APTGT50TDU170PG
Triple Dual Common Source Trench + Field Stop IGBT® Power Module
C1 C3 C5 G1 G3 G5
VCES = 1700V IC = 50A @ Tc = 80°C
Applicatio n • AC Switches • Switched Mode Power Supplies • Uninterruptible Power Supplies
E5/E6
E1 E1/E2
E3 E3/E4
E5
E2
E4
E6
G2 C2
G4 C4
G6 C6
Features • Trench + Field Stop IGBT® Technology - Low voltage drop - Low tail current - Switching frequency up to 20 kHz - Soft recovery parallel diodes - Low diode VF - Low leakage current - Avalanche energy rated - RBSOA and SCSOA rated • Kelvin emitter for easy drive • Very low stray inductance - Symmetrical design - Lead frames for power connections • High level of integration • Kelvin emitter for easy drive Benefits • Stable temperature behavior • Very rugged • Solderable terminals for easy PCB mounting • Direct mounting to heatsink (isolated package) • Low junction to case thermal resistance • Easy paralleling due to positive TC of VCEsat • Very low (12mm) profile • Each leg can be easily paralleled to achieve a dual common source configuration of three times the current capability • RoHS Compliant Max ratings 1700 70 50 100 ±20 310 100A @ 1600V Unit V A V W
July, 2006 1-5 APTGT50TDU170PG – Rev 1
C1
C3
C5
G1 E1/E2 E1 E2 G2 E3/E4
G3 E3 E4 G4 E5/E6
G5 E5 E6 G6
C2
C4
C6
Absolute maximum ratings
Symbol VCES IC ICM VGE PD RBSOA
Parameter Collector - Emitter Breakdown Voltage Continuous Collector Current TC = 25°C TC = 80°C TC = 25°C TC = 25°C Tj = 125°C
Pulsed Collector Current Gate – Emitter Voltage Maximum Power Dissipation Reverse Bias Safe Operating Area
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note APT0502 on www.microsemi.com
www.microsemi.com
APTGT50TDU170PG
All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic ICES VCE(sat) VGE(th) IGES Zero Gate Voltage Collector Current Collector Emitter Saturation Voltage Gate Threshold Voltage Gate – Emitter Leakage Current
Test Conditions VGE = 0 V, VCE = 1700V Tj = 25°C VGE = 15V IC = 50A Tj = 125°C VGE = VCE , IC = 1 mA VGE = 20V, VCE = 0 V
Min
Typ 2.0 2.4 5.8
Max 250 2.4 6.5 400
Unit µA V V nA
5.0
Dynamic Characteristics
Symbol Cies Coes Cres Td(on) Tr Td(off) Tf Td(on) Tr Td(off) Tf Eon Eoff
Characteristic Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Switching Energy Turn-off Switching Energy
Test Conditions VGE = 0 V VCE = 25V f = 1MHz Inductive Switching (25°C) VGE = 15V VBus = 900V IC = 50A R G = 10Ω Inductive Switching (125°C) VGE = 15V VBus = 900V IC = 50A R G = 10Ω VGE = 15V Tj = 125°C VBus = 900V IC = 50A Tj = 125°C R G = 10Ω
Min
Typ 4400 180 150 370 40 650 180 400 50 800 250 16
Max
Unit pF
ns
ns
mJ 15
Diode ratings and characteristics
Symbol Characteristic VRRM IRM IF VF trr Qrr Er
Maximum Peak Repetitive Reverse Voltage
Test Conditions Tj = 25°C Tj = 125°C Tc = 80°C Tj = 25°C Tj = 125°C Tj = 25°C Tj = 125°C Tj = 25°C Tj = 125°C Tj = 25°C Tj = 125°C
Min 1700
Typ
Max 250 500
Unit V µA A
Maximum Reverse Leakage Current DC Forward Current Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Energy
VR=1700V
IF = 50A
50 1.8 1.9 385 490 14 23 6 12
2.2
V ns µC mJ
July, 2006 2-5 APTGT50TDU170PG – Rev 1
IF = 50A VR = 900V di/dt =800A/µs
www.microsemi.com
APTGT50TDU170PG
Thermal and package characteristics
Symbol Characteristic RthJC VISOL TJ TSTG TC Torque Wt Junction to Case Thermal Resistance Operating junction temperature range Storage Temperature Range Operating Case Temperature Mounting torque Package Weight IGBT Diode 3500 -40 -40 -40 3 Min Typ Max 0.4 0.7 150 125 100 5 250 Unit °C/W V °C N.m g
RMS Isolation Voltage, any terminal to case t =1 min, I isol
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