16GB (x64, DR) 260-Pin DDR4 SODIMM
Features
DDR4 SDRAM SODIMM
MTA16ATF2G64HZ – 16GB
Features
Figure 1: 260-Pin SODIMM (MO-310, R/C E1)
• DDR4 functionality and operations supported as
defined in the component data sheet
• 260-pin, small-outline dual in-line memory module
(SODIMM)
• Fast data transfer rates: PC4-3200, PC4-2666, or
PC4-2400
• 16GB (2 Gig x 64)
• VDD = 1.20V (NOM)
• VPP = 2.5V (NOM)
• VDDSPD = 2.5V (NOM)
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die V REFDQ generation and calibration
• Dual-rank
• On-board I2C serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
• Halogen-free
• Fly-by topology
• Terminated control, command, and address bus
Module height: 30mm (1.181in)
Options
Marking
• Operating temperature
– Commercial (0°C ≤ T OPER ≤ 95°C)
• Package
– 260-pin DIMM (halogen-free)
• Frequency/CAS latency
– 0.62ns @ CL = 22 (DDR4-3200)
– 0.75ns @ CL = 19 (DDR4-2666)
– 0.83ns @ CL = 17 (DDR4-2400)
None
Z
-3G2
-2G6
-2G3
Table 1: Key Timing Parameters
Speed
Grade
Data Rate (MT/s)
CL =
PC4-
24
22
21
-3G2
3200
3200,
2933
3200,
2933
2933
2666 \
2666
2400 \
2400
2133 \
2133
1866 \
1866
1600 \
1600
1333 \
–
-2G9
2933
–
2933
2933
2666 \
2666
2400 \
2400
2133 \
2133
1866 \
1866
1600 \
1600
1333 \ 14.32
14.32
46.32
–
(13.75)1 (13.75)1 (45.75)1
-2G6
2666
–
–
–
2666 \
2666
2400 \
2400
2133 \
2133
1866 \
1866
1600 \
1600
1333 \ 14.25
14.25
46.25
–
(13.75)1 (13.75)1 (45.75)1
CCMTD-1725822587-9882
atf16c2gx64hz.pdf – Rev. I 10/18 EN
20 \
19
18 \
17
16 \
15
14 \
13
12 \
11
10 \
9
tRCD
tRP
tRC
(ns)
(ns)
(ns)
13.75
13.75
45.75
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
16GB (x64, DR) 260-Pin DDR4 SODIMM
Features
Table 1: Key Timing Parameters (Continued)
Speed
Grade
Data Rate (MT/s)
CL =
PC4-
24
22
21
20 \
19
18 \
17
16 \
15
14 \
13
12 \
11
-2G3
2400
–
–
–
–
2400 \
2400
2133 \
2133
1866 \
1866
1600 \
1600
1333 \ 14.16
14.16
46.16
–
(13.75)1 (13.75)1 (45.75)1
-2G1
2133
–
–
–
–
–
2133 \
2133
1866 \
1866
1600 \
1600
1333 \
1333
Note:
10 \
9
tRCD
(ns)
14.06
(13.5)1
tRP
(ns)
14.06
(13.5)1
tRC
(ns)
47.06
(46.5)1
1. Down-bin timing, refer to component data sheet Speed Bin Tables for details.
Table 2: Addressing
Parameter
16GB
Row address
64K A[15:0]
Column address
1K A[9:0]
Device bank group address
4 BG[1:0]
Device bank address per group
4 BA[1:0]
Device configuration
8Gb (1 Gig x 8), 16 banks
Module rank address
2 CS_n[1:0]
Table 3: Part Numbers and Timing Parameters – 16GB Modules
Base device: MT40A1G8,1 8Gb DDR4 SDRAM
Module
Part Number2
Density
Configuration
Module
Bandwidth
Memory Clock/
Data Rate
Clock Cycles
(CL-tRCD-tRP)
MTA16ATF2G64HZ-3G2__
16GB
2 Gig x 64
25.6 GB/s
0.62ns/3200 MT/s
22-22-22
MTA16ATF2G64HZ-2G6__
16GB
2 Gig x 64
21.3 GB/s
0.75ns/2666 MT/s
19-19-19
MTA16ATF2G64HZ-2G3__
16GB
2 Gig x 64
19.2 GB/s
0.83ns/2400 MT/s
17-17-17
Notes:
1. The data sheet for the base device can be found on micron.com.
2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions.
Consult factory for current revision codes. Example: MTA16ATF2G64HZ-3G2J1.
CCMTD-1725822587-9882
atf16c2gx64hz.pdf – Rev. I 10/18 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
16GB (x64, DR) 260-Pin DDR4 SODIMM
Features
Important Notes and Warnings
Micron Technology, Inc. ("Micron") reserves the right to make changes to information published in this document,
including without limitation specifications and product descriptions. This document supersedes and replaces all
information supplied prior to the publication hereof. You may not rely on any information set forth in this document if you obtain the product described herein from any unauthorized distributor or other source not authorized
by Micron.
Automotive Applications. Products are not designed or intended for use in automotive applications unless specifically designated by Micron as automotive-grade by their respective data sheets. Distributor and customer/distributor shall assume the sole risk and liability for and shall indemnify and hold Micron harmless against all claims,
costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of
product liability, personal injury, death, or property damage resulting directly or indirectly from any use of nonautomotive-grade products in automotive applications. Customer/distributor shall ensure that the terms and conditions of sale between customer/distributor and any customer of distributor/customer (1) state that Micron
products are not designed or intended for use in automotive applications unless specifically designated by Micron
as automotive-grade by their respective data sheets and (2) require such customer of distributor/customer to indemnify and hold Micron harmless against all claims, costs, damages, and expenses and reasonable attorneys'
fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damage
resulting from any use of non-automotive-grade products in automotive applications.
Critical Applications. Products are not authorized for use in applications in which failure of the Micron component could result, directly or indirectly in death, personal injury, or severe property or environmental damage
("Critical Applications"). Customer must protect against death, personal injury, and severe property and environmental damage by incorporating safety design measures into customer's applications to ensure that failure of the
Micron component will not result in such harms. Should customer or distributor purchase, use, or sell any Micron
component for any critical application, customer and distributor shall indemnify and hold harmless Micron and
its subsidiaries, subcontractors, and affiliates and the directors, officers, and employees of each against all claims,
costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of
product liability, personal injury, or death arising in any way out of such critical application, whether or not Micron or its subsidiaries, subcontractors, or affiliates were negligent in the design, manufacture, or warning of the
Micron product.
Customer Responsibility. Customers are responsible for the design, manufacture, and operation of their systems,
applications, and products using Micron products. ALL SEMICONDUCTOR PRODUCTS HAVE INHERENT FAILURE RATES AND LIMITED USEFUL LIVES. IT IS THE CUSTOMER'S SOLE RESPONSIBILITY TO DETERMINE
WHETHER THE MICRON PRODUCT IS SUITABLE AND FIT FOR THE CUSTOMER'S SYSTEM, APPLICATION, OR
PRODUCT. Customers must ensure that adequate design, manufacturing, and operating safeguards are included
in customer's applications and products to eliminate the risk that personal injury, death, or severe property or environmental damages will result from failure of any semiconductor component.
Limited Warranty. In no event shall Micron be liable for any indirect, incidental, punitive, special or consequential
damages (including without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such damages are based on tort, warranty,
breach of contract or other legal theory, unless explicitly stated in a written agreement executed by Micron's duly
authorized representative.
CCMTD-1725822587-9882
atf16c2gx64hz.pdf – Rev. I 10/18 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
16GB (x64, DR) 260-Pin DDR4 SODIMM
Pin Assignments
Pin Assignments
The pin assignment table below is a comprehensive list of all possible pin assignments
for DDR4 SODIMM modules. See Functional Block Diagram for pins specific to this
module.
Table 4: Pin Assignments
260-Pin DDR4 SODIMM Front
260-Pin DDR4 SODIMM Back
Pin
Symbol
Pin
Symbol
Pin
Symbol
Pin
Symbol
Pin
Symbol
Pin
Symbol
1
VSS
67
DQ29
133
A1
199
DM5_n/
DBI5_n
2
VSS
68
VSS
Symbol
Pin
Symbol
134 EVENT_n,
NF
3
DQ5
69
VSS
135
VDD
201
VSS
4
DQ4
70
Pin
200
DQS5_t
DQ24
136
VDD
202
VSS
138
DQ47
5
VSS
71
DQ25
137
CK0_t
203
DQ46
6
VSS
72
VSS
CK1_t/NF
204
7
DQ1
73
VSS
139
CK0_c
205
VSS
8
DQ0
74
DQS3_c
140 CK1_c/NF
206
VSS
9
VSS
75
DM3_n/
DBI3_n
141
VDD
207
DQ42
10
VSS
76
DQS3_t
142
VDD
208
DQ43
11
DQS0_c
77
VSS
143
PARITY
209
VSS
12
DM0_n/
DBI0_n
78
VSS
144
A0
210
VSS
13
DQS0_t
79
DQ30
145
BA1
211
DQ52
14
VSS
80
DQ31
146
A10/AP
212
DQ53
15
VSS
81
VSS
147
VDD
213
VSS
16
DQ6
82
VSS
148
VDD
214
VSS
17
DQ7
83
DQ26
149
CS0_n
215
DQ49
18
VSS
84
DQ27
150
BA0
216
DQ48
19
VSS
85
VSS
151
WE_n/
A14
217
VSS
20
DQ2
86
VSS
152
RAS_n/
A16
218
VSS
21
DQ3
87
CB5/NC
153
VDD
219
DQS6_c
22
VSS
88
CB4/NC
154
VDD
220
DM6_n/
DBI6_n
23
VSS
89
VSS
155
ODT0
221
DQS6_t
24
DQ12
90
VSS
156
CAS_n/
A15
222
VSS
25
DQ13
91
CB1/NC
157
CS1_n/
NC
223
VSS
26
VSS
92
CB0/NC
158
A13
224
DQ54
DQ55
28
DQ8
94
VSS
160
VDD
226
VSS
30
VSS
96
228
DQ50
DQ51
32
DQS1_c
98
VSS
164
VREFCA
230
VSS
VSS
34
DQS1_t
100
CB6/NC
166
SA2
232
DQ60
27
VSS
93
VSS
159
VDD
225
29
DQ9
95
DQS8_c/
NC
161
ODT1/
NC
227
31
VSS
97
DQS8_t/
NC
163
VDD
229
33
DM1_n/
DBI_n
99
VSS
165 C1, CS3_n, 231
NC
VSS
DM8_n/ 162
C0/
DBI_n/NC
CS2_n/NC
35
VSS
101
CB2/NC
167
VSS
233
DQ61
36
VSS
102
VSS
168
VSS
234
VSS
37
DQ15
103
VSS
169
DQ37
235
VSS
38
DQ14
104
CB7/NC
170
DQ36
236
DQ57
39
VSS
105
CB3/NC
171
VSS
237
DQ56
40
VSS
106
VSS
172
VSS
238
VSS
41
DQ10
107
VSS
173
DQ33
239
VSS
42
DQ11
108
RESET_n
174
DQ32
240
DQS7_c
43
VSS
109
CKE0
175
VSS
241
DM7_n/
DBI7_n
44
VSS
110
CKE1/
NC
176
VSS
242
DQS7_t
45
DQ21
111
VDD
177
DQS4_c
243
VSS
46
DQ20
112
VDD
178
DM4_n/
DBI4_n
244
VSS
47
VSS
113
BG1
179
DQS4_t
245
DQ62
48
VSS
114
ACT_n
180
VSS
246
DQ63
49
DQ17
115
BG0
181
VSS
247
VSS
50
DQ16
116
ALERT_n
182
DQ39
248
VSS
51
VSS
117
VDD
183
DQ38
249
DQ58
52
VSS
118
VDD
184
VSS
250
DQ59
53
DQS2_c
119
A12
185
VSS
251
VSS
54
DM2_n/
DBI2_n
120
A11
186
DQ35
252
VSS
55
DQS2_t
121
A9
187
DQ34
253
SCL
56
VSS
122
A7
188
VSS
254
SDA
57
VSS
123
VDD
189
VSS
255
VDDSPD
58
DQ22
124
VDD
190
DQ45
256
SA0
CCMTD-1725822587-9882
atf16c2gx64hz.pdf – Rev. I 10/18 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
16GB (x64, DR) 260-Pin DDR4 SODIMM
Pin Assignments
Table 4: Pin Assignments (Continued)
260-Pin DDR4 SODIMM Front
260-Pin DDR4 SODIMM Back
Pin
Symbol
Pin
Symbol
Pin
Symbol
Pin
Symbol
Pin
Symbol
Pin
Symbol
Pin
Symbol
Pin
59
DQ23
125
A8
191
DQ44
257
VPP
60
VSS
126
A5
192
VSS
258
VTT
61
VSS
127
A6
193
VSS
259
VPP
62
DQ18
128
A4
194
DQ41
260
SA1
63
DQ19
129
VDD
195
DQ40
–
–
64
VSS
130
VDD
196
VSS
–
–
65
VSS
131
A3
197
VSS
–
–
66
DQ28
132
A2
198
DQS5_c
–
–
CCMTD-1725822587-9882
atf16c2gx64hz.pdf – Rev. I 10/18 EN
5
Symbol
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
16GB (x64, DR) 260-Pin DDR4 SODIMM
Pin Descriptions
Pin Descriptions
The pin description table below is a comprehensive list of all possible pins for DDR4
modules. All pins listed may not be supported on this module. See Functional Block Diagram for pins specific to this module.
Table 5: Pin Descriptions
Symbol
Type
Description
Ax
Input
Address inputs: Provide the row address for ACTIVATE commands and the column address for
READ/WRITE commands in order to select one location out of the memory array in the respective bank (A10/AP, A12/BC_n, WE_n/A14, CAS_n/A15, and RAS_n/A16 have additional functions;
see individual entries in this table). The address inputs also provide the op-code during the
MODE REGISTER SET command. A17 is only defined for x4 SDRAM.
A10/AP
Input
Auto precharge: A10 is sampled during READ and WRITE commands to determine whether an
auto precharge should be performed on the accessed bank after a READ or WRITE operation
(HIGH = auto precharge; LOW = no auto precharge). A10 is sampled during a PRECHARGE command to determine whether the precharge applies to one bank (A10 LOW) or all banks (A10
HIGH). If only one bank is to be precharged, the bank is selected by the bank group and bank
addresses.
A12/BC_n
Input
Burst chop: A12/BC_n is sampled during READ and WRITE commands to determine if burst
chop (on-the-fly) will be performed (HIGH = no burst chop; LOW = burst chopped). See Command Truth Table in the DDR4 component data sheet.
ACT_n
Input
Command input: ACT_n defines the ACTIVATE command being entered along with CS_n. The
input into RAS_n/A16, CAS_n/A15, and WE_n/A14 are considered as row address A16, A15, and
A14. See Command Truth Table.
BAx
Input
Bank address inputs: Define the bank (with a bank group) to which an ACTIVATE, READ,
WRITE, or PRECHARGE command is being applied. Also determine which mode register is to be
accessed during a MODE REGISTER SET command.
BGx
Input
Bank group address inputs: Define the bank group to which a REFRESH, ACTIVATE, READ,
WRITE, or PRECHARGE command is being applied. Also determine which mode register is to be
accessed during a MODE REGISTER SET command. BG[1:0] are used in the x4 and x8 configurations. x16-based SDRAM only has BG0.
C0, C1, C2
(RDIMM/LRDIMM only)
Input
Chip ID: These inputs are used only when devices are stacked; that is, 2H, 4H, and 8H stacks for
x4 and x8 configurations using through-silicon vias (TSVs). These pins are not used in the x16
configuration. Some DDR4 modules support a traditional DDP package, which uses CS1_n,
CKE1, and ODT1 to control the second die. All other stack configurations, such as a 4H or 8H,
are assumed to be single-load (master/slave) type configurations where C0, C1, and C2 are used
as chip ID selects in conjunction with a single CS_n, CKE, and ODT. Chip ID is considered part of
the command code.
CKx_t
CKx_c
Input
Clock: Differential clock inputs. All address, command, and control input signals are sampled
on the crossing of the positive edge of CK_t and the negative edge of CK_c.
CKEx
Input
Clock enable: CKE HIGH activates and CKE LOW deactivates the internal clock signals, device
input buffers, and output drivers. Taking CKE LOW provides PRECHARGE POWER-DOWN and
SELF REFRESH operations (all banks idle), or active power-down (row active in any bank). CKE is
asynchronous for self refresh exit. After VREFCA has become stable during the power-on and initialization sequence, it must be maintained during all operations (including SELF REFRESH). CKE
must be maintained HIGH throughout read and write accesses. Input buffers (excluding CK_t,
CK_c, ODT, RESET_n, and CKE) are disabled during power-down. Input buffers (excluding CKE
and RESET_n) are disabled during self refresh.
CSx_n
Input
Chip select: All commands are masked when CS_n is registered HIGH. CS_n provides external
rank selection on systems with multiple ranks. CS_n is considered part of the command code
(CS2_n and CS3_n are not used on UDIMMs).
CCMTD-1725822587-9882
atf16c2gx64hz.pdf – Rev. I 10/18 EN
6
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
16GB (x64, DR) 260-Pin DDR4 SODIMM
Pin Descriptions
Table 5: Pin Descriptions (Continued)
Symbol
Type
Description
ODTx
Input
On-die termination: ODT (registered HIGH) enables termination resistance internal to the
DDR4 SDRAM. When enabled, ODT (RTT) is applied only to each DQ, DQS_t, DQS_c, DM_n/
DBI_n/TDQS_t, and TDQS_c signal for x4 and x8 configurations (when the TDQS function is enabled via the mode register). For the x16 configuration, RTT is applied to each DQ, DQSU_t,
DQSU_c, DQSL_t, DQSL_c, UDM_n, and LDM_n signal. The ODT pin will be ignored if the mode
registers are programmed to disable RTT.
PARITY
Input
Parity for command and address: This function can be enabled or disabled via the mode
register. When enabled in MR5, the DRAM calculates parity with ACT_n, RAS_n/A16, CAS_n/A15,
WE_n/A14, BG[1:0], BA[1:0], A[16:0]. Input parity should be maintained at the rising edge of the
clock and at the same time as command and address with CS_n LOW.
RAS_n/A16
CAS_n/A15
WE_n/A14
Input
Command inputs: RAS_n/A16, CAS_n/A15, and WE_n/A14 (along with CS_n) define the command and/or address being entered and have multiple functions. For example, for activation
with ACT_n LOW, these are addresses like A16, A15, and A14, but for a non-activation command with ACT_n HIGH, these are command pins for READ, WRITE, and other commands defined in Command Truth Table.
RESET_n
CMOS Input
SAx
Input
Serial address inputs: Used to configure the temperature sensor/SPD EEPROM address range
on the I2C bus.
SCL
Input
Serial clock for temperature sensor/SPD EEPROM: Used to synchronize communication to
and from the temperature sensor/SPD EEPROM on the I2C bus.
DQx, CBx
I/O
Data input/output and check bit input/output: Bidirectional data bus. DQ represents
DQ[3:0], DQ[7:0], and DQ[15:0] for the x4, x8, and x16 configurations, respectively. If cyclic redundancy checksum (CRC) is enabled via the mode register, the CRC code is added at the end of
the data burst. Any one or all of DQ0, DQ1, DQ2, or DQ3 may be used for monitoring of internal VREF level during test via mode register setting MR[4] A[4] = HIGH; training times change
when enabled.
DM_n/DBI_n/
TDQS_t (DMU_n,
DBIU_n), (DML_n/
DBIl_n)
I/O
Input data mask and data bus inversion: DM_n is an input mask signal for write data. Input
data is masked when DM_n is sampled LOW coincident with that input data during a write access. DM_n is sampled on both edges of DQS. DM is multiplexed with the DBI function by the
mode register A10, A11, and A12 settings in MR5. For a x8 device, the function of DM or TDQS
is enabled by the mode register A11 setting in MR1. DBI_n is an input/output identifying
whether to store/output the true or inverted data. If DBI_n is LOW, the data will be stored/
output after inversion inside the DDR4 device and not inverted if DBI_n is HIGH. TDQS is only
supported in x8 SDRAM configurations (TDQS is not valid for UDIMMs).
SDA
I/O
Serial Data: Bidirectional signal used to transfer data in or out of the EEPROM or EEPROM/TS
combo device.
DQS_t
DQS_c
DQSU_t
DQSU_c
DQSL_t
DQSL_c
I/O
Data strobe: Output with read data, input with write data. Edge-aligned with read data, centered-aligned with write data. For x16 configurations, DQSL corresponds to the data on
DQ[7:0], and DQSU corresponds to the data on DQ[15:8]. For the x4 and x8 configurations, DQS
corresponds to the data on DQ[3:0] and DQ[7:0], respectively. DDR4 SDRAM supports a differential data strobe only and does not support a single-ended data strobe.
ALERT_n
Output
Alert output: Possesses functions such as CRC error flag and command and address parity error
flag as output signal. If a CRC error occurs, ALERT_n goes LOW for the period time interval and
returns HIGH. If an error occurs during a command address parity check, ALERT_n goes LOW until the on-going DRAM internal recovery transaction is complete. During connectivity test mode,
this pin functions as an input. Use of this signal is system-dependent. If not connected as signal,
ALERT_n pin must be connected to VDD on DIMMs.
EVENT_n
Output
Temperature event: The EVENT_n pin is asserted by the temperature sensor when critical temperature thresholds have been exceeded. This pin has no function (NF) on modules without
temperature sensors.
CCMTD-1725822587-9882
atf16c2gx64hz.pdf – Rev. I 10/18 EN
Active LOW asynchronous reset: Reset is active when RESET_n is LOW and inactive when RESET_n is HIGH. RESET_n must be HIGH during normal operation.
7
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
16GB (x64, DR) 260-Pin DDR4 SODIMM
Pin Descriptions
Table 5: Pin Descriptions (Continued)
Symbol
Type
Description
TDQS_t
TDQS_c
Output
Termination data strobe: When enabled via the mode register, the DRAM device enables the
same RTT termination resistance on TDQS_t and TDQS_c that is applied to DQS_t and DQS_c.
When the TDQS function is disabled via the mode register, the DM/TDQS_t pin provides the data mask (DM) function, and the TDQS_c pin is not used. The TDQS function must be disabled in
the mode register for both the x4 and x16 configurations. The DM function is supported only in
x8 and x16 configurations. DM, DBI, and TDQS are a shared pin and are enabled/disabled by
mode register settings. For more information about TDQS, see the DDR4 DRAM component data sheet (TDQS_t and TDQS_c are not valid for UDIMMs).
VDD
Supply
Module power supply: 1.2V (TYP).
VPP
Supply
DRAM activating power supply: 2.5V –0.125V / +0.250V.
VREFCA
Supply
Reference voltage for control, command, and address pins.
VSS
Supply
Ground.
(x8 DRAM-based
RDIMM only)
VTT
Supply
Power supply for termination of address, command, and control VDD/2.
VDDSPD
Supply
Power supply used to power the I2C bus for SPD.
RFU
–
Reserved for future use.
NC
–
No connect: No internal electrical connection is present.
NF
–
No function: May have internal connection present, but has no function.
CCMTD-1725822587-9882
atf16c2gx64hz.pdf – Rev. I 10/18 EN
8
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
16GB (x64, DR) 260-Pin DDR4 SODIMM
DQ Map
DQ Map
Table 6: Component-to-Module DQ Map, R/C-E1
Component
Reference
Number
Component
DQ
U1
0
U3
U5
U8
CCMTD-1725822587-9882
atf16c2gx64hz.pdf – Rev. I 10/18 EN
Module DQ
Module Pin
Number
Component
Reference
Number
Component
DQ
Module DQ
Module Pin
Number
11
42
U2
0
27
84
1
8
28
1
25
71
2
10
41
2
26
83
3
9
29
3
24
70
4
14
38
4
31
80
5
12
24
5
29
67
6
15
37
6
30
79
7
13
25
7
28
66
0
34
187
0
51
229
1
33
173
1
49
215
2
35
186
2
50
228
3
32
174
3
48
216
4
39
182
4
55
225
5
36
170
5
53
212
6
38
183
6
54
224
7
37
169
7
52
211
0
2
20
0
22
58
1
0
8
1
20
46
2
3
21
2
23
59
3
1
7
3
21
45
4
6
16
4
18
62
5
4
4
5
16
50
6
7
17
6
19
63
7
5
3
7
17
49
0
42
207
0
59
250
1
40
195
1
57
236
2
43
208
2
58
249
3
41
194
3
56
237
4
46
203
4
63
246
5
45
190
5
61
233
6
47
204
6
62
245
7
44
191
7
60
232
U4
U6
U9
9
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
16GB (x64, DR) 260-Pin DDR4 SODIMM
DQ Map
Table 6: Component-to-Module DQ Map, R/C-E1 (Continued)
Component
Reference
Number
Component
DQ
U10
U12
U14
U16
CCMTD-1725822587-9882
atf16c2gx64hz.pdf – Rev. I 10/18 EN
Module DQ
Module Pin
Number
Component
Reference
Number
Component
DQ
Module DQ
Module Pin
Number
0
49
215
U11
0
33
173
1
51
229
1
34
187
2
48
216
2
32
174
3
50
228
3
35
186
4
53
212
4
36
170
5
55
225
5
39
182
6
52
211
6
37
169
7
54
224
7
38
183
0
25
71
0
8
28
1
27
84
1
11
42
2
24
70
2
9
29
3
26
83
3
10
41
4
29
67
4
12
24
5
31
80
5
14
38
6
28
66
6
13
25
7
30
79
7
15
37
0
57
236
0
40
195
1
59
250
1
42
207
2
56
237
2
41
194
3
58
249
3
43
208
4
61
233
4
45
190
5
63
246
5
46
203
6
60
232
6
44
191
7
62
245
7
47
204
0
20
46
0
0
8
1
22
58
1
2
20
2
21
45
2
1
7
3
23
59
3
3
21
4
16
50
4
4
4
5
18
62
5
6
16
6
17
49
6
5
3
7
19
63
7
7
17
U13
U15
U17
10
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
16GB (x64, DR) 260-Pin DDR4 SODIMM
Functional Block Diagram
Functional Block Diagram
Figure 2: Functional Block Diagram, R/C-E1
CS1_n
CS0_n
DQS4_t
DQS4_c
DQS0_t
DQS0_c
DBI4_n/DM4_n
DBI0_n/DM0_n
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
Vss
DM_n/ CS_n DQS_t DQS_c
DBI_n
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
ZQ
U5
DM_n/ CS_n DQS_t DQS_c
DBI_n
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
U17
U3
DM_n/ CS_n DQS_t DQS_c
DBI_n
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
U11
ZQ
DQS5_t
DQS5_c
DBI5_n/DM5_n
Vss
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
Vss
DM_n/ CS_n DQS_t DQS_c
DBI_n
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
ZQ
U1
DM_n/ CS_n DQS_t DQS_c
DBI_n
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
Vss
DM_n/ CS_n DQS_t DQS_c
DBI_n
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
ZQ
U6
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
Vss
DM_n/ CS_n DQS_t DQS_c
DBI_n
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
ZQ
U2
BA[1:0]: DDR4 SDRAMs
BG[1:0]: DDR4 SDRAMs
ACT_n: DDR4 SDRAMS
A[13:0]: DDR4 SDRAMs
RAS_n/A16: DDR4 SDRAMs
CAS_n/A15: DDR4 SDRAMs
WE_n/A14: DDR4 SDRAMs
CKE0: Rank 0
CKE1: Rank 1
ODT0: Rank 0
ODT1: Rank 1
RESET_n: DDR4 SDAMS
PAR: DDR4 SDRAMs
ALERT_DRAM: DDR4 SDRAMs
DM_n/ CS_n DQS_t DQS_c
DBI_n
U4
ZQ
DM_n/ CS_n DQS_t DQS_c
DBI_n
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
ZQ
U12
Vss
U9
U7
SCL
U14
Vss
Rank 0: U1–U6, U8, U9
Rank 1: U10–U17
SPD EEPROM
EVT A0
Rank 0
DM_n/ CS_n DQS_t DQS_c
DBI_n
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
ZQ
Vss
CK1
CK1#
U10
Vss
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63
ZQ
CK0
CK0#
DM_n/ CS_n DQS_t DQS_c
DBI_n
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQS7_t
DQS7_c
DBI7_n/DM7_n
DM_n/ CS_n DQS_t DQS_c
DBI_n
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
ZQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
ZQ
Vss
ZQ
Vss
U15
Vss
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
U16
DQS3_t
DQS3_c
DBI3_n/DM3_n
U8
DM_n/ CS_n DQS_t DQS_c
DBI_n
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQS6_t
DQS6_c
DBI6_n/DM6_n
DM_n/ CS_n DQS_t DQS_c
DBI_n
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DM_n/ CS_n DQS_t DQS_c
DBI_n
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
ZQ
Vss
ZQ
Vss
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
Vss
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
U13
DQS2_t
DQS2_c
DBI2_n/DM2_n
BA[1:0]
BG[1:0]
ACT_n
A[13:0]
RAS_n/A16
CAS_n/A15
WE_n/A14
CKE0
CKE1
ODT0
ODT1
RESET
PAR_IN
ALERT_CONN
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
ZQ
Vss
ZQ
DQS1_t
DQS1_c
DBI1_n/DM1_n
DM_n/ CS_n DQS_t DQS_c
DBI_n
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
Vss
SDA
A1 A2
SA0 SA1
Vss
Rank 1
Vddspd
SPD EEPROM
Vdd
DDR4 SDRAM
Vtt
Control, command, and
address termination
Vref CA
DDR4 SDRAM
Vpp
DDR4 SDRAM
Vss
DDR4 SDRAM
Clock, control, command, and address line terminations:
DDR4
SDRAM
CS_n[1:0], BA[1:0], BG[1:0],
ACT_n, A[13:0], RAS_n/A16,
CAS_n/A15, WE_n/A14,
PAR, CKE[1:0], ODT[1:0]
VTT
DDR4
SDRAM
VDD
CK
CK#
Note:
CCMTD-1725822587-9882
atf16c2gx64hz.pdf – Rev. I 10/18 EN
1. The ZQ ball on each DDR4 component is connected to an external 240Ω ±1% resistor
that is tied to ground. It is used for the calibration of the component’s ODT and output
driver.
11
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
16GB (x64, DR) 260-Pin DDR4 SODIMM
General Description
General Description
High-speed DDR4 SDRAM modules use DDR4 SDRAM devices with two or four internal
memory bank groups. DDR4 SDRAM modules utilizing 4- and 8-bit-wide DDR4 SDRAM
devices have four internal bank groups consisting of four memory banks each, providing a total of 16 banks. 16-bit-wide DDR4 SDRAM devices have two internal bank
groups consisting of four memory banks each, providing a total of eight banks. DDR4
SDRAM modules benefit from DDR4 SDRAM's use of an 8n-prefetch architecture with
an interface designed to transfer two data words per clock cycle at the I/O pins. A single
READ or WRITE operation for the DDR4 SDRAM effectively consists of a single 8n-bitwide, four-clock data transfer at the internal DRAM core and eight corresponding n-bitwide, one-half-clock-cycle data transfers at the I/O pins.
DDR4 modules use two sets of differential signals: DQS_t and DQS_c to capture data
and CK_t and CK_c to capture commands, addresses, and control signals. Differential
clocks and data strobes ensure exceptional noise immunity for these signals and provide precise crossing points to capture input signals.
Fly-By Topology
DDR4 modules use faster clock speeds than earlier DDR technologies, making signal
quality more important than ever. For improved signal quality, the clock, control, command, and address buses have been routed in a fly-by topology, where each clock, control, command, and address pin on each DRAM is connected to a single trace and terminated (rather than a tree structure, where the termination is off the module near the
connector). Inherent to fly-by topology, the timing skew between the clock and DQS signals can be easily accounted for by using the write-leveling feature of DDR4.
Module Manufacturing Location
Micron Technology manufactures modules at sites world-wide. Customers may receive
modules from any of the following manufacturing locations:
Table 7: DRAM Module Manufacturing Locations
Manufacturing Site Location
Country of Origin Specified on Label
Boise, USA
USA
Aguadilla, Puerto Rico
Puerto Rico
Xian, China
China
Singapore
Singapore
CCMTD-1725822587-9882
atf16c2gx64hz.pdf – Rev. I 10/18 EN
12
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
16GB (x64, DR) 260-Pin DDR4 SODIMM
Address Mapping to DRAM
Address Mapping to DRAM
Address Mirroring
To achieve optimum routing of the address bus on DDR4 multi rank modules, the address bus will be wired as shown in the table below, or mirrored. For quad rank modules, ranks 1 and 3 are mirrored and ranks 0 and 2 are non-mirrored. Highlighted address pins have no secondary functions allowing for normal operation when crosswired. Data is still read from the same address it was written. However, Load Mode operations require a specific address. This requires the controller to accommodate for a
rank that is "mirrored." Systems may reference DDR4 SPD to determine if the module
has mirroring implemented or not. See the JEDEC DDR4 SPD specification for more details.
Table 8: Address Mirroring
Edge Connector Pin
DRAM Pin, Non-mirrored
DRAM Pin, Mirrored
A0
A0
A0
A1
A1
A1
A2
A2
A2
A3
A3
A4
A4
A4
A3
A5
A5
A6
A6
A6
A5
A7
A7
A8
A8
A8
A7
CCMTD-1725822587-9882
atf16c2gx64hz.pdf – Rev. I 10/18 EN
A9
A9
A9
A10
A10
A10
A11
A11
A13
A13
A13
A11
A12
A12
A12
A14
A14
A14
A15
A15
A15
A16
A16
A16
A17
A17
A17
BA0
BA0
BA1
BA1
BA1
BA0
BG0
BG0
BG1
BG1
BG1
BG0
13
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
16GB (x64, DR) 260-Pin DDR4 SODIMM
SPD EEPROM Operation
SPD EEPROM Operation
DDR4 SDRAM modules incorporate serial presence detect (SPD). The SPD data is stored in a 512-byte JEDEC JC-42.4-compliant EEPROM that is segregated into four 128byte, write-protectable blocks. The SPD content is aligned with these blocks as shown in
the table below.
Block
Range
Description
0
0–127
1
128–255
080h–0FFh
Module-specific parameters
2
256–319
100h–13Fh
Reserved; all bytes coded as 00h
320–383
140h–17Fh
Manufacturing information
384–511
180h–1FFh
End-user programmable
3
000h–07Fh
Configuration and DRAM parameters
The first 384 bytes are programmed by Micron to comply with JEDEC standard JC-45,
"Appendix X: Serial Presence Detect (SPD) for DDR4 SDRAM Modules." The remaining
128 bytes of storage are available for use by the customer.
The EEPROM resides on a two-wire I2C serial interface and is not integrated with the
memory bus in any way. It operates as a slave device in the I2C bus protocol, with all
operations synchronized by the serial clock. Transfer rates of up to 1 MHz are achievable at 2.5V (NOM).
Micron implements reversible software write protection on DDR4 SDRAM-based modules. This prevents the lower 384 bytes (bytes 0–383) from being inadvertently programmed or corrupted. The upper 128 bytes remain available for customer use and unprotected.
CCMTD-1725822587-9882
atf16c2gx64hz.pdf – Rev. I 10/18 EN
14
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
16GB (x64, DR) 260-Pin DDR4 SODIMM
Electrical Specifications
Electrical Specifications
Stresses greater than those listed may cause permanent damage to the module. This is a
stress rating only, and functional operation of the module at these or any other conditions outside those indicated in each device's data sheet is not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability.
Table 9: Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Units
Notes
VDD
VDD supply voltage relative to VSS
–0.4
1.5
V
1
VDDQ
VDDQ supply voltage relative to VSS
–0.4
1.5
V
1
Voltage on VPP pin relative to VSS
–0.4
3.0
V
2
VIN, VOUT Voltage on any pin relative to VSS
–0.4
1.5
V
VPP
Table 10: Operating Conditions
Symbol
Parameter
Min
Nom
Max
Units
Notes
VDD
VDD supply voltage
1.14
1.2
1.26
V
1
VPP
DRAM activating power supply
2.375
2.5
2.75
V
2
0.49 × VDD
0.5 × VDD
0.51 × VDD
V
3
–500
–
500
mA
0.49 × VDD 20mV
0.5 × VDD
0.51 × VDD +
20mV
V
4
VREFCA(DC) Input reference voltage command/
address bus
IVTT
Termination reference current from VTT
VTT
Termination reference voltage (DC) –
command/address bus
IIN
Input leakage current; any input excluding ZQ;
0V < VIN < 1.1V
–2.0
–
2.0
µA
5
IZQ
Input leakage current; ZQ
5, 6
–50.0
–
10.0
µA
IOZpd
Output leakage current; VOUT = VDD; DQ is disabled
–
–
10.0
µA
IOZpu
Output leakage current; VOUT = VSS; DQ is disabled;
ODT is disabled with ODT input HIGH
–50.0
–
–
µA
VREFCA leakage; VREFCA = VDD/2 (after DRAM is initialized)
–2.0
–
2.0
µA
IVREFCA
Notes:
CCMTD-1725822587-9882
atf16c2gx64hz.pdf – Rev. I 10/18 EN
5
1. VDDQ tracks with VDD; VDDQ and VDD are tied together.
2. VPP must be greater than or equal to VDD at all times.
3. VREFCA must not be greater than 0.6 x VDD. When VDD is less than 500mV, VREF may be
less than or equal to 300mV.
4. VTT termination voltages in excess of the specification limit adversely affect the voltage
margins of command and address signals and reduce timing margins.
5. Multiply by the number of DRAM die on the module.
6. Tied to ground. Not connected to edge connector.
15
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
16GB (x64, DR) 260-Pin DDR4 SODIMM
Electrical Specifications
Table 11: Thermal Characteristics
Symbol
Parameter/Condition
Value
Units
Notes
TC
Commercial operating case temperature
0 to 85
°C
1, 2, 3
>85 to 95
°C
1, 2, 3, 4
0 to 85
°C
5, 7
TC
TOPER
Normal operating temperature range
TOPER
Extended temperature operating range (optional)
>85 to 95
°C
5, 7
TSTG
Non-operating storage temperature
–55 to 100
°C
6
RHSTG
Non-operating Storage Relative Humidity (non-condensing)
5 to 95
%
NA
Change Rate of Storage Temperature
20
°C/hour
Notes:
CCMTD-1725822587-9882
atf16c2gx64hz.pdf – Rev. I 10/18 EN
1. Maximum operating case temperature; TC is measured in the center of the package.
2. A thermal solution must be designed to ensure the DRAM device does not exceed the
maximum TC during operation.
3. Device functionality is not guaranteed if the DRAM device exceeds the maximum TC during operation.
4. If TC exceeds 85°C, the DRAM must be refreshed externally at 2X refresh, which is a 3.9µs
interval refresh rate.
5. The refresh rate must double when 85°C < TOPER ≤ 95°C.
6. Storage temperature is defined as the temperature of the top/center of the DRAM and
does not reflect the storage temperatures of shipping trays.
7. For additional information, refer to technical note TN-00-08: "Thermal Applications"
available at micron.com.
16
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
16GB (x64, DR) 260-Pin DDR4 SODIMM
DRAM Operating Conditions
DRAM Operating Conditions
Recommended AC operating conditions are given in the DDR4 component data sheets.
Component specifications are available at micron.com. Module speed grades correlate
with component speed grades, as shown below.
Table 12: Module and Component Speed Grades
DDR4 components may exceed the listed module speed grades; module may not be available in all listed speed grades
Module Speed Grade
Component Speed Grade
-3G2
-062E
-2G9
-068
-2G6
-075
-2G3
-083
-2G1
-093E
Design Considerations
Simulations
Micron memory modules are designed to optimize signal integrity through carefully designed terminations, controlled board impedances, routing topologies, trace length
matching, and decoupling. However, good signal integrity starts at the system level. Micron encourages designers to simulate the signal characteristics of the system's memory bus to ensure adequate signal integrity of the entire memory system.
Power
Operating voltages are specified at the edge connector of the module, not at the DRAM.
Designers must account for any system voltage drops at anticipated power levels to ensure the required supply voltage is maintained.
IDD, I PP and IDDQ Specifications
IDD and IPP values are only for the DDR4 SDRAM, and calculated from values in the supporting component data sheet. IPP and IDDQ currents are not included in IDD currents.
IDD and IDDQ currents are not included in IPP currents. Micron does not specify IDDQ
currents. In DRAM module application, IDDQ cannot be measured separately because
VDD and V DDQ use a merged-power layer in the module PCB.
CCMTD-1725822587-9882
atf16c2gx64hz.pdf – Rev. I 10/18 EN
17
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
16GB (x64, DR) 260-Pin DDR4 SODIMM
IDD Specifications
IDD Specifications
Table 13: DDR4 IDD Specifications and Conditions – 16GB (Die Revision D)
Values are for the MT40A1G8 DDR4 SDRAM only and are computed from values specified in the 8Gb (1 Gig x 8) component data sheet
Parameter
Symbol
3200
2666
2400
Units
IDD01
One bank ACTIVATE-PRECHARGE current
One bank ACTIVATE-PRECHARGE, wordline boost, IPP current
One bank ACTIVATE-READ-PRECHARGE current
IPP0
656
608
584
mA
1
48
48
48
mA
1
752
704
680
mA
IDD1
Precharge standby current
IDD2N
2
592
560
544
mA
Precharge standby ODT current
IDD2NT1
680
600
600
mA
Precharge power-down current
IDD2P
2
400
400
400
mA
Precharge quite standby current
IDD2Q2
480
480
480
mA
2
896
816
768
mA
48
48
48
mA
2
688
624
592
mA
1
1544
1368
1280
mA
1
Active standby current
IDD3N
Active standby IPP current
IPP3N2
Active power-down current
IDD3P
Burst read current
IDD4R
Burst write current
IDD4W
1480
1336
1256
mA
Burst refresh current (1x REF)
IDD5R1
728
688
664
mA
1
64
64
64
mA
2
496
496
496
mA
Self refresh current: Extended temperature range (0°C to 95°C)
IDD6E
2
576
576
576
mA
Self refresh current: Reduced temperature range (0°C to 45°C)
IDD6R2
336
336
336
mA
2
137.6
137.6
137.6
mA
2
336
336
336
mA
2
Burst refresh IPP current (1x REF)
IPP5R
Self refresh current: Normal temperature range (0°C to 85°C)
Auto self refresh current (25°C)
IDD6N
IDD6A
Auto self refresh current (45°C)
IDD6A
Auto self refresh current (75°C)
IDD6A
496
496
496
mA
Auto self refresh IPP current
IIPP6X2
80
80
80
mA
1
1720
1640
1600
mA
1
144
144
144
mA
2
400
400
400
mA
Bank interleave read current
IDD7
Bank interleave read IPP current
IPP7
Maximum power-down current
Notes:
CCMTD-1725822587-9882
atf16c2gx64hz.pdf – Rev. I 10/18 EN
IDD8
1. One module rank in the active IDD/PP, the other rank in IDD2P/PP3N.
2. All ranks in this IDD/PP condition.
18
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
16GB (x64, DR) 260-Pin DDR4 SODIMM
IDD Specifications
Table 14: DDR4 IDD Specifications and Conditions – 16GB (Die Revision E)
Values are for the MT40A1GM8 DDR4 SDRAM only and are computed from values specified in the 8Gb (1 Gig x 8) component data sheet
Parameter
Symbol
3200
2666
2400
Units
IDD01
One bank ACTIVATE-PRECHARGE current
One bank ACTIVATE-PRECHARGE, wordline boost, IPP current
One bank ACTIVATE-READ-PRECHARGE current
552
520
504
mA
1
48
48
48
mA
1
632
mA
IPP0
IDD1
680
648
Precharge standby current
IDD2N
2
528
496
480
mA
Precharge standby ODT current
IDD2NT1
528
496
480
mA
2
352
352
352
mA
2
416
416
416
mA
2
Precharge power-down current
IDD2P
Precharge quite standby current
IDD2Q
Active standby current
IDD3N
688
624
592
mA
Active standby IPP current
IPP3N2
48
48
48
mA
Active power-down current
IDD3P2
Burst read current
528
496
480
mA
1
1600
1424
1336
mA
1
IDD4R
Burst write current
IDD4W
1376
1232
1160
mA
Burst refresh current (1x REF)
IDD5R1
576
560
552
mA
1
64
64
64
mA
2
544
mA
Burst refresh IPP current (1x REF)
IPP5R
Self refresh current: Normal temperature range (0–85°C)
IDD6N
544
544
Self refresh current: Extended temperature range (0–95°C)
IDD6E
2
928
928
928
mA
Self refresh current: Reduced temperature range (0–45°C)
IDD6R2
336
336
336
mA
2
137.6
137.6
137.6
mA
2
336
336
336
mA
Auto self refresh current (25°C)
IDD6A
Auto self refresh current (45°C)
IDD6A
Auto self refresh current (75°C)
IDD6A
2
496
496
496
mA
Auto self refresh current (95°C)
IDD6A2
928
928
928
mA
2
80
80
80
mA
1
1696
1616
1576
mA
Bank interleave read IPP current
IPP7
1
128
128
128
mA
Maximum power-down current
IDD82
288
288
288
mA
Auto self refresh IPP current
IPP6X
Bank interleave read current
Notes:
CCMTD-1725822587-9882
atf16c2gx64hz.pdf – Rev. I 10/18 EN
IDD7
1. One module rank in the active IDD/PP, the other rank in IDD2P/PP3N.
2. All ranks in this IDD/PP condition.
19
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
16GB (x64, DR) 260-Pin DDR4 SODIMM
IDD Specifications
Table 15: DDR4 IDD Specifications and Conditions – 16GB (Die Revision H)
Values are for the MT40A1G8 DDR4 SDRAM only and are computed from values specified in the 8Gb (1 Gig x 8) component data sheet
Parameter
Symbol
2666
2400
Units
IDD01
One bank ACTIVATE-PRECHARGE current
One bank ACTIVATE-PRECHARGE, wordline boost, IPP current
One bank ACTIVATE-READ-PRECHARGE current
696
656
mA
1
60
60
mA
1
IPP0
IDD1
800
760
mA
Precharge standby current
IDD2N
2
672
624
mA
Precharge standby ODT current
IDD2NT1
600
560
mA
2
432
432
mA
2
576
544
mA
2
Precharge power-down current
IDD2P
Precharge quite standby current
IDD2Q
Active standby current
IDD3N
768
752
mA
Active standby IPP current
IPP3N2
72
72
mA
2
624
576
mA
1
1608
1392
mA
1
Active power-down current
IDD3P
Burst read current
IDD4R
Burst write current
IDD4W
1952
1664
mA
Burst refresh current (1x REF)
IDD5R1
624
608
mA
1
80
80
mA
2
576
576
mA
Self refresh current: Extended temperature range (0°C to 95°C)
IDD6E
2
784
768
mA
Self refresh current: Reduced temperature range (0°C to 45°C)
IDD6R2
416
416
mA
2
240
240
mA
2
416
416
mA
2
Burst refresh IPP current (1x REF)
IPP5R
Self refresh current: Normal temperature range (0°C to 85°C)
Auto self refresh current (25°C)
IDD6N
IDD6A
Auto self refresh current (45°C)
IDD6A
Auto self refresh current (75°C)
IDD6A
576
576
mA
Auto self refresh IPP current
IIPP6X2
80
80
mA
Bank interleave read current
IDD71
Bank interleave read IPP current
CCMTD-1725822587-9882
atf16c2gx64hz.pdf – Rev. I 10/18 EN
2040
mA
164
164
mA
2
336
336
mA
IPP7
Maximum power-down current
Notes:
2136
1
IDD8
1. One module rank in the active IDD/PP, the other rank in IDD2P/PP3N.
2. All ranks in this IDD/PP condition.
20
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
16GB (x64, DR) 260-Pin DDR4 SODIMM
IDD Specifications
Table 16: DDR4 IDD Specifications and Conditions – 16GB (Die Revision J)
Values are for the MT40A1G8 DDR4 SDRAM only and are computed from values specified in the 8Gb (1 Gig x 8) component data sheet
Parameter
Symbol
3200
2666
Units
IDD01
One bank ACTIVATE-PRECHARGE current
One bank ACTIVATE-PRECHARGE, wordline boost, IPP current
One bank ACTIVATE-READ-PRECHARGE current
528
504
mA
1
48
48
mA
1
IPP0
IDD1
656
624
mA
Precharge standby current
IDD2N
2
496
480
mA
Precharge standby ODT current
IDD2NT1
512
480
mA
2
352
352
mA
2
416
416
mA
2
Precharge power-down current
IDD2P
Precharge quite standby current
IDD2Q
Active standby current
IDD3N
688
624
mA
Active standby IPP current
IPP3N2
48
48
mA
2
528
496
mA
1
1528
1360
mA
1
Active power-down current
IDD3P
Burst read current
IDD4R
Burst write current
IDD4W
1312
1176
mA
Burst refresh current (1x REF)
IDD5R1
552
536
mA
1
64
64
mA
2
512
512
mA
Self refresh current: Extended temperature range (0°C to 95°C)
IDD6E
2
880
880
mA
Self refresh current: Reduced temperature range (0°C to 45°C)
IDD6R2
320
320
mA
2
131.2
131.2
mA
2
320
320
mA
Burst refresh IPP current (1x REF)
IPP5R
Self refresh current: Normal temperature range (0°C to 85°C)
Auto self refresh current (25°C)
IDD6N
IDD6A
Auto self refresh current (45°C)
IDD6A
Auto self refresh current (75°C)
IDD6A
2
480
480
mA
Auto self refresh current (95°C)
IDD6A2
880
880
mA
Auto self refresh IPP current
IIPP6X2
80
80
mA
1
1616
1544
mA
Bank interleave read IPP current
IPP7
1
128
104
mA
Maximum power-down current
IDD82
288
288
mA
Bank interleave read current
Notes:
CCMTD-1725822587-9882
atf16c2gx64hz.pdf – Rev. I 10/18 EN
IDD7
1. One module rank in the active IDD/PP, the other rank in IDD2P/PP3N.
2. All ranks in this IDD/PP condition.
21
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
16GB (x64, DR) 260-Pin DDR4 SODIMM
SPD EEPROM Operating Conditions
SPD EEPROM Operating Conditions
For the latest SPD data, refer to Micron's SPD page: micron.com/spd.
Table 17: SPD EEPROM DC Operating Conditions
Parameter/Condition
Symbol
Min
Nom
Max
Units
VDDSPD
–
2.5
–
V
Input low voltage: logic 0; all inputs
VIL
–0.5
–
VDDSPD ×
0.3
V
Input high voltage: logic 1; all inputs
VIH
VDDSPD ×
0.7
–
VDDSPD +
0.5
V
Output low voltage: 3mA sink current VDDSPD > 2V
Supply voltage
VOL
–
–
0.4
V
Input leakage current: (SCL, SDA) VIN = VDDSPD or VSSSPD
ILI
–
–
±5
µA
Output leakage current: VOUT = VDDSPD or VSSSPD, SDA in High-Z
ILO
–
–
±5
µA
Notes:
1. Table is provided as a general reference. Consult JEDEC JC-42.4 EE1004 and TSE2004 device specifications for complete details.
2. All voltages referenced to VDDSPD.
Table 18: SPD EEPROM AC Operating Conditions
Parameter/Condition
Symbol
Min
Max
Units
tSCL
10
1000
kHz
Clock pulse width HIGH time
tHIGH
260
–
ns
Clock pulse width LOW time
tLOW
500
–
ns
tTIMEOUT
25
35
ms
SDA rise time
tR
–
120
ns
SDA fall time
tF
–
120
ns
Data-in setup time
tSU:DAT
50
–
ns
Data-in hold time
tHD:DI
0
–
ns
Data out hold time
tHD:DAT
0
350
ns
Start condition setup time
tSU:STA
260
–
ns
Start condition hold time
tHD:STA
260
–
ns
Stop condition setup time
tSU:STO
260
–
ns
tBUF
500
–
ns
tW
Clock frequency
Detect clock LOW timeout
Time the bus must be free before a new transition can start
Write time
Warm power cycle time off
Time from power on to first command
Note:
CCMTD-1725822587-9882
atf16c2gx64hz.pdf – Rev. I 10/18 EN
–
5
ms
tPOFF
1
–
ms
tINIT
10
–
ms
1. Table is provided as a general reference. Consult JEDEC JC-42.4 EE1004 and TSE2004 device specifications for complete details.
22
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
16GB (x64, DR) 260-Pin DDR4 SODIMM
Module Dimensions
Module Dimensions
Figure 3: 260-Pin DDR4 SODIMM, R/C-E1
Front view
3.7 (0.145)
MAX
69.73 (2.745)
69.47 (2.735)
.65 (0.025) R0
(4X)
U1
U2
U3
U4
30.13 (1.186)
29.87 (1.176)
1.75 (0.07)
1.8 (0.071) TYP (2X)
(2X)
U5
U6
U8
U7
U9
20.0 (0.787)
TYP
6.0 (0.236)
TYP
0.35 (0.014)
TYP
PIN 1
2.0 (0.079)
TYP
1.0 (0.039)
TYP
1.3 (0.051)
1.1 (0.043)
0.5 (0.019)
TYP
PIN 259
65.6 (2.58)
TYP
Back view
0.6 (0.24) x 45° (4X)
U10
U11
U12
U13
4.0 (0.157) TYP (2X)
U14
18.0 (0.71)
TYP
2.55 (0.10)
TYP
PIN 260
U15
2.5 (0.98)
TYP
U16
U17
4.0 (0.157)
TYP
0.25 (0.1) x 45° (2X)
PIN 2
28.5 (1.12)
TYP
35.5 (1.4)
TYP
38.3 (1.51)
TYP
Notes:
1. All dimensions are in millimeters (inches); MAX/MIN or typical (TYP) where noted.
2. The dimensional diagram is for reference only.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-4000
www.micron.com/products/support Sales inquiries: 800-932-4992
Micron and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.
Although considered final, these specifications are subject to change, as further product development and data characterization sometimes occur.
CCMTD-1725822587-9882
atf16c2gx64hz.pdf – Rev. I 10/18 EN
23
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
工商网监
湘ICP备2023018690号
