LX8221DIDU-TR

LX8221 TM ® Dual 150mA CMOS Low Dropout Regulator P RODUCTION D ATA S HEET DESCRIPTION KEY FEATURES W WW . Microsemi . C OM The LX8221 family of dual output linear regulators provide for the selection of either fixed or adjustable output voltages, and combine low dropout operation, fast transient performance, tight output voltage accuracy, and ultra-low ground current within a very small package footprint. The PMOS output transistor allows for an ultra-low dropout characteristic (e.g., typically less than 175mV at 100mA). The individual regulators can be powered from either separate supply voltages or the same supply voltage between 2.8V to 6V allowing for maximum system flexibility. An optional ceramic or tantalum type capacitor may be connected to each Bypass pin separately to improve performance in critical low-noise applications. Overall regulator efficiency has been improved with a minimized operating ground current (typical < 140µA per regulator). Further, this ground current is virtually eliminated in shutdown mode (typical < 1µA). Other safety features include channel independent Thermal and Short Circuit Current protection. Separate Enable pins allow each regulator to be switched on and off independently by applying a TTL logic level control signal to the Enable pin further enhancing system level power management. These features combined with a small footprint (i.e., 10-pin MSOP package) make the LX8221 especially useful for battery-operated equipment such as cellular telephones, laptop computers and PDA equipment. Compact Regulators With Two 150mA Outputs Dropout Voltage Typically 175mV @ 100mA Ultra Low Shutdown Current Typically Less Than 1µA Output Trimmed to 0.5% Small MSOP-10 Package Over Current & Temperature Protection Stable with Ceramic or Tantalum Capacitors APPLICATIONS Battery Operated Systems Laptop, Notebook and PDA’s Cellular Telephones/Pagers Instrumentation Linear Post Regulators for SMPS IMPORTANT: For the most current data, consult Microsemi’s website: http://www.microsemi.com PRODUCT HIGHLIGHT 5.0V VIN2 VIN1 3.3V CB1 ADJ GND VOUT1 VOUT2 R1 N/C EN1 EN2 } To Control Logic On Off 5.0V VIN2 VIN1 3.3V CB1 ADJ N/C EN1 EN2 VOUT1 VOUT2 GND } To Control Logic On Off R1 R2 R2 R1 R2 Fixed / Adjustable Application Adjustable / Adjustable Application PACKAGE ORDER INFO LX8221 LX8221 TA (°C) -40 to 85 -40 to 85 -40 to 85 -40 to 85 VOUT1 Adjustable 2.5V 2.7V 3.0V VOUT2 Adjustable Adjustable Adjustable Adjustable Plastic MSOP 10-Pin DU RoHS Compliant / Pb-free Transition D/C: 0432 Package Marking 8221 AIDU LX 8221 BIDU LX 8221 DIDU LX 8221 GIDU LX LX8221AIDU LX8221BIDU LX8221DIDU LX8221GIDU Contact Microsemi for additional / available options Note: Available in Tape & Reel. Append the letters “TR” to the part number. (i.e. LX8221AIDU-TR) Copyright © 2000 Rev. 1.1a, 2006-01-19 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 1 LX8221 TM ® Dual 150mA CMOS Low Dropout Regulator P RODUCTION D ATA S HEET ABSOLUTE MAXIMUM RATINGS Input Voltage (VIN1, VIN2) .......................................................................... -0.3V to +7V Output Current (IOUT1, IOUT2)................................................................................. 150mA Operating Temperature Range .....................................................................-40 to +125 °C Maximum Junction Temperature (TJ) ...................................................................... 150 °C Storage Temperature (TJ) .............................................................................-65 to +150 °C Peak Package Solder Reflow Temp. (40 second max. exposure)................. 260°C (+0, -5) Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of specified terminal. PACKAGE PIN OUT W WW . Microsemi . C OM VOUT1 CB1 NC EN2 VIN2 1 2 3 4 5 10 9 8 7 6 VIN1 EN1 GND ADJ VOUT2 DU PACKAGE (Top View) “NC” = No Internal Connection RoHS / Pb-free 100% Matte Tin Lead Finish THERMAL DATA FRONT MARKING DU Plastic MSOP 8-Pin THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA 206°C/W Junction Temperature Calculation: TJ = TA + (PD x θJC). The θJA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. 8221 xIDU LX x = Voltage Combination i.e. A = Adj/Adj FUNCTIONAL PIN DESCRIPTION PIN NAME VIN1/VIN2 GND EN1/EN2 CB1 VOUT1/VOUT2 ADJ (1, 2) Unregulated input supply voltage Ground Pin Enable control input: Logic high = Enable; logic low or open = Shutdown Reference bypass input. Adding an additional external capacitor reduces output noise. Regulated output voltage. Regulator stability is achieved with external capacitor of 1µF Adjust pin. Connect a resistor divider to this pin to establish preferred output voltage. BLOCK DIAGRAM VIN1 EN1 EN2 VIN2 DESCRIPTION VOUT1 THERMAL SENSOR THERMAL SENSOR VOUT2 PACKAGE DATA PACKAGE DATA CURRENT LIMIT CURRENT LIMIT + CB1 VREF CONTROL LOGIC CONTROL LOGIC + VREF ADJ GND Copyright © 2000 Rev. 1.1a, 2006-01-19 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 2 LX8221 TM ® Dual 150mA CMOS Low Dropout Regulator P RODUCTION D ATA S HEET RECOMMENDED OPERATING CONDITIONS Parameter Input Operating Voltage Range (Note 1) Enable Input Voltage Range Continuous Output Current Range Input Capacitor (VIN to GND) Output Capacitor (VOUT to GND) W WW . Microsemi . C OM Symbol VIN1, VIN2 EN1/2 IOUT1, IOUT1 CIN COUT Min 2.5 LX8221 Typ Max 6 VIN + 0.3V Units V V mA µF µF 150 1.0* 1.0* 2.2 Note 1: The minimum VIN has to meet two conditions VIN > 2.5V and VIN > VOUT + VDROPOUT, at high line voltage conditions output current may be limited to less than 150mA due to the power dissipation. * Size your output capacitor to meet the transient loading requirement. If you have a very dynamic load, a lower ESR and larger value capacitor will improve the response to these load steps. Unless otherwise specified, the following specifications apply over the operating ambient temperature -40°C ≤ TA ≤ 85°C except where otherwise noted. Test conditions: VIN = VOUT + 0.5V; IOUT =10mA; CIN = 1µF; COUT = 1µF; TJ = TA using low duty cycle pulse testing methods. LX8221 Parameter Symbol Test Conditions Units Min Typ Max Output Voltage (2.5, 2.7, 3.0, ADJ) Adjust Reference Voltage Line Regulation VOUT1/2 VADJ VRV VRI TJ = 25°C 0mA ≤ IOUT1/2 ≤ 100mA, (VOUT1/2 + 0.5V) ≤ VIN ≤ 6V TJ = 25°C 0mA ≤ IOUT1/2 ≤ 100mA, 2.85V ≤ VIN ≤ 6V (VOUT1/2 + 0.5V) ≤ VIN ≤ 5V, IOUT1/2 = 0.1mA TJ = 25°C, 0.5mA ≤ IOUT1/2 ≤ 150mA 0.5mA ≤ IOUT1/2 ≤ 100mA ILOAD1/2 = 1mA, ΔVO = -1% ILOAD1/2 = 50mA, ΔVO = -1% ILOAD1/2 = 100mA, ΔVO = -1% ILOAD1/2 = 150mA, ΔVO = -1% EN1 = High, EN2 = High EN1 = Low, EN2 = Low VADJ = 1.25V VEN1/2 = VIN 2.0 0.4 VOUT1 = 0V, VOUT2 = 0V TJ = 25°C, f = 120Hz TJ = 25°C, COUT = 10µF,CBYPASS = 470pF 400 50 50 170 -1 -2.5 1.163 1.140 1 2.5 1.187 1.210 0.15 % V %/V %VNOM ELECTRICAL CHARACTERISTICS 1.175 0.04 0.5 ⎛ ΔVO ⎞ ⎜ ΔVIN ⎟ ⎝ ⎠ ⎛ ΔVO ⎞ Load Regulation ⎜ ΔI O ⎟ ⎝ ⎠ 1.5 0.050 0.175 0.3 0.4 440 1 100 100 Dropout Voltage (Note 2) (VIN − VO ) VDO IGND ISTBY IADJ IEN VEN(IH) VEN(IL) IOUT(SC) PSRR Ground Pin Current Adjust Input Bias Current Enable Pin Current Enable Threshold Short Circuit Current Limit Power Supply Rejection Ratio Output Noise Thermal Shutdown Temperature 0.175 0.25 280 V µA nA nA V mA dB µV °C eN TSD ELECTRICALS ELECTRICALS Note 2: Dropout voltage is defined as the input to output differential at which the output voltage drops 1% below the nominal value. Dropout voltage specification applies only to output voltages greater than 2.8V. For output voltages below 2.8V, the dropout voltage is nothing but the input to output differential, since the minimum input voltage is 2.8V. Copyright © 2000 Rev. 1.1a, 2006-01-19 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 3 LX8221 TM ® Dual 150mA CMOS Low Dropout Regulator P RODUCTION D ATA S HEET APPLICATIONS W WW . Microsemi . C OM Description The LX8221 family of LDO linear regulators is available in a 10-pin MSOP Package and provides a cost effective power management solution for battery driven applications. The regulator family includes both fixed/adjustable and adjustable/adjustable output voltage versions. The internal PMOS power device provides low dropout regulation with a fast line and load transient response. It also includes internal current limiting and thermal shutdown circuitry. In this section you will find information about capacitor, thermal, and layout design considerations. Input Capacitor To improve load transient response and noise rejection a bypass capacitor is recommended (but it is not required for stability). There are no requirements for the ESR (Equivalent Series Resistor) on the input capacitor, but tolerance and temperature coefficient must be considered when selecting this capacitor to ensure that the capacitor’s value will be around 1µF over the entire operating temperature range. For the LX8221, a 1µF ceramic type capacitor may be connected between both VIN1/2 and ground. Output Capacitor The LX8221 uses an internal feedback loop to maintain a constant output voltage. This feedback loop induces a natural phase shift and the amount of phase shift determines the loop’s stability. Therefore, like any lowdropout regulator, an output capacitor with low ESR (Equivalent Series Resistance) is required between VOUT and GND to stabilize the internal control loop. A ceramic, tantalum or electrolytic capacitor with a minimum recommended capacitance value of 1.0µF and ESR between 5mΩ and 1Ω will satisfy the stability for the entire operating range. Optional Bypass Capacitor The fixed/adjustable voltage version of the LX8221 includes a separate Bypass pin (CB1) for the fixed regulator that allows for further reduction of output noise. If the regulator’s output noise performance meets system design specifications without the capacitor, omit it. The bypass capacitor impacts the start up time, which is inversely proportional to the size of bypass capacitor. Further, the bypass capacitor reduces the regulator phase margin. Hence, implementing the bypass capacitor will require the use of a larger output capacitor to maintain the LDO’s stability. The LX8221-x adjustable regulator’s output voltage can be externally set by connecting the ADJ pin/s to an external resistor divider (See Figure 1 and 2). The output voltage can be calculated using the formula: ⎛ R⎞ VOUT = VADJ ⎜1 + 1 ⎟ ⎜ R⎟ 2⎠ ⎝ Enable The Enable pin allows the LX8221 to be independently turned on and off. The Enable pins are compatible with standard TTL-CMOS levels. A logic zero (0.4V) on the En1/ En2 pins shuts the LX8221 off and reduces the supply current to less than 1µA (typical). Pulling the Enable inputs high (2.0V) causes normal operation to resume. If the Enable feature is not used, this pin can be connected to VIN. Minimum Load Requirement Although line regulation is improved with a minimum load of 100µA, the LX8221 does not have a minimum load current in order to maintain stability. This is an especially important feature in certain applications. Temperature Protection The thermal protection shuts the LX8221 down when the junction temperature exceeds approximately 150°C; there is no appreciable thermal hysteresis. Short Circuit Current Protection The LX8221 includes over-current protection, when the output load current exceeds about 400mA. When this occurs, the protection circuit forces the regulator to decrease its output current. Thermal Consideration Thermal shutdown protects the integrated circuit from thermal overload caused from a rise in junction temperature during power dissipation. This type of protection is intended for fault protection only and not as a means of current (or, power) limiting during normal application usage. Proper thermal evaluation should be done to ensure that the junction temperature dose not exceed it’s maximum rating. Operating at the maximum TJ of 150°C can impact reliability. Due to variation in individual device electrical characteristics and thermal resistance, the built in thermal overload protection may be activated at power levels slightly above or below the rated dissipation. Power dissipation for each regulator can APPLICATIONS APPLICATIONS Copyright © 2000 Rev. 1.1a, 2006-01-19 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 4 LX8221 TM ® Dual 150mA CMOS Low Dropout Regulator P RODUCTION D ATA S HEET APPLICATIONS W WW . Microsemi . C OM be calculated using the following equation: PD = (VIN ( MAX ) − VOUT ( MIN ) )× I OUT ( MAX ) calculate the temperature: total power dissipation and junction Total Power Dissipation: PD = (4.2V − 2.7 V ) × 0.1A = 0.15 W (Note: power dissipation resulting from quiescent current is negligible) For the MSOP package, thermal resistance, θJA is 206°C/W when mounted on a FR4 copper clad PCB. Junction temperature of the integrated circuit can be calculated using: TJ = TA + TRISE Junction Temperature: TJ = 60 o C + 0.15W × 206 o C / W = 91o C ( ) Where: TRISE = (PD × Θ JA ) Example: Given the following conditions: TA = 60°C VIN= 4.2V VOUT= 2.7V IOUT= 100mA Layout Consideration: The layout must be implemented with low impedance paths for VIN, VOUT and Ground by creating sufficiently wide traces to avoid voltage drops and pick up noise. Adding an area of PCB copper to the GND pin (pin 8) will reduce the overall θJA since it is thermally connected to the device substrate. This will lower the device junction temperature improving overall output voltage accuracy. The input/output capacitors must be placed as close as possible to each voltage regulator output pin. APPLICATIONS APPLICATIONS Copyright © 2000 Rev. 1.1a, 2006-01-19 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 5 LX8221 TM ® Dual 150mA CMOS Low Dropout Regulator P RODUCTION D ATA S HEET APPLICATION CIRCUITS W WW . Microsemi . C OM Resistor Table 5.0V VIN2 VIN1 3.3V CB1 ADJ GND VOUT1 VOUT2 2.7V R1 N/C EN1 EN2 R1 = 13.0kΩ R2 = 10.0kΩ 3.0V R2 Figure 1 – Fixed / Adjustable Output Application 5.0V VIN2 VIN1 3.3V CB1 ADJ N/C EN1 EN2 VOUT1 Resistor Table VOUT1 R1 = 13.0kΩ R2 = 10.0kΩ VOUT2 R1 = 11.3kΩ R2 = 10.0kΩ 2.7V 2.5V VOUT2 GND R1 R2 R1 R2 Figure 2 – Adjustable / Adjustable Output Application APPLICATIONS APPLICATIONS Copyright © 2000 Rev. 1.1a, 2006-01-19 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 6 LX8221 TM ® Dual 150mA CMOS Low Dropout Regulator P RODUCTION D ATA S HEET OUTPUT VOLTAGE VS TEMPERATURE DROPOUT VOLTAGE VS TEMPERATURE W WW . Microsemi . C OM 1.185 Output Voltage (V) 1.18 1.175 1.17 1.165 1.16 1.155 -50 -25 0 25 50 75 Temperature (°C) 100 125 Dropout (mV) 350 325 300 275 250 225 200 175 150 125 100 75 50 -50 IL=150mA IL=100mA -25 0 25 50 75 TEMPERATURE (°C) 100 125 OUTPUT CURRENT VS SUPPLY VOLTAGE SHORT CIRCUIT CURRENT VS TEMPERATURE 0 -50 Current (mA) -340 -350 -360 -40°C 25°C 85°C Current -100 -150 -200 -250 2.8 -370 -380 -390 -400 -410 -420 5V 4V 3V 115°C 3.3 3.8 4.3 4.8 5.3 5.8 6.3 -430 -40 -25 0 Supply Voltage (V) PSRR VS FREQUENCY 0 25 85 100 Temperature (°C) 115 125 PSRR VS FREQUENCY IN DROPOUT 0 PSRR (dB) PSRR (dB) 50 50 100 0.1 1 Frequency(kHz) 10 100 100 0.1 1 10 Frequency (kHz) 100 PERFORMANCE Typical performance characteristics, unless otherwise specified are: CIN = COUT = 1µF, CBY = 470pF, VIN = VOUT = 2.5V, TA = 25°C, ENABLE is tied to VIN. Copyright © 2000 Rev. 1.1a, 2006-01-19 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 7 LX8221 TM ® Dual 150mA CMOS Low Dropout Regulator P RODUCTION D ATA S HEET PACKAGE DIMENSIONS W WW . Microsemi . C OM DU G 10-Pin Plastic MSOP D Dim A B C D F G H J P *LC B MILLIMETERS MIN MAX 2.85 3.05 2.90 3.10 1.10 0.16 0.31 0.40 0.60 0.50 BSC 0.050 0.150 0.10 4.75 5.05 0.10 INCHES MIN MAX 0.112 0.120 0.114 0.122 0.043 0.006 0.0124 0.015 0.023 0.019 BSC 0.002 0.006 0.004 0.187 0.198 0.004 A C H F P J *Lead Coplanarity Note: Dimensions do not include mold flash or protrusions; these shall not exceed 0.155mm(.006”) on any side. Lead dimension shall not include solder coverage. MECHANICALS MECHANICALS Copyright © 2000 Rev. 1.1a, 2006-01-19 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 8 LX8221 TM ® Dual 150mA CMOS Low Dropout Regulator P RODUCTION D ATA S HEET NOTES W WW . Microsemi . C OM NOTES NOTES PRODUCTION DATA – Information contained in this document is proprietary to Microsemi and is current as of publication date. This document may not be modified in any way without the express written consent of Microsemi. Product processing does not necessarily include testing of all parameters. Microsemi reserves the right to change the configuration and performance of the product and to discontinue product at any time. Copyright © 2000 Rev. 1.1a, 2006-01-19 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 9