APT80F60J
600V, 84A, 0.055Ω Max, trr ≤ 370ns
N-Channel FREDFET
Power MOS 8™ is a high speed, high voltage N-channel switch-mode power MOSFET. This 'FREDFET' version has a drain-source (body) diode that has been optimized for high reliability in ZVS phase shifted bridge and other circuits through reduced trr, soft recovery, and high recovery dv/dt capability. Low gate charge, high gain, and a greatly reduced ratio of Crss/Ciss result in excellent noise immunity and low switching loss. The intrinsic gate resistance and capacitance of the poly-silicon gate structure help control di/dt during switching, resulting in low EMI and reliable paralleling, even when switching at very high frequency.
S G D
S
SO
2 T-
27
"UL Recognized"
IS OTO P ®
file # E145592
APT80F60J Single die FREDFET
G
D
S
FEATURES
• Fast switching with low EMI • Low trr for high reliability • Ultra low Crss for improved noise immunity • Low gate charge • Avalanche energy rated • RoHS compliant
TYPICAL APPLICATIONS
• ZVS phase shifted and other full bridge • Half bridge • PFC and other boost converter • Buck converter • Single and two switch forward • Flyback
Absolute Maximum Ratings
Symbol ID IDM VGS EAS IAR Parameter Continuous Drain Current @ TC = 25°C Continuous Drain Current @ TC = 100°C Pulsed Drain Current Gate-Source Voltage Single Pulse Avalanche Energy 2 Avalanche Current, Repetitive or Non-Repetitive
1
Ratings 84 52 447 ±30 3352 60
Unit
A
V mJ A
Thermal and Mechanical Characteristics
Symbol PD RθJC RθCS TJ,TSTG VIsolation WT Characteristic Total Power Dissipation @ TC = 25°C Junction to Case Thermal Resistance Case to Sink Thermal Resistance, Flat, Greased Surface Operating and Storage Junction Temperature Range RMS Voltage (50-60hHz Sinusoidal Waveform from Terminals to Mounting Base for 1 Min.) Package Weight -55 2500 1.03 29.2 10 1.1 0.15 150 Min Typ Max 961 0.13 Unit W °C/W °C V
Rev C 4-2011 050-8175
oz g in·lbf N·m
Torque
Terminals and Mounting Screws.
Microsemi Website - http://www.microsemi.com
Static Characteristics
Symbol
VBR(DSS) ∆VBR(DSS)/∆TJ RDS(on) VGS(th) ∆VGS(th)/∆TJ IDSS IGSS
TJ = 25°C unless otherwise specified
Test Conditions
VGS = 0V, ID = 250μA Reference to 25°C, ID = 250μA VGS = 10V, ID = 60A VGS = VDS, ID = 2.5mA VDS = 600V VGS = 0V TJ = 25°C TJ = 125°C
APT80F60J
Typ 0.60 0.042 4 -10 Max Unit V V/°C Ω V mV/°C μA nA Unit S
Parameter
Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Drain-Source On Resistance
3
Min 600
Gate-Source Threshold Voltage Threshold Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Source Leakage Current
2.5
0.055 5 250 1000 ±100
VGS = ±30V
Dynamic Characteristics
Symbol
gfs Ciss Crss Coss Co(cr) Co(er) Qg Qgs Qgd td(on) tr td(off) tf
4
TJ = 25°C unless otherwise specified
Test Conditions
VDS = 50V, ID = 60A VGS = 0V, VDS = 25V f = 1MHz
Parameter
Forward Transconductance Input Capacitance Reverse Transfer Capacitance Output Capacitance Effective Output Capacitance, Charge Related Effective Output Capacitance, Energy Related Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Current Rise Time Turn-Off Delay Time Current Fall Time
Min
Typ 117 23994 245 2201
Max
pF
VGS = 0V, VDS = 0V to 400V
1170 606
5
VGS = 0 to 10V, ID = 60A, VDS = 300V
598 128 251 nC
Resistive Switching VDD = 400V, ID = 60A RG = 2.2Ω 6 , VGG = 15V
134 156 408 123 ns
Source-Drain Diode Characteristics
Symbol
IS ISM VSD trr Qrr Irrm dv/dt
Parameter
Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) 1 Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current Peak Recovery dv/dt
Test Conditions
MOSFET symbol showing the integral reverse p-n junction diode (body diode)
Min
D
Typ
Max 84
Unit
G S
A 447 1.0 370 690 2.6 7.0 14.5 20 25 V ns μC A V/ns
ISD = 60A, TJ = 25°C, VGS = 0V TJ = 25°C TJ = 125°C ISD = 60A 3 VDD = 100V diSD/dt = 100A/μs TJ = 25°C TJ = 125°C TJ = 25°C TJ = 125°C ISD ≤ 60A, di/dt ≤1000A/μs, VDD = 400V, TJ = 125°C
1 Repetitive Rating: Pulse width and case temperature limited by maximum junction temperature. 2 Starting at TJ = 25°C, L = 2.08mH, RG = 25Ω, IAS = 60A.
Rev C 4-2011
3 Pulse test: Pulse Width < 380μs, duty cycle < 2%. 4 Co(cr) is defined as a fixed capacitance with the same stored charge as COSS with VDS = 67% of V(BR)DSS. 5 Co(er) is defined as a fixed capacitance with the same stored energy as COSS with VDS = 67% of V(BR)DSS. To calculate Co(er) for any value of VDS less than V(BR)DSS, use this equation: Co(er) = -3.14E-7/VDS^2 + 7.31E-8/VDS + 2.09E-10. 6 RG is external gate resistance, not including internal gate resistance or gate driver impedance. (MIC4452)
Microsemi reserves the right to change, without notice, the specifications and information contained herein.
050-8175
APT80F60J
350 300 ID, DRAIN CURRENT (A) 250 200
TJ = 25°C
V
GS
= 10V
160
T = 125°C
J
V
140 ID, DRIAN CURRENT (A)
TJ = -55°C
GS
= 7,8 & 10V
120 100 80 60 40
5V 6V
150 100 50 0
TJ = 125°C TJ = 150°C
20 0 5 10 15 20 25 VDS(ON), DRAIN-TO-SOURCE VOLTAGE (V) Figure 1, Output Characteristics
NORMALIZED TO VGS = 10V @ 42A
4.5V
0
0
5 10 15 20 25 30 VDS, DRAIN-TO-SOURCE VOLTAGE (V) Figure 2, Output Characteristics
RDS(ON), DRAIN-TO-SOURCE ON RESISTANCE
2.5
280 240 ID, DRAIN CURRENT (A) 200 160 120 80 40
VDS> ID(ON) x RDS(ON) MAX. 250 μSEC. PULSE TEST @