MSMBJ6.0CAE3

MSMBG5.0A – MXLSMBG170CAe3, MSMBJ5.0A – MXLSMBJ170CAe3 Screening in reference to MIL-PRF-19500 available 600 Watt Surface Mount Transient Voltage Suppressor Available DESCRIPTION The MSMB 5.0A – MSMB 170CA series of surface mount 600 watt transient voltage suppressors provide a selection of standoff voltages (Vwm) from 5.0 to 170 V. These high-reliability devices are available in either unidirectional or bidirectional versions. The SMBG Gull-wing design in the DO215AA package is ideal for visible solder connections. The SMBJ J-bend design in the DO214AA package allows for greater PC board mounting density. It is available with SnPb or RoHS compliant matte-tin plating. DO-215AA Gull-wing Package Important: For the latest information, visit our website http://www.microsemi.com. FEATURES • • • • • • High reliability devices with wafer fabrication and assembly lot traceability. All devices 100% surge tested. Enhanced reliability screening in reference to MIL-PRF-19500 is also available. Refer to High Reliability Up-Screened Plastic Products Portfolio for more details on the screening options. (See part nomenclature for all options.) Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B. 3σ lot norm screening performed on standby current (I D ). RoHS compliant versions available. APPLICATIONS / BENEFITS • • • • • DO-214AA J-bend Package NOTE: All SMB series are equivalent to prior SMS package identifications. Protects sensitive components such as IC’s, CMOS, Bipolar, BiCMOS, ECL, DTL, T2L, etc. Protection from switching transients & RF induced voltage pulses. Also available in: Protection from ESD and EFT per IEC 61000-4-2 and IEC 61000-4-4. Secondary lightning protection per IEC61000-4-5 with 42 ohms source impedance: Class 1: MSB 5.0A to MSMB 120CA Class 2: MSMB 5.0A to MSMB 60CA Class 3: MSMB 5.0A to MSMB 30CA Class 4: MSMB 5.0A to MSMB 15CA Secondary lightning protection per IEC61000-4-5 with 12 ohms source impedance: Class 1: MSMB 5.0A to MSMB 36CA Class 2: MSMB 5.0A to MSMB 18CA Commercial Grade SMBJ5.0A – SMBJ170CAe3 T-18 package (axial-leaded) P6KE6.8A – P6KE200CAe3 MAXIMUM RATINGS @ 25 ºC unless otherwise stated Parameters/Test Conditions Junction and Storage Temperature Thermal Resistance, Junction to Lead (1) Thermal Resistance, Junction to Ambient (2) Peak Pulse Power Dissipation 10/1000us (1) Rated Average Power Dissipation @ TL < 25 ºC @ TA = 25 ºC Unidirectional Tclamping (0 volts to V (BR) min) Bidirectional (3) Forward Surge Current Solder Temperature @ 10 s Symbol Value TJ and TSTG R ӨJL R ӨJA P PP P M(AV) -65 to +150 I FS TSP 25 90 600 5 1.38 < 100