1N6114AUS

1N6103AUS – 1N6137AUS Available on commercial versions Voidless Hermetically Sealed Surface Mount Bidirectional Transient Voltage Suppressors Qualified to MIL-PRF-19500/516 Qualified Levels: JAN, JANTX, JANTXV and JANS* DESCRIPTION This surface mount series of industry recognized voidless, hermetically sealed, bidirectional Transient Voltage Suppressors (TVS) designs is military qualified to MIL-PRF-19500/516 and is ideal for high-reliability applications where a failure cannot be tolerated. They provide a Working Peak “Standoff” Voltage selection from 5.7 to 152 Volts with a 500 W rating for a 10/1000 µs pulse. They are very robust in hard-glass construction and internal “Category 1” metallurgical bonds. These are also available as both a non-suffix part and an “A” version providing different voltage tolerances as described in the nomenclature section. These devices are also available in axialleaded packages for thru-hole mounting. Also available in: Important: For the latest information, visit our website http://www.microsemi.com. FEATURES • • • • • • “B” or SQ-MELF Package “B” Package • High surge current and peak pulse power provides transient voltage protection for sensitive circuits. Triple-layer passivation. Internal “Category 1” metallurgical bonds. Voidless hermetically sealed glass package. JAN, JANTX, and JANTXV qualified versions are available per MIL-PRF-19500/516. *JANS available for 1N6103(A)US thru 1N6118(A)US per MIL-PRF-19500/516 as well as further options for screening in reference to MIL-PRF-19500 for all others in this series. (See part nomenclature for all available options.) RoHS compliant versions available (commercial grade only). • • • • • • • • • Military and other high-reliability applications. Extremely robust construction. Extensive range in working peak “standoff” voltage (V WM ) from 5.7 to 152 volts. 500 watt peak pulse power (P PP ) for a 10/1000 µs pulse. ESD and EFT protection per IEC6100-4-2 and IEC61000-4-4 respectively. Protection from the secondary effects of lightning per select levels in IEC61000-4-5. Square-end-cap terminals for easy placement. Non-sensitive to ESD per MIL-STD-750 method 1020. Inherently radiation hard as described in Microsemi “MicroNote 050”. (axial-leaded) 1N6103 – 1N6137 APPLICATIONS / BENEFITS o MAXIMUM RATINGS @ T A = 25 C unless otherwise noted Parameters/Test Conditions Junction and Storage Temperature Thermal Resistance Junction-to-End Cap Peak Pulse Power @ 25 ºC (10/1000 µs) o (1) Steady-State Power up to T EC = 150 C o (2) Steady-State Power @ T A = 25 C Impulse Repetition Rate Solder Temperature @ 10 s Notes: 1. 2. Symbol Value T J and T STG R ӨJEC P PP -55 to +175 8.3 500 PD PD df T SP 3.0 2.0 0.01 260 Unit o o C C/W W W W % o C Linearly derate above T EC =150 oC to zero at T EC =175 oC. Steady-state power ratings with reference to ambient are for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where maximum rated T J is not exceeded (also see figure 4). T4-LDS-0277-1, Rev. 1 (121354) ©2013 Microsemi Corporation MSC – Lawrence 6 Lake Street, Lawrence, MA 01841 Tel: 1-800-446-1158 or (978) 620-2600 Fax: (978) 689-0803 MSC – Ireland Gort Road Business Park, Ennis, Co. Clare, Ireland Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 Website: www.microsemi.com Page 1 of 6 1N6103AUS – 1N6137AUS MECHANICAL and PACKAGING • • • • • • • CASE: Hermetically sealed voidless hard glass with tungsten slugs. TERMINALS: Tin/lead plate over copper. RoHS compliant matte-tin is available on commercial grade only. MARKING: None. POLARITY: No polarity marking for these bidirectional TVSs. TAPE & REEL option: Standard per EIA-481-B. Consult factory for quantities. WEIGHT: Approximately 539 milligrams. See Package Dimensions on last page. PART NOMENCLATURE Applicable to entire series: JAN 1N6103 A US (e3) Reliability Level JAN = JAN Level JANTX = JANTX Level JANTXV = JANTXV Level Blank = commercial RoHS Compliance e3 = RoHS compliant (available on commercial grade only) Blank = non-RoHS compliant Surface Mount Package JEDEC type number See Electrical Characteristics table Voltage Tolerance A = Standard Blank =5% higher V C , 5% lower min. V (BR) and 5% lower I PP Applicable to 1N6103(A)US – 1N6118(A)US only: JANS 1N6103 A US Reliability Level JANS = JANS Level Surface Mount Package Voltage Tolerance A = Standard Blank =5% higher V C , 5% lower min. V (BR) and 5% lower I PP JEDEC type number See Electrical Characteristics table Applicable to 1N6119(A)US – 1N6137(A)US only: MSP 1N6119 A US (e3) Reliability Level MSP (reference JANS) RoHS Compliance e3 = RoHS compliant Blank = non-RoHS compliant JEDEC type number See Electrical Characteristics table Surface Mount Package Voltage Tolerance A = Standard Blank =5% higher V C , 5% lower min. V (BR) and 5% lower I PP T4-LDS-0277-1, Rev. 1 (121354) ©2013 Microsemi Corporation Page 2 of 6 1N6103AUS – 1N6137AUS SYMBOLS & DEFINITIONS Definition Symbol ID VC Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current. Working Peak Voltage: The maximum peak voltage that can be applied over the operating temperature range. This is also referred to as Standoff Voltage. Maximum Standoff Current: The maximum current that will flow at the specified voltage and temperature. Maximum clamping voltage at specified I PP (Peak Pulse Current) at the specified pulse conditions. P PP Peak Pulse Power: The peak power dissipation resulting from the peak impulse current I PP . V (BR) V WM ELECTRICAL CHARACTERISTICS INDUSTRY TYPE NUMBER (Note 1) †1N6103AUS †1N6104AUS †1N6105AUS †1N6106AUS †1N6107AUS †1N6108AUS †1N6109AUS †1N6110AUS †1N6111AUS †1N6112AUS †1N6113AUS †1N6114AUS †1N6115AUS †1N6116AUS †1N6117AUS †1N6118AUS 1N6119AUS 1N6120AUS 1N6121AUS 1N6122AUS 1N6123AUS 1N6124AUS 1N6125AUS 1N6126AUS 1N6127AUS 1N6128AUS 1N6129AUS 1N6130AUS 1N6131AUS 1N6132AUS 1N6133AUS 1N6134AUS 1N6135AUS 1N6136AUS 1N6137AUS MINIMUM BREAKDOWN VOLTAGE (Note 1) V (BR) @ I (BR) Volts 7.13 7.79 8.65 9.50 10.45 11.40 12.35 14.25 15.20 17.10 19.0 20.9 22.8 25.7 28.5 31.4 34.2 37.1 40.9 44.7 48.5 53.2 58.9 64.6 71.3 77.9 86.5 95.0 104.5 114.0 123.5 142.5 152.0 171.0 190.0 mA 175 150 150 125 125 100 100 75 75 65 65 50 50 50 40 40 30 30 30 25 25 20 20 20 20 15 15 12 12 10 10 8 8 5 5 RATED STANDOFF VOLTAGE MAXIMUM STANDBY CURRENT V WM I D @ V WM µA 50 20 20 20 20 20 20 20 20 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 V 5.7 6.2 6.9 7.6 8.4 9.1 9.9 11.4 12.2 13.7 15.2 16.7 18.2 20.6 22.8 25.1 27.4 29.7 32.7 35.8 38.8 42.6 47.1 51.7 56.0 62.2 69.2 76.0 86.6 91.2 98.8 114.0 121.6 136.8 152.0 MAXIMUM CLAMPING VOLTAGE (Note 1) V C @ I PP Volts 11.2 12.1 13.4 14.5 15.6 16.9 18.2 21.0 22.3 25.1 27.7 30.5 33.3 37.4 41.6 45.7 49.9 53.6 59.1 64.6 70.1 77.0 85.3 97.1 103.1 112.8 125.1 137.6 151.3 165.1 178.8 206.3 218.4 245.7 273.0 MAXIMUM PEAK PULSE CURRENT (Note 1) I PP Amps 44.6 41.3 37.3 34.5 32.0 29.6 27.5 23.8 22.4 19.9 18.0 16.4 15.0 13.4 12.0 10.9 10.0 9.3 8.5 7.7 7.1 6.5 5.9 5.1 4.8 4.4 4.0 3.6 3.3 3.0 2.8 2.4 2.3 2.0 1.8 MAXIMUM TEMP. COEF. OF V (BR) α V(BR) o %/ C .06 .06 .06 .07 .07 .07 .08 .08 .08 .085 .085 .085 .09 .09 .09 .095 .095 .095 .095 .095 .095 .095 .100 .100 .100 .100 .100 .100 .100 .100 .105 .105 .105 .110 .110 † Also available in JANS qualification per MIL-PRF-19500/516. Notes: 1. Part number without the A suffix has 5% higher V C , 5% lower minimum V (BR) , and 5% lower I PP . T4-LDS-0277-1, Rev. 1 (121354) ©2013 Microsemi Corporation Page 3 of 6 1N6103AUS – 1N6137AUS Peak Pulse Power (PPP) GRAPHS Pulse Time (t p ) Max Peak Pulse Power (PPP) or current (IPP) in percent of Max Ratings FIGURE 1 Peak Pulse Power vs. Pulse Time Junction Temperature (T J ) in °C FIGURE 2 Peak Pulse Power vs T J (prior to impulse) T4-LDS-0277-1, Rev. 1 (121354) ©2013 Microsemi Corporation Page 4 of 6 1N6103AUS – 1N6137AUS Pulse Current (IPP) in Percent of IPP GRAPHS Time (t) in milliseconds DC Operation Maximum Rating (W) FIGURE 3 Pulse Wave Form T A (°C) (Ambient) FIGURE 4 Temperature-Power Derating Curve T4-LDS-0277-1, Rev. 1 (121354) ©2013 Microsemi Corporation Page 5 of 6 1N6103AUS – 1N6137AUS PACKAGE DIMENSIONS Ltr BD BL ECT S Dimensions Inch Millimeters Min Max Min Max 0.137 0.148 3.48 3.76 0.200 0.225 5.08 5.72 0.019 0.028 0.48 0.71 0.003 0.08 - Notes 4 NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. Minimum clearance of glass body to mounting surface on all orientations. 4. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology. PAD LAYOUT DIM A1 A2 B C INCH 0.288 0.144 0.070 0.155 MILLIMETERS 7.32 3.66 1.78 3.94 NOTE: If mounting requires adhesive separate from the solder, an additional 0.080 inch (2.03 mm) diameter contact may be placed in the center between the pads as an optional spot for cement. T4-LDS-0277-1, Rev. 1 (121354) ©2013 Microsemi Corporation Page 6 of 6