns Output hold time (SPI NOR similar to 20 MHz read 30pF) t HO 0 – ns Output hold time (SPI NOR similar to 20 MHz read 10pF) tHO 0 – ns WP# hold time tWPH 100 – ns WP# setup time tWPS 20 – ns HO Notes: 1. Read from Cache Dual I/O (BBh) and Quad I/O (EBh) can run up to 108 MHz. 2. When read protocol similar to SPI NOR is enabled, Read from Cache 03h command can run up to 20 MHz, while read from Cache 0Bh command can run up to 133 MHz. Table 18: PROGRAM/READ/ERASE Characteristics Parameter BLOCK ERASE operation time (128KB) PROGRAM PAGE operation time (ECC disabled) Symbol Typ Max Unit tERS 2 10 ms tPROG 200 600 220 600 µs – 25 46 70 – 5 40 50 tPOR – 1.25 ms VWI – 2.5 V RST1 – 30/35/525 – 75/80/570 µs – 4 PROGRAM PAGE operation time (ECC enabled) Page read time (ECC disabled) tRD Page read time (ECC enabled) Data transfer time from data register to cache register (internal ECC disabled) tRCBSY Data transfer time from data register to cache register (internal ECC enabled) Power-on reset time (device initialization) from VCC MIN Write inhibit voltage Reset time for READ, PROGRAM, and ERASE operations (internal ECC disabled) t Reset time for READ, PROGRAM, and ERASE operations (internal ECC enabled) Number of partial-page programming operations supported NOP2 µs µs µs µs – Notes: 1. For first RESET condition after power-up, tRST will be 1.25ms maximum. For stacked die, no command should be issued during this time. 2. In the main user area and in user meta data area I, single partial-page programming operations must be used. Within a page, the user can perform a maximum of four partial-page programming operations. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 55 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Electrical Specifications Figure 33: WP# Timing 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 SCK CS# Command (1Fh) Address (A0h) 7 SI 6 5 MSB tWPS 4 3 Data byte 2 1 0 7 6 5 4 3 2 MSB WP# 1 17 18 19 20 21 22 23 SCK CS# Data byte SI 6 5 4 3 2 1 0 tWPH WP# 1 CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 Don’t Care 56 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Electrical Specifications Figure 34: Serial Input Timing tCSH tCSS tCSH tCFT tCSS tCRT SCK tCS CS# tHDDAT tSUDAT MSB SI SO LSB High-Z Don’t Care Figure 35: Serial Output Timing tWL tWH SCK CS# tHO SO tV tHO High-Z tDIS LSB OUT Don’t Care CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 57 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Package Dimensions Package Dimensions Figure 36: 16-pin SOP (300 mils body width) – Package Code: SF 0.5 ±0.25 X 45° 10.3 ±0.2 2.5 ±0.15 16X 0.2 ±0.1 0.1 A 0.275 ±0.045 16X 0.42 ±0.09 See Detail A 1.27 TYP 16 9 Plating material composition: PPF (0.003μm–0.015μm Au, 0.02μm–0.15μm Pd, 0.5μm–2.0μm Ni). Plastic package material: epoxy novolac. 10.3 ±0.2 7.5 ±0.1 Pin 1 ID 1 Package width and length do not include mold protrusion. Allowable protrusion is 0.25 per side. 8 0.25 gage plane Seating plane 0.2 ±0.1 (for reference only) 0.83 ±0.44 Detail A Note: 1. All dimensions are in millimeters. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 58 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Package Dimensions Package Dimensions Figure 37: 8-pin U-PDFN (MLP8) 8mm x 6mm x 0.65mm – Package Code: WB Note: 1. All dimensions are in millimeters. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 59 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Package Dimensions Package Dimensions Figure 38: 24-Pin T-PBGA (5 x 5 Ball Grid Array) 6mm x 8mm – Package Code: 12 Note: 1. All dimensions are in millimeters. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 60 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 1Gb 3.3V x1, x2, x4: SPI NAND Flash Memory Revision History Revision History Rev. H – 02/22 • Updated Package Dimensions figures Rev. G – 11/16 • Updated Table 11 for a typo • Updated Power-up and Power-down section Rev. F – 10/16 • Updated legal status to Production • Updated AC Characteristics table for NOR 03h cache read mode Rev. E – 06/16 • • • • • Added uncycled data retention Updated PROGRAM/ERASE cycle to 100,000 Updated byte 105 and 106 of the parameter table for P/E of 100,000 Added permanent block lock Revised OTP section Rev. D – 05/16 • • • • Updated error management table Replaced W9 package with WB UDFN Updated the parameter page data Updated IO capacitance to 9pF Rev. C – 01/16 • • • • • Updated functional block diagram Updated the parameter table Updated electrical specifications per characterization data Updated read x4 timing diagram Updated read and program timing diagrams to reflect 2Gb and 1Gb dummy bits Rev. B – 09/15 • Updates to ensure consistency with NAND technology Rev. A – 06/15 • Initial release 8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006 208-368-4000, micron.com/support Micron and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners. This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein. Although considered final, these specifications are subject to change, as further product development and data characterization sometimes occur. CCMTD-816717818-10392 m78a_1gb_3v_nand_spi.pdf Rev. H 02/22 61 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2022 Micron Technology, Inc. All rights reserved.