APTGT30X60T3G

APTGT30X60T3G VCES = 600V IC = 30A @ Tc = 80°C 3 Phase bridge Trench + Field Stop IGBT3 Power Module 15 19 20 23 29 25 30 18 11 10 Application  Motor control 31 16 14 22 8 4 7 3 28 R1 13 12 2 It is recommended to connect a decoupling capacitor between pins 31 & 2 to reduce switching overvoltages, if DC Power is connected between pins 15, 16 & 12. Pins 15 & 16 must be shorted together. Features  Trench + Field Stop IGBT3 - Low voltage drop - Low tail current - Switching frequency up to 20 kHz - Low leakage current - RBSOA and SCSOA rated  Kelvin emitter for easy drive  Very low stray inductance  Internal thermistor for temperature monitoring Benefits  Outstanding performance at high frequency operation  Direct mounting to heatsink (isolated package)  Low junction to case thermal resistance  Solderable terminals both for power and signal for easy PCB mounting  Low profile  RoHS compliant All ratings @ Tj = 25°C unless otherwise specified Absolute maximum ratings (Per IGBT) IC ICM VGE PD RBSOA Parameter Collector - Emitter Voltage TC = 25°C TC = 80°C TC = 25°C Continuous Collector Current Pulsed Collector Current Gate – Emitter Voltage Power Dissipation Reverse Bias Safe Operating Area TC = 25°C TJ = 150°C Max ratings 600 50 30 60 ±20 90 60A @ 550V Unit V A V W These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. www.microsemi.com 1-6 APTGT30X60T3G – Rev 2 November, 2017 Symbol VCES APTGT30X60T3G Electrical Characteristics (Per IGBT) Symbol Characteristic ICES Zero Gate Voltage Collector Current VCE(sat) Collector Emitter Saturation Voltage VGE(th) IGES Gate Threshold Voltage Gate – Emitter Leakage Current Test Conditions VGE = 0V, VCE = 600V Tj = 25°C VGE =15V IC = 30A Tj = 150°C VGE = VCE , IC = 400µA VGE = 20V, VCE = 0V Min Typ 5.0 1.5 1.7 5.8 Min Typ Max Unit 250 1.9 µA 6.5 300 V nA Max Unit V Dynamic Characteristics (Per IGBT) Symbol Characteristic Test Conditions Cies Coes Cres Input Capacitance Output Capacitance Reverse Transfer Capacitance VGE = 0V VCE = 25V f = 1MHz 1600 110 50 Td(on) Tr Td(off) Turn-on Delay Time Rise Time Turn-off Delay Time Inductive Switching (25°C) VGE = ±15V VBus = 300V IC = 30A RG = 10 Inductive Switching (150°C) VGE = ±15V VBus = 300V IC = 30A RG = 10 VGE = ±15V Tj = 150°C VBus = 300V IC = 30A Tj = 150°C RG = 10 110 45 200 Tf Fall Time Td(on) Turn-on Delay Time Tr Rise Time Turn-off Delay Time Fall Time Td(off) Tf Eon Turn-on Switching Energy Eoff Turn-off Switching Energy RthJC Junction to Case Thermal Resistance pF ns 40 120 50 250 60 ns 0.3 mJ 1.05 mJ 1.6 °C/W Max Unit 600 V 250 µA Reverse diode ratings and characteristics (Per diode) VRRM IRM IF Min Typ Peak Repetitive Reverse Voltage Reverse Leakage Current VR=600V DC Forward Current VF Diode Forward Voltage trr Reverse Recovery Time Qrr Reverse Recovery Charge Er Reverse Recovery Energy RthJC Test Conditions IF = 30A VGE = 0V IF = 30A VR = 300V di/dt =1800A/µs Junction to Case Thermal Resistance Tc = 80°C Tj = 25°C Tj = 150°C Tj = 25°C 30 1.6 1.5 100 Tj = 150°C Tj = 25°C 150 1.5 Tj = 150°C Tj = 25°C Tj = 150°C 3.1 0.34 0.75 A 2 ns µC mJ 2.45 www.microsemi.com V °C/W 2-6 APTGT30X60T3G – Rev 2 November, 2017 Symbol Characteristic APTGT30X60T3G Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information). Symbol R25 ∆R25/R25 B25/85 ∆B/B Characteristic Resistance @ 25°C Min T25 = 298.15 K TC=100°C RT  R25 Typ 50 5 3952 4 Max Unit k % K % T: Thermistor temperature   1 1  RT: Thermistor value at T exp B25 / 85     T25 T   Thermal and package characteristics Symbol VISOL TJ TJOP TSTG TC Torque Wt Characteristic RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz Operating junction temperature range Recommended junction temperature under switching conditions Storage Temperature Range Operating Case Temperature Mounting torque To heatsink M4 Package Weight Min 4000 -40 -40 -40 -40 2 Max 175 TJmax -25 125 125 3 110 Unit V °C N.m g See application note 1906 - Mounting Instructions for SP3F Power Modules on www.microsemi.com www.microsemi.com 3-6 APTGT30X60T3G – Rev 2 November, 2017 Package outline (dimensions in mm) APTGT30X60T3G Typical Performance Curve Output Characteristics (VGE=15V) Output Characteristics 60 60 TJ=25°C VGE=19V TJ = 150°C 50 50 VGE=13V 40 TJ=150°C IC (A) IC (A) TJ=125°C 40 30 VGE=15V 30 20 20 10 10 VGE=9V TJ=25°C 0 0 0.5 1 1.5 VCE (V) 0 2 2.5 0 3 0.5 2 VCE = 300V VGE = 15V RG = 10Ω TJ = 150°C TJ=25°C 50 1.5 E (mJ) IC (A) 40 30 TJ=125°C 20 1.5 2 VCE (V) 2.5 3 3.5 Energy losses vs Collector Current Transfert Characteristics 60 1 Eoff Er 1 0.5 TJ=150°C Eon 10 TJ=25°C 0 0 5 6 7 8 9 10 11 0 12 10 20 Switching Energy Losses vs Gate Resistance 2.5 VCE = 300V VGE =15V IC = 30A TJ = 150°C 1.5 40 50 60 Reverse Bias Safe Operating Area 70 Eon 60 50 Eoff IC (A) E (mJ) 2 30 IC (A) VGE (V) 1 40 30 20 0.5 Er VGE=15V TJ=150°C RG=10Ω 10 Eon 0 0 0 10 20 30 40 50 60 Gate Resistance (ohms) 70 0 100 200 300 400 VCE (V) 500 600 700 maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 1.6 IGBT 0.9 1.4 1.2 1 0.8 0.7 0.5 0.6 0.3 0.4 0.1 Single Pulse 0.2 0.05 0 0.00001 0.0001 0.001 0.01 0.1 1 10 Rectangular Pulse Duration in Seconds www.microsemi.com 4-6 APTGT30X60T3G – Rev 2 November, 2017 Thermal Impedance (°C/W) 1.8 APTGT30X60T3G Forward Characteristic of diode 60 VCE=300V D=50% RG=10Ω TJ=150°C 60 50 40 50 40 IF (A) Fmax, Operating Frequency (kHz) Operating Frequency vs Collector Current 70 Tc=85°C 30 TJ=125°C 20 Hard switching 20 30 10 10 0 0 TJ=150°C TJ=25°C 0 10 20 IC (A) 30 0 40 0.4 0.8 1.2 1.6 VF (V) 2 2.4 maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration Diode 2.5 2 0.9 0.7 1.5 0.5 1 0.3 0.5 0.1 0.05 0 0.00001 Single Pulse 0.0001 0.001 0.01 0.1 1 10 Rectangular Pulse Duration in Seconds www.microsemi.com 5-6 APTGT30X60T3G – Rev 2 November, 2017 Thermal Impedance (°C/W) 3 APTGT30X60T3G DISCLAIMER The information contained in the document (unless it is publicly available on the Web without access restrictions) is PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted, transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. If the recipient of this document has entered into a disclosure agreement with Microsemi, then the terms of such Agreement will also apply. This document and the information contained herein may not be modified, by any person other than authorized personnel of Microsemi. No license under any patent, copyright, trade secret or other intellectual property right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication, inducement, estoppels or otherwise. Any license under such intellectual property rights must be approved by Microsemi in writing signed by an officer of Microsemi. Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime without any notice. This product has been subject to limited testing and should not be used in conjunction with lifesupport or other mission-critical equipment or applications. Microsemi assumes no liability whatsoever, and Microsemi disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or user must conduct and complete all performance and other testing of this product as well as any user or customers final application. User or customer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the customer’s and user’s responsibility to independently determine suitability of any Microsemi product and to test and verify the same. The information contained herein is provided “AS IS, WHERE IS” and with all faults, and the entire risk associated with such information is entirely with the User. Microsemi specifically disclaims any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. The product is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp Life Support Application Seller's Products are not designed, intended, or authorized for use as components in systems intended for space, aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other application in which the failure of the Seller's Product could create a situation where personal injury, death or property damage or loss may occur (collectively "Life Support Applications"). Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees, subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations that Seller was negligent regarding the design or manufacture of the goods. www.microsemi.com 6-6 APTGT30X60T3G – Rev 2 November, 2017 Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the new proposed specific part.