1N5420US

1N5415US thru 1N5420US VOIDLESS-HERMETICALLY SEALED SURFACE MOUNT FAST RECOVERY GLASS RECTIFIERS SCOTTSDALE DIVISION DESCRIPTION This “fast recovery” rectifier diode series is military qualified to MIL-PRF-19500/411 and is ideal for high-reliability applications where a failure cannot be tolerated. These industry-recognized 3.0 Amp rated rectifiers for working peak reverse voltages from 50 to 600 volts are hermetically sealed with voidless-glass construction using an internal “Category I” metallurgical bond. These devices are also available in axial-leaded packages for thru-hole mounting by deleting the “US” suffix (see separate data sheet for 1N5415 thru 1N5420). Microsemi also offers numerous other rectifier products to meet higher and lower current ratings with various recovery time speed requirements including fast and ultrafast device types in both through-hole and surface mount packages. IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com APPEARANCE W W W . Microsemi . C O M Package “E” or D-5B FEATURES • • • • • • • Surface mount package series equivalent to the JEDEC registered 1N5415 to 1N5420 series Voidless hermetically sealed glass package Triple-Layer Passivation Internal “Category I” Metallurgical bonds Working Peak Reverse Voltage 50 to 600 Volts. JAN, JANTX, JANTXV, and JANS available per MILPRF-19500/411 Axial-leaded equivalents also available (see separate data sheet for 1N5415 thru 1N5420) • • • • • • • • APPLICATIONS / BENEFITS Fast recovery 3 Amp rectifiers 50 to 600 V Military and other high-reliability applications General rectifier applications including bridges, halfbridges, catch diodes, etc. High forward surge current capability Extremely robust construction Low thermal resistance Controlled avalanche with peak reverse power capability Inherently radiation hard as described in Microsemi MicroNote 050 MAXIMUM RATINGS • • • • • • • Junction Temperature: -65 C to +175 C Storage Temperature: -65oC to +175oC Thermal Resistance: 10oC/W junction to endcap Thermal Impedance: 1.5oC/W @ 10 ms heating time Average Rectified Forward Current (IO): 3 Amps @ TA = 55ºC and 2 Amps @ TA = 100ºC (see Note 1) Forward Surge Current (8.3 ms half sine): 80 Amps Solder temperatures: 260oC for 10 s (maximum) o o MECHANICAL AND PACKAGING • • • • • • • CASE: Hermetically sealed voidless hard glass with Tungsten slugs TERMINALS: End caps are solid Silver with Tin/Lead (Sn/Pb) finish MARKING: Cathode band only POLARITY: Cathode indicated by band TAPE & REEL option: Standard per EIA-481-B WEIGHT: 539 mg See package dimensions and recommended pad layout on last page MAXIMUM REVERSE CURRENT IR @ VRWM o o 100 C 25 C µA µA 1.0 20 1.0 20 1.0 20 1.0 20 1.0 20 1.0 20 MAXIMUM REVERSE RECOVERY TIME trr (NOTE 2) ns 150 150 150 150 250 400 AVERAGE RECTIFIED CURRENT IO (NOTE 1) o o 100 C 55 C AMPS AMPS 3.0 2.0 3.0 2.0 3.0 2.0 3.0 2.0 3.0 2.0 3.0 2.0 ELECTRICAL CHARACTERISTICS MINIMUM BREAKDOWN VOLTAGE VBR @ 50µA VOLTS 1N5415US 1N5416US 1N5417US 1N5418US 1N5419US 1N5420US 50V 100V 200V 400V 500V 600V 55V 110V 220V 440V 550V 660V FORWARD VOLTAGE VF @ 9 A MIN. VOLTS 0.6 0.6 0.6 0.6 0.6 0.6 MAX. VOLTS 1.5 1.5 1.5 1.5 1.5 1.5 1N5415 thru 1N5420 TYPE VRWM o o o o NOTE 1: From 3.0 Amps at TA = 55 C, derate linearly at 22 mA/ C to 2.0 Amps at TA = 100 C. Above TA = 100 C, derate linearly to zero at TA = 175 oC. These ambient ratings are for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where TJ(max) does not exceed 175 oC. NOTE 2: IF = 0.5A, IRM = 1A, IR(REC) = 0.250A Copyright  2004 11-22-2004 REV A Microsemi Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503 Page 1 1N5415US thru 1N5420US VOIDLESS-HERMETICALLY SEALED SURFACE MOUNT FAST RECOVERY GLASS RECTIFIERS SCOTTSDALE DIVISION Symbol VBR VRWM IO VF IR trr SYMBOLS & DEFINITIONS Definition Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current. Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating temperature range excluding all transient voltages (ref JESD282-B). Average Rectified Output Current: The Output Current averaged over a full cycle with a 50 Hz or 60 Hz sinewave input and a 180 degree conduction angle. Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current. Maximum Reverse Current: The maximum reverse (leakage) current that will flow at the specified voltage and temperature. Reverse Recovery Time: The time interval between the instant the current passes through zero when changing from the forward direction to the reverse direction and a specified decay point after a peak reverse current occurs. W W W . Microsemi . C O M GRAPHS FIGURE 1 – Typical Reverse Current vs. PIV FIGURE 2 – Typical Forward Current vs. Forward Voltage 1N5415 thru 1N5420 Copyright  2004 11-22-2004 REV A Microsemi Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503 Page 2 1N5415US thru 1N5420US VOIDLESS-HERMETICALLY SEALED SURFACE MOUNT FAST RECOVERY GLASS RECTIFIERS SCOTTSDALE DIVISION PACKAGE DIMENSIONS AND LAYOUT W W W . Microsemi . C O M NOTE: This Package Outline has also previously been identified as “D-5B” INCHES MIN BL BD ECT S .205 .137 .019 .003 MAX .225 .142 .028 --MIN 5.21 3.48 0.48 0.08 mm MAX 5.72 3.61 0.711 --A B C PAD LAYOUT INCHES 0.288 0.070 0.155 mm 7.32 1.78 3.94 Note: If mounting requires adhesive separate from the solder, an additional 0.080 inch diameter contact may be placed in the center between the pads as an optional spot for cement. 1N5415 thru 1N5420 Copyright  2004 11-22-2004 REV A Microsemi Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503 Page 3