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LX5261CDP

LX5261CDP

  • 厂商:

    MICROSEMI(美高森美)

  • 封装:

  • 描述:

    LX5261CDP - 27-Line LVD SCSI Source/Sink Regulator - Microsemi Corporation

  • 数据手册
  • 价格&库存
LX5261CDP 数据手册
LX5261 TM ® 27-Line LVD SCSI Source/Sink Regulator P R ODUCTION D ATA S HEET DESCRIPTION KEY FEATURES W WW . Microsemi . C OM The LX5261 is a source/sink regulator designed to provide the correct reference voltages and bias currents for SCSI LVD applications. With the proper LVD termination network (475Ω, 121Ω, 475Ω), the LX5261 assures that LVD performance is compliant to the SPI-2 (Ultra2), SPI3 (Ultra160) and SPI-4 (Ultra320) specification. The LX5261 provides two fixed regulated outputs (1.75V and 0.75V) each capable of sourcing / sinking 200mA, along with a buffered 1.3V output for DIFSENS signaling. The LX5261 features on-chip trimming of the internal voltage enabling precise output voltages; typically +/- 1% of its specified value. Thermal Shutdown and Current Limiting is integrated onchip. The LX5261 is available in the 16pin SOIC (DP) package. Compliant with SPI-2 (Ultra2), SPI-3 (Ultra160), and SPI-4 (Ultra320) 2.7V to 5.25V Operation 200mA Source/Sink Capability DIFSENS Line Driver Current Limit and Thermal Protection Pin Compatible With Unitrode UCC561 IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com TYPICAL APPLICATION 1.3V Reference 2 4.7uF 1.75V Reference VTERM 2.7V to 5.25V + - 1.3V +/- 0.1V 7 DIFSENS + - 1.75V +/- 0.05V 200mA source/sink 6 VOUT1 475 1% L1121 1% 475 1% 4.7uF 0.75V Reference 4 0.75V +/- 0.05V 200mA source/sink 3 VOUT2 GND + - L1+ 27 LVD Pairs L27121 1% L27+ 4.7uF 475 1% 475 1% LX5261 LX5261 PACKAGE ORDER INFO SOIC DP 16-Pin TA (°C) 0 to 70 RoHS Compliant / Pb-free Transition DC: 0440 LX5261CDP Note: Available in Tape & Reel. Append the letters “TR” to the part number. (i.e. LX5261CDP-TR) Copyright © 2000 Rev. 1.0c, 2005-02-08 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 1 LX5261 TM ® 27-Line LVD SCSI Source/Sink Regulator P R ODUCTION D ATA S HEET ABSOLUTE MAXIMUM RATINGS Term Power (VTERM) .........................................................................................................6V Operating Junction Temperature..................................................................................... 150°C Storage Temperature Range..............................................................................-65°C to 150°C RoHS / Pb-freePeak Package Solder Reflow Temperature (40 second maximum exposure) ........................................................................ 260°C (+0, -5) Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of specified terminal. PACKAGE PIN OUT W WW . Microsemi . C OM N/C VTERM VOUT2 GND HSGND VOUT1 DIFSENS 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 N/C N/C N/C HSGND HSGND N/C N/C N/C THERMAL DATA N/C DP PACKAGE DP 16-Pin SOIC 111.8 °C/W (Top View) NC – No Internal Connection THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA RoHS / Pb-free 100% Matte Tin Lead Finish Junction Temperature Calculation: TJ = TA + (PD x θJA). The θJA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. θJA can vary significantly depending on mounting technique. (See Application Notes Section: Thermal considerations) FUNCTIONAL PIN DESCRIPTION PIN NAME VOUT1 VOUT2 DESCRIPTION 1.75V Regulated Output. Capable of sourcing/sinking 200mA. 0.75V Regulated Output. Capable of sourcing/sinking 200mA. Power supply pin for terminator. Connect to SCSI bus VTERM. Usually decoupled by one 4.7µF low-ESR capacitor. It is absolutely necessary to connect this pin to the VTERM decoupling capacitor through a very low impedance (big traces to PCB). Keeping distances very short from the decoupling capacitors is somewhat layout dependent and some applications may benefit from high frequency decoupling with 0.1µF capacitors at VTERM pin. 1.3V buffered output for DIFSENS signaling. DIFSENS GND HSGND PACKAGE DATA PACKAGE DATA Regulator ground pin. Connect to ground. Attached to die mounting pad, but not bonded to GND pin. Pins should be considered a heat sink only, and not a true ground connection. It is recommended that these pins be connected to ground, but can be left floating. Copyright © 2000 Rev. 1.0c, 2005-02-08 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 2 LX5261 TM ® 27-Line LVD SCSI Source/Sink Regulator P R ODUCTION D ATA S HEET RECOMMENDED MAX OPERATING CONDITIONS Parameter VTERM Signal Line Voltage Operating Junction Temperature TJ W WW . Microsemi . C OM Symbol VTERM Min 2.7 0 0 LX5261 Typ Max 5.25 5.0 70 Units V V °C ELECTRICAL CHARACTERISTICS Unless otherwise specified, the following specifications apply over the operating ambient temperature 0°C ≤ TA ≤ 70°C, and VTERM = 3.3V. Parameter TERMPWR Section VTERM Supply Current VTERM Voltage Regulator Section 1.75V Regulator 1.3V Regulator 0.75V Regulator 1.75V Regulator Source Current 1.75V Regulator Sink Current 1.75V Source Current Limit 1.75V Sink Current Limit 1.3V Regulator Source Current 1.3V Regulator Sink Current 0.75V Regulator Source Current 0.75V Regulator Sink Current 0.75V Source Current Limit 0.75V Sink Current Limit IDIFS_SRC IDIFS_SNK ISRC2 ISNK2 DIFSENS; 0V DIFSENS = 2.4V VOUT = 0.25V VOUT = 1.25V 200 -700 700 -5 50 VREG1 VDIFS VREG2 ISRC1 ISNK1 -125mA < IOUT < 125mA, 2.7V < VIN < 5.25V DIFSENS; No Load -125mA < IOUT < 125mA, 2.7V < VIN < 5.25V VOUT = 1.25V VOUT = 2.25V 200 -700 700 -15 200 -200 1.7 1.2 0.7 1.75 1.3 0.75 1.8 1.4 0.8 -200 V V V mA mA mA mA mA µA mA mA mA mA ITERM VTERM No Load 2.7 35 40 5.25 mA V Symbol Test Conditions Min LX5261 Typ Max Units ELECTRICALS ELECTRICALS Copyright © 2000 Rev. 1.0c, 2005-02-08 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 3 LX5261 TM ® 27-Line LVD SCSI Source/Sink Regulator P R ODUCTION D ATA S HEET BLOCK DIAGRAM W WW . Microsemi . C OM 1.3V Reference VTERM 2 + - 1.3V +/- 0.1V 7 DIFSENS 1.75V Reference + - 1.75V +/- 0.05V 200mA source/sink 6 VOUT1 GND 4 0.75V +/- 0.05V 200mA source/sink 3 VOUT2 0.75V Reference + - Figure 1 – LX5261 Block Diagram APPLICATION INFORMATION LVD SCSI with Resistor Stack The LX5261 is used with a LVD resistor network (475Ω, 121Ω, 475Ω) to meet LVD SCSI performance. Connecting the top side of the LVD resistor network to the 1.75V regulated output (VREG1, pin 6), and the bottom side of the LVD resistor network to the 0.75 regulated output (VREG2, pin 3) provides the correct bias voltage, differential impedance, common mode differential impedance, and common mode voltage required by the SPI-2 through SPI-4 SCSI specification (see Figure 2. below). The LX5261 is designed to drive up to 27 LVD pairs. 1.75V +/- 0.05V 200mA source/sink 6 475 1% + - VOUT1 27 Ln- Parameter 121 1 of 27 1% LVD Pairs 27 475 1% Ln+ LX5261 107.3 112.9 237 1.25 SCSI Standard 100 to 110 100 to 125 100 to 300 1.2 to 1.3 Units ohm mV ohm V 4.7uF 0.75V +/- 0.05V 200mA source/sink 3 VOUT2 Differential Impedance Differential Bias Voltage Common Mode Impedance Common Mode Voltage BLOCK DIAGRAM BLOCK DIAGRAM + - 4.7uF Figure 2 – LX5261 with LVD Resistor Stack Copyright © 2000 Rev. 1.0c, 2005-02-08 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 4 LX5261 TM ® 27-Line LVD SCSI Source/Sink Regulator P R ODUCTION D ATA S HEET MECHANICAL DRAWINGS W WW . Microsemi . C OM DP 16-Pin Small Outline Package (SOIC) Narrow Body F B P 1 2 D 3 G A L C K M J Dim A B C D F G J K L M P *LC Note: MILLIMETERS MIN MAX 9.78 10.01 3.81 4.01 1.35 1.75 0.35 0.46 0.77 1.27 BSC 0.19 0.25 0.10 0.25 4.82 5.21 0 8 5.79 6.20 0.10 INCHES MIN MAX 0.385 0.394 0.150 0.158 0.053 0.069 0.014 0.018 0.030 0.050 BSC 0.007 0.010 0.004 0.010 0.189 0.205 0 8 0.228 0.244 0.004 MECHANICALS MECHANICALS 1. Dimensions do not include mold flash or protrusions; these shall not exceed 0.155mm (.006”) on any side. Lead dimension shall not include solder coverage. Copyright © 2000 Rev. 1.0c, 2005-02-08 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 5 LX5261 TM ® 27-Line LVD SCSI Source/Sink Regulator P R ODUCTION D ATA S HEET NOTES W WW . Microsemi . C OM NOTES NOTES PRODUCTION DATA – Information contained in this document is proprietary to Microsemi and is current as of publication date. This document may not be modified in any way without the express written consent of Microsemi. Product processing does not necessarily include testing of all parameters. Microsemi reserves the right to change the configuration and performance of the product and to discontinue product at any time. Copyright © 2000 Rev. 1.0c, 2005-02-08 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 6
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