M2GL010S-TQ144

PB0121 Product Brief IGLOO2 FPGAs Product Brief Microsemi IGLOO®2 FPGAs integrate fourth generation flash-based FPGA fabric and high-performance communications interfaces on a single chip. The IGLOO2 family is the industry’s lowest power, most reliable and highest security programmable logic solution. This next generation IGLOO2 architecture offers up to 3.6X gate count implemented with 4-input look-up table (LUT) fabric with carry chains, giving 2X performance, and includes multiple embedded memory options and mathblocks for digital signal processing (DSP). High speed serial interfaces include PCI EXPRESS (PCIe), 10 Gbps attachment unit interface (XAUI) / XGMII extended sublayer (XGXS) plus native serialization/deserialization (SERDES) communication, while double data rate 2 (DDR2)/DDR3 memory controllers provide high speed memory interfaces. IGLOO2 Family High-Performance FPGA High Speed Memory Interfaces • Efficient 4-Input LUTs with Carry Chains for High-Performance and Low Power – • Up to 236 Blocks of Dual-Port 18 Kbit SRAM (Large SRAM) with 400 MHz Synchronous Performance (512 x 36, 512 x 32, 1 Kbit x 18, 1 Kbit x 16, 2 Kbit x 9, 2 Kbit x 8, 4 Kbit x 4, 8 Kbit x 2, or 16 Kbit x 1) HPMS DDR (MDDR) and Fabric DDR (FDDR) Controllers – Supports LPDDR/DDR2/DDR3 – Maximum 333 MHz Clock Rate • Up to 240 Blocks of Three-Port 1 Kbit SRAM with 2 Read Ports and 1 Write Port (micro SRAM) – SECDED Enable/Disable Feature – • High-Performance DSP Supports Various DRAM Bus Width Modes, x8, x9, x16, x18, x32, x36 – Supports Command Reordering to Optimize Memory Efficiency – Supports Data Reordering, Returning Critical Word First for Each Command – Up to 240 Fast mathblocks with 18 x 18 Signed Multiplication, 17 x 17 Unsigned Multiplication and 44-Bit Accumulator High Speed Serial Interfaces • Up to 16 SERDES Lanes, Each Supporting: – XGXS/XAUI Extension (To Implement a 10 Gbps (XGMII) Ethernet PHY Interface) – Native SERDES Interface Facilitates Implementation of Serial RapidIO in Fabric or an SGMII Interface to a soft Ethernet MAC – • PCI Express (PCIe) Endpoint Controller • 64-/32-Bit AXI/AHB Master and Slave Interfaces to the Application Layer June 2016 © 2016 Microsemi Corporation SDRAM Support through a Soft SDRAM Memory Controller High-Performance Memory Subsystem • 64 KB Embedded SRAM (eSRAM) • Up to 512 KB Embedded Nonvolatile Memory (eNVM) • One SPI/COMM_BLK • DDR Bridge (2 Port Data R/W Buffering Bridge to DDR Memory) with 64-Bit AXI Interface • Non-Blocking, Multi-Layer AHB Bus Matrix Allowing Multi-Master Scheme Supporting 5 Masters and 7 Slaves x1, x2, x4 Lane PCI Express Core Up to 2 Kbytes Maximum Payload Size Up to 2 High Speed DDRx Memory Controllers I IGLOO2 FPGAs Product Brief • • Two AHB/APB Interfaces to FPGA Fabric (Master/Slave Capable) Two DMA Controllers to Offload Data Transactions – • 8-Channel Peripheral DMA (PDMA) for Data Transfer Between HPMS Peripherals and Memory • High-Performance DMA (HPDMA) for Data Transfer Between eSRAM and DDR Memories Clocking Resources • • Clock Sources Enhanced Anti-Tamper Features – Zeroization Data Security Features (available on premium devices) – Non-Deterministic Random Bit Generator (NRBG) – User Cryptographic Services (AES-256, SHA-256, Elliptical Curve Cryptographic (ECC) Engine) – User Physically Unclonable Function (PUF) Key Enrollment and Regeneration High Precision 32 kHz to 20 MHz Main Crystal Oscillator – CRI Pass-Through DPA Patent Portfolio License – 1 MHz Embedded RC Oscillator – – 50 MHz Embedded RC Oscillator Hardware Firewalls Protecting Subsystem (HPMS) Memories Up to 8 Clock Conditioning Circuits (CCCs) with Up to 8 Integrated Analog PLLs Microcontroller Reliability • Output Clock with 8 Output Phases and 45° Phase Difference (Multiply/Divide, and Delay Capabilities) Single Event Upset (SEU) Immune – Frequency: Input 1 MHz to 200 MHz, Output 20 MHz to 400 MHz Operating Voltage and I/Os Zero FIT FPGA Configuration Cells • Junction Temperature: 125°C – Military Temperature, 100°C – Industrial Temperature, 85°C – Commercial Temperature • • 1.2 V Core Voltage Single Error Correct Double Error Detect (SECDED) Protection on the Following: • Multi-Standard User I/Os (MSIO/MSIOD) – Embedded Memory (eSRAMs) – LVTTL/LVCMOS 3.3 V (MSIO only) – PCIe Buffer – LVCMOS 1.2 V, 1.5 V, 1.8 V, 2.5 V – – DDR (SSTL2_1, SSTL2_2) DDR Memory Controllers with Optional SECDED Modes – LVDS, MLVDS, Standards – PCI – LVPECL (receiver only) • • Mini-LVDS, RSDS • Differential DDR I/Os (DDRIO) – DDR, DDR2, DDR3, LPDDR, SSTL2, SSTL18, HSTL – LVCMOS 1.2 V, 1.5 V, 1.8 V, 2.5 V • Buffers Implemented with SEU Resistant Latches on the Following: – DDR Bridges (HPMS, MDDR, FDDR) – SPI FIFO • NVM Integrity Check at Power-Up and On-Demand • No External Configuration Memory Required— Instant-On, Retains Configuration When Powered Off Low Power Market Leading Number of User I/Os with 5G SERDES • Low Static and Dynamic Power – Security II Supply-Chain Assurance Device Certificate – – – • – Design Security Features (available on all devices) – Intellectual Property (IP) Protection through Unique Security Features and Use Models New to the PLD Industry – Encrypted User Key and Bitstream Loading, Enabling Programming in Less-Trusted Locations R evis i o n 13 Flash*Freeze Mode for Fabric • Power as low as 13 mW/Gbps per lane for SERDES devices • Up to 25% lower total power than competing devices IGLOO2 FPGAs Product Brief IGLOO2 FPGA Block Diagram Acronyms AES AHB APB AXI COMM_BLK DDR DPA ECC EDAC FDDR FIC Advanced Encryption Standard Advanced High-Performance Bus Advanced Peripheral Bus Advanced eXtensible Interface Communication Block Double Data Rate Differential Power Analysis Elliptical Curve Cryptography Error Detection And Correction DDR2/3 Controller in FPGA Fabric Fabric Interface Controller HPMS IAP MACC MDDR SECDED SEU SHA XAUI XGMII XGXS R ev i si o n 1 3 High-Performance Memory Subsystem In-Application Programming Multiply-Accumulate DDR2/3 Controller in HPMS Single Error Correct Double Error Detect Single Event Upset Secure Hashing Algorithm 10 Gbps Attachment Unit Interface 10 Gigabit Media Independent Interface XGMII Extended Sublayer III IGLOO2 FPGAs Product Brief Logic/DSP Table 1 • IGLOO2 FPGA Product Family Features 2, 3 M2GL005 (S) M2GL010 (S/T/TS) M2GL025 (T/TS) M2GL050 (T/TS) M2GL060 (T/TS) M2GL090 (T/TS) M2GL150 (T/TS) Maximum Logic Elements (4LUT + DFF)1 6,060 12,084 27,696 56,340 56,520 86,184 146,124 Math Blocks (18x18) 11 22 34 72 72 84 240 PLLs and CCCs 2 SPI/HPDMA/PDMA 1 Memory Data Security 1 AES256, SHA256, RNG 2 AES256, SHA256, RNG, ECC, PUF 128 LSRAM 18K Blocks 10 21 31 69 69 109 236 uSRAM1K Blocks 11 22 34 72 72 112 240 1826 1826 2586 5000 2x36 1x18 1x18 2x36 8 4 4 16 256 eSRAM (K Bytes) 512 64 703 DDR Controllers High Speed 2 eNVM (K Bytes) Total RAM (K bits) User I/Os 8 1 each Fabric Interface Controllers (FICs) Grades 6 912 1104 1x18 SERDES Lanes (T) 0 4 PCIe End Points 0 1 2 MSIO (3.3 V) 119 123 157 MSIOD (2.5 V) 28 40 DDRIO (2.5 V) 66 70 Total User I/O 209 233 Commercial (C), Industrial (I), Military (M), Automotive (T1/T2) C, I, T1, T2 4 139 271 309 292 40 62 40 40 106 70 176 76 76 176 267 377 387 425 574 C, I, M, T1, T2 C, I, M Notes: 1. Total logic may vary based on utilization of DSP and memories in your design. See the UG0445: IGLOO2 FPGA and SmartFusion2 SoC FPGA Fabric User Guide for details. 2. Feature availability is package dependent. 3. Data security features are only available in "S" and "TS" devices. IV Revision 13 IGLOO2 FPGAs Product Brief I/Os Per Package Table 2 • I/Os per Package and Package Options Package Options4 Type FCS(G)325 5 VF(G)256 5, 9 FCS(G)536 5 VF(G)400 5, 9 FCV(G)484 5, 9 TQ(G)144 5, 11 FG(G)484 5, 10 FG(G)676 5, 9 FG(G)896 5 FC(G)1152 5 Pitch (mm) 0.5 0.8 0.5 0.8 0.8 0.5 1.0 1.0 1.0 1.0 Length x Width (mm) 11x11 14x14 16x16 17x17 19x19 20x20 23x23 27x27 31x31 35x35 Device I/O Lanes M2GL005 (S) M2GL010 (T/TS) 1, 6 I/O Lanes 161 I/O Lanes I/O Lanes - 171 138 2 138 2 I/O Lanes I/O Lanes I/O Lanes - 84 - 209 - 195 4 84 - 233 4 207 4 267 4 I/O Lanes M2GL025 (T/TS) 1 180 2 M2GL050 (T/TS) 1 200 2 207 4 267 4 M2GL060 (T/TS) 1 200 2 207 4 267 4 387 4 180 4 267 4 425 4 M2GL090 (T/TS) 1, 2, 7 M2GL150 (T/TS) 2 293 4 248 I/O Lanes 37 7 8 4 I/O Lanes 574 16 Notes: 1. Mil Temp 010/025/050/060/090 devices are only available in the FG(G)484 package. 2. Mil Temp 150 devices are only available in the FC(G)1152 package. 3. 090 FCS(G)325 is 11x13.5 pkg dimension. 4. All the packages mentioned above are available with lead and lead free. 5. (G) indicates that the package is RoHS 6/6 Compliant/Pb-free 6. M2GL010 (S) device is only available in TQ(G)144 package. M2GL010 (T/TS) devices are not available in TQ(G)144 package. 7. The M2GL090 (T/TS) device in the FCSG325 package is available with an ordering code of XZ48. The XZ48 ordering code pre-configures the device for Auto Update mode. Minimum Order quantities apply, contact your local Microsemi sales office for details. 8. Shaded cells indicate that the device packages have vertical migration capability. 9. Automotive T2 grade devices are available in the VF(G)256, VF(G)400, FG(G)484, and FG(G)676 packages. 10. Automotive T1 grade devices are available in the FG(G)484 package. 11. The TQ(G)144 package will be available in T2 grade by the end of February, 2017. Table 3 • Features per Device/Package Combination Package TQ(G)144 8 VF(G)256 8 FCS(G)325 8 5G5 Crystal PCIe SERDES FDDR Oscillators Lanes Endpoints MSIO (3.3V max) 6 MSIOD (2.5V max) 7 DDRIO (2.5V max) Total User I/O Devices MDDR M2GL005 (S) - - 1 - - 52 9 23 84 M2GL010 (S) - - 1 - - 50 11 23 84 M2GL005 (S) - - 1 - - 119 12 30 161 M2GL010 (T/TS) x181 - 1 2 1 66 8 64 138 M2GL025 (T/TS) x181 - 1 2 1 66 8 64 138 M2GL025 (T/TS) x181 - 1 2 1 94 22 64 180 M2GL050 (T/TS) x182 - 1 2 1 90 22 88 200 M2GL060 (T/TS) x181 - 1 4 2 114 22 64 200 M2GL090 (T/TS) x181 - 1 4 2 104 12 64 180 R ev i si o n 1 3 V IGLOO2 FPGAs Product Brief Table 3 • Features per Device/Package Combination (continued) VF(G)400 8 FCV(G)484 8 FG(G)484 8 FC(G)536 8 FG(G)676 FG(G)896 8 8, 10 FC(G)1152 8 M2GL005 (S) x181 - 1 - - 79 28 64 171 M2GL010 (T/TS) x181 - 1 4 1 99 32 64 195 M2GL025 (T/TS) x181 - 1 4 1 111 32 64 207 M2GL050 (T/TS) x182 - 1 4 1 87 32 88 207 M2GL060 (T/TS) 1 x18 - 1 4 2 111 32 64 207 M2GL150 (T/TS) x181 x181 1 4 49 91 34 123 248 M2GL005 (S) 1 x18 - 1 - - 115 28 66 209 M2GL010 (T/TS) x181 - 1 4 1 123 40 70 233 M2GL025 (T/TS) x181 - 1 4 1 157 40 70 267 M2GL050 (T/TS) x182 - 1 4 1 105 40 122 267 M2GL060 (T/TS) x181 - 1 4 2 157 40 70 267 M2GL090 (T/TS) x181 - 1 4 2 157 40 70 267 M2GL150 (T/TS) x181 x181 1 4 49 151 16 126 293 M2GL060 (T/TS) x181 - 1 4 2 271 40 76 387 M2GL090 (T/TS) x181 - 1 4 2 309 40 76 425 M2GL050 (T/TS) x364 x364 1 8 2 139 62 176 377 M2GL150 (T/TS) x363 x363 1 16 4 292 106 176 574 1. 2. 3. 4. 5. 6. 7. 8. DDR supports x18, x16, x9, and x8 modes DDR supports x18 and x16 modes DDR supports x36, x32, x18, x16, x9, and x8 modes DDR supports x36, x32, x18, and x16 modes Maximum SERDES rate for Mil temp devices is 3.125Gbps Number of differential MSIO is Number of MSIOs/2 for even and (Number of MSIOs - 1)/2 for odd Number of differential MSIOD is Number of MSIODs/2 for even and (Number of MSIODs - 1)/2 for odd All the packages mentioned above are available with lead and lead free. (G) indicates that the package is RoHS 6/6 Compliant/Pb-free. 9. 4 PCIe Gen1/Gen2 endpoints x1 lane configuration. 10. DDR3 is non-compliant. Call technical support for details. 11. SERDES is not available in Automotive T1 grade. VI R evis i o n 13 IGLOO2 FPGAs Product Brief Table 4 • Available Programming Interfaces Package TQ(G)144 1 VF(G)256 1 1 FCS(G)325 VF(G)400 1 1 FCV(G)484 FG(G)484 1 1 FCS(G)536 FG(G)676 1 FG(G)896 1 FC(G)1152 1 Devices JTAG SPI_0 Flash_GOLDEN_N System Controller SPI Port M2GL005 (S) Yes Yes No No M2GL010 (S) Yes Yes No No M2GL005 (S) Yes Yes Yes Yes M2GL010 (T/TS) Yes Yes Yes No M2GL025 (T/TS) Yes Yes Yes No M2GL025 (T/TS) Yes Yes No No M2GL050 (T/TS) Yes Yes No No M2GL060 (T/TS) Yes Yes No No M2GL090 (T/TS) Yes Yes No No M2GL005 (S) Yes Yes Yes Yes M2GL010 (T/TS) Yes Yes Yes Yes M2GL025 (T/TS) Yes Yes Yes Yes M2GL050 (T/TS) Yes Yes Yes Yes M2GL060 (T/TS) Yes Yes Yes Yes M2GL150 (T/TS) Yes Yes Yes Yes M2GL005 (S) Yes Yes Yes Yes M2GL010 (T/TS) Yes Yes Yes Yes M2GL025 (T/TS) Yes Yes Yes Yes M2GL050 (T/TS) Yes Yes Yes Yes M2GL060 (T/TS) Yes Yes Yes Yes M2GL090 (T/TS) Yes Yes Yes Yes M2GL150 (T/TS) Yes Yes Yes Yes M2GL060 (T/TS) Yes Yes Yes Yes M2GL090 (T/TS) Yes Yes Yes Yes M2GL050 (T/TS) Yes Yes Yes Yes M2GL150 (T/TS) Yes Yes Yes Yes Notes: 1. All the packages mentioned above are available with lead and lead free. (G) indicates that the package is RoHS 6/6 Compliant/Pb-free. R ev i si o n 1 3 VII IGLOO2 FPGAs Product Brief Table 5 • Chip Resources Needed for Programming Modes Programming Mode JTAG SPI_0 Flash_GOLDEN_N System Controller SPI Port External FlashPro4/5 Yes No No No External uP – JTAG slave Yes No No No External uP – SPI Slave No No No Yes Auto Programming No Yes Yes No 2-Step IAP No Yes No No Programming Recovery No Yes No No IGLOO2 Ordering Information M2GL050 TS FG 1 896 G I Application (Temperature Range) Blank = Commercial (0°C to +85°C Junction Temperature ) I = Industrial (–40°C to +100°C Junction Temperature) M = Military (–55°C to +125°C Junction Temperature) T1 = AEC-Q100 Automotive Grade 1 (–40°C to 135°C Junction Temperature) T2 = AEC-Q100 Automotive Grade 2 (–40°C to 125°C Junction Temperature) Package Lead Count RoHS Status Package Type Blank = RoHs 5/6 Compliant / Package contains Pb (Lead) G = RoHS 6/6 Compliant / Pb-free packaging FG = Fine Pitch Ball Grid Array (1.0 mm pitch) VF = Very Fine Pitch Ball Grid Array (0.8 mm pitch) FC = Flip Chip Ball Grid Array (1.0 mm pitch) FCS = Flip Chip Ball Grid Array (0.5 mm pitch) FCV = Very Fine Pitch Flip Chip Ball Grid Array (0.8 mm pitch) TQ = Thin Quad Flat Pack Rectangular Package (0.5 mm pitch) Speed Grade Blank = PCIe Gen 1 Support Only Standard Speed Grade 1 = 15 % Faster than STD, PCIe Gen 1 and Gen 2 Prefix Blank TS T S = = = = Design Security Transceiver, Design, and Data Security Transceiver and Design Security Design and Data Security Part Number (Digits indicate approximate number of LUTs in Thousands) M2GL005 * M2GL010 M2GL025 M2GL050 M2GL060 M2GL090 M2GL150 Notes: *M2GL005 devices are not available with Transceivers or in the Military temperature grade. Automotive grade devices are available with S/TS. VIII Revision 13 IGLOO2 FPGAs Product Brief IGLOO2 Commercial and Industrial Temperature Grade Devices Table 6 • IGLOO2 Devices without Data Security (All Speed Grades, C and I Temperature)1 Density FCS(G)325 VF(G)256 FCS(G)536 VF(G)400 FCV(G)484 TQ(G)144 FG(G)484 FG(G)676 FG(G)896 FC(G)1152 M2GL005 M2GL010 T T T T T T M2GL025 T M2GL050 T T T M2GL060 T T T T M2GL090 T T T T M2GL150 T T T Notes: 1. All the packages mentioned above are available with lead and lead free. (G) indicates that the package is RoHS 6/6 Compliant/Pb-free. 2. T indicates that the devices are available with Transceiver. Example ordering code: M2GL025T-FCSG325 3. Shaded cells indicate that the devices are available without Transceiver. Example ordering code: M2GL025-FCSG325 Table 7 • IGLOO2 Data Security "S" Devices (All Speed Grades, C and I Temperature)1 Density FCS(G)325 VF(G)256 FCS(G)536 VF(G)400 FCV(G)484 TQ(G)144 FG(G)484 FG(G)676 FG(G)896 FC(G)1152 M2GL005 S S S S M2GL010 TS TS S TS TS TS TS M2GL025 TS M2GL050 TS TS TS M2GL060 TS TS TS TS M2GL090 TS TS TS M2GL150 TS TS TS TS Notes: 1. All the packages mentioned above are available with lead and lead free. (G) indicates that the package is RoHS 6/6 Compliant/Pb-free. 2. S indicates that the devices are available with Data Security. Example ordering code: M2GL005S-VFG400 3. TS indicates that the devices are available with Transceiver and Data Security. Example ordering code: M2GL025TS-FCSG325 R ev i si o n 1 3 IX IGLOO2 FPGAs Product Brief IGLOO2 Military Temperature Grade Devices Table 8 • IGLOO2 Military Temperature Device Offering M2GL010 (T/TS)-1FG(G)484M M2GL025 (T/TS)-1FG(G)484M M2GL050 (T/TS)-1FG(G)484M M2GL060 (T/TS)-1FG(G)484M M2GL090 (T/TS)-1FG(G)484M M2GL150 (T/TS)-1FC(G)1152M Notes: 1. Gold Wire bonds are available for the FG484 package by appending X399 to the part number when ordering, for example: M2GL090 (T/TS)-1FG484MX399. 2. All the packages mentioned above are available with lead and lead free. (G) indicates that the package is RoHS 6/6 Compliant/Pb-free. IGLOO2 Device Status Refer to the DS0128: IGLOO2 and SmartFusion2 Datasheet for device status. IGLOO2 Datasheet and Pin Descriptions The datasheet and pin descriptions are published separately: • DS0128: IGLOO2 and SmartFusion2 Datasheet • DS0124: IGLOO2 Pin Descriptions Datasheet • DS0138: IGLOO2 Automotive Grade 1 Datasheet • DS0134: SmartFusion2 and IGLOO2 Automotive Grade 2 Datasheet • PB0135: Automotive Grade 2 IGLOO2 FPGAs Product Brief Marking Specification Details Microsemi normally topside marks the full ordering part number on each device. The figure below provides the details for each character code present on Microsemi’s IGLOO2 FPGA devices. Device Name Date Code Package Customer Type Number Wafer Lot# Part Number Prefix Speed Grade Country of Origin Product Grade X R evis i o n 13 IGLOO2 FPGAs Product Brief Description • Device Name (M2XXXX): M2GL for IGLOO2 Devices Example: M2GL050TS • Package (PK###): Available Package as below PK: Package code†: FG(G): Fine Pitch BGA, 1.00 mm pitch FC(G): Flip Chip Fine Pitch BGA with Metal LID on top, 1.00 mm pitch FCV(G): Flip Chip Very Fine Pitch BGA with Metal LID on top, 0.8 mm pitch FCS(G): Flip Chip Ultra Fine Pitch BGA with Metal LID on top, 0.5 mm pitch VF(G): Very Fine Pitch BGA, 0.8 mm pitch TQ(G): Ultra Fine Pitch Thin Quad Flat Pack Package, 0.5 mm pitch ###: Number of Pins: Can be three or four digits. For example,144, 256, or 1152 • Wafer Lot (AAAAAASSX): Microsemi Wafer lot # AAAAAA: Wafer lot number SS: Two blank spaces X: One digit die revision code • Speed Grade (-##): Speed Binning Number Blank: Standard speed grade -1: -1 Speed grade • Product grade (Z): Product Grade; assigned as follows Blank/C: Commercial ES: Engineering Samples I: Industrial M: Military Temperature PP: Pre Production T1: AEC-Q100 Automotive Grade 1 T2: AEC-Q100 Automotive Grade 2 • Date Code (YYWWSS%): Assembly Date Code YY: Last two digits for seal year WW: Work week the part was sealed SS: Two blank spaces %: Can be digital number or character for new product • Customer Type Number: As specified on lot traveler • Part number Prefix: Part number prefix, assigned as below GW: Gold Wire bond Blank: Design Security T: Transceivers and Design Security S: Design and Data Security TS: Transceiver, Design, and Data Security † All the packages mentioned above are available with lead and lead free. (G) indicates that the package is RoHS 6/6 Compliant/Pb-free. R ev i si o n 1 3 XI IGLOO2 FPGAs Product Brief • Country of Origin (CCD): Assembly house country location Country name: Country Code China: CHN Hong Kong: HKG Japan: JPN Korea, South: KOR Philippines: PHL Taiwan: TWN Singapore: SGP United States: USA Malaysia: MYS XII R evis i o n 13 1 – IGLOO2 Device Family Overview Microsemi’s IGLOO2 FPGAs integrate fourth generation flash-based FPGA fabric and high-performance communications interfaces on a single chip. The IGLOO2 family is the industry’s lowest power, highest reliability and most secure programmable logic solution. This next generation IGLOO2 architecture offers up to 3.6X gate count, implemented with 4-input look-up table (LUT) fabric with carry chains, giving 2X performance, and includes multiple embedded memory options and mathblocks for DSP. High speed serial interfaces enable PCIe, XAUI / XGXS plus native SERDES communication while DDR2/DDR3 memory controllers provide high speed memory interfaces. Reliability IGLOO2 flash-based fabric has zero FIT configuration rate due to its single event upset (SEU) immunity, which is critical in reliability applications. The flash fabric also has the advantage that no external configuration memory is required, making the device instant-on; it retains configuration when powered off. To complement this unique FPGA capability, IGLOO2 devices add reliability to many other aspects of the device. Single Error Correct Double Error Detect (SECDED) protection is implemented on the embedded SRAM (eSRAM), and is optional on the DDR memory controllers. This means that if a one-bit error is detected, it will be corrected. Errors of more than one bit are detected only and not corrected. SECDED error signals are brought to the FPGA fabric to allow the user to monitor the status of these protected internal memories. Other areas of the architecture are implemented with latches, which are more resistant to SEUs. Therefore, no correction is needed in these locations: DDR bridges (HPMS, MDDR, FDDR), SPI, and PCIe FIFOs. Highest Security Devices Building further on the intrinsic security benefits of flash nonvolatile memory technology, the IGLOO2 family incorporates essentially all the legacy security features that made the original SmartFusion®, Fusion®, IGLOO®, and ProASIC®3 third-generation flash FPGAs and cSoCs the gold standard for secure devices in the PLD industry. In addition, the fourth-generation flash-based SmartFusion2 and IGLOO2 FPGAs add many unique design and data security features and use models new to the PLD industry. Design Security vs. Data Security When classifying security attributes of programmable logic devices (PLDs), a useful distinction is made between design security and data security. R ev i si o n 1 3 1-1 IGLOO2 FPGAs Product Brief Design Security Design security is protecting the intent of the owner of the design, such as keeping the design and associated bitstream keys confidential, preventing design changes (for example, insertion of Trojan Horses), and controlling the number of copies made throughout the device life cycle. Design security may also be known as intellectual property (IP) protection. It is one aspect of antitamper (AT) protection. Design security applies to the device from initial production, includes any updates such as in-the-field upgrades, and can include decommissioning of the device at the end of its life, if desired. Good design security is a prerequisite for good data security. The following are the main design security features supported. Table 1-1 • Design Security Features Features All Devices M2GL005 M2GL060 M2GL010 M2GL090 M2GL025 M2GL150 M2GL050 FlashLock™ Passcode Security (256-bit) x x Flexible security settings using flash lock-bits x x Encrypted/Authenticated Design Key Loading x x Symmetric Key Design Security (256-bit) x x Design Key Verification Protocol x x Encrypted/Authenticated Configuration Loading x x Certificate-of-Conformance (C-of-C) x x Back-Tracking Prevention (also know as, Versioning) x x Device Certificate(s) (Anti-Counterfeiting) x x Support for Configuration Variations x x Fabric NVM and eNVM Integrity Tests x x Information Services (S/N, Cert., USERCODE, and others) x x Tamper Detection x x Tamper Response (includes Zeroization) x x ECC Public Key Design Security (384-bit) x Hardware Intrinsic Design Key (SRAM-PUF) x R ev i si o n 1 3 1 -2 IGLOO2 Device Family Overview Data Security Data Security is protecting the information the FPGA is storing, processing, or communicating in its role in the end application. If, for example, the configured design is implementing the key management and encryption portion of a secure military radio, data security could entail encrypting and authenticating the radio traffic, and protecting the associated application-level cryptographic keys. Data security is closely related to the terms information assurance (IA) and information security. All IGLOO2 devices incorporate enhanced design security, making them the most secure programmable logic devices ever made. Select IGLOO2 models also include an advanced set of on-chip data security features that make designing secure information assurance applications easier and better than ever before. Table 1-2 • Data Security Features Features S Devices M2GL005S M2GL060TS M2GL010S M2GL010TS M2GL090TS M2GL025TS M2GL150TS M2GL050TS CRI Pass-through DPA Patent License x x Hardware Firewalls protecting access to memories x x Non-Deterministic Random Bit Generator Service x x AES-128/256 Service (ECB, OFB, CTR, CBC modes) x x SHA-256 Service x x HMAC-SHA-256 Service x x Key Tree Service x x PUF Emulation (Pseudo-PUF) x PUF Emulation (SRAM-PUF) x ECC Point-Multiplication Service x ECC Point-Addition Service x User SRAM-PUF Enrollment Service x User SRAM-PUF Activation Code Export Service x SRAM-PUF Intrinsic Key Gen. & Enrollment Service x SRAM-PUF Key Import & Enrollment Service x SRAM-PUF Key Regeneration Service x Low Power Microsemi’s flash-based FPGA fabric results in extremely low power design implementation with static power as low as 7.5 mW (for 6,060 LE device). Flash*Freeze (F*F) technology provides an ultra-low power static mode (Flash*Freeze mode) for IGLOO2 devices, with power less than 11 mW for the largest device (146,124 LEs). F*F mode entry retains all the SRAM and register information and the exit from F*F mode achieves rapid recovery to active mode. 1 -3 R evis i o n 13 IGLOO2 FPGAs Product Brief High-Performance FPGA Fabric Built on 65 nm process technology, the IGLOO2 FPGA fabric is composed of four building blocks: the logic module, the large SRAM, the micro SRAM and the mathblock. The logic module is the basic logic element and has advanced features: • A fully permutable 4-input LUT (look-up table) optimized for lowest power • A dedicated carry chain based on carry look-ahead technique • A separate flip-flop which can be used independently from the LUT The 4-input look-up table can be configured either to implement any 4-input combinatorial function or to implement an arithmetic function where the LUT output is XORed with carry input to generate the sum output. Dual-Port Large SRAM (LSRAM) Large SRAM (RAM1Kx18) is targeted for storing large memory for use with various operations. Each LSRAM block can store up to 18,432 bits. Each RAM1Kx18 block contains two independent data ports: Port A and Port B. The LSRAM is synchronous for both Read and Write operations. Operations are triggered on the rising edge of the clock. The data output ports of the LSRAM have pipeline registers which have control signals that are independent of the SRAM’s control signals. Three-Port Micro SRAM (uSRAM) Micro SRAM (RAM64x18) is the second type of SRAM which is embedded in the fabric of IGLOO2 devices. RAM64x18 uSRAM is a 3-port SRAM; it has two read ports (Port A and Port B) and one write port (Port C). The two read ports are independent of each other and can perform Read operations in both synchronous and asynchronous modes. The write port is always synchronous. The uSRAM block is approximately 1 KB (1,152 bits) in size. These uSRAM blocks are primarily targeted for building embedded FIFOs to be used by any embedded fabric masters. Mathblocks for DSP Applications The fundamental building block in any digital signal processing algorithm is the multiply-accumulate function. The IGLOO2 device implements a custom 18x18 Multiply-Accumulate (18x18 MACC) block for efficient implementation of complex DSP algorithms such as finite impulse response (FIR) filters, infinite impulse response (IIR) filters, and fast Fourier transform (FFT) for filtering and image processing applications. Each mathblock has the following capabilities: • Supports 18x18 signed multiplications natively (A[17:0] x B[17:0]) • Supports dot product; the multiplier computes: (A[8:0] x B[17:9] + A[17:9] x B[8:0]) x 29 • Built-in addition, subtraction, and accumulation units to combine multiplication results efficiently In addition to the basic MACC function, DSP algorithms typically need small amounts of RAM for coefficients and larger RAMs for data storage. IGLOO2 micro RAMs are ideally suited to serve the needs of coefficient storage while the large RAMs are used for data storage. High-Performance Memory Subsystem (HPMS) The high-performance memory subsystem (HPMS) embeds two separates 32 Kbyte SRAM blocks that have optional SECDED capabilities (32 Kbytes with SECDED enabled, 40 Kbytes with SECDED disabled), up to two separate 256 Kbyte eNVM (flash) blocks, and two separate DMA controllers for fast DMA user logic offloading. The HPMS provides multiple interfacing options to the FPGA fabric in order to facilitate tight integration between the HPMS and user logic in the fabric. R ev i si o n 1 3 1 -4 IGLOO2 Device Family Overview DDR Bridge The DDR bridge is a data bridge between two AHB bus masters and a single AXI bus slave. The DDR bridge accumulates AHB writes into write combining buffers prior to bursting out to external DDR memory. The DDR bridge also includes read combining buffers, allowing AHB masters to efficiently read data from the external DDR memory from a local buffer. The DDR bridge optimizes reads and writes from multiple masters to a single external DDR memory. Data coherency rules between the masters and the external DDR memory are implemented in hardware. The DDR bridge contains two write combining / read buffers. All buffers within the DDR bridge are implemented with SEU tolerant latches and are not subject to the single event upsets (SEUs) that SRAM exhibits. IGLOO2 devices implement three DDR bridges in the HPMS, FDDR, and MDDR subsystems. AHB Bus Matrix (ABM) The AHB bus matrix (ABM) is a non-blocking, AHB-Lite multi-layer switch, supporting 4 master interfaces and 8 slave interfaces. The switch decodes access attempts by masters to various slaves, according to the memory map and security configurations. When multiple masters are attempting to access a particular slave simultaneously, an arbiter associated with that slave decides which master gains access, according to a configurable set of arbitration rules. These rules can be configured by the user to provide different usage patterns to each slave. For example, a number of consecutive access opportunities to the slave can be allocated to one particular master, to increase the likelihood of same type accesses (all reads or all writes), which makes more efficient usage of the bandwidth to the slave. Fabric Interface Controller (FIC) The FIC block provides two separate interfaces between the HPMS and the FPGA fabric: the HPMS master (MM) and fabric master (FM). Each of these interfaces can be configured to operate as AHB-Lite or APB3. Depending on device density, there are up to two FIC blocks present in the HPMS (FIC_0 and FIC_1). Embedded SRAM (eSRAM) The HPMS contains two blocks of 32 KB eSRAM, giving a total of 64 KB. Having the eSRAM arranged as two separate blocks allows the user to take advantage of the parallelism that exists in the HPMS. The eSRAM is designed for Single Error Correct Double Error Detect (SECDED) protection. When SECDED is disabled, the SRAM usually used to store SECDED data may be reused as an extra 16 KB of eSRAM. Embedded NVM (eNVM) The HPMS contains up to 512 KB of eNVM (64 bits wide). DMA Engines Two DMA engines are present in the HPMS: high-performance DMA and peripheral DMA. High-Performance DMA (HPDMA) The high-performance DMA (HPDMA) engine provides efficient memory to memory data transfers between an external DDR memory and internal eSRAM. This engine has two separate AHB-Lite interfaces—one to the MDDR bridge and the other to the AHB bus matrix. All transfers by the HPDMA are full word transfers. Peripheral DMA (PDMA) The peripheral DMA engine (PDMA) is tuned for offloading byte-intensive operations, involving HPMS peripherals, to and from the internal eSRAMs. Data transfers can also be targeted to user logic/RAM in the FPGA fabric. APB Configuration Bus On every IGLOO2 device memory, an APB configuration bus is present to allow the user to initialize the SERDES ASIC blocks, the fabric DDR memory controller, and user instantiated peripherals in the FPGA fabric. 1 -5 R evis i o n 13 IGLOO2 FPGAs Product Brief Peripherals A large number of communications and general purpose peripherals are implemented in the HPMS. Communication Block (COMM_BLK) The COMM block provides a UART-like communications channel between the HPMS and the system controller. System services are initiated through the COMM block. System services such as Enter Flash*Freeze Mode are initiated though this block. SPI The serial peripheral interface controller is compliant with the Motorola SPI, Texas Instruments synchronous serial, and National Semiconductor MICROWIRE™ formats. In addition, the SPI supports interfacing to large SPI flash and EEPROM devices by way of the slave protocol engine. The SPI controller supports both Master and Slave modes of operation. The SPI controller embeds two 4×32 (depth × width) FIFOs for receive and transmit. These FIFOs are accessible through RX data and TX data registers. Writing to the TX data register causes the data to be written to the transmit FIFO. This is emptied by transmit logic. Similarly, reading from the RX data register causes data to be read from the receive FIFO. Clock Sources: On-Chip Oscillators, PLLs, and CCCs IGLOO2 devices have two on-chip RC oscillators—a 1 MHz RC oscillator and a 50 MHz RC oscillator—and the main crystal oscillator (32 KHz–20 MHz). These are available to the user for generating clocks to the on-chip resources and the logic built on the FPGA fabric array. These oscillators can be used in conjunction with the integrated user phase-locked loops (PLLs) and FAB_CCCs to generate clocks of varying frequency and phase. In addition to being available to the user, these oscillators are also used by the system controller, power-on reset circuitry, and HPMS during the Flash*Freeze mode. IGLOO2 devices have up to eight fabric CCC (FAB_CCC) blocks and a dedicated PLL associated with each CCC to provide flexible clocking to the FPGA fabric portion of the device. The user has the freedom to use any of the eight PLLs and CCCs to generate the fabric clocks and the internal HPMS clock from the base fabric clock (CLK_BASE). There is also a dedicated CCC block for the HPMS (HPMS_CCC) and an associated PLL (MPLL) for HPMS clocking and de-skewing the CLK_BASE clock. The fabric alignment clock controller (FACC), part of the HPMS CCC, is responsible for generating various aligned clocks required by the HPMS for correct operation of the HPMS blocks and synchronous communication with the user logic in the FPGA fabric. R ev i si o n 1 3 1 -6 IGLOO2 Device Family Overview High Speed Serial Interfaces SERDES Interface IGLOO2 FPGA has up to four 5 Gbps SERDES transceivers, each supporting the following: • 4 SERDES/PCS lanes • The native SERDES interface facilitates implementation of Serial RapidIO (SRIO) in fabric or a SGMII interface for a soft Ethernet MAC PCI Express (PCIe) PCIe is a high speed, packet-based, point-to-point, low pin count, serial interconnect bus. The IGLOO2 family has two hard highspeed serial interface blocks. Each SERDES block contains a PCIe system block. The PCIe system is connected to the SERDES block and following are the main features supported: • Supports x1, x2, and x4 lane configuration • Endpoint configuration only • PCI Express Base Specification Revision 2.0 • 2.5 and 5.0 Gbps compliant • Embedded receive (2 KB), transmit (1 KB) and retry (1 KB) buffer dual-port RAM implementation • Up to 2 Kbytes maximum payload size • 64-bit AXI or 32-bit/64-bit AHBL Master and Slave interface to the application layer • 32-bit APB interface to access configuration and status registers of PCIe system • Up to 3 x 64 bit base address registers • 1 virtual channel (VC) XAUI/XGXS Extension The XAUI/XGXS extension allows the user to implement a 10 Gbps (XGMII) Ethernet PHY interface by connecting the XGMII fabric interface through an appropriate soft IP block in the fabric. 1 -7 R evis i o n 13 IGLOO2 FPGAs Product Brief High Speed Memory Interfaces: DDRx Memory Controllers There are up to two DDR subsystems, MDDR (HPMS DDR) and FDDR (fabric DDR) present in IGLOO2 devices. Each subsystem consists of a DDR controller, PHY, and a wrapper. The MDDR has an interface to/from the HPMS and fabric, and FDDR provides an interface to/from the fabric. The following are the main features supported by the FDDR and MDDR: • Support for LPDDR, DDR2, and DDR3 memories • Simplified DDR command interface to standard AMBA AXI/AHB interface • Up to 667 Mbps (333 MHz double data rate) performance • Supports 1, 2, or 4 ranks of memory • Supports different DRAM bus width modes: x8, x9, x16, x18, x32, and x36 • Supports DRAM burst length of 2, 4, or 8 in full bus-width mode; supports DRAM burst length of 2, 4, 8, or 16 in half buswidth mode • Supports memory densities up to 4 GB • Supports a maximum of 8 memory banks • SECDED enable/disable feature • Embedded physical interface (PHY) • Read and Write buffers in fully associative CAMs, configurable in powers of 2, up to 64 Reads plus 64 Writes • Support for dynamically changing clock frequency while in self-refresh • Supports command reordering to optimize memory efficiency • Supports data reordering, returning critical word first for each command MDDR Subsystem The MDDR subsystem has two interfaces to the DDR. One is an AXI 64-bit bus from the DDR bridge within the HPMS. The other is a multiplexed interface from the FPGA fabric, which can be configured as either a single AXI 64-bit bus or two 32-bit AHB-Lite buses. There is also a 16-bit APB configuration bus, which is used to initialize the majority of the internal registers within the MDDR subsystem after reset. This APB configuration bus is mastered by a master in the FPGA fabric. Support for 3.3 V Single Data Rate DRAMs (SDRAM) can be obtained by instantiating a soft AHB or AXI SDRAM memory controller in the FPGA fabric and connecting I/O ports to 3.3 V MSIO. FDDR Subsystem The FDDR subsystem has one interface to the DDR. This is a multiplexed interface from the FPGA fabric, which can be configured as either a single AXI 64-bit bus or two 32-bit AHB-Lite buses. There is also a 16-bit APB configuration bus, which is used to initialize the majority of the internal registers within the FDDR subsystem after reset. This APB configuration bus can be mastered by a master in the FPGA fabric. R ev i si o n 1 3 1 -8 IGLOO2 Device Family Overview IGLOO2 Development Tools Design Software Microsemi's Libero® System-on-Chip (SoC) is a comprehensive software toolset to design applications using the IGLOO2 device. Libero SoC manages the entire design flow from design entry, synthesis and simulation, place and route, timing and power analysis, with enhanced integration of the embedded design flow. System designers can leverage the easy-to-use Libero SoC that includes the following features: • System Builder for creation of system level architecture • Synthesis, DSP and debug support from Synopsys • Simulation from Mentor Graphics • Push-button design flow with power analysis and timing analysis • SmartDebug for access to non-invasive probes within the IGLOO2 devices For more information, refer to Libero SoC. Design Hardware Microsemi’s IGLOO2 Evaluation kit (M2GL-EVAL-KIT), is a low-cost platform to evaluate various features offered by the IGLOO2 devices Figure 1-1. The kit includes a M2GL010T-1FGG484 device. The board includes an RJ45 interface to 10/100/1000 Ethernet, 512 Mb of LPDDR, 64 Mb SPI Flash, USB-UART connections as well as I2C, SPI and GPIO headers. The kit includes a 12 V power supply but can also be powered via the PCIe edge connector. The kit also includes a FlashPro4 JTAG programmer for programming and debugging. Figure 1-1 • IGLOO2 Evaluation Kit IP Cores Microsemi offers many soft peripherals that can be placed in the FPGA fabric of the device. These include Core429, Core1553, CoreJESD204BRX/TX, CoreFRI, CoreFFT, and many other DirectCores. Refer to IP Cores for more information. 1 -9 R evis i o n 13 2 – Product Brief Information List of Changes The following table shows important changes made in this document for each revision. Revision Changes Page Revision 13 (June 2016) Updated Table 1 and Table 2 for grade 1 and 2 entries (SAR 80231). Revision 12 (April 2016) Updated Table 3 with more footnotes. (SAR 66079, SAR 77444, and SAR 73335). V–VII Revision 11 (October 2015) Updated Table 1 (SAR 71995). IV Updated "Marking Specification Details" (SAR 71995). XI Updated "Low Power" (SAR 71995). 1-3 Updated Table 2 (SAR 69876). V Added Table 5, Table 6, and Table 7 (SAR 69876). VIII, X, X Updated "Marking Specification Details" (SAR 69876). XI Revision 10 (August 2015) 1-IV, 1-V Updated the "IGLOO2 Ordering Information" image for grade 1 and 2 entries (SAR 80231). 1-IX Added the grade 1 and grade 2 references in "IGLOO2 Datasheet and Pin Descriptions" (SAR 80231). 1-XI Added grade 1 and 2 entries in "Description" (SAR 80231). 1-XII Revision 9 (February 2015) IV, V, V, VII, XI Updated Table 1, Table 2, Table 3, Table 4, and Table 8 Removed all instances of and references to M2GL100. VQ144 is replaced with TQ144 (SAR 62858). 1-2 and 1-3 Updated Table 1-1 and Table 1-2 IX Updated "IGLOO2 Ordering Information" 1-9 Added "IGLOO2 Development Tools" Revision 8 (August 2014) Updated Device Packages 005-VF256 and 150-FCS536 in Table 2–Table 4. V–VII Revision 7 (June 2014) Updated Table 2, Table 3, and Table 4. V, VII Revision 6 (March 2014) Table 1 to Table 4 and "IGLOO2 Ordering Information" were update with IV, VIII Military device data. The "Marking Specification Details" section and the X, VII "Available Programming Interfaces" table were added. Revision 5 (Dec 2013) Tables 3-6 were combined into Table 4. Fabric Interface Controller features VII, IV were added to "IGLOO2 FPGA Product Family" table. Packages VQ144 and V, VII FCV484 were added to Table 2 and Table 4. Revision 4 (Nov 2013) The Data Security Features section, table and the Device Status table were N/A, III removed. “IGLOO2 FPGA Block Diagram” was updated. Revision 3 (Oct 2013) Packages FCS325 and VF256 were added to "I/Os Per Package". "IGLOO2 V, III Ordering Information" was updated. Typo fixed in "IGLOO2 FPGA Block Diagram". R ev i si o n 1 3 2-1 Product Brief Information Revision Revision 2 (Sept 2013) Changes Page LSRAM x32/36 widths added. "IGLOO2 FPGA Product Family" table note IV, V–VII added referring to updates in Table 4 –Table 6. "IGLOO2 Ordering Information" was updated. Part Numbers (tables 7 and 8) VIII, XI were removed. "IGLOO2 Device Status" section was updated. Revision 1 2 -2 M2GL090-FG676 and M2GL005-VF400 package pinouts finalized. V Initial release NA Revision 13 IGLOO2 FPGAs Product Brief Datasheet Categories Categories In order to provide the latest information to designers, some datasheet parameters are published before data has been fully characterized from silicon devices. The data provided for a given device, as highlighted in the "IGLOO2 Device Status", is designated as either "Product Brief," "Advance," "Preliminary," or "Production." The definitions of these categories are as follows: Product Brief The product brief is a summarized version of a datasheet (advance or production) and contains general product information. This document gives an overview of specific device and family information. Advance This version contains initial estimated information based on simulation, other products, devices, or speed grades. This information can be used as estimates, but not for production. This label only applies to the DC and Switching Characteristics chapter of the datasheet and will only be used when the data has not been fully characterized. Preliminary The datasheet contains information based on simulation and/or initial characterization. The information is believed to be correct, but changes are possible. Production This version contains information that is considered to be final. Export Administration Regulations (EAR) The products described in this document are subject to the Export Administration Regulations (EAR). They could require an approved export license prior to export from the United States. An export includes release of product or disclosure of technology to a foreign national inside or outside the United States. Safety Critical, Life Support, and High-Reliability Applications Policy The products described in this advance status document may not have completed the Microsemi qualification process. Products may be amended or enhanced during the product introduction and qualification process, resulting in changes in device functionality or performance. It is the responsibility of each customer to ensure the fitness of any product (but especially a new product) for a particular purpose, including appropriateness for safety-critical, life-support, and other high-reliability applications. Consult the Microsemi SoC Products Group Terms and Conditions for specific liability exclusions relating to life-support applications. Refer to the Reliability Report for all of the SoC Products Group’s products. Microsemi also offers a variety of enhanced qualification and lot acceptance screening procedures. Contact your local sales office for additional reliability information. Microsemi Corporate Headquarters One Enterprise, Aliso Viejo, CA 92656 USA. Within the USA: +1 (949) 380-6100 Sales: +1 (949) 380-6136 Fax: +1 (949) 215-4996 Sales.Support@Microsemi.com R ev i si o n 1 3 2 -3 Microsemi Corporate Headquarters One Enterprise, Aliso Viejo, CA 92656 USA Within the USA: +1 (800) 713-4113 Outside the USA: +1 (949) 380-6100 Sales: +1 (949) 380-6136 Fax: +1 (949) 215-4996 E-mail: sales.support@microsemi.com www.microsemi.com © 2016 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners. Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. 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