MS2209_08

MS2209 RF & MICROWAVE TRANSISTORS AVIONICS APPLICATIONS Features • • • • • 225 MHz BANDWIDTH COMMON BASE GOLD METALLIZATION CLASS C OPERATION POUT = 90 W MIN. WITH 8.4 dB GAIN DESCRIPTION: The MS2209 is a broadband, high peak pulse power silicon NPN bipolar device specifically designed for avionics applications requiring broad bandwidth with moderate duty cycles and pulse width constraints such as ground/ship based DME/TACAN. This device is also designed for specialized applications including JTIDS applications when duty cycle is moderately higher. Gold metallization and emitter ballasting assure high reliability under Class C amplifier operation. ABSOLUTE MAXIMUM RATINGS (Tcase = 25°C) Symbol VCC IC PDISS TJ TSTG Device Current Power Dissipation Junction Temperature (RF Pulsed Operation) Storage Temperature Parameter Collector Supply Voltage Value 50 7.0 220 +200 -65 to +200 Unit V A W °C °C Thermal Data RTH(J-C) Junction-case Thermal Resistance Rev B- September 2008 0.80 °C/W Microsemi reserves the right to change, without notice, the specifications and information contained herein. Visit our web site at www.microsemi.com or contact our factory direct. MS2209 ELECTRICAL SPECIFICATIONS (Tcase = 25°C) STATIC Symbol BVCBO BVEBO BVCER ICBO hFE IC = 40mA IE = 10mA IC= 40mA VCB= 35 V VCE = 5 V IC = 2A Test Conditions IE = 0mA IC=0mA RBE = 10Ω Value Min. 65 3.0 65 -----20 Typ. ----------- Max. ------12 120 Unit V V V mA --- DYNAMIC Symbol POUT GP ηC VSWR f = 960-1215MHz f = 960-1215MHz f = 960-1215MHz f = 960MHz Test Conditions VCC = 50V VCC = 50V VCC = 50V VCC = 50V PIN = 13W PIN = 13W PIN = 13W PIN = 13W Value Min. 90 8.4 38 Typ. 100 --44 Max. ------10:1 Unit W dB % Pulse Width = 10 µs Duty Cycle = 10% IMPEDANCE DATA Freq 960 1025 1090 1150 1215 Vcc=50v Pout=90w Zin (Ω) 5+j9.0 6+j8.0 6.8+j7.2 6.3+j7.0 5.8+j7.8 Zcl (Ω) 10.2-j8.8 9.5-j7.6 9.0-j6.2 8.4-j5.0 7.0-j3.7 Microsemi reserves the right to change, without notice, the specifications and information contained herein. Visit our web site at www.microsemi.com or contact our factory direct. MS2209 TEST CIRCUIT Microsemi reserves the right to change, without notice, the specifications and information contained herein. Visit our web site at www.microsemi.com or contact our factory direct. MS2209 PACKAGE MECHANICAL DATA Microsemi reserves the right to change, without notice, the specifications and information contained herein. Visit our web site at www.microsemi.com or contact our factory direct.