APT60DS10HJ

APT60DS10HJ ISOTOP® Schottky Diode Full Bridge Power Module VRRM = 100V IF = 60A @ Tc = 80°C Application    Switch mode power supplies rectifier Induction heating Welding equipment Features       + ~ ~ Ultra fast recovery times Soft recovery characteristics High current Very low stray inductance High level of integration ISOTOP® Package (SOT-227) Benefits       - Outstanding performance at high frequency operation Low losses Low noise switching Direct mounting to heatsink (isolated package) Low junction to case thermal resistance RoHS Compliant Symbol VR VRRM IFAV IFSM Parameter Maximum DC reverse Voltage Maximum Peak Repetitive Reverse Voltage Rectangular, d=0.5 Non-Repetitive Forward Surge Current t=10ms TC = 80°C TJ = 45°C Max ratings Unit 100 V 60 700 A These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note APT0502 on www.microsemi.com www.microsemi.com 1-4 APT60DS10HJ – Rev 1 October, 2012 Absolute maximum ratings APT60DS10HJ All ratings @ Tj = 25°C unless otherwise specified Electrical Characteristics Symbol Characteristic Test Conditions IR Reverse Current VR = 100V VF Forward Voltage IF = 60A Min Tj = 25°C Tj = 125°C Tj = 25°C Tj = 125°C Typ Max 2 20 0.91 0.74 Unit mA V Thermal and package characteristics Symbol RthJC RthJA VISOL TJ,TSTG TL Torque Wt Characteristic Junction to Case Thermal resistance Junction to Ambient Min RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz 2500 -55 Storage Temperature Range Max Lead Temp for Soldering:0.063” from case for 10 sec Mounting torque (Mounting = 8-32 or 4mm Machine and terminals = 4mm Machine) Package Weight Typ Max 0.8 20 Unit °C/W V 150 300 1.5 29.2 °C N.m g SOT-227 (ISOTOP®) Package Outline 11.8 (.463) 12.2 (.480) 31.5 (1.240) 31.7 (1.248) 7.8 (.307) 8.2 (.322) r = 4.0 (.157) (2 places) W=4.1 (.161) W=4.3 (.169) H=4.8 (.187) H=4.9 (.193) (4 places) 4.0 (.157) 4.2 (.165) (2 places) 3.3 (.129) 3.6 (.143) 8.9 (.350) 9.6 (.378) Hex Nut M4 (4 places) 0.75 (.030) 0.85 (.033) 25.2 (0.992) 25.4 (1.000) 3.30 (.130) 12.6 (.496) 4.57 (.180) 12.8 (.504) 1.95 (.077) 2.14 (.084) 14.9 (.587) 15.1 (.594) 30.1 (1.185) 30.3 (1.193) Dimensions in Millimeters and (Inches) www.microsemi.com 2-4 APT60DS10HJ – Rev 1 October, 2012 38.0 (1.496) 38.2 (1.504) APT60DS10HJ Typical Performance Curve Forward Characteristic 120 100 TJ=125°C IF (A) 80 60 40 TJ=25°C 20 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 VF (V) maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration Thermal Impedance (°C/W) 1 0.8 0.9 0.6 0.7 0.4 0.2 0.5 0.3 0.1 0.05 0 0.00001 Single Pulse 0.0001 0.001 0.01 0.1 1 10 Rectangular Pulse Duration in Seconds www.microsemi.com 3-4 APT60DS10HJ – Rev 1 October, 2012 ISOTOP® is a registered trademark of ST Microelectronics NV APT60DS10HJ DISCLAIMER The information contained in the document (unless it is publicly available on the Web without access restrictions) is PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted, transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. 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Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees, subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations that Seller was negligent regarding the design or manufacture of the goods. www.microsemi.com 4-4 APT60DS10HJ – Rev 1 October, 2012 Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the new proposed specific part.