1N5807US

TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http://www.microsemi.com Gort Road Business Park, Ennis, Co. Clare, Ireland. Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 VOIDLESS - HERMETICALLY- SEALED ULTRAFAST RECOVERY GLASS RECTIFIERS Qualified per MIL-PRF-19500/477 DEVICES LEVELS 1N5807 thru 1N5811 - LEADED 1N5807US thru 1N5811US – SURFACE MOUNT JAN JANTX JANTXV JANS DESCRIPTION This “Ultrafast Recovery” rectifier diode series is military qualified to MIL-PRF-19500/477 and is ideal for high-reliability applications where a failure cannot be tolerated. These industryrecognized 6.0 Amp rated rectifiers for working peak reverse voltages from 50 to 150 volts are hermetically sealed with voidless-glass construction using an internal “Category I” metallurgical bond. These devices are available in both leaded and surface mount MELF package configurations. Microsemi also offers numerous other rectifier products to meet higher and lower current ratings with various recovery time speed requirements including standard, fast and ultrafast device types in both through-hole and surface mount packages. IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com FEATURES Popular JEDEC registered 1N5807 to 1N5811 series Voidless hermetically sealed glass package Extremely robust construction Internal “Category I” Metallurgical bonds JAN, JANTX, JANTXV, and JANS available per MIL-PRF-19500/477 Surface mount versions available in a square end-cap MELF configuration with “US” suffix B-Body Leaded Package B-Body Surface Mount MELF PACKAGE T4-LDS-0168 Rev. 1 (101025) Page 1 of 7 TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http://www.microsemi.com Gort Road Bussiness Park, Ennis, Co. Clare, Ireland. Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 APPLICATIONS / BENEFITS Ultrafast recovery 6 Amp rectifier series 50 to 150V Military Space and other high-reliability applications Switching power supplies or other applications requiring extremely fast switching & low forward loss High forward surge current capability Low thermal resistance Controlled avalanche with peak reverse power capability Inherently radiation hard as described in Microsemi MicroNote 050 MAXIMUM RATINGS Junction Temperature: -65oC to +175oC Storage Temperature: -65oC to +175oC Average Rectified Forward Current (IO): 6 A @ TL = 75ºC at 3/8 inch lead length (see note 1) Thermal Resistance: 22 ºC/W junction to lead (L=.375 in) Thermal Impedance: 1.5 ºC/W @ 10 ms heating time Forward Surge Current (8.3 ms half sine) 125 Amps Capacitance: 60 pF at 10 volts, f = 1 MHz Solder temperature: 260ºC for 10 s (maximum) MECHANICAL AND PACKAGING CASE: Hermetically sealed voidless hard glass with Tungsten slugs TERMINATIONS: Axial-leads are Tin/Lead (Sn/Pb) over Ni plate over Copper. MARKING: Body painted and part number, etc. POLARITY: Cathode indicated by band Tape & Reel option: Standard per EIA-296 Weight: 750 mg See package dimensions on last page T4-LDS-0168 Rev. 1 (101025) Page 2 of 7 TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http://www.microsemi.com Gort Road Bussiness Park, Ennis, Co. Clare, Ireland. Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 ELECTRICAL CHARACTERISTICS @ 30oC Case Temperature WORKING BREAKDOWN VOLTAGE PEAK (MIN.) REVERSE VOLTAGE @ 100μA VRWM VBR VOLTS VOLTS AVERAGE RECTIFIED CURRENT IO1 @TL=75ºC (Note 1) AMPS AVERAGE RECTIFIED CURRENT IO2 @TA=55ºC Note 2 MAXIMUM FORWARD VOLTAGE @ 4A (8.3 ms pulse) VF VOLTS 25 C 1N5807, US 1N5809, US 1N5811, US 50 100 150 60 110 160 6.0 6.0 6.0 3.0 3.0 3.0 0.875 0.875 0.875 o TYPE REVERSE CURRENT (MAX) @ VRWM IR μA 25 C 5 5 5 o SURGE CURRENT (MAX) IFSM (NOTE 3) AMPS REVERSE RECOVERY TIME (MAX) (NOTE 4) trr ns 100 C 0.800 0.800 0.800 o 125 C 525 525 525 125 125 125 30 30 30 o NOTE 1: Leaded: Rated at TL = 75ºC at 3/8 inch lead length. Derate at 60 mA/ºC for TL above 75ºC. Surface mount: Rated at TEC = 75°C. Derate at 60 mA/ºC for TEC above 75ºC. NOTE 2: Derate linearly at 25 mA/ºC above TA = 55ºC. This rating is typical for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where TJ(max) does not exceed 175ºC NOTE 3: TA = 25oC @ IO = 3.0 A and VRWM for ten 8.3 ms surges at 1 minute intervals NOTE 4: IF = 1.0 A, IRM = 1.0 A, IR(REC) = 0.10 A and di/dt = 100 A/µs min SYMBOLS & DEFINITIONS Symbol VBR VRWM VF IR C trr Definition Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current. Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating temperature range. Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current. Maximum Leakage Current: The maximum leakage current that will flow at the specified voltage and temperature. Capacitance: The capacitance in pF at a frequency of 1 MHz and specified voltage Reverse Recovery Time: The time interval between the instant the current passes through zero when changing from the forward direction to the reverse direction and a specified recovery decay point after a peak reverse current is reached. T4-LDS-0168 Rev. 1 (101025) Page 3 of 7 TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http://www.microsemi.com Gort Road Bussiness Park, Ennis, Co. Clare, Ireland. Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 GRAPHS FIGURE 1 TYPICAL FORWARD CURRENT vs. FORWARD VOLTAGE FIGURE 2 TYPICAL REVERSE CURRENT vs. VOLTAGE FIGURE 3 OUTPUT CURRENT vs LEAD TEMPERATURE FIGURE 4 FORWARD PULSE CURRENT vs. DURATION T4-LDS-0168 Rev. 1 (101025) Page 4 of 7 TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http://www.microsemi.com Gort Road Bussiness Park, Ennis, Co. Clare, Ireland. Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 FIGURE 6 MAXIMUM LEAD TEMP. vs. PD FIGURE 7 MULTIPLE SURGE CURRENT vs. DURATION T4-LDS-0168 Rev. 1 (101025) Page 5 of 7 TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http://www.microsemi.com Gort Road Bussiness Park, Ennis, Co. Clare, Ireland. Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 PACKAGE DIMENSIONS Ltr BD BL LD LL NOTE: Dimensions 1N5802, 1N5804, 1N5806 1N5807, 1N5809, 1N5811 Inches Millimeters Inches Millimeters Min Max Min Max Min Max Min Max .065 .085 1.65 2.16 .115 .142 2.92 3.61 .125 .250 3.18 6.35 .130 .300 3.30 7.62 .027 .032 0.69 0.81 .036 .042 0.91 1.07 .700 1.30 17.78 33.02 .900 1.30 22.86 33.02 Notes 4 3 3 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. Dimension BL shall include the entire body including slugs and sections of the lead over which the diameter is uncontrolled. This uncontrolled area is defined as the zone between the edge of the diode body and extending .050 inch (1.27 mm) onto the leads. 4. Dimension BD shall be measured at the largest diameter. 5. In accordance with ASME Y14.5M, diameters are equivalent to φx symbology. Lead Tolerance = + .002 -.003 in *Includes sections of the lead or fillet over which the lead diameter is uncontrolled. T4-LDS-0168 Rev. 1 (101025) Page 6 of 7 TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http://www.microsemi.com Gort Road Bussiness Park, Ennis, Co. Clare, Ireland. Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 PACKAGE DIMENSIONS PAD LAYOUT Dimensions 1N5802US, 1N5807US, 1N5804US, 1N5806US 1N5809US, 1N5811US Inches Millimeters Inches Millimeters Min Max Min Max Min Max Min Max .091 .103 2.31 2.62 .137 .148 3.84 3.76 .168 .200 4.27 5.08 .200 .225 5.08 5.72 .019 .028 0.48 0.71 .019 .028 0.48 0.71 .003 0.08 .003 0.08 INCHES mm 0.288 7.32 A 0.070 1.78 B 0.155 3.94 C Note: If mounting requires adhesive separate from the solder, an additional 0.080 inch diameter contact may be placed in the center between the pads as an optional spot for cement. Ltr Notes BD BL ECT S NOTE 1: 6. 7. 8. 9. 10. 11. Dimensions are in inches. Millimeters are given for general information only. Dimensions are pre-solder dip. Minimum clearance of glass body to mounting surface on all orientations. Cathode marking to be either in color band, three dots spaced equally, or a color dot on the face of the end tab. Color dots will be .020 inch (0.51 mm) diameter minimum and those on the face of the end tab shall not lie within .020 inch (0.51 mm) of the mounting surface. 12. In accordance with ASME Y14.5M, diameters are equivalent to φx symbology. NOTE 2: This Package Outline has also previously been identified as “D-5B” T4-LDS-0168 Rev. 1 (101025) Page 7 of 7