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APTGT50DSK60T3G

APTGT50DSK60T3G

  • 厂商:

    MICROSEMI(美高森美)

  • 封装:

    SP3

  • 描述:

    IGBT MOD TRENCH DL BUCK CHOP SP3

  • 详情介绍
  • 数据手册
  • 价格&库存
APTGT50DSK60T3G 数据手册
APTGT50DSK60T3G Dual Buck chopper Trench + Field Stop IGBT® Power Module 13 14 VCES = 600V IC = 50A @ Tc = 80°C Applicatio n • AC and DC motor control • Switched Mode Power Supplies Q1 18 19 Q2 11 10 22 23 7 8 CR2 CR1 29 15 30 31 R1 32 16 Features • Trench + Field Stop IGBT® Technology - Low voltage drop - Low tail current - Switching frequency up to 20 kHz - Soft recovery parallel diodes - Low diode VF - Low leakage current - Avalanche energy rated - RBSOA and SCSOA rated • Kelvin emitter for easy drive • Very low stray inductance - Symmetrical design • High level of integration • Internal thermistor for temperature monitoring Benefits • Stable temperature behavior • Very rugged • Solderable terminals for easy PCB mounting • Direct mounting to heatsink (isolated package) • Low junction to case thermal resistance • Easy paralleling due to positive TC of VCEsat • Low profile • Each leg can be easily paralleled to achieve a single buck of twice the current capability. • RoHS Compliant 28 27 26 25 29 30 23 22 20 19 18 16 15 31 32 2 3 4 7 8 10 11 12 14 13 All multiple inputs and outputs must be shorted together Example: 13/14 ; 29/30 ; 22/23 … Absolute maximum ratings Symbol VCES IC ICM VGE PD RBSOA Parameter Collector - Emitter Breakdown Voltage Continuous Collector Current TC = 25°C TC = 80°C TC = 25°C TC = 25°C TJ = 150°C Pulsed Collector Current Gate – Emitter Voltage Maximum Power Dissipation Reverse Bias Safe Operating Area V W These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note APT0502 on www.microsemi.com www.microsemi.com 1-5 APTGT50DSK60T3G – Rev 1 June, 2006 Max ratings 600 80 50 100 ±20 176 100A @ 550V Unit V A APTGT50DSK60T3G All ratings @ Tj = 25°C unless otherwise specified Electrical Characteristics Symbol Characteristic ICES VCE(sat) VGE(th) IGES Zero Gate Voltage Collector Current Collector Emitter Saturation Voltage Gate Threshold Voltage Gate – Emitter Leakage Current Test Conditions VGE = 0 V, VCE = 600V Tj = 25°C VGE =15V IC = 50A Tj = 150°C VGE = VCE , IC = 600µA VGE = 20V, VCE = 0 V Min Typ 1.5 1.7 5.8 Max 250 1.9 6.5 600 Unit µA V V nA 5.0 Dynamic Characteristics Symbol Characteristic Cies Coes Cres Td(on) Tr Td(off) Tf Td(on) Tr Td(off) Tf Eon Eoff Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Switching Energy Turn-off Switching Energy Test Conditions VGE = 0 V VCE = 25V f = 1MHz Inductive Switching (25°C) VGE = ±15V VBus = 300V IC = 50A R G = 8.2Ω Inductive Switching (150°C) VGE = ±15V VBus = 300V IC = 50A R G = 8.2Ω VGE = ±15V Tj = 25°C VBus = 300V Tj = 150°C IC = 50A Tj = 25°C R G = 8.2Ω Tj = 150°C Min Typ 3150 200 95 110 45 200 40 120 50 250 60 0.3 0.43 1.35 1.75 Max Unit pF ns ns mJ mJ Chopper diode ratings and characteristics Symbol Characteristic VRRM IRM IF VF trr Qrr Er Maximum Peak Repetitive Reverse Voltage Test Conditions Tj = 25°C Tj = 150°C Tc = 80°C Tj = 25°C Tj = 150°C Tj = 25°C Tj = 150°C Tj = 25°C Tj = 150°C Tj = 25°C Tj = 150°C Min 600 Typ Max 250 500 Unit V µA A Maximum Reverse Leakage Current DC Forward Current Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Energy VR=600V IF = 50A VGE = 0 V IF = 50A VR = 300V di/dt =1800A/µs µC mJ www.microsemi.com 2-5 APTGT50DSK60T3G – Rev 1 June, 2006 50 1.6 1.5 100 150 2.6 5.4 0.6 1.2 2 V ns APTGT50DSK60T3G Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information). Symbol Characteristic R25 Resistance @ 25°C B 25/85 T25 = 298.15 K Min Typ 50 3952 Max Unit kΩ K RT = R 25   1 1  RT : Thermistor value at T exp B 25 / 85    T − T    25  T: Thermistor temperature Thermal and package characteristics Symbol Characteristic RthJC VISOL TJ TSTG TC Torque Wt Junction to Case Thermal Resistance Operating junction temperature range Storage Temperature Range Operating Case Temperature Mounting torque Package Weight IGBT Diode Min Typ Max 0.85 1.42 175 125 100 4.7 110 Unit °C/W V °C N.m g RMS Isolation Voltage, any terminal to case t =1 min, I isol
APTGT50DSK60T3G
1. 物料型号: - 型号为APTGT50DSK60T3G。

2. 器件简介: - 该器件是一个双降压斩波沟槽+场截止IGBT®功率模块,适用于交流和直流电机控制、开关电源等领域。

3. 引脚分配: - 文档中提到所有多个输入和输出必须短接在一起,例如:13/14;29/30;22/23等。

4. 参数特性: - 绝对最大额定值:VCES=600V,IC=50A(在Tc=80°C时)。 - 特点包括:低电压降、低尾电流、开关频率高达20kHz、软恢复并联二极管、低二极管正向电压降、低漏电流、雪崩能量额定值、RBSOA和SCSOA额定值、Kelvin发射极便于驱动、非常低的杂散电感、对称设计、高集成度、内部热敏电阻用于温度监测。

5. 功能详解: - 该模块采用沟槽+场截止IGBT®技术,具有低电压降、低尾电流等特点,适用于高开关频率应用,并具有软恢复并联二极管和低漏电流等优点。

6. 应用信息: - 适用于交流和直流电机控制、开关电源等。

7. 封装信息: - 封装类型为SP3,具体尺寸和安装说明可以参考Microsemi网站的应用说明1901。 - 还提供了NTC温度传感器的特性,以及热学和封装特性,如结到外壳的热阻、隔离电压、工作结温范围、存储温度范围等。
APTGT50DSK60T3G 价格&库存

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