APTM100H45STG
Full bridge Series & parallel diodes MOSFET Power Module
VBUS CR1A CR3A
VDSS = 1000V RDSon = 450mΩ typ @ Tj = 25°C ID = 18A @ Tc = 25°C
Applicatio n • Motor control • Switched Mode Power Supplies • Uninterruptible Power Supplies
Q1
CR1B
CR3B
Q3
G1 S1 CR2A O UT1 OUT2 CR4A
G3 S3
Q2
CR2B
CR4B
Q4
G2 S2 NTC1 0/VBUS NTC2
G4 S4
Features • Power MOS 7® MOSFETs - Low RDSon - Low input and Miller capacitance - Low gate charge - Avalanche energy rated - Very rugged • Kelvin source for easy drive • Very low stray inductance - Symmetrical design - Lead frames for power connections • Internal thermistor for temperature monitoring • High level of integration Benefits • Outstanding performance at high frequency operation • Direct mounting to heatsink (isolated package) • Low junction to case thermal resistance • Solderable terminals both for power and signal for easy PCB mounting • Low profile • RoHS Compliant
G3 S3
G4 S4
OUT2
VBUS
0/VBUS
OUT1
S1 G1
S2 G2
NTC2 NTC1
Absolute maximum ratings
Symbol VDSS ID IDM VGS RDSon PD IAR EAR EAS
Parameter Drain - Source Breakdown Voltage Continuous Drain Current Pulsed Drain current Gate - Source Voltage Drain - Source ON Resistance Maximum Power Dissipation Avalanche current (repetitive and non repetitive) Repetitive Avalanche Energy Single Pulse Avalanche Energy
T c = 25°C T c = 80°C
T c = 25°C
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note APT0502 on www.microsemi.com
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1–7
APTM100H45STG – Rev 3
Max ratings 1000 18 14 72 ±30 540 357 18 50 2500
Unit V A V mΩ W A mJ
July, 2006
APTM100H45STG
All ratings @ Tj = 25°C unless otherwise specified
Symbol Characteristic IDSS RDS(on) VGS(th) IGSS
Electrical Characteristics
Zero Gate Voltage Drain Current Drain – Source on Resistance Gate Threshold Voltage Gate – Source Leakage Current
Test Conditions
VGS = 0V,VDS= 1000V VGS = 0V,VDS= 800V
Tj = 25°C Tj = 125°C
Min
Typ
VGS = 10V, ID = 9 A VGS = VDS, ID = 2.5mA VGS = ±30 V, VDS = 0 V
450 3
Max 100 500 540 5 ±100
Unit µA mΩ V nA
Dynamic Characteristics
Symbol Ciss Coss Crss Qg Qgs Qgd Td(on) Tr Td(off) Tf Eon Eoff Eon Eoff
Characteristic Input Capacitance Output Capacitance Reverse Transfer Capacitance Total gate Charge Gate – Source Charge Gate – Drain Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Switching Energy Turn-off Switching Energy Turn-on Switching Energy Turn-off Switching Energy
Test Conditions VGS = 0 V VDS = 25V f = 1MHz VGS = 10V VBus = 500V ID = 18A Inductive switching @ 125°C VGS = 15V VBus = 667V ID = 18A R G = 5Ω Inductive switching @ 25°C VGS = 15V, VBus = 667V ID = 18A, R G = 5 Ω Inductive switching @ 125°C VGS = 15V, VBus = 667V ID = 18A, R G = 5Ω
Min
Typ 4350 715 120 154 26 97 10 12 121 35 639 380 1046 451
Max
Unit pF
nC
ns
µJ
µJ
Series diode ratings and characteristics
Symbol Characteristic Test Conditions VRRM Maximum Peak Repetitive Reverse Voltage IRM IF VF Maximum Reverse Leakage Current DC Forward Current Diode Forward Voltage IF = 30A IF = 60A IF = 30A IF = 30A VR = 133V di/dt = 200A/µs VR=200V Tj = 25°C Tj = 125°C Tc = 85°C
Min 200
Typ
Max 250 500
Unit V µA A
trr Qrr
Reverse Recovery Time Reverse Recovery Charge
Tj = 25°C Tj = 125°C Tj = 25°C Tj = 125°C
24 48 33 150
ns nC
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2–7
APTM100H45STG – Rev 3
July, 2006
Tj = 125°C
30 1.1 1.4 0.9
1.15 V
APTM100H45STG
Parallel diode ratings and characteristics
Symbol Characteristic VRRM Maximum Peak Repetitive Reverse Voltage IRM IF VF Maximum Reverse Leakage Current DC Forward Current Diode Forward Voltage IF = 30A IF = 60A IF = 30A IF = 30A VR = 667V
di/dt = 200A/µs
Test Conditions VR=1000V Tj = 25°C Tj = 125°C Tc = 65°C
Min 1000
Typ
Max 250 500
Unit V µA A
Tj = 125°C Tj = 25°C Tj = 125°C Tj = 25°C Tj = 125°C
30 1.9 2.2 1.7 290 390 670 2350
2.3 V
trr Qrr
Reverse Recovery Time Reverse Recovery Charge
ns nC
Thermal and package characteristics
Symbol Characteristic RthJC VISOL TJ TSTG TC Torque Wt Junction to Case Thermal Resistance Operating junction temperature range Storage Temperature Range Operating Case Temperature Mounting torque Package Weight Transistor Diode
Min
Typ
Max 0.35 1.2 150 125 100 4.7 160
Unit °C/W V °C N.m g
RMS Isolation Voltage, any terminal to case t =1 min, I isol ID(on)xRDS(on)MAX 250µs pulse test @ < 0.5 duty cycle
7
8
9 10
VGS, Gate to Source Voltage (V) DC Drain Current vs Case Temperature 20 18 16 14 12 10 8 6 4 2 0 25 50 75 100 125 150
July, 2006 5–7 APTM100H45STG – Rev 3
RDS(on) Drain to Source ON Resistance
1.4 1.3 1.2 1.1 1 0.9 0.8 0
10
20
30
40
50
ID, Drain Current (A)
TC, Case Temperature (°C)
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APTM100H45STG
RDS(on), Drain to Source ON resistance (Normalized) Breakdown Voltage vs Temperature BVDSS, Drain to Source Breakdown Voltage (Normalized) 1.15 1.10 1.05 1.00 0.95 0.90 0.85 -50 -25 0 25 50 75 100 125 150 TJ, Junction Temperature (°C) Threshold Voltage vs Temperature 1.2 VGS(TH), Threshold Voltage (Normalized) I D, Drain Current (A) 1.1 1.0 0.9 0.8 0.7 0.6 -50 -25 0 25 50 75 100 125 150 TC, Case Temperature (°C) Capacitance vs Drain to Source Voltage VGS, Gate to Source Voltage (V) 100000 C, Capacitance (pF) 14 12 10 8 6 4 2 0 0 40 80 120 160 200 Gate Charge (nC)
July, 2006
ON resistance vs Temperature 2.5 2.0 1.5 1.0 0.5 0.0 -50 -25 0 25 50 75 100 125 150 TJ, Junction Temperature (°C) Maximum Safe Operating Area
VGS =10V ID=9A
100
100µs limited by RDSon 1ms
10
10ms
1
Single pulse TJ=150°C TC=25°C
0 1 10 100 1000 VDS, Drain to Source Voltage (V)
Gate Charge vs Gate to Source Voltage ID=18A TJ=25°C
VDS=200V V DS =500V VDS=800V
10000
Ciss Coss Crss
1000
100
10 0 10 20 30 40 50 VDS, Drain to Source Voltage (V)
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6–7
APTM100H45STG – Rev 3
APTM100H45STG
Delay Times vs Current 160 140 td(on) and td(off) (ns) 120 100 80 60 40 20 0 5 10 15 20 25 30 35 40 I D, Drain Current (A) Switching Energy vs Current td(on) 10 0 5 10 15 20 25 30 ID, Drain Current (A) 35 40
VDS=667V RG=5Ω TJ=125°C L=100µH
Rise and Fall times vs Current 60
V DS =667V RG =5Ω T J=125°C L=100µH
t d(off) tr and tf ( ns)
50 40 30 20
tf
tr
Switching Energy vs Gate Resistance 2.5 Switching Energy (mJ)
V DS =667V ID=18A T J=125°C L=100µH
2
Switching Energy (mJ)
1.5 1 0.5 0 5
V DS =667V RG =5Ω T J=125°C L=100µH
Eon
Eoff
2 1.5 1
E off
Eon Eoff
0.5 0
10
15
20
25
30
35
40
0
5
10
15
20
25
30
I D, Drain Current (A) Operating Frequency vs Drain Current
VDS=667V D=50% RG=5Ω T J=125°C T C=75°C
Gate Resistance (Ohms) Source to Drain Diode Forward Voltage I DR, Reverse Drain Current (A) 1000
300 250 Frequency (kHz) 200
ZCS ZVS
100
TJ=150°C
150 100 50 0 6 8 10 12 14 16 ID, Drain Current (A) 18
Hard switching
10
T J=25°C
1 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 VSD, Source to Drain Voltage (V)
July, 2006
M icrosemi reserves the right to change, without notice, the specifications and information contained herein
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.
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7–7
APTM100H45STG – Rev 3