2N4957
Available on
commercial
versions
Qualified Levels:
JAN, JANTX,
and JANTXV
PNP Silicon
VHF-UHF Amplifier Transistors
Qualified per MIL-PRF-19500/426
DESCRIPTION
The 2N4957 is a military qualified silicon PNP amplifier transistor designed for VHF-UHF
equipment and other high-reliability applications. Common applications include high gain low
noise amplifier; oscillator, and mixer applications. It is also available in a low-profile UB
surface mount package.
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
•
JEDEC registered 2N4957
•
JAN, JANTX, and JANTXV military qualified versions are available per MIL-PRF-19500/426
(See part nomenclature for all available options)
•
RoHS compliant version available (commercial grade only)
TO-72 Package
Also available in:
UB Package
(surface mount)
2N4957UB
APPLICATIONS / BENEFITS
•
•
Low-power, ultra-high frequency transistor
Leaded metal TO-72 package
o
MAXIMUM RATINGS @ TA = +25 C
Parameters/Test Conditions
Junction and Storage Temperature
Collector-Emitter Voltage
Collector-Base Voltage
Emitter-Base Voltage
(1)
Total Power Dissipation
Collector Current
Symbol
Value
TJ and TSTG
V CEO
V CBO
V EBO
PT
IC
-65 to +200
-30
-30
-3
200
-30
Unit
o
C
V
V
V
mW
mA
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
Notes: 1. Derate linearly 1.14 mW/°C for T A > +25 °C
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
T4-LDS-0313, Rev. 1 (10/8/13)
©2013 Microsemi Corporation
Page 1 of 4
2N4957
MECHANICAL and PACKAGING
•
•
•
•
•
•
CASE: Ni plated kovar, Ni cap
TERMINALS: Gold over nickel plated kovar leads, solder dipped. RoHS compliant versions are available without solder dip on
commercial grade only.
MARKING: Manufacturer’s ID, date code, part number
POLARITY: PNP, see case outline on last page
WEIGHT: Approximately 0.322 grams
See Package Dimensions on last page.
PART NOMENCLATURE
JAN
2N4957
(e3)
Reliability Level
JAN=JAN level
JANTX=JAN level
JANTXV=JANTXV level
Blank = Commercial
RoHS Compliance
e3 = RoHS compliant (available
on commercial grade only)
Blank = non-RoHS compliant
JEDEC type number
(See Electrical Characteristics
table)
SYMBOLS & DEFINITIONS
Definition
Symbol
IB
IC
IE
TA
TC
V CB
V CBO
V CEO
V EB
V EBO
Base current: The value of the dc current into the base terminal.
Collector current: The value of the dc current into the collector terminal.
Emitter current: The value of the dc current into the emitter terminal.
Ambient temperature: The air temperature measured below a device, in an environment of substantially uniform
temperature, cooled only by natural air convection and not materially affected by reflective and radiant surfaces.
Case temperature: The temperature measured at a specified location on the case of a device.
Collector-base voltage: The dc voltage between the collector and the base.
Collector-base voltage, base open: The voltage between the collector and base terminals when the emitter terminal is
open-circuited.
Collector-emitter voltage, base open: The voltage between the collector and the emitter terminals when the base
terminal is open-circuited.
Emitter-base voltage: The dc voltage between the emitter and the base.
Emitter-base voltage, collector open: The voltage between the emitter and base terminals with the collector terminal
open-circuited.
T4-LDS-0313, Rev. 1 (10/8/13)
©2013 Microsemi Corporation
Page 2 of 4
2N4957
ELECTRICAL CHARACTERISTICS @ TC = +25oC
OFF CHARACTERISTICS
Test Conditions
Symbol
Collector-Emitter Breakdown Voltage
I C = -1.0 mA, I B = 0, Bias condition D
Collector to Base Cutoff Current
V CB = -20 V, I E = 0, Bias condition D
V CB = -30 V, Bias condition D
Emitter to Base Cutoff Current
V EB = -3 V, Bias condition D
Value
Min.
Max.
Unit
V (BR)CEO
-30
-
V
I CBO
-
-100
-100
nA
µA
I EBO
-
-100
µA
Min.
Max.
Unit
15
20
30
10
165
ON CHARACTERISTICS
Test Conditions
Symbol
Forward Current transfer ratio
I C = -0.5 mA, V CE = -10 V
I C = -2.0 mA, V CE = -10 V
I C = -5.0 mA, V CE = -10 V
I C = -5.0 mA, V CE = -10 V, TA = -55 ºC
h FE
Value
DYNAMIC CHARACTERISTICS
Test Conditions
Symbol
Magnitude of common emitter small signal short circuit forward
current transfer ratio
V CE = -10 V, I E = -2.0 mA, f = 100 MHz
Value
Unit
Min.
Max.
|h fe |
12
36
Collector-base time constant
I E = -2.0 mA, V CB = -10.0 V, f = 63.6 MHz
r b ’C c
1.0
8.0
ps
Collector to Base – feedback capacitance
I E = 0 mA, V CB = -10 V, 100 kHz < f < 1 MHz
C cb
0.8
pF
Noise Figure (50 Ohms)
I C = -2.0 mA, V CE = -10 V, f = 450 MHz, R L = 50 Ω
NF
3.5
dB
Small Signal Power Gain (common emitter)
I C = -2.0 mA, V CE = -10 V, f = 450 MHz
G pe
25
dB
T4-LDS-0313, Rev. 1 (10/8/13)
©2013 Microsemi Corporation
17
Page 3 of 4
2N4957
PACKAGE DIMENSIONS
Ltr
TL
TH
HD
CD
LD
LC
CH
LL
P
Q
1
2
3
4
Dimensions
Inch
Millimeters
Min
Max
Min
Max
0.028 0.048 0.071
1.22
0.036 0.046 0.091
1.17
0.209 0.230
5.31
5.84
0.178 0.195
4.52
4.95
0.016 0.021 0.410
0.53
0.100 TP
2.54 TP
0.170 0.210
4.32
5.33
0.500 0.750 12.70 19.05
0.100
2.54
0.040
1.02
Notes
5
5
7, 8
7, 8
7, 8
5
Emitter
Base
Collector
Case
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for information only.
3. Beyond r (radius) maximum, TH shall be held for a minimum length of 0.011 (0.28 mm).
4. Dimension TL measured from maximum HD.
5. Body contour optional within zone defined by HD, CD, and Q.
6. Leads at gauge plane 0.054 +0.001 -0.000 inch (1.37 +0.03 -0.00 mm) below seating plane shall be within 0.007 inch
(0.18mm) radius of true position (TP) at maximum material condition (MMC) relative to tab at MMC. The device may be
measured by direct methods.
7. Dimension LU applies between L1 and L2. Dimension LD applies between L2 and LL minimum. Diameter is uncontrolled in
L1 and beyond LL minimum.
8. All four leads.
9. Dimension r (radius) applies to both inside corners of tab.
10. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology.
11. Lead 1 = emitter, lead 2 = base, lead 3 = collector, lead 4 = case (electrically connected).
T4-LDS-0313, Rev. 1 (10/8/13)
©2013 Microsemi Corporation
Page 4 of 4