APT13GP120K
1200V
POWER MOS 7 IGBT
®
A new generation of high voltage power IGBTs. Using punch-through
technology and a proprietary metal gate, this IGBT has been optimized for very
fast switching, making it ideal for high frequency, high voltage switch-mode
power supplies and tail current sensitive applications. In many cases, the
POWER MOS 7® IGBT provides a lower cost alternative to a Power MOSFET.
• Low Conduction Loss
• 100 kHz operation @ 600V, 10A
• Low Gate Charge
• 50 kHz operation @ 600V, 16A
• Ultrafast Tail Current shutoff
• RBSOA Rated
MAXIMUM RATINGS
Symbol
TO-220
G
C
C
E
G
E
All Ratings: TC = 25°C unless otherwise specified.
Parameter
APT13GP120K
VCES
Collector-Emitter Voltage
1200
VGE
Gate-Emitter Voltage
±20
Gate-Emitter Voltage Transient
±30
VGEM
I C1
Continuous Collector Current @ TC = 25°C
41
I C2
Continuous Collector Current @ TC = 110°C
20
I CM
Pulsed Collector Current
RBSOA
PD
TJ,TSTG
TL
1
UNIT
Volts
Amps
50
@ TC = 150°C
50A @ 960V
Reverse Bias Safe Operating Area @ TJ = 150°C
250
Total Power Dissipation
Watts
-55 to 150
Operating and Storage Junction Temperature Range
°C
300
Max. Lead Temp. for Soldering: 0.063" from Case for 10 Sec.
STATIC ELECTRICAL CHARACTERISTICS
Characteristic / Test Conditions
TYP
MAX
4.5
6
Collector-Emitter On Voltage (VGE = 15V, I C = 13A, Tj = 25°C)
3.3
3.9
Collector-Emitter On Voltage (VGE = 15V, I C = 13A, Tj = 125°C)
3.0
Collector-Emitter Breakdown Voltage (VGE = 0V, I C = 250µA)
VGE(TH)
Gate Threshold Voltage
VCE(ON)
I CES
I GES
1200
3
(VCE = VGE, I C = 1mA, Tj = 25°C)
Collector Cut-off Current (VCE = 1200V, VGE = 0V, Tj = 25°C)
UNIT
2
Collector Cut-off Current (VCE = 1200V, VGE = 0V, Tj = 125°C)
250
2
Gate-Emitter Leakage Current (VGE = ±20V)
µA
2500
±100
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
APT Website - http://www.advancedpower.com
Volts
nA
2-2004
BVCES
MIN
050-7415 Rev B
Symbol
APT13GP120K
DYNAMIC CHARACTERISTICS
Symbol
Characteristic
Test Conditions
1145
VGE = 0V, VCE = 25V
90
Reverse Transfer Capacitance
f = 1 MHz
15
Gate-to-Emitter Plateau Voltage
Gate Charge
VGE = 15V
7.5
VCE = 600V
8
I C = 13A
26
Input Capacitance
Coes
Output Capacitance
Cres
VGEP
Qge
Qgc
RBSOA
TYP
Capacitance
Cies
Qg
MIN
Total Gate Charge
3
Gate-Emitter Charge
Gate-Collector ("Miller ") Charge
Reverse Bias Safe Operating Area
TJ = 150°C, R G = 5Ω, VGE =
MAX
UNIT
pF
V
55
nC
50
A
15V, L = 100µH,VCE = 960V
td(on)
tr
td(off)
tf
Turn-on Delay Time
Current Rise Time
I C = 13A
4
Turn-on Switching Energy (Diode) 5
Eoff
Turn-off Switching Energy
td(on)
Turn-on Delay Time
Eon1
Eon2
Eoff
330
9
12
VGE = 15V
70
I C = 13A
Current Fall Time
5
ns
200
R G = 5Ω
4
Turn-on Switching Energy (Diode)
µJ
165
Inductive Switching (125°C)
VCC = 600V
Turn-off Delay Time
Turn-off Switching Energy
114
TJ = +25°C
6
Current Rise Time
Turn-on Switching Energy
ns
34
R G = 5Ω
Eon2
tf
28
Current Fall Time
Turn-on Switching Energy
td(off)
12
VGE = 15V
Turn-off Delay Time
Eon1
tr
9
Inductive Switching (25°C)
VCC = 600V
223
TJ = +125°C
710
6
µJ
840
THERMAL AND MECHANICAL CHARACTERISTICS
Symbol
Characteristic
MIN
TYP
MAX
RΘJC
Junction to Case (IGBT)
.50
RΘJC
Junction to Case (DIODE)
N/A
Package Weight
1.90
WT
UNIT
°C/W
gm
1 Repetitive Rating: Pulse width limited by maximum junction temperature.
2 For Combi devices, Ices includes both IGBT and FRED leakages
3 See MIL-STD-750 Method 3471.
4 Eon1 is the clamped inductive turn-on-energy of the IGBT only, without the effect of a commutating diode reverse recovery current
adding to the IGBT turn-on loss. (See Figure 24.)
5 Eon2 is the clamped inductive turn-on energy that includes a commutating diode reverse recovery current in the IGBT turn-on switching
loss. (See Figures 21, 22.)
6 Eoff is the clamped inductive turn-off energy measured in accordance with JEDEC standard JESD24-1. (See Figures 21, 23.)
050-7415 Rev B
2-2004
APT Reserves the right to change, without notice, the specifications and information contained herein.
TYPICAL PERFORMANCE CURVES
VGE = 15V.
250µs PULSE TEST
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