2N6756, 2N6758, 2N6760 and 2N6762
Qualified Levels:
JAN, JANTX, and
JANTXV
N-CHANNEL MOSFET
Available on
commercial
versions
Qualified per MIL-PRF-19500/542
DESCRIPTION
This family of 2N6756, 2N6758, 2N6760 and 2N6762 switching transistors are military
qualified up to the JANTXV level for high-reliability applications. Microsemi also offers
numerous other transistor products to meet higher and lower power ratings with various
switching speed requirements in both through-hole and surface-mount packages.
Important: For the latest information, visit our website http://www.microsemi.com.
TO-204AA (TO-3)
Package
FEATURES
•
JEDEC registered 2N6756, 2N6758, 2N6760 and 2N6762 number series.
•
JAN, JANTX, and JANTXV qualifications are available per MIL-PRF-19500/542.
•
RoHS compliant versions available (commercial grade only).
(See part nomenclature for all available options.)
APPLICATIONS / BENEFITS
•
•
Low-profile metal can design.
Military and other high-reliability applications.
MAXIMUM RATINGS @ T A = +25ºC unless otherwise stated
Parameters / Test Conditions
Symbol
Operating & Storage Junction Temperature Range
Thermal Resistance Junction-to-Case
Total Power Dissipation
@ T A = +25 °C
(1)
@ T C = +25 °C
Drain-Source Voltage, dc
2N6756
2N6758
2N6760
2N6762
Gate-Source Voltage, dc
(2)
Drain Current, dc @ T C = +25 ºC
2N6756
2N6758
2N6760
2N6762
(2)
Drain Current, dc @ T C = +100 ºC
2N6756
2N6758
2N6760
2N6762
(3)
Off-State Current (Peak Total Value)
2N6756
2N6758
2N6760
2N6762
Source Current
2N6756
2N6758
2N6760
2N6762
TJ &
T stg
R ӨJC
PT
V DS
V GS
I D1
I D2
I DM
IS
Value
Unit
-55 to +150
°C
1.67
4
75
100
200
400
500
± 20
14.0
9.0
5.5
4.5
9.0
6.0
3.5
3.0
56
36
22
18
14.0
9.0
5.5
4.5
o
C/W
W
V
V
A
A
A
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
A
Website:
www.microsemi.com
Notes featured on next page.
T4-LDS-0111, Rev. 3 (121465)
©2012 Microsemi Corporation
Page 1 of 9
2N6756, 2N6758, 2N6760 and 2N6762
NOTES:
1.
2.
Derated linearly by 0.6 W/ºC for T C > +25 ºC.
The following formula derives the maximum theoretical ID limit. ID is limited by package and internal wires
and may be limited by pin diameter:
3.
I DM = 4 x I D1 as calculated in note 2.
MECHANICAL and PACKAGING
•
•
•
•
•
CASE: TO-3 metal can.
TERMINALS: Solder dipped (Sn63/Pb37) over nickel plated alloy 52. RoHS compliant matte-tin plating is available on
commercial grade only.
MARKING: Manufacturer's ID, part number, date code.
WEIGHT: Approximately 12.7 grams.
See Package Dimensions on last page.
PART NOMENCLATURE
JAN
2N6756
(e3)
Reliability Level
JAN = JAN Level
JANTX = JANTX Level
JANTXV = JANTXV Level
Blank = Commercial
RoHS Compliance
e3 = RoHS compliant (available
on commercial grade only)
Blank = non-RoHS compliant
JEDEC type number
(see Electrical Characteristics
table)
Symbol
di/dt
ID
IF
RG
TC
V DD
V DS
V GS
SYMBOLS & DEFINITIONS
Definition
Rate of change of diode current while in reverse-recovery mode, recorded as maximum value.
Drain current
Forward current
Gate drive impedance
Case Temperature
Drain supply voltage
Drain source voltage
Gate source voltage
T4-LDS-0111, Rev. 3 (121465)
©2012 Microsemi Corporation
Page 2 of 9
2N6756, 2N6758, 2N6760 and 2N6762
ELECTRICAL CHARACTERISTICS @ T A = +25 °C, unless otherwise noted
Parameters / Test Conditions
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
2N6756
2N6758
2N6760
2N6762
V GS = 0 V, I D = 1.0 mA
Gate-Source Voltage (Threshold)
V DS ≥ V GS , I D = 0.25 mA
V DS ≥ V GS , I D = 0.25 mA, T J = +125°C
V DS ≥ V GS , I D = 0.25 mA, T J = -55°C
Gate Current
V GS = ± 20 V, V DS = 0 V
V GS = ± 20 V, V DS = 0 V, T J = +125°C
Drain Current
V GS = 0 V, V DS = 80 V
V GS = 0 V, V DS = 160 V
V GS = 0 V, V DS = 320 V
V GS = 0 V, V DS = 400 V
Drain Current
V GS = 0 V, V DS = 100 V, T J = +125 °C
V GS = 0 V, V DS = 200 V, T J = +125 °C
V GS = 0 V, V DS = 400 V, T J = +125 °C
V GS = 0 V, V DS = 500 V, T J = +125 °C
Drain Current
V GS = 0 V, V DS
V GS = 0 V, V DS
V GS = 0 V, V DS
V GS = 0 V, V DS
= 80 V, T J = +125 °C
= 160 V, T J = +125 °C
= 320 V, T J = +125 °C
= 400 V, T J = +125 °C
V (BR)DSS
100
200
400
500
2.0
1.0
Max.
Unit
V
4.0
V
5.0
I GSS1
I GSS2
±100
±200
nA
2N6756
2N6758
2N6760
2N6762
I DSS1
25
µA
2N6756
2N6758
2N6760
2N6762
I DSS2
1.0
mA
2N6756
2N6758
2N6760
2N6762
I DSS3
0.25
mA
r DS(on)1
0.18
0.40
1.00
1.50
Ω
r DS(on)2
.21
.49
1.22
1.80
Ω
r DS(on)3
0.34
0.8
2.2
3.3
V SD
1.8
1.6
1.5
1.4
2N6756
2N6758
2N6760
2N6762
Static Drain-Source On-State Resistance
V GS = 10 V, I D = 14.0 A pulsed
V GS = 10 V, I D = 9.0 A pulsed
V GS = 10 V, I D = 5.5 A pulsed
V GS = 10 V, I D = 4.5 A pulsed
2N6756
2N6758
2N6760
2N6762
T4-LDS-0111, Rev. 3 (121465)
Min.
V GS(th)1
V GS(th)2
V GS(th)3
Static Drain-Source On-State Resistance
V GS = 10 V, I D = 9.0 A pulsed
V GS = 10 V, I D = 6.0 A pulsed
V GS = 10 V, I D = 3.5 A pulsed
V GS = 10 V, I D = 3.0 A pulsed
Static Drain-Source On-State Resistance
T J = +125°C
V GS = 10 V, I D = 9.0 A pulsed
V GS = 10 V, I D = 6.0 A pulsed
V GS = 10 V, I D = 3.5 A pulsed
V GS = 10 V, I D = 3.0 A pulsed
Diode Forward Voltage
V GS = 0 V, I D = 14.0 A pulsed
V GS = 0 V, I D = 9.0 A pulsed
V GS = 0 V, I D = 5.5 A pulsed
V GS = 0 V, I D = 4.5 A pulsed
Symbol
2N6756
2N6758
2N6760
2N6762
2N6756
2N6758
2N6760
2N6762
©2012 Microsemi Corporation
Ω
V
Page 3 of 9
2N6756, 2N6758, 2N6760 and 2N6762
ELECTRICAL CHARACTERISTICS @ T A = +25 °C, unless otherwise noted (continued)
DYNAMIC CHARACTERISTICS
Parameters / Test Conditions
Gate Charge:
On-State Gate Charge
V GS = 10 V, I D = 14.0 A, V DS = 80 V
V GS = 10 V, I D = 9.0 A, V DS = 160 V
V GS = 10 V, I D = 5.5 A, V DS = 320 V
V GS = 10 V, I D = 4.5 A, V DS = 400 V
Symbol
2N6756
2N6758
2N6760
2N6762
Gate to Source Charge
V GS = 10 V, I D = 14.0 A, V DS = 80 V
V GS = 10 V, I D = 9.0 A, V DS = 160 V
V GS = 10 V, I D = 5.5 A, V DS = 320 V
V GS = 10 V, I D = 4.5 A, V DS = 400 V
2N6756
2N6758
2N6760
2N6762
Gate to Drain Charge
V GS = 10 V, I D = 14.0 A, V DS = 80 V
V GS = 10 V, I D = 9.0 A, V DS = 160 V
V GS = 10 V, I D = 5.5 A, V DS = 320 V
V GS = 10 V, I D = 4.5 A, V DS = 400 V
2N6756
2N6758
2N6760
2N6762
Min.
Max.
Unit
Q g(on)
35
39
39
40
nC
Q gs
10
5.7
6.0
6.0
nC
Q gd
15
20
20
20
nC
Max.
Unit
t d(on)
35
35
30
30
ns
tr
80
80
40
40
ns
t d(off)
60
60
80
80
ns
tf
45
40
35
30
ns
t rr
300
500
700
900
ns
SWITCHING CHARACTERISTICS
Parameters / Test Conditions
Turn-on delay time
I D = 14.0 A, V GS = +10 V, R G = 7.5 Ω, V DD = 50 V
I D = 9.0 A, V GS = +10 V, R G = 7.5 Ω, V DD = 100 V
I D = 5.5 A, V GS = +10 V, R G = 7.5 Ω, V DD = 200 V
I D = 4.5 A, V GS = +10 V, R G = 7.5 Ω, V DD = 250 V
Rinse time
I D = 14.0 A, V GS = +10 V, R G = 7.5 Ω, V DD = 50 V
I D = 9.0 A, V GS = +10 V, R G = 7.5 Ω, V DD = 100 V
I D = 5.5 A, V GS = +10 V, R G = 7.5 Ω, V DD = 200 V
I D = 4.5 A, V GS = +10 V, R G = 7.5 Ω, V DD = 250 V
Turn-off delay time
I D = 14.0 A, V GS = +10 V, R G = 7.5 Ω, V DD = 50 V
I D = 9.0 A, V GS = +10 V, R G = 7.5 Ω, V DD = 100 V
I D = 5.5 A, V GS = +10 V, R G = 7.5 Ω, V DD = 200 V
I D = 4.5 A, V GS = +10 V, R G = 7.5 Ω, V DD = 250 V
Fall time
I D = 14.0 A, V GS = +10 V, R G = 7.5 Ω, V DD = 50 V
I D = 9.0 A, V GS = +10 V, R G = 7.5 Ω, V DD = 100 V
I D = 5.5 A, V GS = +10 V, R G = 7.5 Ω, V DD = 200 V
I D = 4.5 A, V GS = +10 V, R G = 7.5 Ω, V DD = 250 V
Diode Reverse Recovery Time
di/dt = 100 A/µs, V DD ≤ 30 V, I D
di/dt = 100 A/µs, V DD ≤ 30 V, I D
di/dt = 100 A/µs, V DD ≤ 30 V, I D
di/dt = 100 A/µs, V DD ≤ 30 V, I D
T4-LDS-0111, Rev. 3 (121465)
= 14.0 A
= 9.0 A
= 5.5 A
= 4.5 A
Symbol
2N6756
2N6758
2N6760
2N6762
2N6756
2N6758
2N6760
2N6762
2N6756
2N6758
2N6760
2N6762
2N6756
2N6758
2N6760
2N6762
2N6756
2N6758
2N6760
2N6762
©2012 Microsemi Corporation
Min.
Page 4 of 9
2N6756, 2N6758, 2N6760 and 2N6762
Thermal Response (ZθJC)
GRAPHS
t 1 , Rectangle Pulse Duration (seconds)
FIGURE 1
Thermal Response Curves
T4-LDS-0111, Rev. 3 (121465)
©2012 Microsemi Corporation
Page 5 of 9
2N6756, 2N6758, 2N6760 and 2N6762
GRAPHS (continued)
ID DRAIN CURRENT (AMPERES)
ID DRAIN CURRENT (AMPERES)
FIGURE 2
Maximum Drain Current vs Case Temperature
T C CASE TEMPERATURE (ºC)
For 2N6758
ID DRAIN CURRENT (AMPERES)
ID DRAIN CURRENT (AMPERES)
T C CASE TEMPERATURE (ºC)
For 2N6756
T C CASE TEMPERATURE (ºC)
For 2N6760
T4-LDS-0111, Rev. 3 (121465)
©2012 Microsemi Corporation
T C CASE TEMPERATURE (ºC)
For 2N6762
Page 6 of 9
2N6756, 2N6758, 2N6760 and 2N6762
GRAPHS (continued)
ID DRAIN CURRENT (AMPERES)
FIGURE 3
Safe Operating Area
ID DRAIN CURRENT (AMPERES)
V DS , DRAIN-TO-SOURCE VOLTAGE (VOLTS) FOR 2N6756
V DS , DRAIN-TO-SOURCE VOLTAGE (VOLTS) FOR 2N6758
T4-LDS-0111, Rev. 3 (121465)
©2012 Microsemi Corporation
Page 7 of 9
2N6756, 2N6758, 2N6760 and 2N6762
GRAPHS (continued)
ID DRAIN CURRENT (AMPERES)
FIGURE 3
Safe Operating Area
ID DRAIN CURRENT (AMPERES)
V DS , DRAIN-TO-SOURCE VOLTAGE (VOLTS) FOR 2N6760
V DS , DRAIN-TO-SOURCE VOLTAGE (VOLTS) FOR 2N6762
T4-LDS-0111, Rev. 3 (121465)
©2012 Microsemi Corporation
Page 8 of 9
2N6756, 2N6758, 2N6760 and 2N6762
PACKAGE DIMENSIONS
NOTE:
INCHES
DIM
1. Dimensions are in inches.
MIN
MAX
2. Millimeters are given for general information only.
A
.875
3. These dimensions should be measured at points .050
B
.060
.135
inch (1.27 mm) and .055 inch (1.40 mm) below
C
.250
.360
seating plane. When gauge is not used measurement
D
.312
.500
will be made at the seating plane.
D2
.050
4. The seating plane of the header shall be flat within
E
.038
.043
.001 inch (0.03 mm) concave to .004 inch (0.10 mm)
F
.131
.188
G
1.177
1.197
convex inside a .930 inch (23.62 mm) diameter circle
H
.655
.675
on the center of the header and flat within .001 inch
J
.205
.225
(0.03 mm) concave to .006 inch (0.15 mm) convex
K
.420
.440
overall.
L
.495
.525
5. Mounting holes shall be deburred on the seating
M
.151
.161
plane side.
6. Drain is electrically connected to the case.
7. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology.
MILLIMETERS
MIN
MAX
22.23
1.52
3.43
6.35
9.14
7.92
12.70
1.27
0.97
1.09
3.33
4.78
29.90
30.40
16.64
17.15
5.21
5.72
10.67
11.18
12.57
13.34
3.84
4.09
NOTES
DIA.
Radius
3, 5
3, 5
Radius
DIA.
SCHEMATIC
T4-LDS-0111, Rev. 3 (121465)
©2012 Microsemi Corporation
Page 9 of 9