MT8806
ISO-CMOS
8 x 4 Analog Switch Array
Data Sheet
Features
September 2011
•
Internal control latches and address decoder
•
Short set-up and hold times
•
Wide operating voltage: 4.5 V to 13.2 V
•
12Vpp analog signal capability
•
RON 65 max. @ VDD=12 V, 25C
•
RON 10 @ VDD=12 V, 25C
•
Full CMOS switch for low distortion
•
Minimum feedthrough and crosstalk
•
Separate analog and digital reference supplies
•
Low power consumption ISO-CMOS technology
Ordering Information
MT8806APR1
MT8806AP1
MT8806AE1
Key systems
•
PBX systems
•
Mobile radio
•
Test equipment/instrumentation
•
Analog/digital multiplexers
•
Audio/Video switching
CS
STROBE
Tape & Reel
Tubes
Tubes
* Pb free Matte Tin
-40C to +85C
Description
The Zarlink MT8806 is fabricated in Zarlink’s ISOCMOS technology providing low power dissipation and
high reliability. The device contains a 8 x 4 array of
crosspoint switches along with a 5 to 32 line decoder
and latch circuits. Any one of the 32 switches can be
addressed by selecting the appropriate five address
bits. The selected switch can be turned on or off by
applying a logical one or zero to the DATA input. VSS is
the ground reference of the digital inputs. The range of
the analog signal is from VDD to VEE. Chip Select (CS)
allows the crosspoint array to be cascaded for matrix
expansion.
Applications
•
28 Pin PLCC*
28 Pin PLCC*
24 Pin PDIP*
DATA RESET
VDD
1
VEE
VSS
1
AX0
AY0
5 to 32
Decoder
8 x 4
Switch
Array
Latches
AY1
AY2
32
32
•••••••••••••••••••
Yi I/O (i=0-7)
Figure 1 - Functional Block Diagram
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 1997-2011, Zarlink Semiconductor Inc. All Rights Reserved.
••••••••••••••••
AX1
Xi I/O
(i=0-3)
MT8806
NC
Y0
Y1
Y2
VDD
Y3
Y4
Data Sheet
4
3
2
1
28
27
26
VDD
Y3
Y4
Y5
Y6
Y7
RESET
STROBE
AY2
AY1
AY0
VEE
NC
DATA
X0
AX0
X1
AX1
X2
5
6
7
8
9
10
11
12
13
14
15
16
17
18
24
23
22
21
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
9
10
11
12
25
24
23
22
21
20
19
Y5
Y6
Y7
RESET
STROBE
AY2
NC
CS
X3
VSS
VEE
AY0
AY1
NC
Y2
Y1
Y0
DATA
X0
AX0
X1
AX1
X2
CS
X3
VSS
28 PIN PLCC
24 PIN PLASTIC DIP
Figure 2 - Pin Connections
Change Summary
Changes from the May 2005 issue to the September 2011 issue.
Page
Item
1
Ordering Information
Change
Removed leaded packages as per PCN notice.
Pin Description
Pin #
Name
Description
1-3
Y2-Y0
Y2-Y0 Analog (Inputs/Outputs): these are connected to the Y2-Y0 columns of
the switch array.
4
6
DATA
DATA (Input): a logic high input will turn on the selected switch and a logic low
will turn off the selected switch. Active High.
5
7
X0
X0 Analog (Input/Output): this is connected to the X0 row of the switch array.
6
8
AX0
7
9
X1
8
10
AX1
9
11
X2
X2 Analog (Input/Output): this is connected to the X2 row of the switch array.
10
12
CS
Chip Select (Input): this is used to select the device. Active High.
11
13
X3
X3 Analog (Input/Output): this is connected to the X3 row of the switch array.
12
14
VSS
Digital Ground Reference
PDIP
PLCC
1-3
X0 Address Line (Input)
X1 Analog (Input/Output): this is connected to the X1 row of the switch array.
X1 Address Line (Input)
2
Zarlink Semiconductor Inc.
MT8806
Data Sheet
Pin Description
Pin #
Name
Description
PDIP
PLCC
13
15
14-16
16,17, 20
17
21
18
22
RESET
Master RESET (Input): this is used to turn off all switches regardless of the
condition of CS. Active High.
19-23
23-27
Y7-Y3
Y7-Y3 Analog (Inputs/Outputs): these are connected to the Y7-Y3 columns of
the switch array.
24
28
VDD
4, 5,
18, 19
NC
VEE
Negative Power Supply
AY0-AY2 Y0 -Y2 Address Lines (Inputs)
STROBE STROBE (Input): enables function selected by address and data. Address must
be stable before STROBE goes high and DATA must be stable on the falling
edge of the STROBE. Active High.
Positive Power Supply
No Connect
Functional Description
The MT8806 is an analog switch matrix with an array size of 8 x 4. The switch array is arranged such that there are
8 columns by 4 rows. The columns are referred to as the Y inputs/outputs and the rows are the X inputs/outputs.
The crosspoint analog switch array will interconnect any X I/O with any Y I/O when turned on and provide a high
degree of isolation when turned off. The control memory consists of a 32 bit write only RAM in which the bits are
selected by the address inputs (AY0-AY2, AX0 & AX1). Data is presented to the memory on the DATA input. Data is
asynchronously written into memory whenever both the CS (Chip Select) and the STROBE inputs are high and is
latched on the falling edge of STROBE. A logical “1” written into a memory cell turns the corresponding crosspoint
switch on and a logical “0” turns the crosspoint off. Only the crosspoint switches corresponding to the addressed
memory location are altered when data is written into memory. The remaining switches retain their previous states.
Any combination of X and Y inputs/outputs can be interconnected by establishing appropriate patterns in the control
memory. A logical “1” on the RESET input will asynchronously return all memory locations to logical “0” turning off
all crosspoint switches regardless of whether CS is high or low. Two voltage reference pins (VSS and VEE) are
provided for the MT8806 to enable switching of negative analog signals. The range for digital signals is from VDD to
VSS while the range for analog signals is from VDD to VEE. VSS and VEE pins can be tied together if a single voltage
reference is needed.
Address Decode
The five address inputs along with the STROBE and CS (Chip Select) inputs are logically ANDed to form an enable
signal for the resettable transparent latches. The DATA input is buffered and is used as the input to all latches. To
write to a location, RESET must be low and CS must go high while the address and data are set up. Then the
STROBE input is set high and then low causing the data to be latched. The data can be changed while STROBE is
high, however, the corresponding switch will turn on and off in accordance with the DATA input. DATA must be
stable on the falling edge of STROBE in order for correct data to be written to the latch.
3
Zarlink Semiconductor Inc.
MT8806
Data Sheet
Absolute Maximum Ratings*- Voltages are with respect to VEE unless otherwise stated.
Parameter
Symbol
Min.
Max.
Units
1
Supply Voltage
VDD
VSS
-0.3
-0.3
15.0
VDD+0.3
V
V
2
Analog Input Voltage
VINA
-0.3
VDD+0.3
V
3
Digital Input Voltage
VIN
VSS-0.3
VDD+0.3
V
4
Current on any I/O Pin
15
mA
5
Storage Temperature
+150
C
0.6
W
I
-65
TS
6 Package Power Dissipation
PLASTIC DIP
PD
* Exceeding these values may cause permanent damage. Functional operation under these conditions is not implied.
Recommended Operating Conditions - Voltages are with respect to VEE unless otherwise stated.
Characteristics
Sym.
Min.
Typ.
Max.
Units
TO
-40
25
85
C
1
Operating Temperature
2
Supply Voltage
VDD
VSS
4.5
VEE
13.2
VDD-4.5
V
V
3
Analog Input Voltage
VINA
VEE
VDD
V
4
Digital Input Voltage
VIN
VSS
VDD
V
Test Conditions
DC Electrical Characteristics†- Voltages are with respect to VEE=VSS=0V, VDD =12V unless otherwise stated.
Characteristics
1
Quiescent Supply Current
Sym.
Min.
Typ.‡
Max.
Units
Test Conditions
1
100
A
All digital inputs at VIN=VSS or
VDD
0.4
1.5
mA
All digital inputs at VIN=2.4 +
VSS; VSS =7.0V
5
15
mA
All digital inputs at VIN=3.4V
1
500
nA
IVXi - VYjI = VDD - VEE
See Appendix, Fig. A.1
0.8+VS
V
VSS =7.5V; VEE=0V
VSS =6.5V; VEE=0V
IDD
2
Off-state Leakage Current
(See G.9 in Appendix)
IOFF
3
Input Logic “0” level
VIL
S
4
Input Logic “1” level
VIH
2.0+VSS
V
5
Input Logic “1” level
VIH
3.3
V
6
Input Leakage (digital pins)
0.1
ILEAK
10
A
All digital inputs at VIN = VSS
or VDD
† DC Electrical Characteristics are over recommended temperature range.
‡ Typical figures are at 25C and are for design aid only; not guaranteed and not subject to production testing.
4
Zarlink Semiconductor Inc.
MT8806
Data Sheet
DC Electrical Characteristics- Switch Resistance - VDC is the external DC offset applied at the analog I/O pins.
Characteristics
Sym.
25C
70C
85C
Units
Test Conditions
Typ. Max. Typ. Max. Typ. Max.
1 On-state
VDD=12V
Resistance VDD=10V
VDD= 5V
(See G.1, G.2, G.3 in
Appendix)
RON
45
55
120
65
75
185
75
85
215
80
90
225
VSS=VEE=0V,VDC=VDD/2,
IVXi-VYjI = 0.4V
See Appendix, Fig. A.2
2 Difference in on-state
resistance between two
switches
(See G.4 in Appendix)
RON
5
10
10
10
VDD=12V, VSS=VEE=0,
VDC=VDD/2,
IVXi-VYjI = 0.4V
See Appendix, Fig. A.2
AC Electrical Characteristics† - Crosspoint Performance - Voltages are with respect to VDD=5V, VSS=0V,
VEE=-7V, unless otherwise stated.
Characteristics
Sym.
Typ.‡
Min.
Max.
Units
Test Conditions
1
Switch I/O Capacitance
CS
20
pF
f=1 MHz
2
Feedthrough Capacitance
CF
0.2
pF
f=1 MHz
3
Frequency Response
Channel “ON”
20LOG(VOUT/VXi)=-3dB
F3dB
45
MHz
Switch is “ON”; VINA = 2Vpp
sinewave; RL = 1k
See Appendix, Fig. A.3
4
Total Harmonic Distortion
(See G.5, G.6 in Appendix)
THD
0.01
%
Switch is “ON”; VINA = 2Vpp
sinewave f= 1kHz; RL=1k
5
Feedthrough
Channel “OFF”
Feed.=20LOG (VOUT/VXi)
(See G.8 in Appendix)
FDT
-95
dB
All Switches “OFF”; VINA=
2Vpp sinewave; f= 1kHz;
RL= 1k
See Appendix, Fig. A.4
6
Crosstalk between any two
channels for switches Xi-Yi and
Xj-Yj.
Xtalk
-45
dB
VINA=2Vpp sinewave
f= 10MHz; RL = 75
-90
dB
VINA=2Vpp sinewave
f= 10kHz; RL = 600
-85
dB
VINA=2Vpp sinewave
f= 10kHz; RL = 1k
-80
dB
VINA=2Vpp sinewave
f= 1kHz; RL = 10k
Refer to Appendix, Fig. A.5
for test circuit.
ns
RL=1k; CL=50pF
Xtalk=20LOG (VYj/VXi).
(See G.7 in Appendix).
7
Propagation delay through
switch
tPS
30
† Timing is over recommended temperature range. See Fig. 3 for control and I/O timing details.
‡ Typical figures are at 25C and are for design aid only; not guaranteed and not subject to production testing.
Crosstalk measurements are for Plastic DIPS only, crosstalk values for PLCC packages are approximately 5 dB better.
5
Zarlink Semiconductor Inc.
MT8806
Data Sheet
AC Electrical Characteristics† - Control and I/O Timings- Voltages are with respect to VDD=5V, VSS=0V, VEE=-7V, unless
otherwise stated.
Min.
Typ.‡
Characteristics
Sym.
Max.
Units
Test Conditions
1
Control Input crosstalk to switch
(for CS, DATA, STROBE, Address)
CXtalk
30
mVpp
VIN=3V squarewave;
RIN=1k, RL=10k
See Appendix, Fig. A.6
2
Digital Input Capacitance
CDI
10
pF
3
Switching Frequency
FO
4
Setup Time DATA to STROBE
tDS
10
ns
RL= 1k,
CL=50pF Å
5
Hold Time DATA to STROBE
tDH
10
ns
RL= 1k,
CL=50pF Å
6
Setup Time Address to STROBE
tAS
10
ns
RL= 1k,
CL=50pF Å
7
Hold Time Address to STROBE
tAH
10
ns
RL= 1k,
CL=50pF Å
8
Setup Time CS to STROBE
tCSS
10
ns
RL= 1k,
CL=50pF Å
9
Hold Time CS to STROBE
tCSH
10
ns
RL= 1k,
CL=50pF Å
10
STROBE Pulse Width
tSPW
20
ns
RL= 1k,
CL=50pF Å
11
RESET Pulse Width
tRPW
40
ns
RL= 1k,
CL=50pF Å
12
STROBE to Switch Status Delay
13
14
20
f=1MHz
MHz
tS
40
100
ns
RL= 1k,
CL=50pF Å
DATA to Switch Status Delay
tD
50
100
ns
RL= 1k,
CL=50pF Å
RESET to Switch Status Delay
tR
35
100
ns
RL= 1k,
CL=50pF Å
† Timing is over recommended temperature range. See Fig. 3 for control and I/O timing details.
Digital Input rise time (tr) and fall time (tf) = 5 ns.
‡ Typical figures are at 25C and are for design aid only; not guaranteed and not subject to production testing.
Å Refer to Appendix, Fig. A.7 for test circuit.
tCSS
tCSH
50%
50%
tRPW
CS
50%
RESET
50%
tSPW
50%
STROBE
50%
50%
tAS
50%
ADDRESS
50%
tAH
50%
DATA
50%
tDS
tDH
ON
SWITCH*
OFF
tS
tD
Figure 3 - Control Memory Timing Diagram
* See Appendix, Fig. A.7 for switching waveform
6
Zarlink Semiconductor Inc.
tR
tR
MT8806
Data Sheet
AX0
AX1
AY0
AY1
AY2
Connection
0
0
0
0
0
X0-Y0
0
0
1
0
0
X0-Y1
0
0
0
1
0
X0-Y2
0
0
1
1
0
X0-Y3
0
0
0
0
1
X0-Y4
0
0
1
0
1
X0-Y5
0
0
0
1
1
X0-Y6
0
0
1
1
1
X0-Y7
1
1
0
0
0
1
0
1
0
1
X1-Y0
X1-Y7
0
0
1
1
0
1
0
1
0
1
X2-Y0
X2-Y7
1
1
1
1
0
1
0
1
0
1
X3-Y0
X3-Y7
Table 1 - Address Decode Truth Table
7
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