MTSD1T0AKC7MS-1WT

Micron Confidential and Proprietary i300 microSDXC Card Features i300 microSDXC Card MTSD128AKC7MS-1WT, MTSD256AKC7MS-1WT, MTSD512AKC7MS-1WT, MTSD1T0AKC7MS-1WT Features • Integrated power-on reset, oscillator, voltage regulation, and voltage detection circuits • Built-in features for defect and error management – LDPC error correction code implemented – Global wear leveling – Bad block management – Refresh mechanism for UECC prevention – Sudden power-off (SPO) protection • Operating voltage: 2.7–3.6V • Temperature – Operating: –25°C to +85°C – Storage: –40°C to +85°C • Standards compliance – RoHS – FCC – CE – BSMI – KC RRA – W.E.E.E. – VCCI – IC • Halogen-free • Micron® 3D QLC NAND Flash • Form factor: 8-pad microSD memory card (11mm × 15mm) • Density1: 128GB, 256GB, 512GB, 1TB • SD Physical Layer Specification version 6.10 compliant2 – microSD Card Specification version 4.203 – SD memory card file system specification – Password protection of cards – Supports secure digital interface (SD) and serial peripheral interface (SPI) • Mean time to failure (MTTF): 2 million hours • Endurance: Total bytes written (TBW) – 128GB: up to 120TB – 256GB: up to 240TB – 512GB: up to 480TB – 1TB: up to 960TB • Surveillance recording capability – 128GB: 24/7 recording @ 8Mb/s for 3 years – 256GB: 24/7 recording @16 Mb/s for 3 years – 512GB: 24/7 recording @32 Mb/s for 3 years – 1TB: 24/7 recording @64 Mb/s for 3 years • Health monitoring: Available4 • Performance – Refer to Performance and Capacity (page 6) for read and write speed • Bus speed mode (theoretical transfer rate @x4 bits) – Default: 3.3V signaling up to 12.5 MB/s @25 MHz – High-speed: 3.3V signaling up to 25 MB/s @50 MHz – SDR12: UHS-I 1.8V signaling up to 12.5 MB/s @25 MHz – SDR25: UHS-I 1.8V signaling up to 25 MB/s @50 MHz – SDR50: UHS-I 1.8V signaling up to 50 MB/s @100 MHz – SDR104: UHS-I 1.8V signaling up to 104 MB/s @208 MHz – DDR50: UHS-I 1.8V signaling up to 50 MB/s @50 MHz (sampled on both clock edges) • 1.8V low voltage signaling (LVS) interface support5 – LV50: LV cards supporting UHS50 – LV104: LV cards supporting UHS104 CCM005-816717818-10530 i300_microSD_Card_128GB-1TB.pdf - Rev. C 05/2020 EN Notes: 1 1. Actual usable capacity may vary. 1GB = 1 billion bytes. 1TB = 1 trillion bytes. 2. SD Specifications, Part 1, Physical Layer Specification, version 6.10. 3. SD Specifications, Part 1, microSD Card Specification, version 4.20. 4. Contact Micron factory for details. 5. SD Specifications, Part 1, Low Voltage Interface Addendum, version 1.00. Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2019 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice. Micron Confidential and Proprietary i300 microSDXC Card Features Part Number Ordering Information Micron microSD memory cards are available in different configurations and densities. Verify valid part numbers by using Micron’s part catalog search at www.micron.com. To compare features and specifications by device type, visit www.micron.com/products. Contact the factory for cards not found. Figure 1: Marketing Part Number Chart MT SD 128AK C7 MS -1 WT Micron Technology ES Production Status Blank = Production ES = Engineering samples Product Family SD = Secure digital Custom Designator Density Blank = Standard CS = C series 128 = 128GB 256 = 256GB 512 = 512GB 1T0 = 1TB Operating Temperature Range WT = –25°C to +85°C IT = –40°C to +85°C NAND Component AK = QLC 1Tb, x8, 3.3V (3D) Special Features 1 = First genaration Controller Revision C7 = Revision C7 Packaging RG = Full size SD MS = microSD Note: 1. Not all combinations are necessarily available. For a list of available devices or for further information on any aspect of these products, please contact your nearest Micron sales office. Table 1: Ordering Information Part Number Capacity MTSD128AKC7MS-1WT 128GB MTSD256AKC7MS-1WT 256GB MTSD512AKC7MS-1WT 512GB MTSD1T0AKC7MS-1WT 1TB CCM005-816717818-10530 i300_microSD_Card_128GB-1TB.pdf - Rev. C 05/2020 EN 2 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2019 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary i300 microSDXC Card Important Notes and Warnings Important Notes and Warnings Micron Technology, Inc. ("Micron") reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions. This document supersedes and replaces all information supplied prior to the publication hereof. You may not rely on any information set forth in this document if you obtain the product described herein from any unauthorized distributor or other source not authorized by Micron. Automotive Applications. Products are not designed or intended for use in automotive applications unless specifically designated by Micron as automotive-grade by their respective data sheets. Distributor and customer/distributor shall assume the sole risk and liability for and shall indemnify and hold Micron harmless against all claims, costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damage resulting directly or indirectly from any use of nonautomotive-grade products in automotive applications. Customer/distributor shall ensure that the terms and conditions of sale between customer/distributor and any customer of distributor/customer (1) state that Micron products are not designed or intended for use in automotive applications unless specifically designated by Micron as automotive-grade by their respective data sheets and (2) require such customer of distributor/customer to indemnify and hold Micron harmless against all claims, costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damage resulting from any use of non-automotive-grade products in automotive applications. Critical Applications. Products are not authorized for use in applications in which failure of the Micron component could result, directly or indirectly in death, personal injury, or severe property or environmental damage ("Critical Applications"). Customer must protect against death, personal injury, and severe property and environmental damage by incorporating safety design measures into customer's applications to ensure that failure of the Micron component will not result in such harms. Should customer or distributor purchase, use, or sell any Micron component for any critical application, customer and distributor shall indemnify and hold harmless Micron and its subsidiaries, subcontractors, and affiliates and the directors, officers, and employees of each against all claims, costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of product liability, personal injury, or death arising in any way out of such critical application, whether or not Micron or its subsidiaries, subcontractors, or affiliates were negligent in the design, manufacture, or warning of the Micron product. Customer Responsibility. Customers are responsible for the design, manufacture, and operation of their systems, applications, and products using Micron products. ALL SEMICONDUCTOR PRODUCTS HAVE INHERENT FAILURE RATES AND LIMITED USEFUL LIVES. IT IS THE CUSTOMER'S SOLE RESPONSIBILITY TO DETERMINE WHETHER THE MICRON PRODUCT IS SUITABLE AND FIT FOR THE CUSTOMER'S SYSTEM, APPLICATION, OR PRODUCT. Customers must ensure that adequate design, manufacturing, and operating safeguards are included in customer's applications and products to eliminate the risk that personal injury, death, or severe property or environmental damages will result from failure of any semiconductor component. Limited Warranty. In no event shall Micron be liable for any indirect, incidental, punitive, special or consequential damages (including without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort, warranty, breach of contract or other legal theory, unless explicitly stated in a written agreement executed by Micron's duly authorized representative. CCM005-816717818-10530 i300_microSD_Card_128GB-1TB.pdf - Rev. C 05/2020 EN 3 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2019 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary i300 microSDXC Card General Description General Description The microSD card is an advanced Micron® 3D NAND Flash memory technology based removable storage device specifically designed to meet the performance, capacity, and quality required for industrial devices or systems. In addition to mass storage-specific Flash memory, the microSD card includes an on-board intelligent controller which manages interface protocols, security algorithms for content protection, data storage and retrieval, as well as error correction code (ECC) algorithms, defect handling, sudden power-off safeguard and wear leveling. The microSD card includes one or more NAND Flash memory components and a microSD card controller. The density of a card depends on the number of die within the package and the density of each die. Figure 2: Functional Block Diagram Micron NAND Flash CPU Media manager SD protocol NAND Flash interface Micron NAND Flash (optional) Data buffer Note: CCM005-816717818-10530 i300_microSD_Card_128GB-1TB.pdf - Rev. C 05/2020 EN 1. Not drawn to scale. 4 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2019 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary i300 microSDXC Card Pad Assignment and Descriptions Pad Assignment and Descriptions Figure 3: microSD Card Pad Assignment (Bottom View) 1 2 3 4 5 6 7 8 Table 2: MicroSD Contact Pad Description Pad Number 1 SD Mode Symbol Type1 Description DAT22 I/O/PP Data line [Bit 2] 2 CD/DAT32 I/O/PP3 3 CMD PP SPI Mode Symbol Type1 RSV – Reserved Card detect/data line [Bit 3] CS I3 Chip select (active low) Command/response DI I Data in Description 4 VDD S Supply voltage VDD S Supply voltage 5 CLK I Clock SCLK I Clock 6 VSS S Supply voltage ground VSS S Supply voltage ground 7 DAT0 I/O/PP Data line [Bit 0] DO O/PP Data out 8 DAT12 I/O/PP Data line [Bit 1] RSV – Reserved Notes: CCM005-816717818-10530 i300_microSD_Card_128GB-1TB.pdf - Rev. C 05/2020 EN 1. S: Power supply; I: Input; O: Output using push-pull drivers; PP: I/O using push-pull drivers. 2. The extended DAT lines (DAT1-DAT3) are input on power-up. They start to operate as DAT lines after SET_BUS_WIDTH (ACMD6) command. The host should keep its own DAT1-DAT3 lines in input mode, as well, while they are not used. 3. After power-up, pad 2 is configured as an input with an internal 50kΩ pull-up (for card detection and SPI mode selection). The pull-up should be disconnected prior to regular data transfer by issuing the SET_CLR_CARD_DETECT (ACMD42) command. 5 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2019 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary i300 microSDXC Card Performance and Capacity Performance and Capacity Performance Using a striping method across multiple NAND Flash devices the card read and write performance is optimized. The Industrial microSD cards also use performance features of the underlying NAND Flash to increase speed in streaming applications. By sending larger packets of sequential data, the Industrial microSD card can better utilize NAND Flash features to enhance performance. Table 3: Measured Performance (25°C, VDD = 3.3V) Density1 Sequential Read2 Sequential Write2 128GB 100 MB/s 20 MB/s 256GB 100 MB/s 35 MB/s 512GB 100 MB/s 39 MB/s 1TB 100 MB/s 39 MB/s Notes: 1. 1GB = 1 billion bytes. 1TB = 1 trillion bytes. 2. Measurements are based on a 100MB file size in UHS-I mode and depend on the host configuration used to run the test. Capacity When quoting device capacity, Micron uses the formatted capacity, not the raw number of bytes available. Table 4: Bytes Available After Factory Formatting (exFAT for SDXC card) Density1 Usable Bytes2 Speed Class3 Application Performance Class3, 4 128GB 124,980,822,016 Class10, U1 Class2 (A2) 256GB 249,961,644,032 Class10, U3 Class2 (A2) 512GB 503,010,295,808 Class10, U3 Class2 (A2) 1TB 1,000,018,542,592 Class10, U3 Class2 (A2) Notes: CCM005-816717818-10530 i300_microSD_Card_128GB-1TB.pdf - Rev. C 05/2020 EN 1. 1GB = 1 billion bytes. 1TB = 1 trillion bytes. 2. Actual user usable capacity. When cloning disk partitions, the master disk should always be formatted to no more than the minimum guaranteed usable bytes available for that card capacity. 3. Class is determined by Testmetrix VTE4100 Compliance Test. 4. Enable users to run their smartphone apps from the installed memory card. 6 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2019 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary i300 microSDXC Card OCR Register OCR Register The 32-bit operation conditions register defines the supported operating voltage ranges for the power supply and supported access modes of the microSD card. Additionally, this register includes status information bits. Table 5: OCR Field Parameters OCR-Slice OCR Value [31] 1b (ready)/0b (busy) Description [30] 1b Card Capacity Status (CCS)2 [29] 0b Card doesn't support UHS-II interface [28:25] 0000b [24] 1b (switching)/0b (maintained) [23:15] 1 1111 1111b [14:0] 000 0000 0000 0000b Notes: CCM005-816717818-10530 i300_microSD_Card_128GB-1TB.pdf - Rev. C 05/2020 EN Card power-up status bit (busy)1 Reserved Switching to 1.8V Accepted (S18A) VDD: 2.7–3.6V range Reserved 1. This bit is set to LOW if the card has not finished the power-up routine. 2. This bit is valid only when the card power-up status bit is set. 7 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2019 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary i300 microSDXC Card CID Register CID Register The card identification (CID) register is 128 bits wide. It contains the device identification information used during the card identification phase as required by SD protocol. Each card is created with a unique identification number. Table 6: CID Register Field Parameters Name Field Width CID-Slice CID Value Manufacturer ID MID 8 [127:120] 09h OEM/Application ID OID 16 [119:104] 41 50h 40 [103:64] 128GB: MB58B 256GB: MB68B 512GB: MB78B 1TB: MB98B Product name PNM Product revision PRV 8 [63:56] 06h Product serial number PSN 32 [55:24] – – 4 [23:20] – Manufacturing date MDT 12 [19:8] – CRC7 checksum CRC 7 [7:1] – – 1 [0] 1 Reserved Not used, always 1 CCM005-816717818-10530 i300_microSD_Card_128GB-1TB.pdf - Rev. C 05/2020 EN 8 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2019 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary i300 microSDXC Card CSD Register CSD Register The card-specific data (CSD) register provides information about accessing the card contents. The CSD register defines the data format, error correction type, maximum data access time, as well as whether the DSR register can be used, and so forth. The programmable part of the register (entries marked with W in the following table) can be changed by the PROGRAM_CSD (CMD27) command. The types of the entries in the table below are coded as follows: R = readable, W(1) = writable once, W = multiple writable. Table 7: CSD Register Field Parameters Width Cell Type CSD-Slice CSD Value1 CSD_STRUCTURE 2 R [127:126] 01b Reserved – 6 R [125:120] 00 0000b Data read access time TAAC 8 R [119:112] 0Eh Data read access time in CLK cy- NSAC cles (NSAC × 100) 8 R [111:104] 00h Maximum data transfer rate TRAN_SPEED 8 R [103:96] - Card command classes CCC 12 R [95:84] 010110110101b Maximum read data block length READ_BL_LEN 4 R [83:80] 9 Partial blocks for read allowed READ_BL_PARTIAL 1 R [79:79] 0 Write block misalignment WRITE_BLK_MISALIGN 1 R [78:78] 0 Read block misalignment READ_BLK_MISALIGN 1 R [77:77] 0 DSR implemented DSR_IMP 1 R [76:76] 0 Reserved – 6 R [75:70] 00 0000b Device size C_SIZE 22 R [69:48] 128GB - 0x03A36D 256GB - 0x0746DB 512GB - 0x0EA437 1TB - 0x1D1BB7 Reserved – 1 R [47:47] 0 Erase single block enable ERASE_BLK_EN 1 R [46:46] 1 Erase sector size SECTOR_SIZE 7 R [45:39] 7Fh Write protect group size WP_GRP_SIZE 7 R [38:32] 000 0000b Write protect group enable WP_GRP_ENABLE 1 R [31:31] 0 Reserved – 2 R [30:29] 00b Write speed factor R2W_FACTOR 3 R [28:26] 010b Maximum write data block length WRITE_BL_LEN 4 R [25:22] 9 Partial blocks for write allowed WRITE_BL_PARTIAL 1 R [21:21] 0 Reserved – 5 R [20:16] 0 0000b File format group FILE_FORMAT_GRP 1 R [15:15] 0 Copy flag COPY 1 R/W(1) [14:14] 0 Permanent write protection PERM_WRITE_PROTECT 1 R/W(1) [13:13] 0 Name Field CSD structure CCM005-816717818-10530 i300_microSD_Card_128GB-1TB.pdf - Rev. C 05/2020 EN 9 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2019 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary i300 microSDXC Card CSD Register Table 7: CSD Register Field Parameters (Continued) Width Cell Type CSD-Slice CSD Value1 TMP_WRITE_PROTECT 1 R/W [12:12] 0 File format FILE_FORMAT 2 R [11:10] 0 Reserved – 2 R [9:8] 00b CRC CRC 7 R/W [7:1] xxxxxxxb Not used, always 1 – 1 – [0:0] 1 Name Field Temporary write protection Note: CCM005-816717818-10530 i300_microSD_Card_128GB-1TB.pdf - Rev. C 05/2020 EN 1. All register table values reflect their expected state after card initialization and prior to host issuing CMD6. 10 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2019 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary i300 microSDXC Card SCR Register SCR Register In addition to the CSD register, there is another configuration register named SD card configuration register (SCR). SCR provides information on the SD Memory Card's special features that were configured into the given card. The size of SCR register is 64 bits. The types of all bits of SCR are R = readable. Table 8: CSD Register Field Parameters Width Cell Type CSD-Slice CSD Value SCR_STRUCTURE 4 R [63:60] 0000b SD memory card – Specification version SD_SPEC 4 R [59:56] 0010b Data status after erases DATA_STAT_AFTER_ERASE 1 R [55:55] 0 CPRM security support SD_SECURITY 3 R [54:52] 000b DAT bus widths supported SD_BUS_WIDTHS 4 R [51:48] 0101b Specification version 3.00 or later SD_SPEC3 1 R [47:47] 1b Extended security support EX_SECURITY 4 R [46:43] 0000b Specification version 4.00 or later SD_SPEC4 1 R [42:42] 1b Specification version 5.00 or later SD_SPECX 4 R [41:38] 0010b Reserved – 2 R [37:36] 00b Command support bits CMD_SUPPORT 4 R [35:32] 0111b Reserved for manufacturer usage – 32 R [31:0] 01 00 00 00h Description Field SCR structure CCM005-816717818-10530 i300_microSD_Card_128GB-1TB.pdf - Rev. C 05/2020 EN 11 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2019 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary i300 microSDXC Card Command Set Command Set The SD specification categorizes commands into classes. Table 9 shows commands supported by the microSD card. Table 9: Supported Commands Card Command Class (CCC) Supported Commands Command Type Basic commands Class 0 CMD0, CMD2, CMD3, CMD7, CMD8, CMD9, CMD10, CMD11, CMD12, CMD13, CMD15 Command Queue function commands Class 1 CMD43, CMD44, CMD45, CMD46, CMD47 Block-oriented READ commands Class 2 CMD16, CMD17, CMD18, CMD19, CMD20, CMD23 Block-oriented WRITE commands Class 4 CMD16, CMD20, CMD23, CMD24, CMD25, CMD27 ERASE commands Class 5 CMD32, CMD33, CMD38 Class 7 CMD16, CMD42 Class 8 CMD55, CMD56, ACMD6, ACMD13, ACMD22, ACMD23, ACMD41, ACMD42, ACMD51 Lock card Application-specific commands1 SWITCH commands Class 10 CMD6 Function extension commands Class 11 CMD48, CMD49 Note: CCM005-816717818-10530 i300_microSD_Card_128GB-1TB.pdf - Rev. C 05/2020 EN 1. Each application-specific (ACMD) command is a 2-sequence command. First, a CMD55 is sent, followed by a CMDx, where x is the ACMDx value. 12 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2019 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary i300 microSDXC Card Electrical Specifications Electrical Specifications Absolute Ratings and Operating Conditions Stresses greater than those listed in Table 10 may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability. Table 10: Absolute Maximum Ratings Parameter/Condition Min Max Unit VDD supply voltage 2.7 3.6 V Storage temperature –40 +85 °C Table 11: Recommended Operating Conditions Parameter/Condition Symbol Min Typ Max Unit Operating temperature TA –25 – +85 °C VDD 2.7 3.3 3.6 V VDDIO 1.7 1.8 1.95 V VSS 0 0 0 V Supply voltage Regulator supply voltage for 1.8V signaling Ground supply voltage DC Characteristics Table 12: DC Voltage Characteristics for 3.3V Signaling Parameter Symbol Min Max Unit Input low voltage VIL VSS - 0.30 0.25 × VDD V Comments Input high voltage VIH 0.625 × VDD VDD + 0.30 V Output low voltage VOL – 0.125 × VDD V IOL = 2mA @ VDD (MIN) Output high voltage VOH 0.75 × VDD – V IOH = –2mA @ VDD (MIN) Comments Table 13: DC Voltage Characteristics for 1.8V Signaling Symbol Min1 Max1 Unit Input low voltage VIL VSS - 0.30 0.58 V Input high voltage VIH 1.27 2.00 V Parameter Output low voltage VOL – 0.45 V IOL = 2mA Output high voltage VOH 1.40 – V IOH = –2mA Note: CCM005-816717818-10530 i300_microSD_Card_128GB-1TB.pdf - Rev. C 05/2020 EN 1. As signaling level is generated by regulator in host and card, some of the values are defined by fixed value rather than based on VDD. 13 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2019 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary i300 microSDXC Card Electrical Specifications Table 14: DC Current Characteristics Parameter Density Symbol 128GB 258GB Operating current (read) ICC1 512GB Max1 Unit – 133 mA – 133 mA – 136 mA 1TB – 143 mA 128GB – 127 mA – 165 mA – 174 mA – 179 mA 256GB Operating current (write) Min ICC2 512GB 1TB 1. Peak current: RMS value in SDR104 mode with Testmetrix VTE4100. Note: AC Characteristics Timing specifications including clock timing, input and output timings for all bus modes are defined in SD Specifications. Refer to Section 6.6 and 6.7 of Part 1, Physical Layer Specification, version 5.10 for detail information. Electrostatic Discharge (ESD) Contacts pads: • Human body model of ±4kV according to IEC61000-4-2. Non contacts pad area: • Coupling plane discharge of ±8kV. • Air discharge of ±15kV. • Human body model according to IEC61000-4-2. CCM005-816717818-10530 i300_microSD_Card_128GB-1TB.pdf - Rev. C 05/2020 EN 14 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2019 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary i300 microSDXC Card Package Dimensions Package Dimensions Figure 4 provides the physical dimensions of Micron microSD card. For detail dimensions and tolerances, refer to SDA microSD Card Addendum, Section 3.0 Mechanical Specification for microSD Memory Card. Figure 4: microSD Card – 11mm × 15mm 0.70 ±0.1 15.0 ±0.1 9.70 ±0.1 0.80 MIN 9.0 MAX 0.70 ±0.1 0.90 MIN 8.50 MAX Note: 1.0 ±0.1 11.0 ±0.1 1. Dimensions are in millimeters. Table 15: Package Specifications Parameter Descriptions Surface Plain (except contact area) Edges Smooth edges Weight CCM005-816717818-10530 i300_microSD_Card_128GB-1TB.pdf - Rev. C 05/2020 EN 0.25gm 15 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2019 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary i300 microSDXC Card Compliance Compliance Micron microSD card comply with the following: • • • • Micron Green Standard CE (Europe): EN 55032 Class B, RoHS FCC: CFR Title 47, Part 15 Class B BSMI (Taiwan): approval to CNS 13438 Class B and CNS 15663 • KC RRA (Korea): approval to KN32 Class B, KN 35 Class B R-R-MU2-MTSDXXXAKC7MS • W.E.E.E.: compliance with EU WEEE directive 2012/19/EC. Additional obligations may apply to customers who place these products in the markets where WEEE is enforced. • VCCI (Japan): 2015-04 Class B • IC (Canada): ICES-003 Class B - This Class B digital apparatus complies with Canadian ICES-003. - Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada. - CAN ICES-3 (B)/NMB-3(B). FCC Rules This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. CCM005-816717818-10530 i300_microSD_Card_128GB-1TB.pdf - Rev. C 05/2020 EN 16 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2019 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary i300 microSDXC Card Compliance • Increase the separation between the equipment and the receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. CCM005-816717818-10530 i300_microSD_Card_128GB-1TB.pdf - Rev. C 05/2020 EN 17 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2019 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary i300 microSDXC Card Revision History Revision History Rev. C – 05/2020 • Updated surveillance recording capability Rev. B – 12/19 • Updated legal status to Production Rev. A – 09/19 • Preliminary version 8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-4000 www.micron.com/products/support Sales inquiries: 800-932-4992 Micron and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners. This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein. Although considered final, these specifications are subject to change, as further product development and data characterization sometimes occur. CCM005-816717818-10530 i300_microSD_Card_128GB-1TB.pdf - Rev. C 05/2020 EN 18 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2019 Micron Technology, Inc. All rights reserved.