MT48H16M32LGCM-8LIT

512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Features Mobile SDRAM MT48H32M16LF – 8 Meg x 16 x 4 banks MT48H16M32LF/LG – 4 Meg x 32 x 4 banks Features • Endur-IC™ technology • Fully synchronous; all signals registered on positive edge of system clock • VDD = 1.7–1.95V; VDDQ = 1.7–1.95V • Internal, pipelined operation; column address can be changed every clock cycle • Four internal banks for concurrent operation • Programmable burst lengths: 1, 2, 4, 8, and continuous1 • Auto precharge, includes concurrent auto precharge • Auto refresh and self refresh modes • LVTTL-compatible inputs and outputs • On-chip temperature sensor to control refresh rate • Partial-array self refresh (PASR) • Deep power-down (DPD) • Selectable output drive (DS) Table 1: DQ Bus Width Options • VDD/VDDQ – 1.8V/1.8V • Row size option – Standard addressing option – Reduced page-size option • Configuration – 32 Meg x 16 (8 Meg x 16 x 4 banks) – 16 Meg x 32 (4 Meg x 32 x 4 banks) • Plastic “green” packages – 54-Ball VFBGA (10mm x 11.5mm) – 90-Ball VFBGA (10mm x 13mm) • Timing – cycle time – 7.5ns at CL = 3 – 8ns at CL = 3 • Power – Standard IDD2P/IDD7 – Low IDD2P/IDD7 • Operating temperature range – Commercial (0°C to +70°C) – Industrial (–40°C to +85°C) • Design revision Marking H LF LG3, 4 32M16 16M32 CJ5 CM3 -75 -8 None L None IT :A Configuration Addressing JEDECStandard Option 4 BA0, BA1 A0–A12 A0–A9 A0–A12 A0–A8 Reduced Page-Size Option2 4 BA0, BA1 – – A0–A13 A0–A7 Architecture Number of banks Bank address balls Row address balls Column address balls Row address balls Column address balls x16 x32 Table 2: Key Timing Parameters CL = CAS (READ) latency Clock Rate (MHz) CL = 2 104 100 CL = 3 133 125 Access Time CL = 2 9ns 9ns CL = 3 6ns 7ns Notes: 1. For continuous page burst, contact factory for availability. 2. For reduced page-size option, contact factory for availability. 3. LG is a reduced page-size option. Contact factory for availability. 4. Only available for x32 configuration. 5. Only available for x16 configuration. Speed Grade -75 -8 PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 1 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Table of Contents Table of Contents Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Functional Block Diagrams. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Ball Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Ball Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Mode Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Extended Mode Register (EMR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 Bank/Row Activation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 READs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 WRITEs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46 Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51 Timing Diagrams. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .72 PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 2 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM List of Figures List of Figures Figure 1: Figure 2: Figure 3: Figure 4: Figure 5: Figure 6: Figure 7: Figure 8: Figure 9: Figure 10: Figure 11: Figure 12: Figure 13: Figure 14: Figure 15: Figure 16: Figure 17: Figure 18: Figure 19: Figure 20: Figure 21: Figure 22: Figure 23: Figure 24: Figure 25: Figure 26: Figure 27: Figure 28: Figure 29: Figure 30: Figure 31: Figure 32: Figure 33: Figure 34: Figure 35: Figure 36: Figure 37: Figure 38: Figure 39: Figure 40: Figure 41: Figure 42: Figure 43: Figure 44: Figure 45: Figure 46: Figure 47: Figure 48: Figure 49: Figure 50: Figure 51: Figure 52: Figure 53: Figure 54: Figure 55: Figure 56: 512Mb Mobile SDRAM Part Numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 32 Meg x 16 SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 16 Meg x 32 SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 54-Ball FBGA (Top View) – 10mm x 11.5mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 90-Ball VFBGA (Top View) – 10mm x 13mm. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Mode Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 CAS Latency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 EMR Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Activating a Specific Row in a Specific Bank. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 Example: Meeting tRCD (MIN) When 2 < tRCD (MIN)/tCK < 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 READ Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 Consecutive READ Bursts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 Random READ Accesses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 READ-to-WRITE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 READ-to-WRITE with Extra Clock Cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 READ-to-PRECHARGE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 Terminating a READ Burst . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 WRITE Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 WRITE Burst. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 WRITE-to-WRITE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 Random WRITE Cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 WRITE-to-READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 WRITE-to-PRECHARGE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 Terminating a WRITE Burst . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 PRECHARGE Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 Power-Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 Deep Power-Down Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 Deep Power-Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 Clock Suspend During WRITE Burst . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 Clock Suspend During READ Burst . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 READ With Auto Precharge Interrupted by a READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 READ With Auto Precharge Interrupted by a WRITE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 WRITE With Auto Precharge Interrupted by a READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 WRITE With Auto Precharge Interrupted by a WRITE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 Typical Self Refresh Current vs. Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50 Initialize and Load Mode Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53 Power-Down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54 Clock Suspend Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55 Auto Refresh Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56 Self Refresh Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57 READ – Without Auto Precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58 READ – With Auto Precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 Single READ – Without Auto Precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60 Single READ – With Auto Precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61 Alternating Bank Read Accesses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62 READ – Continuous-Page Burst. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63 READ – DQM Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64 WRITE – Without Auto Precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65 WRITE – With Auto Precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .66 Single WRITE – Without Auto Precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67 Single WRITE – With Auto Precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68 Alternating Bank Write Accesses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69 WRITE – Continuous-Page Burst. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70 WRITE – DQM Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71 54-Ball VFBGA (10mm x 11.5mm). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .72 90-Ball VFBGA (10mm x 13mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73 3 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM List of Tables List of Tables Table 1: Table 2: Table 3: Table 4: Table 5: Table 6: Table 7: Table 8: Table 9: Table 10: Table 11: Table 12: Table 13: Table 14: Table 15: Table 16: Table 17: Configuration Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Key Timing Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 VFBGA Ball Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Burst Definition Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Truth Table – Commands and DQM Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Truth Table – CKE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 Truth Table – Current State Bank n, Command to Bank n . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42 Truth Table – Current State Bank n, Command to Bank m . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46 DC Electrical Characteristics and Operating Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46 Electrical Characteristics and Recommended AC Operating Conditions . . . . . . . . . . . . . . . . . . . . . . .47 AC Functional Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48 IDD Specifications and Conditions (x16) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49 IDD Specifications and Conditions (x32) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49 IDD7 Specifications and Conditions (x16 and x32) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50 Capacitance (x16) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51 Capacitance (x32) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51 PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 4 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM General Description Figure 1: 512Mb Mobile SDRAM Part Numbering Power Example Part Number: M T48H16M32LFCM-75IT:A MT48 VDD/ VDDQ Mobile Configuration Package Speed Temp. Revision VDD/VDDQ 1.8V/1.8V H :A Design revision Configuration Row Size Option 32 Meg x 16 16 Meg x 32 Standard Standard 32M16LF 16M32LF IT Operating Temp. Commercial Industrial 16 Meg x 32 Reduced page-size 16M32LG Power Package 54-Ball (10 x 11.5 VFBGA) Pb–free 90-Ball (10 x 13 VFBGA) Pb–free CJ CM L Standard IDD2/IDD7 Low IDD2/IDD7 Speed Grade -75 -8 tCK tCK = 7.5ns = 8.0ns General Description The Micron® 512Mb Mobile SDRAM is a high-speed CMOS, dynamic random-access memory containing 536,870,912-bits. It is internally configured as a quad-bank DRAM with a synchronous interface (all signals are registered on the positive edge of the clock signal, CLK). Each of the x16’s 134,217,728-bit banks is organized as 8,192 rows by 1K columns by 16 bits. Each of the x32’s 134,217,728-bit banks is organized as 8,192 rows by 512 columns by 32 bits. In a reduced page-size option, each of the x32’s 134,217,728-bit banks is organized as 16,384 rows by 256 columns x32 bits. Read and write accesses to the SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an ACTIVE command, which is then followed by a READ or WRITE command. The address bits registered coincident with the ACTIVE command are used to select the bank and row to be accessed (BA0, BA1 select the bank; A0–A12 select the row). The address bits registered coincident with the READ or WRITE command are used to select the starting column location for the burst access. The SDRAM provides for programmable read or write burst lengths (BL) of 1, 2, 4, or 8 locations with a read burst terminate option. An auto precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst sequence. The 512Mb SDRAM uses an internal pipelined architecture to achieve high-speed operation. This architecture is compatible with the 2n rule of prefetch architectures, but it also allows the column address to be changed on every clock cycle to achieve a highspeed, fully random access. Precharging one bank while accessing one of the other three banks will hide the PRECHARGE cycles and provide seamless high-speed, randomaccess operation. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 5 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Functional Block Diagrams The 512Mb SDRAM is designed to operate in 1.8V low-power memory systems. An auto refresh mode is provided, along with a power-saving deep power-down mode. All inputs and outputs are LVTTL-compatible. SDRAMs offer substantial advances in DRAM operating performance, including the ability to synchronously burst data at a high data rate with automatic column-address generation, the ability to interleave between internal banks in order to hide precharge time, and the capability to randomly change column addresses on each clock cycle during a burst access. Functional Block Diagrams Figure 2: 32 Meg x 16 SDRAM CKE CLK CS# WE# CAS# RAS# CONTROL LOGIC BA1 0 0 1 1 BA0 0 1 0 1 Bank 0 1 2 3 COMMAND DECODE BANK3 BANK2 BANK1 EXT MODE REGISTER MODE REGISTER REFRESH 13 COUNTER ROWADDRESS MUX BANK0 ROWADDRESS 8,192 LATCH AND DECODER 13 13 13 BANK0 MEMORY ARRAY (8,192 x 1,024 x 16) 2 2 DQML, DQMH SENSE AMPLIFIERS 16 16,384 DATA OUTPUT REGISTER 2 A0–A12, BA0, BA1 15 ADDRESS REGISTER 2 BANK CONTROL LOGIC I/O GATING DQM MASK LOGIC READ DATA LATCH WRITE DRIVERS 1,024 (x16) 16 DQ0– DQ15 16 DATA INPUT REGISTER COLUMN DECODER COLUMNADDRESS COUNTER/ LATCH 10 10 PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 6 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Functional Block Diagrams Figure 3: 16 Meg x 32 SDRAM CKE CLK CS# WE# CAS# RAS# CONTROL LOGIC BA1 0 0 1 1 BA0 0 1 0 1 Bank 0 1 2 3 COMMAND DECODE BANK3 BANK2 BANK1 EXT MODE REGISTER MODE REGISTER REFRESH 13 COUNTER BANK0 ROWADDRESS 8,192 LATCH AND DECODER 13 13 ROWADDRESS MUX 13 BANK0 MEMORY ARRAY (8,192 x 512 x 32) 4 4 DQM0–3 SENSE AMPLIFIERS 32 16,384 DATA OUTPUT REGISTER 2 A0–A12, BA0, BA1 15 ADDRESS REGISTER 2 BANK CONTROL LOGIC I/O GATING DQM MASK LOGIC READ DATA LATCH WRITE DRIVERS 32 32 DQ0– DQ31 512 (x32) DATA INPUT REGISTER COLUMN DECODER COLUMNADDRESS COUNTER/ LATCH 9 9 PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 7 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Ball Assignments Ball Assignments Figure 4: 54-Ball FBGA (Top View) – 10mm x 11.5mm 1 A VSS 2 3 4 5 6 7 8 9 DQ15 VSSQ VDDQ DQ0 VDD B DQ14 DQ13 VDDQ VSSQ DQ2 DQ1 C DQ12 DQ11 VSSQ VDDQ DQ4 DQ3 D DQ10 DQ9 VDDQ VSSQ DQ6 DQ5 E DQ8 VSSQ1 Vss VDD LDQM DQ7 F UDQM CLK CKE CAS# RAS# WE# G A12 A11 A9 BA0 BA1 CS# H A8 A7 A6 A0 A1 A10 J VSS A5 A4 A3 A2 VDD Notes: 1. The E2 pin is a test pin and must be tied to VSSQ in normal operation. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 8 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Ball Assignments Figure 5: 90-Ball VFBGA (Top View) – 10mm x 13mm 1 2 3 4 5 6 7 8 9 A DQ26 B DQ28 C VSSQ D VSSQ E VDDQ F VSS G A4 H A7 J CLK K DQM1 L VDDQ M VSSQ N VSSQ P DQ11 R DQ13 DQ15 VSS VDD DQ0 DQ2 VDDQ VSSQ VDDQ VSSQ DQ4 DQ12 DQ14 DQ1 DQ3 VDDQ DQ10 DQ9 DQ6 DQ5 VDDQ DQ8 VSS VDD DQ7 VSSQ DNU1 NC CAS# WE# DQM0 CKE A9 BA0 CS# RAS# A8 A12 A13/NC BA1 A11 A5 A6 A10 A0 A1 DQM3 A3 A2 DQM2 VDD DQ31 NC NC DQ16 VSSQ DQ29 DQ30 DQ17 DQ18 VDDQ DQ27 DQ25 DQ22 DQ20 VDDQ VDDQ VSSQ VDDQ VSSQ DQ19 DQ24 VSS VDD DQ23 DQ21 Notes: 1. The K2 “DNU” ball should not be used in the application. However, it may be connected to VSS (ground). PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 9 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Ball Descriptions Ball Descriptions Table 3: VFBGA Ball Descriptions 90-Ball VFBGA J1 Symbol CLK Type Input Description Clock: CLK is driven by the system clock. All SDRAM input signals are sampled on the positive edge of CLK. CLK also increments the internal burst counter and controls the output registers. Clock enable: CKE activates (HIGH) and deactivates (LOW) the CLK signal. Deactivating the clock provides precharge powerdown and SELF REFRESH operation (all banks idle), active powerdown (row active in any bank), deep power-down (all banks idle), or CLOCK SUSPEND operation (burst/access in progress). CKE is synchronous except after the device enters power-down and self refresh modes, where CKE becomes asynchronous until after exiting the same mode. The input buffers, including CLK, are disabled during power-down and self refresh modes, providing low standby power. Chip select: CS# enables (registered LOW) and disables (registered HIGH) the command decoder. All commands are masked when CS# is registered HIGH. CS# provides for external bank selection on systems with multiple banks. CS# is considered part of the command code. Command inputs: RAS#, CAS#, and WE# (along with CS#) define the command being entered. Input/Output mask: DQM is sampled HIGH and is an input mask signal for write accesses and an output enable signal for read accesses. Input data is masked during a WRITE cycle. The output buffers are placed in a High-Z state (two-clock latency) during a READ cycle. For the x16, LDQM corresponds to DQ0–DQ7 and HDQM corresponds to DQ8–DQ16. For the x32, DQM0 corresponds to DQ0–DQ7, DQM1 corresponds to DQ8–DQ15, DQM2 corresponds to DQ16–DQ23, and DQM3 corresponds to DQ24–DQ31. DQM0–3 (or LDQM and HDQM if x16) are considered same state when referenced as DQM. Bank address input(s): BA0 and BA1 define to which bank the ACTIVE, READ, WRITE, or PRECHARGE command is being applied. BA0 and BA1 become “don’t care” when registering an ALL BANK PRECHARGE (A10 HIGH). Address inputs: A0–A12 are sampled during the ACTIVE command (row-address A0–A12) and READ/WRITE command [column-address A0–A8 (x32); column-address A0–A9 (x16); with A10 defining auto precharge] to select one location out of the memory array in the respective bank. A10 is sampled during a PRECHARGE command to determine if all banks are to be precharged (A10 HIGH) or bank selected by BA0, BA1. The address inputs also provide the op-code during a LOAD MODE REGISTER command. H7 is used for the LG, reduced page-size, option (see Table 1 on page 1); otherwise, leave as NC. 54-Ball VFBGA F2 F3 J2 CKE Input G9 J8 CS# Input F7, F8, F9 E8, F1 J9, K7, K8 K9, K1, F8, F2 CAS#, RAS#, WE# DQM0–3, LDQM, UDQM Input Input G7, G8 J7, H8 BA0, BA1 Input H7, H8, J8, J7, J3, J2, H3, H2, H1, G3, H9, G2, G1 G8, G9, F7, F3, G1, G2, G3, H1, H2, J3, G7, H9, H3 A0–A12 Input – H7 A13/NC Input PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 10 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Ball Descriptions Table 3: VFBGA Ball Descriptions (Continued) 90-Ball VFBGA R8, N7, R9, N8, P9, M8, M7, L8, L2, M3, M2, P1, N2, R1, N3, R2, E8, D7, D8, B9, C8, A9, C7, A8, A2, C3, A1, C2, B1, D2, D3, E2 B2, B7, C9, D9, E1, L1, M9, N9, P2, P7 B8, B3, C1, D1, E9, L9, M1, N1, P3, P8 A7, F9, L7, R7 A3, F1, L3, R3 E3, E7, K3 – K2 Symbol DQ0–DQ31 Type I/O Description Data input/output: Data bus. 54-Ball VFBGA A8, B9, B8, C9, C8, D9, D8, E9, E1, D2, D1, C2, C1, B2, B1, A2 A7, B3, C7, D3 VDDQ Supply DQ power: Provide isolated power to DQ for improved noise immunity. Supply DQ ground: Provide isolated ground to DQ for improved noise immunity. Supply Core power supply. Supply Ground. – Internally not connected: These balls could be left unconnected, but it is recommended they be connected to Vss. – This TEST pin must be tied to VSS or VSSQ in normal operation. – Should not be used in the application. However, it may be connected to Vss (ground). A3, B7, C3, D7 VssQ A9, E7, J9 A1, E3, J1 – E2 – VDD VSS NC VSSQ DNU PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 11 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Functional Description Functional Description In general, the 512Mb SDRAMs (4 Meg x 32 x 4 banks) are quad-bank DRAMs that operate at 1.8V and include a synchronous interface (all signals are registered on the positive edge of the clock signal, CLK). Read and write accesses to the SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an ACTIVE command, which is then followed by a READ or WRITE command. The address bits registered coincident with the ACTIVE command are used to select the bank and row to be accessed (BA0 and BA1 select the bank, A0–A12 select the row). The address bits (A0–A9 for x16 and A0–A8 for x32) registered coincident with the READ or WRITE command are used to select the starting column location for the burst access. Prior to normal operation, the SDRAM must be initialized. The following sections provide detailed information covering device initialization, register definition, command descriptions, and device operation. Initialization SDRAMs must be powered up and initialized in a predefined manner. Operational procedures other than those specified may result in undefined operation. Once the power is applied to VDD and VDDQ (simultaneously) and the clock is stable (stable clock is defined as a signal cycling within timing constraints specified for the clock ball), the SDRAM requires a 100µs delay prior to issuing any command other than a COMMAND INHIBIT or NOP Starting at some point during this 100µs period and continuing at least . through the end of this period, COMMAND INHIBIT or NOP commands should be applied. Once the 100µs delay has been satisfied with at least one COMMAND INHIBIT or NOP command having been applied, a PRECHARGE command must be applied. All banks must then be precharged, thereby placing the device in the all banks idle state. Once in the idle state, two AUTO REFRESH cycles must be performed. After the AUTO REFRESH cycles are complete, the SDRAM is ready for programming the mode registers. Because the mode registers will power up in an unknown state, they should be loaded prior to applying any operational command. Register Definition Mode Register There are two mode registers in the component: mode register and extended mode register (EMR). The mode register is illustrated in Figure 6 on page 14. The mode register is used to define the specific mode of operation of the SDRAM. This definition includes the selection of a burst length (BL), a burst type, a CAS latency (CL), an operating mode and a write burst mode, as shown in Figure 6 on page 14. The mode register is programmed via the LOAD MODE REGISTER command and will retain the stored information until it is programmed again or the device loses power. Mode register bits M0–M2 specify the BL, M3 specifies the type of burst, M4–M6 specify the CL, M7 and M8 specify the operating mode, M9 specifies the write burst mode, and M10 and M11 should be set to zero. M12 and M13 should be set to zero to prevent the extended mode register from being programmed. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 12 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Register Definition The mode registers must be loaded when all banks are idle, and the controller must wait t MRD before initiating the subsequent operation. Violating either of these requirements will result in unspecified operation. Burst Length (BL) Read and write accesses to the SDRAM are burst oriented, with the BL being programmable, as shown in Figure 6 on page 14. The BL determines the maximum number of column locations that can be accessed for a given READ or WRITE command. BL = 1, 2, 4, 8, or continuous locations are available for both the sequential and the interleaved burst types, and a continuous-page burst is available for the sequential type. The continuous-page burst is used in conjunction with the BURST TERMINATE command to generate arbitrary BLs. Reserved states should not be used, as unknown operation or incompatibility with future versions may result. When a READ or WRITE command is issued, a block of columns equal to the BL is effectively selected. All accesses for that burst take place within this block, meaning that the burst will wrap within the block if a boundary is reached. The block is uniquely selected by A1–A8 when BL = 2, A2–A8 when BL = 4, and A3–A8 when BL = 8. The remaining (least significant) address bit(s) is (are) used to select the starting location within the block. Burst Type Accesses within a given burst may be programmed to be either sequential or interleaved; this is referred to as the burst type and is selected via bit M3. The ordering of accesses within a burst is determined by the BL, the burst type, and the starting column address, as shown in Table 4 on page 15. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 13 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Register Definition Figure 6: Mode Register Definition BA1 BA0 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 Address Bus M14 M13 M12 M11 M10 M9 M8 M7 M6 M5 M4 M3 M2 M1 M0 14 13 00 0 12 11 10 9 8 7 65 4 3 2 1 Reserved1 WB Op Mode CAS Latency BT Burst Length Mode Register (Mx) M14 M13 Mode Register Definition 0 0 Base mode register 0 1 1 1 0 1 Reserved Extended mode register Reserved M9 0 1 Write Burst Mode Programmed burst length Single location access M8 0 – M7 0 – Operating Mode Normal operation All other states reserved M6 M5 M4 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 CAS Latency Reserved Reserved 2 3 Reserved Reserved Reserved Reserved Burst Length M2 M1 M0 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 M3 = 0 1 2 4 8 Reserved Reserved Reserved Reserved M3 = 1 1 2 4 8 Reserved Reserved Reserved Reserved M3 0 1 Burst Type Sequential Interleaved Notes: 1. Should be programmed to “0” to ensure compatibility with future devices. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 14 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Register Definition Table 4: Burst Definition Table Burst Length 2 Order of Accesses Within a Burst Starting Column Address A0 0 1 A0 0 1 0 1 A0 0 1 0 1 0 1 0 1 Type = Sequential 0-1 1-0 0-1-2-3 1-2-3-0 2-3-0-1 3-0-1-2 0-1-2-3-4-5-6-7 1-2-3-4-5-6-7-0 2-3-4-5-6-7-0-1 3-4-5-6-7-0-1-2 4-5-6-7-0-1-2-3 5-6-7-0-1-2-3-4 6-7-0-1-2-3-4-5 7-0-1-2-3-4-5-6 Type = Interleaved 0-1 1-0 0-1-2-3 1-0-3-2 2-3-0-1 3-2-1-0 0-1-2-3-4-5-6-7 1-0-3-2-5-4-7-6 2-3-0-1-6-7-4-5 3-2-1-0-7-6-5-4 4-5-6-7-0-1-2-3 5-4-7-6-1-0-3-2 6-7-4-5-2-3-0-1 7-6-5-4-3-2-1-0 4 8 A2 0 0 0 0 1 1 1 1 A1 0 0 1 1 A1 0 0 1 1 0 0 1 1 CAS Latency (CL) The CL is the delay, in clock cycles, between the registration of a READ command and the availability of the first piece of output data. The latency can be set to two or three clocks. If a READ command is registered at clock edge n, and the latency is m clocks, the data will be available by clock edge n + m. The DQs will start driving as a result of the clock edge one cycle earlier (n + m - 1), and provided that the relevant access times are met, the data will be valid by clock edge n + m. For example, assuming that the clock cycle time is such that all relevant access times are met, if a READ command is registered at T0 and the latency is programmed to two clocks, the DQs will start driving after T1 and the data will be valid by T2, as shown in Figure 7 on page 16. Reserved states should not be used as unknown operation or incompatibility with future versions may result. Operating Mode The normal operating mode is selected by setting M7 and M8 to zero; the other combinations of values for M7 and M8 are reserved for future use. Reserved states should not be used because unknown operation or incompatibility with future versions may result. Write Burst Mode When M9 = 0, the BL programmed via M0–M2 applies to both READ and WRITE bursts; when M9 = 1, the programmed BL applies to READ bursts, but write accesses are singlelocation accesses. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 15 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Register Definition Extended Mode Register (EMR) The EMR controls the functions beyond those controlled by the mode register. These additional functions are special features of the mobile device that helps reduce overall system power consumption. They include temperature-compensated self refresh (TCSR) control, partial-array self refresh (PASR), and output drive strength. The EMR is programmed via the MODE REGISTER SET command (BA1 = 1, BA0 = 0) and retains the stored information until it is programmed again or the device loses power. Figure 7: CAS Latency T0 CLK COMMAND T1 T2 T3 READ NOP tLZ NOP tOH DOUT tAC DQ CL = 2 T0 CLK COMMAND T1 T2 T3 T4 READ NOP NOP tLZ NOP tOH DOUT tAC DQ CL = 3 DON’T CARE UNDEFINED Notes: 1. Each READ command may be to any bank. DQM is LOW. 2. For CL = 2, DQM should be taken LOW at READ command. For CL = 3, DQM should be taken LOW one cycle after the READ command. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 16 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Register Definition Figure 8: EMR Definition BA1 BA0 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 Address Bus E14 E13 E12 E11 E10 E9 14 1 13 12 0 11 10 9 set to “0” E8 8 E7 7 E6 E5 E4 E3 E2 2 E1 E0 Extended Mode Register 65 DS 4 3 TCSR1 0 1 PASR E14 E13 Mode Register Definintion 0 Standard mode register 0 1 Reserved 0 0 Extended mode register 1 1 Reserved 1 E6 0 0 1 1 E5 0 1 0 1 Driver Strength Full-strength driver Half-strength driver Quarter-strength driver One eighth-strength driver E12 E11 E10 E9 0 0 0 0 – – – – E8 0 – E7 0 Normal operation – All other states reserved E2 0 0 0 0 1 1 1 1 E1 0 0 1 1 0 0 1 1 E0 Partial-Array Self Refresh Coverage 0 Full array 1 Half array 0 1 0 1 0 1 Quarter array Reserved Reserved One-eighth array One-sixteenth array Reserved Notes: 1. On-die temperature sensor is used in place of TCSR. Setting these bits will have no effect. The extended mode register must be programmed with E7 through E12 set to “0.” It must be loaded when all banks are idle and no bursts are in progress, and the controller must wait the specified time before initiating any subsequent operation. Violating either of these requirements results in unspecified operation. Once the values are entered, the extended mode register settings will be retained even after exiting deep power-down mode. Temperature-Compensated Self Refresh (TCSR) On this version of the Mobile DDR SDRAM, a temperature sensor is implemented for automatic control of the self refresh oscillator. Programming of the TCSR bits will have no effect on the device. The self refresh oscillator will continue refresh at the factory programmed optimal rate for the device temperature. Partial-Array Self Refresh (PASR) For further power savings during self refresh, the partial-array self refresh (PASR) feature allows the controller to select the amount of memory that will be refreshed during self refresh. The following refresh options are available. 1. All banks (banks 0, 1, 2, and 3). 2. Two banks (banks 0 and 1; BA1=0). 3. One bank (bank 0; BA1 = BA0 = 0). 4. Half bank (bank 0; BA1 = BA0 = row address MSB = 0). 5. Quarter bank (bank 0; BA1 = BA0; row address MSB = row address MSB - 1 = 0). PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 17 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Register Definition WRITE and READ commands occur to any bank selected during standard operation, but only the selected banks or segments of a bank in PASR will be refreshed during self refresh. It is important to note that data in unused banks or portions of banks will be lost when PASR is used. Driver Strength Bits E5 and E6 of the extended mode register can be used to select the driver strength of the DQ outputs. This value should be set according to the application’s requirements. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 18 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Commands Commands Table 5 provides a quick reference of available commands. This is followed by a written description of each command. Three additional Truth Tables appear on pages 41–44; these tables provide current state/next state information. Table 5: Truth Table – Commands and DQM Operation Notes 4 and 5 apply to all commands Name (Function) COMMAND INHIBIT (NOP) NO OPERATION (NOP) ACTIVE (Select bank and activate row) READ (Select bank and column, and start READ burst) WRITE (Select bank and column, and start WRITE burst) BURST TERMINATE or deep power-down (Enter deep power-down mode) PRECHARGE (Deactivate row in bank or banks) AUTO REFRESH or SELF REFRESH (Enter self refresh mode) LOAD MODE REGISTER Write enable/output enable Write inhibit/output High-Z Notes: CS# H L L L L L L L L X X RAS# CAS# X H L H H H L L L X X X H H L L H H L L X X WE# X H H H L L L H L X X DQM X X X L/H L/H X X X X L H ADDR X X Bank/Row Bank/Col Bank/Col X Code X Op-Code X X DQs X X X X Valid X X X X Active High-Z Notes 1 1 2 3 3 6, 7, 8 9 10, 11 12 1. COMMAND INHIBIT and NOP are functionally interchangeable. 2. BA0–BA1 provide bank address and A0–A12 provide row address. 3. BA0–BA1 provide bank address; A0–A9 provide column address; A10 HIGH enables the auto precharge feature (nonpersistent), and A10 LOW disables the auto precharge feature. 4. CKE is HIGH for all commands shown except SELF REFRESH and deep power-down. 5. All states and sequences not shown are reserved and/or illegal. 6. The purpose of the BURST TERMINATE command is to stop a data burst, thus the command could coincide with data on the bus. However, the DQs column reads a don’t care state to illustrate that the BURST TERMINATE command can occur when there is no data present. 7. Applies only to read and write bursts with auto precharge disabled; this command is undefined and should not be used for READ bursts with auto precharge enabled. 8. This command is a BURST TERMINATE if CKE is HIGH, deep power-down if CKE is LOW. 9. A10 LOW: BA0–BA1 determine which bank is precharged. A10 HIGH: all banks are precharged and BA0–BA1 are “Don’t Care.” 10. This command is AUTO REFRESH if CKE is HIGH, SELF REFRESH if CKE is LOW. 11. Internal refresh counter controls row addressing; all inputs and I/Os are “Don’t Care” except for CKE. 12. BA0–BA1 select either the standard mode register or the extended mode register (BA0 = 0, BA1 = 0 select the standard mode register; BA0 = 0, BA1 = 1 select extended mode register; other combinations of BA0–BA1 are reserved.) A0–A12 provide the op-code to be written to the selected mode register. COMMAND INHIBIT The COMMAND INHIBIT function prevents new commands from being executed by the SDRAM, regardless of whether the CLK signal is enabled. The SDRAM is effectively deselected. Operations already in progress are not affected. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 19 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Commands NO OPERATION (NOP) The NO OPERATION (NOP) command is used to perform a NOP to an SDRAM which is selected (CS# is LOW). This prevents unwanted commands from being registered during idle or wait states. Operations already in progress are not affected. Load Mode Register The mode register is loaded via inputs A0–A12, BA0, and BA1. (See "Mode Register" on page 12.) The LOAD MODE REGISTER and LOAD EXTENDED MODE REGISTER commands can only be issued when all banks are idle, and a subsequent executable command cannot be issued until tMRD is met. ACTIVE The ACTIVE command is used to open (or activate) a row in a particular bank for a subsequent access. The value on the BA0, BA1 inputs selects the bank, and the address provided selects the row. This row remains active (or open) for accesses until a PRECHARGE command is issued to that bank. A PRECHARGE command must be issued before opening a different row in the same bank. READ The READ command is used to initiate a burst read access to an active row. The value on the BA0, BA1 inputs selects the bank, and the address provided selects the starting column location. The value on input A10 determines whether or not auto precharge is used. If auto precharge is selected, the row being accessed will be precharged at the end of the read burst; if auto precharge is not selected, the row will remain open for subsequent accesses. Read data appears on the DQs subject to the logic level on the DQM inputs two clocks earlier. If a given DQM signal was registered HIGH, the corresponding DQs will be High-Z two clocks later; if the DQM signal was registered LOW, the DQs will provide valid data. WRITE The WRITE command is used to initiate a burst write access to an active row. The value on the BA0, BA1 inputs selects the bank, and the address provided selects the starting column location. The value on input A10 determines whether or not auto precharge is used. If auto precharge is selected, the row being accessed will be precharged at the end of the write burst; if auto precharge is not selected, the row will remain open for subsequent accesses. Input data appearing on the DQs is written to the memory array subject to the DQM input logic level appearing coincident with the data. If a given DQM signal is registered LOW, the corresponding data will be written to memory; if the DQM signal is registered HIGH, the corresponding data inputs will be ignored, and a write will not be executed to that byte/column location. PRECHARGE The PRECHARGE command is used to deactivate the open row in a particular bank or the open row in all banks. The bank(s) will be available for a subsequent row access a specified time (tRP) after the precharge command is issued. Input A10 determines whether one or all banks are to be precharged, and in the case where only one bank is to be precharged, inputs BA0, BA1 select the bank. Otherwise BA0, BA1 are treated as “Don’t Care.” Once a bank has been precharged, it is in the idle state and must be activated prior to any READ or WRITE commands being issued to that bank. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 20 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Commands Auto Precharge Auto precharge is a feature which performs the same individual-bank precharge function described above, without requiring an explicit command. This is accomplished by using A10 to enable auto precharge in conjunction with a specific READ or WRITE command. A precharge of the bank/row that is addressed with the READ or WRITE command is automatically performed upon completion of the READ or WRITE burst. Auto precharge is non persistent in that it is either enabled or disabled for each individual READ or WRITE command. Auto precharge ensures that the precharge is initiated at the earliest valid stage within a burst. The user must not issue another command to the same bank until the precharge time (tRP) is completed. This is determined as if an explicit PRECHARGE command was issued at the earliest possible time, as described for each burst type in "Burst Type" on page 13. BURST TERMINATE The BURST TERMINATE command is used to truncate fixed-length bursts. The most recently registered READ or WRITE command prior to the BURST TERMINATE command will be truncated, as shown in "Operations" on page 22. AUTO REFRESH AUTO REFRESH is used during normal operation of the SDRAM and is analogous to CAS#-BEFORE-RAS# (CBR) refresh in conventional DRAMs. This command is non persistent, so it must be issued each time a refresh is required. All active banks must be PRECHARGED prior to issuing an AUTO REFRESH command. The AUTO REFRESH command should not be issued until the minimum tRP has been met after the PRECHARGE command, as shown in "Operations" on page 22. The addressing is generated by the internal refresh controller. This makes the address bits “Don’t Care” during an AUTO REFRESH command. The 512Mb SDRAM requires 8,192 AUTO REFRESH cycles every 64ms (tREF). Providing a distributed AUTO REFRESH command every 7.8125µs will meet the refresh requirement and ensure that each row is refreshed. Alternatively, 8,192 AUTO REFRESH commands can be issued in a burst at the minimum cycle rate (tRFC), once every 64ms. SELF REFRESH The SELF REFRESH command can be used to retain data in the SDRAM, even if the rest of the system is powered down. When in the self refresh mode, the SDRAM retains data without external clocking. The SELF REFRESH command is initiated like an AUTO REFRESH command, except CKE is disabled (LOW). Once the SELF REFRESH command is registered, all the inputs to the SDRAM become “Don’t Care” with the exception of CKE, which must remain LOW. Once self refresh mode is engaged, the SDRAM provides its own internal clocking, causing it to perform its own AUTO REFRESH cycles. The SDRAM must remain in self refresh mode for a minimum period equal to tRAS and may remain in self refresh mode for an indefinite period beyond that. The procedure for exiting self refresh requires a sequence of commands. First, CLK must be stable (stable clock is defined as a signal cycling within timing constraints specified for the clock ball) prior to CKE going back HIGH. Once CKE is HIGH, the SDRAM must have NOP commands issued (a minimum of two clocks) for tXSR because time is required for the completion of any internal refresh in progress. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 21 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Operations Upon exiting the self refresh mode, AUTO REFRESH commands must be issued every 7.8125µs or less as both SELF REFRESH and AUTO REFRESH utilize the row refresh counter. Deep Power-Down Deep power-down is an operating mode used to achieve maximum power reduction by eliminating the power of the whole memory array of the devices. Array data will not be retained once the device enters deep power-down mode. This mode is entered by having all banks idle then CS# and WE# held LOW with RAS# and CAS# held HIGH at the rising edge of the clock, while CKE is LOW. This mode is exited by asserting CKE HIGH. Operations Bank/Row Activation Before any READ or WRITE commands can be issued to a bank within the SDRAM, a row in that bank must be “opened.” This is accomplished via the ACTIVE command, which selects both the bank and the row to be activated (see Figure 9 on page 23). After opening a row (issuing an ACTIVE command), a READ or WRITE command may be issued to that row, subject to the tRCD specification. tRCD (MIN) should be divided by the clock period and rounded up to the next whole number to determine the earliest clock edge after the ACTIVE command on which a READ or WRITE command can be entered. For example, a tRCD specification of 20ns with a 125 MHz clock (8ns period) results in 2.5 clocks, rounded to 3. This is reflected in Figure 10 on page 23, which covers any case where 2 < tRCD (MIN)/tCK ≤ 3. (The same procedure is used to convert other specification limits from time units to clock cycles.) A subsequent ACTIVE command to a different row in the same bank can only be issued after the previous active row has been “closed” (precharged). The minimum time interval between successive ACTIVE commands to the same bank is defined by tRC. A subsequent ACTIVE command to another bank can be issued while the first bank is being accessed, which results in a reduction of total row-access overhead. The minimum time interval between successive ACTIVE commands to different banks is defined by tRRD. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 22 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Operations Figure 9: Activating a Specific Row in a Specific Bank CLK CKE CS# HIGH RAS# CAS# WE# A0–A12 ROW ADDRESS BA0, BA1 BANK ADDRESS DON´T CARE Figure 10: Example: Meeting tRCD (MIN) When 2 < tRCD (MIN)/tCK < 3 T0 CLK tCK COMMAND ACTIVE NOP tRCD (MIN) tCK NOP tCK READ or WRITE T1 T2 T3 DON’T CARE READs READ bursts are initiated with a READ command, as shown in Figure 11. The starting column and bank addresses are provided with the READ command, and auto precharge is either enabled or disabled for that burst access. If auto precharge is enabled, the row being accessed is precharged at the completion of the burst. For the generic READ commands used in the following illustrations, auto precharge is disabled. During READ bursts, the valid data-out element from the starting column address will be available following the CL after the READ command. Each subsequent data-out element will be valid by the next positive clock edge. Figure 12 on page 25 shows general timing for each possible CL setting. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 23 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Operations Figure 11: READ Command CLK CKE CS# HIGH RAS# CAS# WE# A0–A8 COLUMN ADDRESS A9, A11, A12 EN AP A101 DIS AP BANK ADDRESS BA0, BA1 DON’T CARE Notes: 1. EN AP = enable auto precharge DIS AP = disable auto precharge Upon completion of a burst, assuming no other commands have been initiated, the DQs will go High-Z. Data from any READ burst may be truncated with a subsequent READ command, and data from a fixed-length READ burst may be immediately followed by data from a READ command. In either case, a continuous flow of data can be maintained. The first data element from the new burst follows either the last element of a completed burst or the last desired data element of a longer burst that is being truncated. The new READ command should be issued x cycles before the clock edge at which the last desired data element is valid, where x = CL -1. Figure 7 on page 16 shows CLs of two and three; data element n + 3 is either the last of a burst of four or the last desired of a longer burst. The 512Mb SDRAM uses a pipelined architecture and therefore does not require the 2n rule associated with a prefetch architecture. A READ command can be initiated on any clock cycle following a previous READ command. Full-speed random read accesses can be performed to the same bank, as shown in Figure 12 on page 25, or each subsequent READ may be performed to a different bank. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 24 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Operations Figure 12: Consecutive READ Bursts T0 CLK T1 T2 T3 T4 T5 T6 COMMAND READ NOP NOP NOP READ NOP NOP X = 1 cycle ADDRESS BANK, COL n BANK, COL b DQ CL = 2 DOUT n DOUT n+1 DOUT n+2 DOUT n+3 DOUT b T0 CLK T1 T2 T3 T4 T5 T6 T7 COMMAND READ NOP NOP NOP READ NOP NOP NOP X = 2 cycles ADDRESS BANK, COL n BANK, COL b DQ CL = 3 DOUT n DOUT n+1 DOUT n+2 DOUT n+3 DOUT b DON’T CARE Notes: 1. Each READ command may be to any bank. DQM is LOW. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 25 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Operations Figure 13: Random READ Accesses T0 CLK T1 T2 T3 T4 T5 COMMAND READ READ READ READ NOP NOP ADDRESS BANK, COL n BANK, COL a BANK, COL x BANK, COL m DQ CL = 2 DOUT n DOUT a DOUT x DOUT m T0 CLK T1 T2 T3 T4 T5 T6 COMMAND READ READ READ READ NOP NOP NOP ADDRESS BANK, COL n BANK, COL a BANK, COL x BANK, COL m DQ CL = 3 DOUT n DOUT a DOUT x DOUT m DON’T CARE Notes: 1. Each READ command may be to any bank. DQM is LOW. Data from any READ burst may be truncated with a subsequent WRITE command, and data from a fixed-length READ burst may be immediately followed by data from a WRITE command (subject to bus turnaround limitations). The WRITE burst may be initiated on the clock edge immediately following the last (or last desired) data element from the READ burst, provided that I/O contention can be avoided. In a given system design, there may be a possibility that the device driving the input data will go Low-Z before the SDRAM DQs go High-Z. In this case, at least a single-cycle delay should occur between the last read data and the WRITE command. The DQM input is used to avoid I/O contention, as shown in Figure 14 on page 27 and Figure 15 on page 28. The DQM signal must be asserted (HIGH) at least two clocks prior to the WRITE command (DQM latency is two clocks for output buffers) to suppress dataout from the READ. Once the WRITE command is registered, the DQs will go High-Z (or remain High-Z), regardless of the state of the DQM signal, provided the DQM was active on the clock just prior to the WRITE command that truncated the READ command. If not, the second WRITE will be an invalid WRITE. For example, if DQM was LOW during T4 (in Figure 15 on page 28) then the WRITEs at T5 and T7 would be valid, while the WRITE at T6 would be invalid. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 26 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Operations The DQM signal must be de-asserted prior to the WRITE command (DQM latency is zero clocks for input buffers) to ensure that the written data is not masked. Figure 13 on page 26 shows the case where the clock frequency allows for bus contention to be avoided without adding a NOP cycle, and Figure 15 on page 28 shows the case where the additional NOP is needed. A fixed-length READ burst may be followed by, or truncated with, a PRECHARGE command to the same bank (provided that auto precharge was not activated). The PRECHARGE command should be issued x cycles before the clock edge at which the last desired data element is valid, where x = CL - 1. This is shown in Figure 16 on page 28 for each possible CL; data element n + 3 is either the last of a burst of four or the last desired of a longer burst. Following the PRECHARGE command, a subsequent command to the same bank cannot be issued until tRP is met. Note that part of the row precharge time is hidden during the access of the last data element(s). In the case of a fixed-length burst being executed to completion, a PRECHARGE command issued at the optimum time (as described above) provides the same operation that would result from the same fixed-length burst with auto precharge. The disadvantage of the PRECHARGE command is that it requires that the command and address buses be available at the appropriate time to issue the command; the advantage of the PRECHARGE command is that it can be used to truncate fixed-length bursts. Figure 14: READ-to-WRITE T0 CLK DQM T1 T2 T3 T4 COMMAND ADDRESS READ NOP NOP NOP WRITE BANK, COL n BANK, COL b tCK tHZ DQ DOUT n DIN b tDS DON’T CARE Notes: 1. CL = 3. The READ command may be to any bank, and the WRITE command may be to any bank. If a burst of one is used, then DQM is not required. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 27 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Operations Figure 15: READ-to-WRITE with Extra Clock Cycle T0 CLK DQM T1 T2 T3 T4 T5 COMMAND ADDRESS READ NOP NOP NOP NOP WRITE BANK, COL n BANK, COL b tHZ DQ DOUT n DIN b tDS DON’T CARE Notes: 1. CL = 3. The READ command may be to any bank, and the WRITE command may be to any bank. Figure 16: READ-to-PRECHARGE T0 CLK t RP T1 T2 T3 T4 T5 T6 T7 COMMAND READ NOP NOP NOP PRECHARGE X = 1 cycle NOP NOP ACTIVE ADDRESS BANK a, COL n BANK (a or all) BANK a, ROW DQ CL = 2 DOUT n DOUT n+1 DOUT n+2 DOUT n+3 T0 CLK T1 T2 T3 T4 T5 T6 T7 t RP COMMAND READ NOP NOP NOP PRECHARGE NOP NOP ACTIVE X = 2 cycles ADDRESS BANK a, COL n BANK (a or all) BANK a, ROW DQ CL = 3 DOUT n DOUT n+1 DOUT n+2 DOUT n+3 DON’T CARE Notes: 1. DQM is LOW. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 28 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Operations Fixed-length READ bursts may be truncated with a BURST TERMINATE command, provided that auto precharge was not activated. The BURST TERMINATE command should be issued x cycles before the clock edge at which the last desired data element is valid, where x = CL - 1. This is shown in Figure 17 on page 29 for each possible CL; data element n + 3 is the last desired data element of a longer burst. Figure 17: Terminating a READ Burst T0 CLK T1 T2 T3 T4 T5 T6 COMMAND READ NOP NOP NOP BURST TERMINATE X = 1 cycle NOP NOP ADDRESS BANK, COL n DQ CL = 2 DOUT n DOUT n+1 DOUT n+2 DOUT n+3 T0 CLK T1 T2 T3 T4 T5 T6 T7 COMMAND READ NOP NOP NOP BURST TERMINATE NOP NOP NOP X = 2 cycles ADDRESS BANK, COL n DQ CL = 3 DOUT n DOUT n+1 DOUT n+2 DOUT n+3 DON’T CARE Notes: 1. DQM is LOW. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 29 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Operations WRITEs WRITE bursts are initiated with a WRITE command, as shown in Figure 18. The starting column and bank addresses are provided with the WRITE command, and auto precharge is either enabled or disabled for that access. If auto precharge is enabled, the row being accessed is precharged at the completion of the burst. For the generic WRITE commands used in the following illustrations, auto precharge is disabled. During WRITE bursts, the first valid data-in element will be registered coincident with the WRITE command. Subsequent data elements will be registered on each successive positive clock edge. Upon completion of a fixed-length burst, assuming no other commands have been initiated, the DQs will remain High-Z and any additional input data will be ignored (see Figure 19 on page 31). Figure 18: WRITE Command CLK CKE CS# HIGH RAS# CAS# WE# A0–A8 COLUMN ADDRESS A9, A11, A12 EN AP A101 DIS AP BA0, BA1 BANK ADDRESS VALID ADDRESS DON’T CARE Notes: 1. EN AP = enable auto precharge DIS AP = disable auto precharge Data for any WRITE burst may be truncated with a subsequent WRITE command, and data for a fixed-length WRITE burst may be immediately followed by data for a WRITE command. The new WRITE command can be issued on any clock following the previous WRITE command, and the data provided coincident with the new command applies to the new command. An example is shown in Figure 20 on page 31. Data n + 1 is either the last of a burst of two or the last desired of a longer burst. The 512Mb SDRAM uses a pipelined architecture and therefore does not require the 2n rule associated with a prefetch architecture. A WRITE command can be initiated on any clock cycle following a previous PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 30 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Operations WRITE command. Full-speed random write accesses within a page can be performed to the same bank, as shown in Figure 21 on page 32, or each subsequent WRITE may be performed to a different bank. Figure 19: WRITE Burst T0 CLK T1 T2 T3 COMMAND WRITE NOP NOP NOP ADDRESS BANK, COL n DQ DIN n DIN n+1 DON’T CARE Notes: 1. BL = 2. DQM is LOW. Figure 20: WRITE-to-WRITE T0 CLK T1 T2 COMMAND WRITE NOP WRITE ADDRESS BANK, COL n BANK, COL b DQ DIN n DIN n+1 DIN b DON’T CARE Notes: 1. DQM is LOW. Each WRITE command may be to any bank. Data for any WRITE burst may be truncated with a subsequent READ command, and data for a fixed-length WRITE burst may be immediately followed by a READ command. Once the READ command is registered, the data inputs will be ignored, and WRITEs will not be executed. An example is shown in Figure 22 on page 32. Data n + 1 is either the last of a burst of two or the last desired of a longer burst. Data for a fixed-length WRITE burst may be followed by, or truncated with, a PRECHARGE command to the same bank (provided that auto precharge was not activated). The PRECHARGE command should be issued tWR after the clock edge at which the last desired input data element is registered. The auto precharge mode requires a t WR of at least one clock plus time, regardless of frequency. In addition, when truncating a WRITE burst at high clock frequencies (tCK < 15ns), the DQM signal must be used to mask input data for the clock edge prior to, and the clock edge coincident with, the PRECHARGE command. An example is shown in Figure 23 on page 33. Data n + 1 is either the last of a burst of two or the last desired of a longer burst. Following the PRECHARGE command, a subsequent command to the same bank cannot be issued until tRP is met. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 31 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Operations In the case of a fixed-length burst being executed to completion, a PRECHARGE command issued at the optimum time (as described above) provides the same operation that would result from the same fixed-length burst with auto precharge. The disadvantage of the PRECHARGE command is that it requires that the command and address buses be available at the appropriate time to issue the command; the advantage of the PRECHARGE command is that it can be used to truncate fixed-length bursts. Figure 21: Random WRITE Cycles T0 CLK T1 T2 T3 COMMAND WRITE WRITE WRITE WRITE ADDRESS BANK, COL n BANK, COL a BANK, COL x BANK, COL m DQ DIN n DIN a DIN x DIN m DON’T CARE Notes: 1. Each WRITE command may be to any bank. DQM is LOW. Figure 22: WRITE-to-READ T0 CLK T1 T2 T3 T4 T5 COMMAND WRITE NOP READ NOP NOP NOP ADDRESS BANK, COL n BANK, COL b DQ DIN n DIN n+1 DOUT b DOUT b+1 DON’T CARE Notes: 1. The WRITE command may be to any bank, and the READ command may be to any bank. DQM is LOW. CL = 2 for illustration. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 32 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Operations Figure 23: WRITE-to-PRECHARGE T0 CLK tWR@ tCK ≥ 15ns T1 T2 T3 T4 T5 T6 DQM t RP COMMAND WRITE NOP PRECHARGE NOP NOP ACTIVE NOP ADDRESS BANK a, COL n t WR BANK (a or all) BANK a, ROW DQ DIN n DIN n+1 tWR@ tCK < 15ns DQM t RP COMMAND ADDRESS WRITE NOP NOP PRECHARGE NOP NOP ACTIVE BANK a, COL n t WR BANK (a or all) BANK a, ROW DQ DIN n DIN n+1 DON’T CARE Notes: 1. DQM could remain LOW in this example if the WRITE burst is a fixed length of two. Figure 24: Terminating a WRITE Burst T0 CLK T1 T2 COMMAND WRITE BURST TERMINATE NEXT COMMAND ADDRESS BANK, COL n (ADDRESS) DQ DIN n (DATA) DON’T CARE PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 33 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Operations Fixed-length WRITE bursts can be truncated with the BURST TERMINATE command. When truncating a WRITE burst, the input data applied coincident with the BURST TERMINATE command will be ignored. The last data written (provided that DQM is LOW at that time) will be the input data applied one clock previous to the BURST TERMINATE command. This is shown in Figure 24 on page 33, where data n is the last desired data element of a longer burst. PRECHARGE The PRECHARGE command (see Figure 25 on page 34) is used to deactivate the open row in a particular bank or the open row in all banks. The bank(s) will be available for a subsequent row access some specified time (tRP) after the precharge command is issued. Input A10 determines whether one or all banks are to be precharged, and in the case where only one bank is to be precharged, inputs BA0, BA1 select the bank. When all banks are to be precharged, inputs BA0, BA1 are treated as “Don’t Care.” Once a bank has been precharged, it is in the idle state and must be activated prior to any READ or WRITE commands being issued to that bank. Figure 25: PRECHARGE Command CLK CKE CS# HIGH RAS# CAS# WE# A0–A9, A11, A12 All Banks A10 Bank Selected BA0,1 BANK ADDRESS VALID ADDRESS DON’T CARE Power-Down Power-down occurs if CKE is registered LOW coincident with a NOP or COMMAND INHIBIT when no accesses are in progress. If power-down occurs when all banks are idle, this mode is referred to as precharge power-down; if power-down occurs when there is a row active in any bank, this mode is referred to as active power-down. Entering power-down deactivates the input and output buffers, excluding CKE, for maximum power savings while in standby. The device may not remain in the power-down state longer than the refresh period (64ms) since no REFRESH operations are performed in this mode. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 34 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Operations The power-down state is exited by registering a NOP or COMMAND INHIBIT and CKE HIGH at the desired clock edge (meeting tCKS). See Figure 28 on page 36. Figure 26: Power-Down CLK tCKS CKE (( )) (( )) > tCKS (( )) COMMAND NOP (( )) (( )) NOP ACTIVE All banks idle Input buffers gated off Enter power-down mode. Exit power-down mode. tRCD tRAS tRC DON’T CARE Deep Power-Down Deep power-down mode is a maximum power savings feature achieved by shutting off the power to the entire memory array of the device. Data on the memory array will not be retained once deep power-down mode is executed. Deep power-down mode is entered by having all banks idle then CS# and WE# held LOW with RAS# and CAS# HIGH at the rising edge of the clock, while CKE is LOW. CKE must be held LOW during deep power-down. Figure 27: Deep Power-Down Command CK# CK CKE CS# RAS# CAS# WE# A0–A12 BA0, BA1 DON’T CARE PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 35 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Operations Figure 28: Deep Power-Down T0 CK tIS T1 T2 ( ( Ta01 Ta1 Ta2 Ta3 )) (( )) tCKE CKE (( )) T = 100µs NOP NOP Vaild3 COMMAND NOP DPD2 (( )) (( )) All Banks idle with no activity on the data bus Enter deep power-down mode Exit deep power-down mode DON’T CARE Notes: 1. Clock must be stable prior to CKE going HIGH. 2. DPD = Deep power-down mode command; PRE ALL = Precharge all banks. 3. Exit of deep power-down mode must be followed by the sequence described in the Deep Power-Down” section on page 35. In order to exit deep power-down mode, CKE must be asserted HIGH. After exiting, the following sequence is needed in order to enter a new command: 1. Maintain NOP input conditions for a minimum of 100µs. 2. Issue PRECHARGE commands for all banks. 3. Issue two or more AUTO REFRESH commands. The values of the mode register and extended mode register will be retained upon exiting deep power-down. Clock Suspend The clock suspend mode occurs when a column access/burst is in progress and CKE is registered LOW. In the clock suspend mode, the internal clock is deactivated, “freezing” the synchronous logic. For each positive clock edge on which CKE is sampled LOW, the next internal positive clock edge is suspended. Any command or data present on the input balls at the time of a suspended internal clock edge is ignored; any data present on the DQ balls remains driven; and burst counters are not incremented, as long as the clock is suspended (see examples in Figure 29 on page 37 and Figure 30 on page 37). Clock suspend mode is exited by registering CKE HIGH; the internal clock and related operation will resume on the subsequent positive clock edge. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 36 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Operations Figure 29: Clock Suspend During WRITE Burst T0 CLK T1 T2 T3 T4 T5 CKE INTERNAL CLOCK COMMAND NOP WRITE NOP NOP ADDRESS BANK, COL n DIN DIN n DIN n+1 DIN n+2 DON’T CARE Notes: 1. For this example, BL = 4 or greater, and DQM is LOW. Figure 30: Clock Suspend During READ Burst T0 CLK T1 T2 T3 T4 T5 T6 CKE INTERNAL CLOCK COMMAND READ NOP NOP NOP NOP NOP ADDRESS BANK, COL n DQ DOUT n DOUT n+1 DOUT n+2 DOUT n+3 DON’T CARE Notes: 1. For this example, CL = 2, BL = 4 or greater, and DQM is LOW. Burst Read/Single Write The burst read/single write mode is entered by programming the write burst mode bit (M9) in the mode register to a logic 1. In this mode, all WRITE commands result in the access of a single column location (burst of one), regardless of the programmed BL. READ commands access columns according to the programmed BL and sequence, just as in the normal mode of operation. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 37 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Operations Concurrent Auto Precharge An access command (READ or WRITE) to a second bank while an access command with auto precharge enabled on a first bank is executing is not allowed by SDRAMs, unless the SDRAM supports concurrent auto precharge. Micron SDRAMs support concurrent auto precharge. Four cases where concurrent auto precharge occurs are defined below. READ with Auto Precharge 1. Interrupted by a READ (with or without auto precharge): A READ to bank m will interrupt a READ on bank n, CL later. The precharge to bank n will begin when the READ to bank m is registered (Figure 31). 2. Interrupted by a WRITE (with or without auto precharge): A WRITE to bank m will interrupt a READ on bank n when registered. DQM should be used two clocks prior to the WRITE command to prevent bus contention. The precharge to bank n will begin when the WRITE to bank m is registered (Figure 32 on page 39). Figure 31: READ With Auto Precharge Interrupted by a READ T0 CLK READ - AP BANK n READ - AP BANK m T1 T2 T3 T4 T5 T6 T7 COMMAND BANK n NOP NOP NOP NOP NOP NOP Page Active READ with Burst of 4 Interrupt Burst, Precharge t RP - BANK n Idle tRP - BANK m Precharge Internal States BANK m Page Active READ with Burst of 4 ADDRESS DQ BANK n, COL a BANK m, COL d DOUT a CL = 3 (bank n) CL = 3 (bank m) DOUT a+1 DOUT d DOUT d+1 DON’T CARE Notes: 1. DQM is LOW. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 38 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Operations Figure 32: READ With Auto Precharge Interrupted by a WRITE T0 CLK READ - AP BANK n Page Active WRITE - AP BANK m T1 T2 T3 T4 T5 T6 T7 COMMAND BANK n NOP NOP NOP NOP NOP NOP READ with Burst of 4 Interrupt Burst, Precharge tRP - BANK n Idle t WR - BANK m Write-Back Internal States BANK m BANK n, COL a Page Active WRITE with Burst of 4 ADDRESS 1 DQM DQ BANK m, COL d DOUT a CL = 3 (bank n) DIN d DIN d+1 DIN d+2 DIN d+3 DON’T CARE Notes: 1. DQM is HIGH at T2 to prevent DOUT a + 1 from contending with DIN d at T4. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 39 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Operations WRITE with Auto Precharge 1. Interrupted by a READ (with or without auto precharge): A READ to bank m will interrupt a WRITE on bank n when registered, with the data-out appearing CL later. The precharge to bank n will begin after tWR is met, where tWR begins when the READ to bank m is registered. The last valid WRITE to bank n will be data-in registered one clock prior to the READ to bank m (Figure 33). 2. Interrupted by a WRITE (with or without auto precharge): A WRITE to bank m will interrupt a WRITE on bank n when registered. The precharge to bank n will begin after tWR is met, where tWR begins when the WRITE to bank m is registered. The last valid data WRITE to bank n will be data registered one clock prior to a WRITE to bank m (Figure 34). Figure 33: WRITE With Auto Precharge Interrupted by a READ T0 CLK WRITE - AP BANK n READ - AP BANK m T1 T2 T3 T4 T5 T6 T7 COMMAND BANK n NOP NOP NOP NOP NOP NOP Page Active WRITE with Burst of 4 Interrupt Burst, Write-Back tWR - BANK n Precharge tRP - BANK n tRP - BANK m Internal States BANK m Page Active READ with Burst of 4 ADDRESS DQ BANK n, COL a DIN a DIN a+1 BANK m, COL d DOUT d CL = 3 (bank m) DOUT d+1 DON’T CARE Notes: 1. DQM is LOW. Figure 34: WRITE With Auto Precharge Interrupted by a WRITE T0 CLK WRITE - AP BANK n WRITE - AP BANK m T1 T2 T3 T4 T5 T6 T7 COMMAND BANK n NOP NOP NOP NOP NOP NOP Page Active WRITE with Burst of 4 Interrupt Burst, Write-Back tWR - BANK n Precharge tRP - BANK n t WR - BANK m Write-Back Internal States BANK m Page Active WRITE with Burst of 4 ADDRESS DQ BANK n, COL a DIN a DIN a+1 DIN a+2 BANK m, COL d DIN d DIN d+1 DIN d+2 DIN d+3 DON’T CARE Notes: 1. DQM is LOW. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 40 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Truth Tables Truth Tables Table 6: CKEn-1 L Truth Table – CKE Notes: 1–4 CKEn L Current State Power-Down Self refresh Clock suspend Deep power-down Power-Down Deep power-down Self refresh Clock suspend All banks idle All banks idle All banks idle Reading or writing Notes: Commandn X X X X COMMAND INHIBIT or NOP X COMMAND INHIBIT or NOP X COMMAND INHIBIT or NOP BURST TERMINATE AUTO REFRESH VALID Table 8 on page 44 Actionn Maintain power-down Maintain self refresh Maintain clock suspend Maintain deep power-down Exit power-down Exit deep power-down Exit self refresh Exit clock suspend Power-Down entry Deep power-down entry Self refresh entry Clock suspend entry Notes L H 5 6 5 7 8 5 H L H H 1. CKEn is the logic state of CKE at clock edge n; CKEn-1 was the state of CKE at the previous clock edge. 2. Current state is the state of the SDRAM immediately prior to clock edge n. 3. COMMANDn is the command registered at clock edge n, and ACTIONn is a result of COMMANDn. 4. All states and sequences not shown are illegal or reserved. 5. Deep power-down is power savings feature of this Mobile SDRAM device. This command is BURST TERMINATE when CKE is HIGH and deep power-down when CKE is LOW. 6. Exiting power-down at clock edge n will put the device in the all banks idle state in time for clock edge n + 1 (provided that tCKS is met). 7. Exiting self refresh at clock edge n will put the device in the all banks idle state once tXSR is met. COMMAND INHIBIT or NOP commands should be issued on any clock edges occurring during the tXSR period. A minimum of two NOP commands must be provided during the tXSR period. 8. After exiting clock suspend at clock edge n, the device will resume operation and recognize the next command at clock edge n + 1. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 41 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Truth Tables Table 7: Truth Table – Current State Bank n, Command to Bank n Notes: 1–6; notes appear below table Current State Any Idle CS# H L L L L L L L L L L L L L L L L Notes: RAS# X H L L L L H H L H H L H H H L H CAS# X H H L L H L L H L L H H L L H H WE# X H H H L L H L L H L L L H L L L Command (Action) COMMAND INHIBIT (NOP/Continue previous operation) NO OPERATION (NOP/Continue previous operation) ACTIVE (Select and activate row) AUTO REFRESH LOAD MODE REGISTER PRECHARGE READ (Select column and start READ burst) WRITE (Select column and start WRITE burst) PRECHARGE (Deactivate row in bank or banks) READ (Select column and start new READ burst) WRITE (Select column and start WRITE burst) PRECHARGE (Truncate READ burst, start PRECHARGE) BURST TERMINATE READ (Select column and start READ burst) WRITE (Select column and start new WRITE burst) PRECHARGE (Truncate WRITE burst, start PRECHARGE) BURST TERMINATE Notes Row active Read (auto precharge disabled) Write (auto precharge disabled) 7 7 8 9 9 10 9 9 10 11 9 9 10 11 1. This table applies when CKEn-1 was HIGH and CKEn is HIGH (see Table 6 on page 41) and after tXSR has been met (if the previous state was self refresh). 2. This table is bank-specific, except where noted; i.e., the current state is for a specific bank and the commands shown are those allowed to be issued to that bank when in that state. Exceptions are covered in the notes below. 3. Current state definitions: The bank has been precharged, and tRP has been met. A row in the bank has been activated, and tRCD has been met. No data bursts/accesses and no register accesses are in progress. Read: A READ burst has been initiated, with auto precharge disabled, and has not yet terminated or been terminated. Write: A WRITE burst has been initiated, with auto precharge disabled, and has not yet terminated or been terminated. 4. The following states must not be interrupted by a command issued to the same bank. COMMAND INHIBIT or NOP commands, or allowable commands to the other bank should be issued on any clock edge occurring during these states. Allowable commands to the other bank are determined by its current state and Table 7, and according to Table 8 on page 44. Idle: Row active: Precharging: Row activating: Read w/autoprecharge enabled: Write w/autoprecharge enabled: Starts with registration of a PRECHARGE command and ends when RP is met. Once tRP is met, the bank will be in the idle state. Starts with registration of an ACTIVE command and ends when tRCD is met. Once tRCD is met, the bank will be in the row active state. Starts with registration of a READ command with auto precharge enabled and ends when tRP has been met. Once tRP is met, the bank will be in the idle state. Starts with registration of a WRITE command with auto precharge enabled and ends whentRP has been met. Once tRP is met, the bank will be in the idle state. t PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 42 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Truth Tables 5. The following states must not be interrupted by any executable command; COMMAND INHIBIT or NOP commands must be applied on each positive clock edge during these states. Starts with registration of an AUTO REFRESH command and ends when tRFC is met. Once tRFC is met, the SDRAM will be in the all banks idle state. Accessing mode Starts with registration of a LOAD MODE REGISTER command and register: ends when tMRD has been met. Once tMRD is met, the Mobile SDRAM will be in the all banks idle state. Precharging all: Starts with registration of a PRECHARGE ALL command and ends when tRP is met. Once tRP is met, all banks will be in the idle state. All states and sequences not shown are illegal or reserved. Not bank-specific; requires that all banks are idle. Does not affect the state of the bank and acts as a NOP to that bank. READs or WRITEs listed in the Command (Action) column include READs or WRITEs with auto precharge enabled and READs or WRITEs with auto precharge disabled. May or may not be bank-specific; if all banks are to be precharged, all must be in a valid state for precharging. This command is BURST TERMINATE when CKE is HIGH. Refreshing: 6. 7. 8. 9. 10. 11. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 43 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Truth Tables Table 8: Truth Table – Current State Bank n, Command to Bank m Notes: 1–6; notes appear below and on next page Current State Any Idle Row activating, active, or precharging Read (auto precharge disabled) Write (auto precharge disabled) Read (with auto precharge) Write (with auto precharge) CS# H L X L L L L L L L L L L L L L L L L L L L L Notes: RAS# X H X L H H L L H H L L H H L L H H L L H H L CAS# X H X H L L H H L L H H L L H H L L H H L L H WE# X H X H H L L H H L L H H L L H H L L H H L L Command (Action) COMMAND INHIBIT (NOP/Continue previous operation) NO OPERATION (NOP/Continue previous operation) Any command otherwise allowed to bank m ACTIVE (Select and activate row) READ (Select column and start READ burst) WRITE (Select column and start WRITE burst) PRECHARGE ACTIVE (Select and activate row) READ (Select column and start new READ burst) WRITE (Select column and start WRITE burst) PRECHARGE ACTIVE (Select and activate row) READ (Select column and start READ burst) WRITE (Select column and start new WRITE burst) PRECHARGE ACTIVE (Select and activate row) READ (Select column and start new READ burst) WRITE (Select column and start WRITE burst) PRECHARGE ACTIVE (Select and activate row) READ (Select column and start READ burst) WRITE (Select column and start new WRITE burst) PRECHARGE Notes 7 7 7, 8 7, 9 10 7, 11 7, 12 10 7, 13, 14 7, 13, 15 10 7, 13, 16 7, 13, 17 10 1. This table applies when CKEn-1 was HIGH and CKEn is HIGH (Table 6 on page 41) and after tXSR has been met (if the previous state was self refresh). 2. This table describes alternate bank operation, except where noted; i.e., the current state is for bank n and the commands shown are those allowed to be issued to bank m (assuming that bank m is in such a state that the given command is allowable). Exceptions are covered in the notes below. 3. Current state definitions: Idle: Row active: Read: Write: Read w/autoprecharge enabled: Write w/autoprecharge enabled: The bank has been precharged, and tRP has been met. A row in the bank has been activated, and tRCD has been met. No data bursts/accesses and no register accesses are in progress. A READ burst has been initiated, with auto precharge disabled, and has not yet terminated or been terminated. A WRITE burst has been initiated, with auto precharge disabled, and has not yet terminated or been terminated. Starts with registration of a READ command with auto precharge enabled and ends when tRP has been met. Once tRP is met, the bank will be in the idle state. Starts with registration of a WRITE command with auto precharge enabled and ends whentRP has been met. Once tRP is met, the bank will be in the idle state. 4. AUTO REFRESH, SELF REFRESH and LOAD MODE REGISTER commands may only be issued when all banks are idle. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 44 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Truth Tables 5. A BURST TERMINATE command cannot be issued to another bank; it applies to the bank represented by the current state only. 6. All states and sequences not shown are illegal or reserved. 7. READs or WRITEs to bank m listed in the Command (Action) column include READs or WRITEs with auto precharge enabled and READs or WRITEs with auto precharge disabled. 8. For a READ without auto precharge interrupted by a READ (with or without auto precharge), the READ to bank m will interrupt the READ on bank n, CL later (Figure 11 on page 24). 9. For a READ without auto precharge interrupted by a WRITE (with or without auto precharge), the WRITE to bank m will interrupt the READ on bank n when registered. DQM should be used one clock prior to the WRITE command to prevent bus contention. 10. Burst in bank n continues as initiated. 11. For a WRITE without auto precharge interrupted by a READ (with or without auto precharge), the READ to bank m will interrupt the WRITE on bank n when registered, with the data-out appearing CL later. The last valid WRITE to bank n will be data-in registered one clock prior to the READ to bank m. 12. For a WRITE without auto precharge interrupted by a WRITE (with or without auto precharge), the WRITE to bank will interrupt the WRITE on bank n when registered. The last valid WRITE to bank n will be data-in registered one clock prior to the READ to bank m. 13. Concurrent auto precharge: Bank n will initiate the auto precharge command when its burst has been interrupted by bank m burst. 14. For a READ with auto precharge interrupted by a READ (with or without auto precharge), the READ to bank m will interrupt the READ on bank n, CL later. The PRECHARGE to bank n will begin when the READ to bank m is registered. 15. For a READ with auto precharge interrupted by a WRITE (with or without auto precharge), the WRITE to bank m will interrupt the READ on bank n when registered. DQM should be used two clocks prior to the WRITE command to prevent bus contention. The PRECHARGE to bank n will begin when the WRITE to bank m is registered. 16. For a WRITE with auto precharge interrupted by a READ (with or without auto precharge), the READ to bank m will interrupt the WRITE on bank n when registered, with the data-out appearing CL later. The PRECHARGE to bank n will begin after tWR is met, where tWR begins when the READ to bank m is registered. The last valid WRITE bank n will be data-in registered one clock prior to the READ to bank m. 17. For a WRITE with auto precharge interrupted by a WRITE (with or without auto precharge), the WRITE to bank m interrupt the WRITE on bank n when registered. The PRECHARGE to bank n will begin after tWR is met, where tWR begins when the WRITE to bank m is registered. The last valid WRITE to bank n will be data registered one clock to the WRITE to bank m. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 45 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Electrical Specifications Electrical Specifications Absolute Maximum Ratings Stresses greater than those listed in Table 9 may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Table 9: Absolute Maximum Ratings Voltage/Temperature Voltage on VDD/VDDQ supply relative to VSS Voltage on inputs, NC or I/O balls relative to VSS Storage temperature plastic Min –0.3 –0.3 –55 Max +2.7 +2.7 +150 Units V °C Table 10: DC Electrical Characteristics and Operating Conditions Notes: 1, 5, 6; notes appear on pages 51–52 Symbol VDD VDDQ VIH VIL VOH VOL II Min Max Units V V V V V V µA Notes Parameter/Condition Supply voltage I/O supply voltage Input high voltage: Logic 1; All inputs Input low voltage: Logic 0; All inputs Output high voltage: Output low voltage: Input leakage current: Any input 0V ≤ VIN ≤ VDD (All other balls not under test = 0V) Operating temperature Commercial Industrial 1.7 1.95 1.7 1.95 0.8 × VDDQ VDDQ + 0.3 –0.3 +0.3 0.9 × VDDQ – – 0.2 –1.0 1.0 22 22 28 28 TA TA 0 –40 +70 +85 °C PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 46 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Electrical Specifications Table 11: Electrical Characteristics and Recommended AC Operating Conditions Notes: 5, 6, 8, 9, 11; notes appear on pages 51–52 AC Characteristics Parameter Access time from CLK (pos. edge) Address hold time Address setup time CLK high-level width CLK low-level width Clock cycle time CKE hold time CKE setup time CS#, RAS#, CAS#, WE#, DQM hold time CS#, RAS#, CAS#, WE#, DQM setup time Data-in hold time Data-in setup time Data-out High-Z time Data-out Low-Z time Data-out hold time (load) ACTIVE-to-PRECHARGE command ACTIVE-to-ACTIVE command period ACTIVE-to-READ or WRITE delay Refresh period (8,192 rows) AUTO REFRESH period PRECHARGE command period ACTIVE bank a to ACTIVE bank b command Transition time WRITE recovery time Exit SELF REFRESH-to-ACTIVE command CL = 3 CL = 2 Symbol t t -75 Min Max 6 9 1 1.5 3 3 7.5 9.6 1 2.5 1 1.5 1 1.5 6 9 1 2.5 44 67.5 19 80 19 2 0.3 15 80 1 2.5 48 72 20 80 19 2 0.5 15 80 1 2.5 3 3 8 10 1 2.5 1 2.5 1 2.5 Min -8 Max 7 9 Units ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ms ns ns tCK ns ns ns Notes CL = 3 CL = 2 CL = 3 CL = 2 AC (3) AC (2) t AH t AS t CH t CL tCK (3) tCK (2) t CKH tCKS tCMH tCMS tDH tDS tHZ (3) tHZ (2) tLZ tOH tRAS tRC tRCD tREF tRFC tRP tRRD tT tWR tXSR 23 23 7 9 10 10 120,000 120,000 64 64 1.2 1.2 7 31 20 PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 47 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Electrical Specifications Table 12: Parameter READ/WRITE command to READ/WRITE command CKE to clock disable or power-down entry mode CKE to clock enable or power-down exit mode DQM to input data delay DQM to data mask during WRITEs DQM to data High-Z during READs WRITE command to input data delay Data-in to ACTIVE command Data-in to PRECHARGE command Last data-in to burst STOP command Last data-in to new READ/WRITE command Last data-in to PRECHARGE command LOAD MODE REGISTER command to ACTIVE or REFRESH command CL = 3 Data-out High-Z from PRECHARGE command CL = 2 AC Functional Characteristics Notes: 5, 6, 8, 9,11; notes appear on pages 51–52 Symbol CCD CKED t PED t DQD tDQM t DQZ t DWD t DAL t DPL t BDL t CDL tRDL tMRD tROH(3) tROH(2) t t -75 1 1 1 0 0 2 0 5 2 1 1 2 2 3 2 -8 1 1 1 0 0 2 0 5 2 1 1 2 2 3 2 Units t t Notes 17 14 14 17 17 17 17 15, 21 16, 21 17 17 16, 21 25 17 17 CK CK t CK t CK tCK t CK t CK t CK t CK t CK t CK tCK tCK tCK tCK PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 48 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Electrical Specifications Table 13: IDD Specifications and Conditions (x16) Notes: 1, 5, 6, 11, 13; notes appear on pages 51–52; VDD = 1.7V to 1.95V, VDDQ = 1.7V to 1.95V Max Parameter/Condition Operating current: Active mode; Burst = 1; READ or WRITE; tRC = tRC (MIN) Standby current: Power-down mode; All banks idle; CKE = LOW Symbol IDD1 IDD2P Standard IDD2P Low Power IDD2N IDD3P -75 95 500 300 20 20 -8 90 500 300 20 20 mA mA 12, 19 Units mA µA Notes 18, 19 29 Standby current: Non-power-down mode; All banks idle; CKE = HIGH Standby current: Active mode; CKE = LOW; CS# = HIGH; All banks active; No accesses in progress Standby current: Active mode; CKE = HIGH; CS# = HIGH; All banks active after tRCD met; No accesses in progress Operating current: Burst mode; READ or WRITE; All banks active, half DQs toggling every cycle tRFC = tRFC (MIN) Auto refresh current tRFC = 7.8125µs CKE = HIGH; CS# = HIGH Deep power-down IDD3N 30 30 mA 12, 19 IDD4 90 85 mA 18, 19 IDD5 IDD6 IZZ 85 5 10 80 5 10 mA mA µA 12, 18, 19, 26 29, 30 Table 14: IDD Specifications and Conditions (x32) Notes: 1, 5, 6, 11, 13; notes appear on pages 51–52; VDD = 1.7V to 1.95V, VDDQ = 1.7V to 1.95V Max Parameter/Condition Operating current: Active mode; Burst = 1; READ or WRITE; tRC = tRC (MIN) Standby current: Power-down mode; All banks idle; CKE = LOW Symbol IDD1 IDD2P Standard IDD2P Low Power IDD2N IDD3P -75 115 500 300 20 20 -8 110 500 300 20 20 Units mA µA Notes 18, 19 29 Standby current: Non-power-down mode; All banks idle; CKE = HIGH Standby current: Active mode; CKE = LOW; CS# = HIGH; All banks active; No accesses in progress Standby current: Active mode; CKE = HIGH; CS# = HIGH; All banks active after tRCD met; No accesses in progress Operating current: Burst mode; READ or WRITE; All banks active, half DQs toggling every cycle tRFC = tRFC (MIN) Auto refresh current tRFC = 7.8125µs CKE = HIGH; CS# = HIGH Deep power-down mA mA 12, 19 IDD3N 30 30 mA 12, 19 IDD4 120 115 mA 18, 19 IDD5 IDD6 IZZ 85 5 10 80 5 10 mA mA µA 12, 18, 19, 26 29, 30 PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 49 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Electrical Specifications Table 15: IDD7 Specifications and Conditions (x16 and x32) Notes:1–6, 8, 11, 13, 15, 27; notes appear on pages 51–52; VDD/VDDQ = 1.70–1.95V Parameter/Condition Self refresh CKE = LOW; tCK = tCK (MIN); Address and control inputs are stable; Data bus inputs are stable. Full array, 85°C Full array, 70°C Full array, 45°C Full array, 15°C Half array, 85°C Half array, 70°C Half array, 45°C Half array, 15°C 1/4 array, 85°C 1/4 array, 70°C 1/4 array, 45°C 1/4 array, 15°C 1/8 array, 85°C 1/8 array, 70°C 1/8 array, 45°C 1/8 array, 15°C 1/16 array, 85°C 1/16 array, 70°C 1/16 array, 45°C 1/16 array, 15°C Symbol Low IDD7 Option “L” 300 230 180 160 250 200 170 150 210 175 155 140 180 155 145 135 170 145 135 130 Standard IDD7 Option 500 430 380 360 440 380 350 330 410 365 335 305 390 350 315 300 380 340 320 290 Units µA µA µA µA µA µA µA µA µA µA µA µA µA µA µA µA µA µA µA µA Notes 17, 29 IDD7a IDD7b IDD7c IDD7d IDD7a IDD7b IDD7c IDD7d IDD7a IDD7b IDD7c IDD7d IDD7a IDD7b IDD7c IDD7d IDD7a IDD7b IDD7c IDD7d Figure 35: Typical Self Refresh Current vs. Temperature 250 Full array Half array 1/4 array 1/8 array 1/16 array 200 Current (µA) 150 100 50 0 -40 -30 -20 -10 0 10 20 30 40 Temperature (°C) 50 60 70 80 90 PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 50 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Notes Table 16: Parameter Input capacitance: CLK Input capacitance: All other input-only balls Input/Output capacitance: DQs Capacitance (x16) Note: 2; notes appear on pages 51–52 Symbol CI1 CI2 CIO Min 2.0 2.0 2.5 Max 5.0 5.0 6.0 Units pF pF pF Table 17: Parameter Capacitance (x32) Note: 2; notes appear on pages 51–52 Symbol CI1 CI2 CIO Min 2.0 2.0 2.5 Max 5.0 5.0 6.0 Units pF pF pF Input capacitance: CLK Input capacitance: All other input-only balls Input/Output capacitance: DQs Notes 1. All voltages referenced to VSS. 2. This parameter is sampled. VDD, VDDQ = +1.8V; TA = 25°C; ball under test biased at 0.9V, 1.25V, and 1.4V, respectively; f = 1 MHz. 3. IDD is dependent on output loading and cycle rates. Specified values are obtained with minimum cycle time and the outputs open. 4. Enables on-chip refresh and address counters. 5. The minimum specifications are used only to indicate cycle time at which proper operation over the full temperature range (–40°C ≤ TA ≤ +85°C for TA on IT parts) is ensured. 6. An initial pause of 100µs is required after power-up, followed by two AUTO REFRESH commands, before proper device operation is ensured. (VDD and VDDQ must be powered up simultaneously. VSS and VSSQ must be at same potential.) The two AUTO REFRESH command wake-ups should be repeated any time the tREF refresh requirement is exceeded. 7. AC characteristics assume tT = 1ns. 8. In addition to meeting the transition rate specification, the clock and CKE must transit between VIH and VIL (or between VIL and VIH) in a monotonic manner. 9. Outputs measured for 1.8V at 0.9V with equivalent load: Q 20pF Test loads with full DQ driver strength. Performance will vary with actual system DQ bus capacitive loading, termination, and programmed drive strength. 10. tHZ defines the time at which the output achieves the open circuit condition; it is not a reference to VOH or VOL. The last valid data element will meet tOH before going High-Z. 11. AC timing and IDD tests have VIL and VIH, with timing referenced to VIH/2 = crossover point. If the input transition time is longer than tT (MAX), then the timing is referenced at VIL (MAX) and VIH (MIN) and no longer at the VIH/2 crossover point. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 51 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Notes 12. Other input signals are allowed to transition no more than once every two clocks and are otherwise at valid VIH or VIL levels. 13. IDD specifications are tested after the device is properly initialized. 14. Timing actually specified by tCKS; clock(s) specified as a reference only at minimum cycle rate. 15. Timing actually specified by tWR plus tRP; clock(s) specified as a reference only at minimum cycle rate. 16. Timing actually specified by tWR. 17. Required clocks are specified by JEDEC functionality and are not dependent on any timing parameter. 18. The IDD current will increase or decrease proportionally according to the amount of frequency alteration for the test condition. 19. Address transitions average one transition every two clocks. 20. CLK must be toggled a minimum of two times during this period. 21. Based on tCK = 7.5ns for -75, and tCK = 8ns for -8, CL = 3. 22. VIH overshoot: VIH (MAX) = VDDQ + 2V for a pulse width ≤ 3ns, and the pulse width cannot be greater than one third of the cycle rate. VIL undershoot: VIL (MIN) = –2V for a pulse width ≤ 3ns. 23. The only time that the clock frequency is allowed to change is during clock stop, power down, or self-refresh modes. 24. Auto precharge mode only. The precharge timing budget (tRP) begins at 7ns for -8 after the first clock delay, after the last WRITE is executed. May not exceed limit set for precharge mode. 25. Parameter guaranteed by design. 26. CKE is HIGH during refresh command period tRFC (MIN), else CKE is LOW. The IDD7 limit is actually a nominal value and does not result in a fail value. 27. Values for IDD7 for 85°C are 100 percent tested. Values for 70°C, 45°C, and 15°C are sampled only. 28. IOUT = 4mA for full-drive strength. Other drive strengths require appropriate scale. 29. Current is taken 500ms after entering into this operating mode to allow tester measuring unit settling time. 30. Deep power-down current is a nominal value at 25°C. This parameter is not tested. 31. There must be one tCK during the tWR time for WRITE auto precharge. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 52 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Timing Diagrams Timing Diagrams Figure 36: Initialize and Load Mode Register T0 CLK (( )) (( )) T1 (( )) (( )) Tn + 1 (( )) (( )) To + 1 (( )) (( )) Tp + 1 (( )) (( )) Tq + 1 (( )) (( )) Tr + 1 (( )) (( )) tCK tCKS tCKH CKE (( )) (( )) (( )) (( )) (( )) (( )) tCMS tCMH NOP PRE (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) COMMAND1 AR AR LMR LMR VALID DQM tAS tAH A0-A9, A11 (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) CODE (( )) (( )) (( )) (( )) (( )) (( )) CODE (( )) (( )) (( )) (( )) (( )) (( )) VALID (( )) (( )) (( )) (( )) (( )) (( )) ALL BANKS A10 (( )) (( )) (( )) (( )) (( )) (( )) (( )) (( )) CODE CODE VALID tAS tAH t A S tAH BA0 = L, BA1 = L BA0 = L, BA0 = L, BA1 = H BA1 = L VALID BA0, BA1 DQ (( )) High-Z (( )) tRP (( )) tRFC2 (( )) tRFC2 (( )) tMRD3 (( )) tMRD3 (( )) T = 100µs Power-up: VDD and CLK stable Precharge all banks Load Mode Register Load Extended Mode Register DON’T CARE Notes: 1. PRE = PRECHARGE command, AR = AUTO REFRESH command, LMR = LOAD MODE REGISTER command. 2. Only NOPs or COMMAND INHIBITs may be issued during tRFC time. 3. At least one NOP or COMMAND INHIBIT is required during tMRD time. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 53 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Timing Diagrams Figure 37: Power-Down Mode T0 CLK tCK T1 tCL tCKS CKE tCKS tCKH tCH T2 (( )) (( )) Tn + 1 Tn + 2 tCKS (( )) tCMS tCMH COMMAND PRECHARGE NOP NOP (( )) (( )) (( )) (( )) (( )) (( )) NOP ACTIVE DQM A0–A9, A11, A12 ALL BANKS ROW A10 SINGLE BANK (( )) (( )) ROW tAS BA0, BA1 tAH (( )) (( )) (( )) BANK(S) High-Z BANK DQ Two clock cycles Precharge all active banks All banks idle, enter power-down mode Input buffers gated off while in power-down mode All banks idle Exit power-down mode DON’T CARE Notes: 1. Violating refresh requirements during power-down may result in a loss of data. See Table 11 on page 47. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 54 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Timing Diagrams Figure 38: CLK Clock Suspend Mode T0 tCK T1 tCL tCH tCKS tCKH T2 T3 T4 T5 T6 T7 T8 T9 CKE tCKS tCKH tCMS tCMH COMMAND READ NOP NOP NOP NOP NOP WRITE NOP tCMS tCMH DQM tAS A0–A9, A11, A12 tAH 2 COLUMN e COLUMN m2 tAS A10 tAS BA0, BA1 tAH tAH BANK BANK tAC DQ tLZ DOUT m tAC tOH tHZ DOUT m + 1 tDS tDH DOUT e + 1 DOUT e DON’T CARE UNDEFINED Notes: 1. For this example, BL = 2, CL = 3, and auto precharge is disabled. 2. A9 and A11 = “Don’t Care.” See Table 11 on page 47. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 55 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Timing Diagrams Figure 39: Auto Refresh Mode T0 CLK tCK T1 T2 tCH (( )) (( )) (( )) Tn + 1 tCL (( )) (( )) (( )) To + 1 CKE tCKS tCMS COMMAND tCKH tCMH NOP AUTO REFRESH NOP PRECHARGE (( )) ( ( NOP )) (( )) (( )) (( )) (( )) AUTO REFRESH NOP (( )) ( ( NOP )) (( )) (( )) (( )) (( )) (( )) (( )) ACTIVE DQM A0–A9, A11, A12 ALL BANKS ROW A10 SINGLE BANK (( )) (( )) ROW tAS tAH BA0, BA1 BANK(S) (( )) (( )) (( )) tRP tRFC tRFC (( )) (( )) (( )) BANK DQ High-Z Precharge all active banks DON’T CARE UNDEFINED Notes: 1. Each AUTO REFRESH command performs a REFRESH cycle. Back-to-back commands are not required. See Table 11 on page 47. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 56 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Timing Diagrams Figure 40: Self Refresh Mode T0 CLK tCK T1 tCH tCL T2 (( )) (( )) Tn + 1 tCKS > tRAS (( )) (( )) (( )) (( )) To + 1 To + 2 CKE tCKS tCMS COMMAND tCKH tCMH NOP AUTO REFRESH (( )) PRECHARGE (( )) (( )) (( )) (( )) (( )) (( )) NOP ( ( (( )) AUTO REFRESH )) DQM (( )) (( )) (( )) (( )) (( )) (( )) A0–A9, A11, A12 ALL BANKS A10 SINGLE BANK (( )) (( )) tS A BA0, BA1 tAH (( )) (( )) (( )) (( )) BANK(S) DQ High-Z tRP Precharge all active banks Enter self refresh mode (( )) (( )) tXSR Exit self refresh mode (Restart refresh time base) DON’T CARE CLK stable prior to exiting self refresh mode Notes: 1. Each AUTO REFRESH command performs a REFRESH cycle. Back-to-back commands are not required. See Table 11 on page 47. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 57 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Timing Diagrams Figure 41: READ – Without Auto Precharge T0 CLK tCKS CKE tCMS COMMAND tCMH NOP READ NOP NOP NOP PRECHARGE NOP ACTIVE T1 tCK tCKH tCL T2 tCH T3 T4 T5 T6 T7 T8 ACTIVE tCMS DQM tAS ADDR tAS A10 tAS BA0, BA1 tAH ROW tCMH COLUMN m ROW tAH ROW ALL BANKS ROW DISABLE AUTO PRECHARGE BANK SINGLE BANK BANK(S) BANK tAH BANK tAC DQ tRCD tRAS tRC CL tLZ tAC tOH DOUT m tAC tOH DOUT m + 1 tAC tOH DOUT m + 2 tOH DOUT m + 3 tRP tHZ DON’T CARE UNDEFINED Notes: 1. For this example, BL = 4, CL = 2, and the READ burst is followed by a manual PRECHARGE. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 58 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Timing Diagrams Figure 42: READ – With Auto Precharge T0 CLK tCKS CKE tCMS COMMAND tCMH NOP READ NOP NOP NOP NOP NOP ACTIVE T1 tCK tCKH tCL T2 tCH T3 T4 T5 T6 T7 T8 ACTIVE tCMS DQM tAS ADDR tAS A10 tAS BA0, BA1 tAH ROW tCMH COLUMN m ENABLE AUTO PRECHARGE ROW tAH ROW ROW tAH BANK BANK BANK tAC DQ tRCD tRAS tRC CL tLZ tAC tOH DOUT m tAC tOH DOUT m + 1 tAC tOH DOUT m + 2 tOH DOUT m + 3 tRP tHZ DON’T CARE UNDEFINED Notes: 1. For this example, BL = 4, CL = 2. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 59 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Timing Diagrams Figure 43: CLK tCKS CKE tCMS COMMAND tCMH NOP READ NOP3 NOP3 PRECHARGE NOP ACTIVE NOP Single READ – Without Auto Precharge T0 tCK tCKH T1 tCL tCH T2 T3 T4 T5 T6 T7 T8 ACTIVE tCMS DQM tAS ADDR tAS A10 tAS BA0, BA1 tAH ROW tCMH COLUMN m ROW tAH ROW ALL BANKS ROW DISABLE AUTO PRECHARGE BANK SINGLE BANK BANK(S) BANK tAH BANK tAC DQ tRCD tRAS tRC CL tLZ tOH DOUT m tHZ tRP DON’T CARE UNDEFINED Notes: 1. For this example, BL = 1, CL = 2, and the READ burst is followed by a manual PRECHARGE. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 60 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Timing Diagrams Figure 44: Single READ – With Auto Precharge T0 CLK tCKS CKE tCMS COMMAND tCMH NOP NOP3 NOP3 READ NOP NOP ACTIVE NOP T1 tCK tCKH tCL T2 tCH T3 T4 T5 T6 T7 T8 ACTIVE tCMS DQM tAS ADDR tAS A10 tAS BA0, BA1 tAH ROW tCMH COLUMN m ENABLE AUTO PRECHARGE ROW tAH ROW ROW tAH BANK BANK BANK tAC DQ tRCD tRAS tRC CL tRP tOH DOUT m tHZ DON’T CARE UNDEFINED Notes: 1. For this example, BL = 1, CL = 2, and the READ burst is followed by an auto precharge. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 61 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Timing Diagrams Figure 45: CLK tCKS CKE tCMS COMMAND tCMH NOP READ NOP ACTIVE NOP READ NOP ACTIVE Alternating Bank Read Accesses T0 tCK tCKH T1 tCL tCH T2 T3 T4 T5 T6 T7 T8 ACTIVE tCMS DQM tAS ADDR tAH tCMH ROW COLUMN m ROW COLUMN b ROW tAS A10 tAH ENABLE AUTO PRECHARGE ROW ENABLE AUTO PRECHARGE ROW ROW tAS BA0, BA1 tAH BANK 0 BANK 3 BANK 3 BANK 0 BANK 0 tAC tAC DQ tRCD - bank 0 tRAS - bank 0 tRC - bank 0 tRRD CL - bank 0 tLZ tOH DOUT m tAC tOH DOUT m + 1 tAC tOH DOUT m + 2 tAC tOH DOUT m + 3 tAC tOH DOUT b tRP - bank 0 tRCD - bank 0 tRCD - bank 4 CL - bank 4 DON’T CARE UNDEFINED Notes: 1. For this example, BL = 4, CL = 2. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 62 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Timing Diagrams Figure 46: T0 CLK tCKS CKE tCMS COMMAND tCMH NOP READ NOP NOP NOP NOP READ – Continuous-Page Burst T1 tCL tCH tCKH (( )) (( )) (( )) (( )) (( )) (( )) T2 tCK T3 T4 T5 T6 (( )) (( )) Tn + 1 Tn + 2 Tn + 3 Tn + 4 ACTIVE NOP BURST TERM NOP NOP tCMS DQM tCMH tAS ADDR tAH COLUMN m ROW (( )) (( )) tAS A10 tAH ROW (( )) (( )) tAS BA0, BA1 tAH BANK BANK (( )) (( )) tAC tAC DQ tLZ tRCD CAS Latency tOH Dout m tAC tOH DOUT m+1 tAC ( ( )) tOH (( )) DOUT m+2 (( )) tAC tOH DOUT m-1 tAC tOH DOUT m tOH DOUT m+1 tHZ All locations within same row Full page completed Full-page burst does not self-terminate. 3 Can use BURST TERMINATE command. DON’T CARE UNDEFINED Notes: 1. For this example, CL = 2. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 63 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Timing Diagrams Figure 47: CLK tCKS CKE tCMS COMMAND tCMH NOP READ NOP NOP NOP NOP NOP NOP READ – DQM Operation T0 tCK tCKH T1 tCL tCH T2 T3 T4 T5 T6 T7 T8 ACTIVE tCMS DQM tAS ADDR tAS A10 tAS BA0, BA1 tAH ROW tCMH COLUMN m ENABLE AUTO PRECHARGE tAH ROW tAH BANK DISABLE AUTO PRECHARGE BANK tAC tAC DQ tLZ tRCD CL DOUT m tOH tLZ tAC tOH DOUT m + 2 tOH DOUT m + 3 tHZ tHZ DON’T CARE UNDEFINED Notes: 1. For this example, CL = 2. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 64 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Timing Diagrams Figure 48: CLK tCKS CKE tCMS COMMAND tCMH NOP WRITE NOP NOP NOP NOP PRECHARGE NOP ACTIVE WRITE – Without Auto Precharge T0 tCK tCKH T1 tCL T2 tCH T3 T4 T5 T6 T7 T8 T9 ACTIVE tCMS tCMH DQM tAS ADDR tAH COLUMN m ALL BANKs ROW DISABLE AUTO PRECHARGE BANK SINGLE BANK BANK BANK ROW ROW tAS A10 tAH ROW tAS BA0, BA1 tAH BANK tDS DQ tRCD tRAS tRC tDH tDS tDH tDS tDH tDS tDH DIN m DIN m + 1 DIN m + 2 DIN m + 3 tWR2 tRP DON’T CARE Notes: 1. For this example, BL = 1, and the WRITE burst is followed by an auto precharge. 2. 15ns is required between and the PRECHARGE command, regardless of frequency. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 65 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Timing Diagrams Figure 49: CLK tCKS CKE tCMS COMMAND tCMH NOP WRITE NOP NOP NOP NOP NOP NOP ACTIVE WRITE – With Auto Precharge T0 tCK tCKH T1 tCL T2 tCH T3 T4 T5 T6 T7 T8 T9 ACTIVE tCMS tCMH DQM tAS ADDR tAH COLUMN m ENABLE AUTO PRECHARGE ROW ROW ROW tAS A10 tAH ROW tAS BA0, BA1 tAH BANK BANK BANK tDS DQ tRCD tRAS tRC tDH DIN m tDS tDH tDS tDH tDS tDH DIN m + 1 DIN m + 2 DIN m + 3 tWR2 tRP DON’T CARE UNDEFINED Notes: 1. For this example, BL = 4. 2. There must be one tCK during the tWR time for WRITE auto precharge. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 66 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Timing Diagrams Figure 50: Single WRITE – Without Auto Precharge T0 CLK tCKS CKE tCMS COMMAND tCMH NOP WRITE NOP3 NOP3 PRECHARGE NOP ACTIVE NOP T1 tCK tCKH tCL T2 tCH T3 T4 T5 T6 T7 T8 ACTIVE tCMS DQM tAS ADDR tAS A10 tAS BA0, BA1 tAH ROW tCMH COLUMN m tAH ROW ALL BANKS ROW DISABLE AUTO PRECHARGE BANK SINGLE BANK BANK BANK tAH BANK tDS DQ tRCD tRAS tRC tDH DIN m tWR2 tRP DON’T CARE Notes: 1. For this example, BL = 1, and the WRITE burst is followed by a manual PRECHARGE. 2. 15ns is required between and the PRECHARGE command, regardless of frequency. 3. PRECHARGE command not allowed or tRAS would be violated. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 67 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Timing Diagrams Figure 51: T0 CLK tCKS CKE tCMS COMMAND tCMH NOP NOP NOP WRITE NOP NOP NOP ACTIVE NOP Single WRITE – With Auto Precharge T1 tCK tCKH tCL tCH T2 T3 T4 T5 T6 T7 T8 T9 ACTIVE tCMS DQM tAS ADDR tAS A10 tAS BA0, BA1 tAH ROW tCMH COLUMN m ENABLE AUTO PRECHARGE ROW tAH ROW ROW tAH BANK BANK BANK tDS DQ tRCD tRAS tRC tDH DIN m tWR tRP DON’T CARE Notes: 1. For this example, BL = 1, and the WRITE burst is followed by a manual PRECHARGE. 2. There must be one tCK during the tWR time for WRITE auto precharge. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 68 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Timing Diagrams Figure 52: T0 CLK tCKS CKE tCMS COMMAND tCMH NOP WRITE NOP ACTIVE NOP WRITE NOP NOP ACTIVE Alternating Bank Write Accesses T1 tCK tCKH tCL tCH T2 T3 T4 T5 T6 T7 T8 T9 ACTIVE tCMS DQM tAS ADDR tAH tCMH ROW COLUMN m ROW COLUMN b ROW tAS A10 tAH ENABLE AUTO PRECHARGE ROW ENABLE AUTO PRECHARGE ROW ROW tAS BA0, BA1 tAH BANK 0 BANK 1 BANK 1 BANK 0 BANK 0 tDS DQ tRCD - bank 0 tRAS - bank 0 tRC - bank 0 tRRD tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH DIN m DIN m + 1 DIN m + 2 DIN m + 3 DIN b DIN b + 1 DIN b + 2 tRP - bank 0 DIN m + 3 tRCD - bank 0 tWR - bank 0 tWR - bank 1 tRCD - bank 1 DON’T CARE Notes: 1. For this example, BL = 4. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 69 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Timing Diagrams Figure 53: WRITE – Continuous-Page Burst T0 CLK tCKS CKE tCMS COMMAND tCMH NOP WRITE NOP NOP NOP T1 tCL tCH tCKH tCK T2 T3 T4 T5 (( )) (( )) Tn + 1 Tn + 2 Tn + 3 (( )) (( )) (( )) (( )) ACTIVE NOP BURST TERM NOP tCMS tCMH DQM (( )) (( )) tAS ADDR tAH COLUMN m ROW (( )) (( )) tAS A10 tAH ROW (( )) (( )) tAS BA0, BA1 tAH BANK BANK (( )) (( )) tDS DQ tRCD tDH tDS tDH tDS tDH tDS tDH DIN m DIN m + 1 DIN m + 2 DIN m + 3 (( )) (( )) tDS tDH DIN m - 1 All locations within same row Full-page burst does not self-terminate. Can use BURST TERMINATE command to stop.1, 2 Full page completed DON’T CARE Notes: 1. tWR must be satisfied prior to PRECHARGE command. 2. Page left open; no tRP. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 70 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Timing Diagrams Figure 54: WRITE – DQM Operation T0 CLK tCKS CKE tCMS COMMAND tCMH NOP WRITE NOP NOP NOP NOP NOP T1 tCK tCKH tCL T2 tCH T3 T4 T5 T6 T7 ACTIVE tCMS tCMH DQM tAS ADDR tAH COLUMN m ENABLE AUTO PRECHARGE ROW tAS A10 tAH ROW tAS BA0, BA1 tAH DISABLE AUTO PRECHARGE BANK BANK tDS DQ tRCD tDH DIN m tDS tDH tDS tDH DIN m + 2 DIN m + 3 DON’T CARE Notes: 1. For this example, BL = 4. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 71 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Package Dimensions Package Dimensions Figure 55: 54-Ball VFBGA (10mm x 11.5mm) 0.65 ±0.05 Seating plane 0.1 A A Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or SAC105 (98.5% Sn, 1% Ag, 0.5% Cu) Substrate material: plastic laminate 54X Ø0.45 Dimensions apply to solder balls post reflow. Pre-reflow balls are Ø0.42 on Ø0.40 SMD ball pads. 10 ±0.10 5 ±0.05 Ball A1 ID 9 8 7 3 2 1 Mold compound: epoxy novolac Ball A1 ID A B 5.75 ±0.05 3.2 6.4 C D E F G H 11.5 ±0.1 0.8 TYP J 0.8 TYP 6.4 3.2 1.0 MAX Notes: 1. All dimensions are in millimeters. 2. Green packaging composition is available upon request. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 72 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved. 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM Package Dimensions Figure 56: 90-Ball VFBGA (10mm x 13mm) 0.65 ±0.05 Seating plane A 0.1 A 90X Ø0.45 Dimensions apply to solder balls post reflow. The prereflow balls are Ø0.42 on Ø0.40 SMD ball pads. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or SAC105 (98.5% Sn, 1% Ag, 0.5% Cu) Substrate material: plastic laminate 10 ±0.1 5 ±0.05 98 7 32 1 A B C D E F G Mold compound: epoxy novolac Ball A1 ID Ball A1 ID 5.6 6.5 ±0.05 11.2 H J K L M N P R 13 ±0.1 0.8 TYP 3.2 6.4 0.8 TYP 1.0 MAX Notes: 1. All dimensions are in millimeters. 2. Green packaging composition is available upon request. ® 8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900 prodmktg@micron.com www.micron.com Customer Comment Line: 800-932-4992 Micron, the M logo, the Micron logo, and Endur-IC are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners. This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range for production devices. Although considered final, these specifications are subject to change, as further product development and data characterization sometimes occur. PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03 MT48H32M16LF_1.fm - Rev. H 6/07 EN 73 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved.