MTFC16GJUEF-AIT

Micron Technology, Inc. 8000 S. Federal Way PO Box 6 Boise, ID United States 83707-0006 Product Change Notice Micron PCN: 30840 Date: 3/1/2013 Type of Change: Manufacturing Process Change Title of Change: Automotive e•MMC Firmware and Manufacturing Changes Description of Change: Automotive e•MMC will be manufactured with the following changes:  Polyimide die coating (new passivation layer) on the NAND die (L73A/L74A) will improve manufacturability of multi-die packages.  New controller version, PS8200FF, will improve the circuit’s margin at cold.  BGA 100 assembly site will change from SPIL to AMKOR Korea, including new substrate design with improved signal integrity.  New Firmware.  MTFC8GLUEA-AIT assembly site will change from STATS ChipPAC to Amkor Korea. Reason for Change: Optimization of Manufacturing Efficiency and Product Enhancement Contact Information: AMERICAS: ARAVIND RAMAMOORTHY ARAMAMO@MICRON.COM ASIA-PACIFIC: JINGWEN YANG EMEA : ANTONIO IORIO ANTONIOIORIO@MICRON.COM JAPAN: DAIGO TOYAMA JYANG@MICRON.COM DTOYAMA@MICRON.COM Product Affected: Automotive e•MMC Affected Micron Part Numbers Replacement Part Numbers Package MTFC4GLUDM-AIT MTFC4GLGDM-AIT Z BGA153 MTFC8GLUDM-AIT MTFC8GLGDM-AIT Z BGA153 MTFC8GLUEA-AIT MTFC8GLGDM-AIT Z BGA153 MTFC16GJUEF-AIT MTFC16GJGEF-AIT Z BGA169 MTFC32GJUEF-AIT MTFC32GJGEF-AIT Z BGA169 N2M400FDA311A30E MTFC4GLGDQ-AIT Z BGA100 N2M400FDA311A30F MTFC4GLGDQ-AIT Z BGA100 N2M400GDA321A30E MTFC8GLGDQ-AIT Z BGA100 N2M400GDA321A30F MTFC8GLGDQ-AIT Z BGA100 N2M400JDA341A30E MTFC32GJGDQ-AIT Z BGA100 N2M400JDA341A30F MTFC32GJGDQ-AIT Z BGA100 N2M400FDA311A3BE MTFC4GLGDQ-AIT Z BGA100 N2M400FDA311A3BF MTFC4GLGDQ-AIT Z BGA100 N2M400GDA321A3BE MTFC8GLGDQ-AIT Z BGA100 N2M400GDA321A3BF MTFC8GLGDQ-AIT Z BGA100 N2M400HDA321A3BE MTFC16GJGDQ-AIT Z BGA100 N2M400HDA321A3BF MTFC16GJGDQ-AIT Z BGA100 N2M400JDA341A3BE MTFC32GJGDQ-AIT Z BGA100 N2M400JDA341A3BF MTFC32GJGDQ-AIT Z BGA100 N2M400KDA345K3BE MTFC64GJGDN-AIT Z BGA169 N2M400KDA345K3BF MTFC64GJGDN-AIT Z BGA169 Note: Per JEDEC Standard JESD46-C Section 3.2.3; lack of acknowledgment of this PCN within 30 days constitutes acceptance of change 1 of 2 Micron Confidential and Proprietary Information   Method of Identification: Micron Sites Affected: Part Numbers change (see table above) New PRV field in CID register change from “3.x” to “4.x” will identify new controller version. Fabrication — FAB2 (Lehi, UT, US), FAB6 (Manassas, VA, US) Assembly — Subcontractor Product/Data Availability New Production: Sample Availability: Qual Data Availability: Production Shipments: April 2013 June 2013 July 2013 Old Production: Last Time Buy: Last Time Ship Qualification Plan: Dec 2013 June 2014 Product manufactured with the changes described above will be qualified according to Company qualification procedure and best practices. Qualification plan will be available upon request. Orders placed prior to the LTB date are subject to current inventory levels, which may vary based on market conditions and customer demand. Early orders are encouraged. Note: Per JEDEC Standard JESD46-C Section 3.2.3; lack of acknowledgment of this PCN within 30 days constitutes acceptance of change 2 of 2 Micron Confidential and Proprietary Information