2N2222AUB

TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http: //www.microsemi.com RADIATION HARDENED NPN SILICON SWITCHING TRANSISTOR Qualified per MIL-PRF-19500/255 DEVICES LEVELS 2N2221A 2N2221AL 2N2221AUA 2N2221AUB 2N2221AUBC 2N2222A 2N2222AL 2N2222AUA 2N2222AUB 2N2222AUBC JANSM – 3K Rads (Si) JANSD – 10K Rads (Si) JANSP – 30K Rads (Si) JANSL – 50K Rads (Si) JANSR – 100K Rads (Si) JANSF – 300K Rads (Si) JANSG – 500K Rads (Si) JANSH – 1MEG Rads (Si) ABSOLUTE MAXIMUM RATINGS (TC = +25°C unless otherwise noted) Parameters / Test Conditions Collector-Emitter Voltage Collector-Base Voltage Emitter-Base Voltage Collector Current Total Power Dissipation @ TA = +25°C 2N2221A, L 2N2221AUA 2N2221AUB, UBC 2N2222A, L 2N2222AUA 2N2222AUB, UBC PT 0.5 0.65 0.50 -65 to +200 W Symbol VCEO VCBO VEBO IC Value 50 75 6.0 800 Unit Vdc Vdc Vdc mAdc TO-18 (TO-206AA) 2N2221A, 2N2222A Operating & Storage Junction Temperature Range Top, Tstg °C THERMAL CHARACTERISTICS Parameters / Test Conditions Thermal Resistance, Junction-to-Ambient 2N2221A, L 2N2221AUA 2N2221AUB, UBC 1. 2. 2N2222A, L 2N2222AUA 2N2222AUB, UBC RθJA 325 210 325 °C/W Symbol Max. Unit 4 PIN 2N2221AUA, 2N2222AUA Derate linearly 3.08 mW/°C above TA > +37.5°C Derate linearly 4.76 mW/°C above TA > +63.5°C 3 PIN 2N2221AUB, 2N2222AUB 2N2221AUBC, 2N2222AUBC (UBC = Ceramic Lid Version) T4-LDS-0042 Rev. 3 (100247) Page 1 of 7 TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http: //www.microsemi.com ELECTRICAL CHARACTERISTICS (TA = +25°C, unless otherwise noted) Parameters / Test Conditions OFF CHARACTERISTICS Collector-Emitter Breakdown Voltage IC = 10mAdc Symbol Min. Max. Unit V(BR)CEO 50 Vdc Collector-Base Cutoff Current VCB = 75Vdc VCB = 60Vdc Emitter-Base Cutoff Current VEB = 6.0Vdc VEB = 4.0Vdc Collector-Emitter Cutoff Current VCE = 50Vdc ICBO 10 10 μAdc ηAdc IEBO 10 10 μAdc ηAdc ICES 50 ηAdc ON CHARACTERISTICS (3) Forward-Current Transfer Ratio IC = 0.1mAdc, VCE = 10Vdc 2N2221A, L, UA, UB, UBC 2N2222A, L, UA, UB, UBC 2N2221A, L, UA, UB, UBC 2N2222A, L, UA, UB, UBC 2N2221A, L, UA, UB, UBC 2N2222A, L, UA, UB, UBC 2N2221A, L, UA, UB, UBC 2N2222A, L, UA, UB, UBC 2N2221A, L, UA, UB, UBC 2N2222A, L, UA, UB, UBC hFE 30 50 35 75 40 100 40 100 20 30 0.3 1.0 120 300 150 325 IC = 1.0mAdc, VCE = 10Vdc IC = 10mAdc, VCE = 10Vdc IC = 150mAdc, VCE = 10Vdc IC = 500mAdc, VCE = 10Vdc Collector-Emitter Saturation Voltage IC = 150mAdc, IB = 15mAdc IC = 500mAdc, IB = 50mAdc Base-Emitter Voltage IC = 150mAdc, IB = 15mAdc IC = 500mAdc, IB = 50mAdc VCE(sat) Vdc VBE(sat) 0.6 1.2 2.0 Vdc T4-LDS-0042 Rev. 3 (100247) Page 2 of 7 TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http: //www.microsemi.com DYNAMIC CHARACTERISTICS Parameters / Test Conditions Small-Signal Short-Circuit Forward Current Transfer Ratio IC = 1.0mAdc, VCE = 10Vdc, f = 1.0kHz 2N2221A, L, UA, UB, UBC 2N2222A, L, UA, UB, UBC Magnitude of Small–Signal Short-Circuit Forward Current Transfer Ratio IC = 20mAdc, VCE = 20Vdc, f = 100MHz Symbol hfe Min. 30 50 Max. Unit |hfe| 2.5 Output Capacitance VCB = 10Vdc, IE = 0, 100kHz ≤ f ≤ 1.0MHz Input Capacitance VEB = 0.5Vdc, IC = 0, 100kHz ≤ f ≤ 1.0MHz Cibo 25 pF Cobo 8.0 pF SWITCHING CHARACTERISTICS Parameters / Test Conditions Turn-On Time See figure 8 of MIL-PRF-19500/255 Turn-Off Time See Figure 9 of MIL-PRF-19500/255 (3) Pulse Test: Pulse Width = 300μs, Duty Cycle ≤ 2.0%. Symbol ton Min. Max. 35 Unit ηs toff 300 ηs T4-LDS-0042 Rev. 3 (100247) Page 3 of 7 TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http: //www.microsemi.com PACKAGE DIMENSIONS NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. Beyond r (radius) maximum, TL shall be held for a minimum length of .011 inch (0.28 mm). 4. Dimension TL measured from maximum HD. 5. Body contour optional within zone defined by HD, CD, and Q. 6. Leads at gauge plane .054 +.001 -.000 inch (1.37 +0.03 -0.00 mm) below seating plane shall be within .007 inch (0.18 mm) radius of true position (TP) at maximum material condition (MMC) relative to tab at MMC. 7. Dimension LU applies between L1 and L2. Dimension LD applies between L2 and LL minimum. Diameter is uncontrolled in L1 and beyond LL minimum. 8. All three leads. 9. The collector shall be internally connected to the case. 10. Dimension r (radius) applies to both inside corners of tab. 11. In accordance with ASME Y14.5M, diameters are equivalent to φx symbology. 12. Lead 1 = emitter, lead 2 = base, lead 3 = collector. 13. For L suffix devices, dimension LL = 1.5 inches (38.10 mm) min. and 1.75 inches (44.45 mm) max. Symbol CD CH HD LC LD LL LU L1 L2 P Q TL TW r α Dimensions Inches Millimeters Min Max Min Max .178 .195 4.52 4.95 .170 .210 4.32 5.33 .209 .230 5.31 5.84 .100 TP 2.54 TP .016 .021 0.41 0.53 .500 .750 12.70 19.05 .016 .019 0.41 0.48 .050 1.27 .250 6.35 .100 2.54 .030 0.76 .028 .048 0.71 1.22 .036 .046 0.91 1.17 .010 0.25 45° TP 45° TP 1, 2, 9, 11, 12, 13 Note 6 7,8 7,8,13 7,8 7,8 7,8 5 3,4 3 10 6 FIGURE 1. Physical dimensions (similar to TO-18). T4-LDS-0042 Rev. 3 (100247) Page 4 of 7 TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http: //www.microsemi.com NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. Dimension CH controls the overall package thickness. When a window lid is used, dimension CH must increase by a minimum of .010 inch (0.254 mm) and a maximum of .040 inch (1.020 mm). 4. The corner shape (square, notch, radius) may vary at the manufacturer's option, from that shown on the drawing. 5. Dimensions LW2 minimum and L3 minimum and the appropriate castellation length define an unobstructed three-dimensional space traversing all of the ceramic layers in which a castellation was designed. (Castellations are required on the bottom two layers, optional on the top ceramic layer.) Dimension LW2 maximum and L3 maximum define the maximum width and depth of the castellation at any point on its surface. Measurement of these dimensions may be made prior to solder dipping. 6. The co-planarity deviation of all terminal contact points, as defined by the device seating plane, shall not exceed .006 inch (0.15mm) for solder dipped leadless chip carriers. 7. In accordance with ASME Y14.5M, diameters are equivalent to φx symbology. Symbol BL BL2 BW BW2 CH L3 LH LL1 LL2 LS LW LW2 Dimensions Inches Millimeters Min Max Min Max .215 .225 5.46 5.71 .225 5.71 .145 .155 3.68 3.93 .155 3.93 .061 .075 1.55 1.90 .003 .007 0.08 0.18 .029 .042 0.74 1.07 .032 .048 0.81 1.22 .072 .088 1.83 2.23 .045 .055 1.14 1.39 .022 .028 0.56 0.71 .006 .022 0.15 0.56 Note 3 5 5 Pin no. Transistor 1 Collector 2 Emitter 3 Base 4 N/C FIGURE 2. Physical dimensions, surface mount (UA version). T4-LDS-0042 Rev. 3 (100247) Page 5 of 7 TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http: //www.microsemi.com UB Symbol BH BL BW CL CW LL1 LL2 Dimensions Inches Millimeters Min Max Min Max .046 .056 1.17 1.42 .115 .128 2.92 3.25 .085 .108 2.16 2.74 .128 3.25 .108 2.74 .022 .038 0.56 0.96 .017 .035 0.43 0.89 Note Symbol LS1 LS2 LW r r1 r2 Dimensions Inches Millimeters Min Max Min Max .036 .040 0.91 1.02 .071 .079 1.81 2.01 .016 .024 0.41 0.61 .008 .203 .012 .305 .022 .559 Note NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. Hatched areas on package denote metalized areas. 4. Pad 1 = Base, Pad 2 = Emitter, Pad 3 = Collector, Pad 4 = Shielding connected to the lid. 5. In accordance with ASME Y14.5M, diameters are equivalent to φx symbology. FIGURE 3. Physical dimensions, surface mount (UB version) T4-LDS-0042 Rev. 3 (100247) Page 6 of 7 TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http: //www.microsemi.com UBC Symbol BH BL BW CL CW LL1 LL2 Dimensions Inches Millimeters Min Max Min Max .046 .071 1.17 1.80 .115 .128 2.92 3.25 .085 .108 2.16 2.74 .128 3.25 .108 2.74 .022 .038 0.56 0.96 .017 .035 0.43 0.89 Note Symbol LS1 LS2 LW r r1 r2 Dimensions Inches Millimeters Min Max Min Max .036 .040 0.91 1.02 .071 .079 1.81 2.01 .016 .024 0.41 0.61 .008 .203 .012 .305 .022 .559 Note NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. Hatched areas on package denote metalized areas. 4. Pad 1 = Base, Pad 2 = Emitter, Pad 3 = Collector, Pad 4 = Connected to the lid braze ring. 5. In accordance with ASME Y14.5M, diameters are equivalent to φx symbology. FIGURE 4. Physical dimensions, surface mount (UBC version, ceramic lid) T4-LDS-0042 Rev. 3 (100247) Page 7 of 7