LX1973BIPL

LX1973B TM ® Automotive Light Sensor P RODUCTION D ATA S HEET DESCRIPTION KEY FEATURES Nearly Perfect Best Eye™ Human Eye Spectral Response Dark Current < 0.0005 Lux (@ 25°C) 5 Decades Compressed Output 10% Accuracy Over Temperature Scalable Output Voltage No Optical Filters Needed The LX1973B is a wide dynamic range light sensor with a very low dark current that is optimized for sensing low level light signals that typically occur under dark or darkening outdoor ambient lighting. The LX1973B has been optimized for automotive systems such as headlamp brightness control or rear view mirror contrast control. Its radical (fractional exponent) response when interfaced with an 8 bit DAC can detect levels down to 0.001 Lux or levels as high as 500 Lux. The spectral response of the integrated light sensor closely emulates the human eye so it ignores light such as infrared which emits energy but doesn’t aid vision. This eliminates the need for an Infrared filter required with competitor’s light sensors. The LX1973B internal circuitry consists of a diode array with Microsemi’s Best Eye™ processing that provides a nearly perfect photopic light wavelength response curve. The sensor output feeds into a wide dynamic range compression amplifier that provides accurate resolution over five decades of ambient light. The integrated dark current cancellation circuit facilitates accurate sensing of light below 0.01 Lux. The current source output of the LX1973B can be gain scaled using one external resistor. The LX1973B is internally trimmed to an initial accuracy of 5% at room temperature and a light level of 10 Lux. Accuracy of 10% is maintained over the full temperature range (-40 to +85ºC). WWW . Microsemi . C OM APPLICATIONS Auto Headlamp Control Auto Mirror Contrast Control IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com Protected By US Patents: 6,787,757; Patents Pending PRODUCT HIGHLIGHT LX 1973B Response 5V 4 3 LX1973B Part VOUT RLOAD Output (volts) 2 1 0 0.001 0.01 0 .1 1 10 100 LX1973B LX1973B A m b ien t L ig h t (lu x ) PACKAGE ORDER INFO TA (°C) -40 to 85 PL Plastic MSOP Domed 8-Pin LX1973BIPL PR Plastic MSOP Domed 8-Pin Reverse Form LX1973BIPR RoHS Compliant / Pb-free, NiPdAu Finish RoHS Compliant / Pb-free, NiPdAu Finish Note: Available in Tape & Reel. Append the letters “TR” to the part number. (i.e. LX1973BIPLxxxxx-TR) Copyright © 2007 Rev. 1.3, 2008-01-11 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 1 LX1973B TM ® Automotive Light Sensor P RODUCTION D ATA S HEET PACKAGE PIN OUT ABSOLUTE MAXIMUM RATINGS VDD ................................................................................................................. -0.3 to 6 VDC SNK/SRC (Output Compliance Voltage)........................................... -0.3 to VDD + 0.3VDC SNK/SRC (Maximum Output Current)................................................... Internally Limited Operating Temperature Range ........................................................................ -40 to +85°C Storage Temperature Range.......................................................................... -40 to +100°C RoHS / Pb-free Peak Package Solder Reflow Temperature (40 seconds maximum exposure)..................................................................240°C (+0, -5) Notes: 1. Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of specified terminal. VDD NC NC OUT PL PACKAGES (Top View) VSS NC NC NC WWW . Microsemi . C OM 973B YWWB PL PACKAGE MARKING (Bottom View) VSS NC NC NC VDD NC NC OUT THERMAL DATA 973B YWWB PL PR Plastic MSOP Domed 8-Pin Plastic MSOP Domed 8-Pin Reverse Form 39°C/W 206°C/W VSS NC NC NC VDD NC NC OUT THERMAL RESISTANCE-JUNCTION TO CASE, θJC THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA PR PACKAGE MARKING (Top View) Junction Temperature Calculation: TJ = TA + (PD x θJA). The θJA numbers are guidelines for the thermal performance of the device / pc-board system. All of the above assume no ambient airflow. VDD NC NC OUT PR PACKAGES (Bottom View) VSS NC NC NC FUNCTIONAL PIN DESCRIPTION Name VDD VSS OUT Pin 1 Power Supply Voltage 8 Ground Reference for Power and Signal Output 4 Output Current Description NC – No Connection MSL3/240°C/168 Hours SIMPLIFIED BLOCK DIAGRAM PACKAGE VDD LX1973B LX1973B Photopic Sensor with Dark Current Cancellation Pre Amplifier Compression Amplifier OUT GND LX1973B Figure 1 – Simplified Block Diagram LX1973BIPL Copyright © 2007 Rev. 1.3, 2008-01-11 LX1973BIPR Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 2 LX1973B TM ® Automotive Light Sensor P RODUCTION D ATA S HEET The following specifications apply over the operating ambient temperature -40°C ≤ TA following test conditions: See Note 1, VDD =5V, ROUT = 10k. ELECTRICAL CHARACTERISTICS ≤ 85°C except where otherwise noted and the WWW . Microsemi . C OM Parameter Operational Voltage Supply Current Power Supply Rejection Ratio Peak Spectral Response Infrared Response Light to Current Gain Saturation Current Dynamic Response Time (to 10% Settling Error Point) Dome Top Package Output Current Output Current Output Current Output Current Dark Current (Equivalent Lux) Dome Bottom Package Output Current Output Current Output Current Output Current Dark Current (Equivalent Lux) Symbol VDD IDD PSRR λPR Test Conditions @ 1 Lux VRIPPLE = 100mVP-P, f = 10kHz; COUT = 0.1µF EV(white) = 100 Lux, EV(810nm) = 14.6µWatt/ cm², Note 3 See application section for equation LX1973B Units Min Typ Max 4.5 30 0.22 35 580 1 5.5 0.27 V mA dB nm % IDD (λ ) IDD (λ PR ) GL ISAT TDR IOUT(0.01) IOUT(1.0) IOUT(10) IOUT(100) IOUT (DARK) IOUT(0.01) IOUT(1.0) IOUT(10) IOUT(100) IOUT (DARK) -5 5 520 1.0 Lux to 0.01 Lux 0.01 Lux to 1.0 Lux EV = 0.01 Lux @ 25°C, Note 1,2 EV = 1.0 Lux, Note 1,2 EV = 10 Lux, Note 1,2 EV = 100 Lux, Note 1,2 EV = 0 Lux, TA = 20°C, Note 4 EV = 0 Lux, TA = 50°C, Note 4 EV = 0.01 Lux @ 25°C, Note 1,2 EV = 1.0 Lux, Note 1,2 EV = 10 Lux, Note 1,2 EV = 100 Lux, Note 1,2 EV = 0 Lux, TA = 20°C, Note 4 EV = 0 Lux, TA = 50°C, Note 4 36 114 202 369 0.63 0.2 40 126 224 410 190 700 40 124 223 405 190 700 1.25 0.5 44 139 246 451 380 1400 44 137 245 445 380 1400 µA sec sec µA µA µA µA µLux µA µA µA µA µLux 36 112 201 365 ELECTRICALS ELECTRICALS Notes: 1. The input irradiance is supplied from a point source which is a white light emitting diode (LED); Fairchild Semiconductor part number MV8W00. 2. See Figure 2. 3. See Figure 3. 4. Dark Current equivalent Lux at 0 Lux: EL= ⎢ IOUT ⎥ ÷ (146 × 10 −9 ) ⎣ IREF ⎦ ⎡ ⎤ 4 For Dome Top Package, IREF = 6446µA. For Dome Bottom Package, IREF= 6344µA. LX1973B LX1973B Copyright © 2007 Rev. 1.3, 2008-01-11 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 3 LX1973B TM ® Automotive Light Sensor P RODUCTION D ATA S HEET TEST CIRCUITS VDD VDD WWW . Microsemi . C OM VDD White LED VDD VOUT RLOAD White LED 810nm OUT Part GND OUT Part GND VOUT RLOAD LX1973B Figure 2 – Operational Voltage Measurement Circuit LX1973B Figure 3 – IR Sensitivity Measurement Circuit APPLICATION CIRCUITS 5V LX1973B Part 10K 1µF LX1800 SCL SCD ADR GND VDD REF AIN 5V Part 2.5V AOUT DAC / ADC HI BRT Headlamp Controller Lamp Figure 4 – Typical Application LX1973B LX1973B Copyright © 2007 Rev. 1.3, 2008-01-11 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 4 LX1973B TM ® Automotive Light Sensor P RODUCTION D ATA S HEET APPLICATIONS GENERAL DESCRIPTION WWW . Microsemi . C OM The LX1973B produces an output current that is sensitive to the level of ambient light that falls onto the photosensitive area of the IC package. The sensitivity is amplified and compressed to provide ratio metric accuracy across several decades. The sensitivity function is: I OUT (P )= Iref 0.25 × [E DARK + E AMBIENT ] 0.25 1 Lux 1 Lux 0.25 = 10.25 Iref = 126µA for the Domed Top Package Iref = 124µA for the Domed Bottom Package EDARK = dark current equivalent Lux expressed in Lux from a white LED point source. EAMBIENT = ambient illumination expressed in Lux from a white LED point source. LX1973B LX1973B Copyright © 2007 Rev. 1.3, 2008-01-11 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 5 LX1973B TM ® Automotive Light Sensor P RODUCTION D ATA S HEET DARK CURRENT VS TEMP 100000 SENSITIVITY 500 450 WWW . Microsemi . C OM 400 Output Current (µA) 350 300 250 200 150 100 50 0 0.001 Dark Current (µLux) 0.01 0.1 1 10 100 1000 10000 1000 100 20 40 60 Temperature (C) 80 100 Point Source Light (lux) NORMALIZED (PRE COMPRESSION) 1.2 1.0 Normalized Diode Response 0.8 100 LUX OUTPUT VOLTAGE 6 4.5V 5 Output Voltage 4 3 2 1 0 5.0V 5.5V LX1973B Human Eye 0.6 0.4 0.2 0.0 -0.2 400 600 800 Wavelength (nm) 1000 0 2 4 6 8 10 Load Resistor (in kilo-ohms) 12 14 IOUT VS TEMPERATURE & VDD Iout vs Temperature @ 10 lux 225 IOUT STEP RESPONSE 215 Iout (uA) 205 Iout @ 4.5V Iout @ 5.0V Iout @ 5.5V 195 -40 -20 0 20 40 60 80 100 LX1973B LX1973B Temperature (ºC) Load =10k and 0µF; Photo Step = Direct Light Input of 1 Lux to 0.01 Lux. Copyright © 2007 Rev. 1.3, 2008-01-11 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 6 LX1973B TM ® Automotive Light Sensor P RODUCTION D ATA S HEET PACKAGE DIMENSIONS PL 8-Pin Miniature Shrink Outline Package (MSOP) Dome Top D D/2 PIN # NAME 1 VDD 2 NC 3 NC 4 OUT 5 NC 6 NC 7 NC 8 VSS WWW . Microsemi . C OM Dim A A1 A2 b c D E E1 e L L1 S θ MILLIMETERS MIN MAX 1.60 1.85 0.05 0.15 1.10 0.26 0.41 0.13 0.23 2.90 3.10 4.75 5.05 2.90 3.10 0.65 BSC 0.41 0.71 0.95 REF 0.525 REF 3° INCHES MIN MAX 0.063 0.073 0.002 0.006 0.043 0.010 0.016 0.005 0.009 0.114 0.122 0.187 0.199 0.114 0.122 0.026 BSC 0.016 0.028 0.037 REF 0.021 REF 3° 8 7 6 5 E/2 E 1 2 3 4 S E1 c A A2 Seating Plane R 0.9mm Typ Note: θ 1. A1 b e L L1 Dimensions do not include mold flash or protrusions; these shall not exceed 0.155mm(.006”) on any side. Lead dimension shall not include solder coverage. PR 8-Pin Plastic MSOP Clear Package Inverted Dome D e1 PIN # NAME 1 VDD 2 NC 3 NC 4 OUT 5 NC 6 NC 7 NC 8 VSS Dim A A1 A2 A3 b c D E E1 e e1 L L1 θ θ MILLIMETERS MIN MAX 1.68 0.05 0.15 0.81 0.92 0.66 0.76 0.26 0.41 0.13 0.23 2.90 3.10 4.75 5.05 2.90 3.10 0.65 BSC 1.95 TYP 0.41 0.71 0.95 REF 5° INCHES MIN MAX 0.066 0.002 0.006 0.032 0.036 0.026 0.030 0.010 0.016 0.005 0.009 0.114 0.122 0.187 0.199 0.114 0.122 0.026 BSC 0.077 TYP 0.016 0.028 0.037 REF 5° 8 7 6 5 E 1 2 3 4 LX1973B LX1973B b A3 A A2 e E1 A1 c L1 L Copyright © 2007 Rev. 1.3, 2008-01-11 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 7 LX1973B TM ® Automotive Light Sensor P RODUCTION D ATA S HEET PACKAGE DIMENSIONS (CONTINUED) Light Footprint WWW . Microsemi . C OM Active Area Required Minimum Light footpri Bonding / Wafer area Dim P1 P2 MILLIMETERS 1.8 2.5 INCHES 0.070 0.098 C L Recommended light footprint pattern Note: P2 represents a possible light footprint and its dimensions are not subject to strict tolerances. Only P1 is required to be covered with light. This larger footprint is designed to ensure coverage of the device’s active area. Recommended light foot print P2 P1 Minimum light foot print Dome Top Package Active Area Required Minimum Light footprint Bonding / Wafer area C L Dim P1 P2 P3 MILLIMETERS 1.8 2.5 2.9 INCHES 0.070 0.098 0.114 Recommended light footprint pattern Recommended light foot print P2 P1 Minimum light foot print Note: P2 represents a possible light footprint and its dimensions are not subject to strict tolerances. Only P1 is required to be covered with light. This larger footprint is designed to ensure coverage of the device’s active area. P3 represents the minimum aperture through which the dome of the device would fit in the PCB. LX1973B LX1973B P3 Recommended PCB Cutout Dome Bottom Package PRODUCTION DATA – Information contained in this document is proprietary to Microsemi and is current as of publication date. This document may not be modified in any way without the express written consent of Microsemi. Product processing does not necessarily include testing of all parameters. Microsemi reserves the right to change the configuration and performance of the product and to discontinue product at any time. Copyright © 2007 Rev. 1.3, 2008-01-11 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 8