APT30DL60HJ

APT30DL60HJ ISOTOP®Fast Diode Full Bridge Power Module VRRM = 600V IF = 30A @ Tc = 80°C Application     Switch mode power supplies rectifier Induction heating Welding equipment High speed rectifiers Features + ~         ~ Ultra fast recovery times Soft recovery characteristics High blocking voltage High current Low leakage current Very low stray inductance High level of integration ISOTOP® Package (SOT-227) Benefits -       Outstanding performance at high frequency operation Low losses Low noise switching Direct mounting to heatsink (isolated package) Low junction to case thermal resistance RoHS Compliant Symbol VR VRRM Parameter Maximum DC reverse Voltage Maximum Peak Repetitive Reverse Voltage IF(AV) Maximum Average Forward Current IFRM Maximum repetitive forward current limited by TJmax Duty cycle = 50% 8.3ms Max ratings Unit 600 V TC = 80°C 30 TJ = 45°C 60 A These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note APT0502 on www.microsemi.com www.microsemi.com 1-4 APT30DL60HJ – Rev1 October 2012 Absolute maximum ratings APT30DL60HJ All ratings @ Tj = 25°C unless otherwise specified Electrical Characteristics Symbol Characteristic Test Conditions VF Diode Forward Voltage IF = 30A IRM Maximum Reverse Leakage Current VR = 600V Min Tj = 25°C Tj = 150°C Tj = 25°C Tj = 150°C Typ 1.6 1.5 Max 2 Unit V 250 500 µA Max Unit Dynamic Characteristics Symbol Characteristic Test Conditions trr Reverse Recovery Time Qrr Reverse Recovery Charge Err Reverse Recovery Energy IF = 30A VR = 300V di/dt = 1800A/µs Min Tj = 25°C Tj = 150°C Tj = 25°C Tj = 150°C Tj = 25°C Tj = 150°C Typ 100 150 1.5 3.1 0.34 0.65 ns µC mJ Thermal and package characteristics Characteristic Junction to Case Thermal resistance Junction to Ambient Min RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz 2500 -55 Storage Temperature Range Max Lead Temp for Soldering:0.063” from case for 10 sec Mounting torque (Mounting = 8-32 or 4mm Machine and terminals = 4mm Machine) Package Weight SOT-227 (ISOTOP®) Package Outline r = 4.0 (.157) (2 places) Max 2.45 20 Unit °C/W V 175 300 1.5 29.2 °C N.m g 11.8 (.463) 12.2 (.480) 31.5 (1.240) 31.7 (1.248) 7.8 (.307) 8.2 (.322) Typ W=4.1 (.161) W=4.3 (.169) H=4.8 (.187) H=4.9 (.193) (4 places) 4.0 (.157) 4.2 (.165) (2 places) 3.3 (.129) 3.6 (.143) 8.9 (.350) 9.6 (.378) Hex Nut M4 (4 places) 0.75 (.030) 0.85 (.033) 25.2 (0.992) 25.4 (1.000) 3.30 (.130) 12.6 (.496) 4.57 (.180) 12.8 (.504) 1.95 (.077) 2.14 (.084) 14.9 (.587) 15.1 (.594) 30.1 (1.185) 30.3 (1.193) Dimensions in Millimeters and (Inches) 38.0 (1.496) 38.2 (1.504) www.microsemi.com 2-4 APT30DL60HJ – Rev1 October 2012 Symbol RthJC RthJA VISOL TJ,TSTG TL Torque Wt APT30DL60HJ Typical Performance Curve Forward Characteristic of diode Energy losses vs Collector Current 60 1 VCE = 300V VGE = -15V TJ = 150°C 50 0.75 Err (mJ) IF (A) 40 30 20 TJ=150°C 0.5 0.25 10 TJ=25°C 0 0 0 0.4 0.8 1.2 1.6 VF (V) 2 0 2.4 10 20 30 40 50 60 IF (A) maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration Thermal Impedance (°C/W) 2.5 2 0.9 0.7 1.5 0.5 1 0.3 0.5 0.1 Single Pulse 0.05 0 0.00001 0.0001 0.001 0.01 0.1 1 10 Rectangular Pulse Duration in Seconds www.microsemi.com 3-4 APT30DL60HJ – Rev1 October 2012 ISOTOP® is a registered trademark of ST Microelectronics NV APT30DL60HJ DISCLAIMER The information contained in the document (unless it is publicly available on the Web without access restrictions) is PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted, transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. 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Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees, subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations that Seller was negligent regarding the design or manufacture of the goods. www.microsemi.com 4-4 APT30DL60HJ – Rev1 October 2012 Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. 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