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LX8610-XX

LX8610-XX

  • 厂商:

    MICROSEMI(美高森美)

  • 封装:

  • 描述:

    LX8610-XX - 1A BiCMOS Very Low Dropout Regulators - Microsemi Corporation

  • 详情介绍
  • 数据手册
  • 价格&库存
LX8610-XX 数据手册
A MICROSEMI  COMPANY LX8610-xx 1A BiCMOS Very Low Dropout Regulators P RELIMINARY D ATAS HEET  The LX8610 family are positive very low dropout regulators. They are designed to provide a power supply for very low headroom applications, such as 3.3V– 2.5V. BiCMOS technology allows an effective series pass element resistance, RDS(ON) of 250m      dropout voltage of 250mV at 1A. Low Quiescent Current and LogicControlled Shutdown help conserve battery life and increase system efficiency. Typical quiescent current is under 400µA irrespective of load current, while the shutdown current is only 10µA. The device will enter shutdown mode when the ENABLE pin is pulled low. Thermal & Short-Circuit Current Limiting: the LX8610 limits the current when the output is shorted, so protecting sensitive load circuits. The device will also turn off if the junction temperature exceeds 155°C. Available in small outline SOT-223 and 8-pin SOIC: Adjustable versions use the 8-pin SOIC and fixed output voltage devices are supplied in the 3-lead SOT-223.     Dropout Voltage Typically W W W . Microsemi . COM      250mA At 1A And 50mV At 10mA Low Quiescent Current, Under 400µA, Irrespective Of Load Shutdown Current 10µA Adjustable Output Version In 8-pin SOIC Package Fixed Outputs Of 2.5V, 3.3V Available In 3-Pin SOT-223 Package Low Reverse Leakage Current Short-Circuit And Thermal Shutdown Protection         3.3V & 2.5V Supplies For IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com Memory, Microprocessors, Clock Circuits, Etc.  Portable Equipment    L X 86 1 0 -xx S im p lified B lock D ia gram V IN Current Lim it Reference Current Charge P um p RA V OUT A D J* 1 .2 5 V RB E N A B LE * GND V IN /2 RA RB 25K 25K Reverse V oltage S ense L X 8 6 1 0-0 0 25K 41K Therm al S hutdown * A d ju sta b le 8 le a d ve rsio n on ly L X 8 6 1 0-2 5 L X 8 6 1 0-3 3 LX8610-XX LX8610-XX     TJ (°C) 0 to 125°C OUTPUT ST PLASTIC SOT-233 DM Plastic SOIC 8-PIN VOLTAGE 3-PIN 3.3 2.5 ADJ (00) LX8610-33CST LX8610-25CST – LX8610-33CDM LX8610-25CDM LX8610-00CDM Note: Available in Tape & Reel. Append the letter “T” to the part number. (i.e. LX8610CDMT) Copyright © 2000 Rev. 0.6f,2000-09-15 Microsemi Linfinity Microelectronics Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 1 A MICROSEMI  COMPANY LX8610-xx 1A BiCMOS Very Low Dropout Regulators P RELIMINARY D ATAS HEET      Input Voltage (VIN) ......................................................................................................6.5V Enable Pin ..............................................................................................-0.3V to V IN+0.3V Operating Junction Temperature Plastic (ST & DM) Packages .................................125°C Storage Temperature ................................................................................... -65°C to 150°C Lead Temperature (Soldering, 10 Seconds) ...............................................................300°C        T A B IS G N D 3 V OU T W W W . Microsemi . COM 2 GND 1 V IN Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of specified terminal. ST PACKAGE (Top View) V O UT 1 2 3 4 8 7 6 5 ADJ GND/ H E A T S IN K GND/ H E A T S IN K V IN   ST PLASTIC SOT-223 PACKAGE 15°C/W* 150°C/W THERMAL RESISTANCE-JUNCTION TO TAB, θJT THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA GND/ H E A T S IN K GND/ H E A T S IN K E N A B LE DM PACKAGE (Top View) DM PLASTIC SOIC PACKAGE 30°C/W 90°C/W θJLD THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA THERMAL RESISTANCE-JUNCTION TO AMBIENT,       Junction Temperature Calculation: TJ = TA + (PD x θJA). The θJA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. θJA can be improved with package soldered copper area over backside ground plane or internal power plane. θJA can vary from 45°C/W > 75°C/W depending on mounting technique. See table below for thermal resistance guidelines: Copper Area (Topside)* 2.0 sq” (1290mm2) 1.0 sq” (645 mm2) 0.5 sq” (323 mm2) 0.25 sq” (161 mm2) 2.0 sq” (1290mm ) 1.0 sq” (645 mm2) 0.5 sq” (323 mm2) 0.25 sq” (161 mm2) 2 Copper Area (Backside)* 1.0 sq” (645 mm2) 0.5 sq” (323 mm2) 0.1 sq” (65 mm2) 0.1 sq” (65 mm2) 1.0 sq” (645 mm ) 0.5 sq” (323 mm2) 0.1 sq” (65 mm2) 0.1 sq” (65 mm2) 2 Board Area 2.0 sq” (1290mm2) 1.0 sq” (645 mm2) 0.5 sq” (323 mm2) 0.25 sq” (161 mm2) 2.0 sq” (1290mm ) 1.0 sq” (645 mm2) 0.5 sq” (323 mm2) 0.25 sq” (161 mm2) 2 Thermal Resistance (θJA) 45°C/W 50°C/W 60°C/W 70°C/W 60°C/W 67°C/W 70°C/W 75°C/W Possible Heat Sink Approaches using PCB Copper ST (SOT-223) 1 2 3 4 8 7 6 5 PACKAGE DATA PACKAGE DATA DM (SOIC) *Tab of device attached to topside copper, or leads 2,3,5,6 of SOIC package Copyright © 2000 Rev. 0.6f,2000-09-15 Microsemi Linfinity Microelectronics Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 2 A MICROSEMI  COMPANY LX8610-xx 1A BiCMOS Very Low Dropout Regulators P RELIMINARY D ATAS HEET              W W W . Microsemi . COM VIN Positive supply input for the regulator. Bypass to GND with at least 2.2µF of low ESR, ESL capacitance if supply source is further than 1 inch from the device. Output for the regulator. It is recommended to bypass to GND with at least 10µF although this is not required for regulation, rather it is needed for transient response. Size your output capacitor to meet the transient loading requirement. If you have a very dynamic load, a larger capacitor will improve the response to these load steps. Reference ground. The input and output bypass capacitors should be connected to this pin. In addition the tab on the SOT-223 package and pins 2,3,6, and 7 on the SOIC package are also used for heat sinking the device. Feedback pin for the regulator. For the LX8610-00, the output voltage can be set by two external resistors with the following relationship: VOUT = 1.25V * (1 + RA / RB) where RA is the resistor connected between VOUT and ADJ, and RB is the resistor connected between ADJ and GND. Enable input. This pin has a threshold of about VIN / 2, it should be actively pulled high to enable the regulator. This can be accomplished with a resistive pull-up. When low, it turns off the regulator and puts the device in a low current shutdown state. VOUT GND ADJ ENALBE    VIN 5 IN OUT 1 VOUT RA CIN LX8610-00 ENABLE 4 GND 2,3 6,7 ADJ 8 COUT RB VREF VOUT = VREF 1 +   RA  RB   PIN DESCRIPTION PIN DESCRIPTION Figure 1 – Typical Application Copyright © 2000 Rev. 0.6f,2000-09-15 Microsemi Linfinity Microelectronics Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 3 A MICROSEMI  COMPANY Parameter LX8610-xx 1A BiCMOS Very Low Dropout Regulators P RELIMINARY D ATAS HEET         Symbol VIN Min 3 10 2.2 10 LX8610 Typ 5.5 1000 10 22* Max Units V mA µF µF W W W . Microsemi . COM Input Voltage Load Current (with adequate heatsinking) Input Capacitor (VIN to GND) Output Capacitor (VOUT to GND) these load steps. * Size your output capacitor to meet the transient loading requirement. If you have a very dynamic load, a larger capacitor will improve the response to  Unless otherwise specified, the following specifications apply over the operating ambient temperature 0°C ≤ TA ≤ 125°C except where otherwise noted. Test conditions: VIN = VOUT + 1.5V; IOUT = 10mA; CIN = 10µF; COUT = 22µF; TJ = TA. Parameter Symbol Test Conditions LX8610-xx Typ Max 3.3 4 5 0.25 0.15 0.05 1.25 400 400 0 VIN / 2 10 3.35 3.38 8 10 0.4 0.25 0.15 1.7 600 650 Units   Min 3.25 3.22  LX8610-33 FIXED 3.3V, 1A Output Voltage Line Regulation Load Regulation Dropout Voltage (VDO = VIN–VOUT) Short Circuit Current Quiescent Current Reverse Leakage Current Shutdown Threshold * Shutdown Current * VOUT VREG IREG VDO ISC IQ IREV VSD ISD TJ = 25°C Over Temperature VIN = 3.45V to 5.5V IOUT = 10mA to 1A IOUT = 1A, VOUT  OUT –1% IOUT = 0.5A, VOUT  OUT – 1% IOUT = 10mA, VOUT  OUT – 1% VOUT = 0V IOUT = 10mA to 1A 0V < VIN < VOUT, VOUT 3V IOUT = 10mA to 1A, VIN = 5.5V 0V < VIN < VOUT, VOUT < 5.5V (at VOUT) 0V < VIN < VOUT, VOUT
LX8610-XX
### 物料型号 - LX8610-xx:1A BiCMOS超低dropout调节器系列。

### 器件简介 - LX8610系列:正电压超低dropout调节器,设计用于为3.3V-2.5V等极低头顶房间应用提供电源。BiCMOS技术允许有效的串联通道元件电阻$R_{DS(ON)}$为250mΩ,导致在1A时典型dropout电压为250mV。

### 引脚分配 - VIN:调节器的正供电输入。 - VOUT:调节器的输出。 - GND:参考地。输入和输出旁路电容器应连接到此引脚。 - ADJ:反馈引脚,用于调节输出电压。 - ENABLE:使能输入,拉高以启用调节器。

### 参数特性 - Dropout电压:在1A时典型为250mV,在10mA时为50mV。 - 静态电流:400uA以下,与负载电流无关。 - 关闭电流:仅10uA。 - 热限制和短路电流限制:当输出短路时限制电流,保护敏感负载电路。

### 功能详解 - LX8610:在输出短路时限制电流,超过155°C时关闭设备。 - 调整版本:使用8引脚SOIC封装,固定输出电压设备提供3引脚SOT-223封装。

### 应用信息 - 3.3V和2.5V电源:适用于内存、微处理器、时钟电路等。 - 便携设备:适用于需要低静态电流和逻辑控制关闭的应用。

### 封装信息 - SOT-223:小外形封装,适用于固定输出电压设备。 - 8引脚SOIC:适用于可调整输出版本的设备。
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