MWS11GB11-G1

MWS11GB11-G1

  • 厂商:

    MICROSEMI(美高森美)

  • 封装:

  • 描述:

    MWS11GB11-G1 - InGaP HBT Gain Block - Microsemi Corporation

  • 详情介绍
  • 数据手册
  • 价格&库存
MWS11GB11-G1 数据手册
C ONFIDENTIAL MWS11-GB11-xx InGaP HBT Gain Block A MICROSEMI COMPANY P REVIEW  This general purpose amplifier is a low cost, broadband RFIC manufactured with an InGaP/GaAs Heterojunction Bipolar Transistor (HBT) process (MOCVD). This RFIC amplifier was designed as an easily cascadable 50 ohm gain block. The device is self-contained with 50 ohm input and output impedance. Applications include IF and RF amplification in wireless/ wired voice and data communication products and broadband test equipment operating up to 6 GHz. This RFIC amplifier is initially available in a plastic SOT-89 3-Pin package to handle P1dB output power up to 19dBm (5V). The same RFIC will be available later in an advanced Microsemi Gigamite™ package, with significantly smaller footprint for applications where board space is at a premium.        Advanced InGaP HBT DC to 6GHz Single +5V Supply Small Signal Gain = 16dB P1dB = 19dBm (5V), f=1GHz  SOT-89 3-Pin, & Gigamite Packages W W W . Microsemi . COM        Broadband Gain Blocks  IF or RF buffer Amplifiers  Driver Stage for Power Amps  Final Power Amp for Low to IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com Medium Power Applications  Broadband Test Equipment    45 Gain (dB), Pout (dBm), Current (A)00 40 35 30 25 20 15 10 5 0 -5 -1 0 -2 0 -1 5 -1 0 -5 0 5 P in (d B m ) 10 15 P out G a in C u rre n t f = 5 .7 G H z Vcc = 5 V N o m in a l C u r r e n t 20 m A MWS11-GB11 MWS11-GB11     PK Plastic SOT-89 3 Pin Gigamite MWS11GB11-G1 MWS11GB11-S1 Note: Available in Tape & Reel. Append the letter “T” to the part number. (i.e. MSW11GB11-S89T) Copyright © 2000 Rev. 0.2,2000-12-15 Microsemi 11861 Western Avenue, Garden Grove, CA. 92841. Tel: (714) 898-8121 Page 1 C ONFIDENTIAL MWS11-GB11-xx InGaP HBT Gain Block A MICROSEMI COMPANY P REVIEW      DC Supply Voltage..................................................................................................5.0 Vdc Absolute Max. Limit...................................................................................................60mA RF Input Power (Pin)...............................................................................................10 dBm Operating Case Temperature ..........................................................................-40º to +85ºC Storage Temperature.....................................................................................-60º to +150ºC Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of specified terminal.        T a b is GND W W W . Microsemi . COM 1 2 3 R F IN GND RF OUT/ B IA S   Plastic SOT-89 3-Pin THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA THERMAL RESISTANCE-JUNCTION TO CASE, θJC THERMAL RESISTANCE-JUNCTION TO LEAD, θJT Gigamite θJA THERMAL RESISTANCE-JUNCTION TO CASE, θJC THERMAL RESISTANCE-JUNCTION TO LEAD, θJT THERMAL RESISTANCE-JUNCTION TO AMBIENT, XX°C/W XX°C/W XX°C/W PK PACKAGE (Top View) PK XX°C/W 149°C/W XX°C/W Junction Temperature Calculation: TJ = TA + (PD x θJA). The θJA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow.              RF IN GND RF Input pin. A DC blocking capacitor should be used in most applications. Ground connection. Traces should be minimized and connect immediately to ground. RF output and bias pin. In the bias network, a resistor is selected to set the DC current into this pin as: RF OUT / BIAS R= (VCC − VD ) ICC PACKAGE DATA PACKAGE DATA Note that maximum current limit ICC must not be exceeded and a resistor should always be used. A DC blocking capacitor should also be used. Copyright © 2000 Rev. 0.2,2000-12-15 Microsemi 11861 Western Avenue, Garden Grove, CA. 92841. Tel: (714) 898-8121 Page 2 C ONFIDENTIAL MWS11-GB11-xx InGaP HBT Gain Block A MICROSEMI COMPANY P REVIEW Unless otherwise specified, the following specifications apply over the operating ambient temperature -40°C ≤ TA ≤ +85°C except where otherwise noted. Test conditions: [Enter Test Conditions Here] Parameter Symbol Test Conditions MWS11-GB11-xx Min Typ Max DC 16 34 f=1 GHz f=1.5 GHz 13 3.3 16 4 5 60 6 19 Units   W W W . Microsemi . COM  POWER SUPPLY Application Frequency Range Linear Output Power rd Output 3 Order Intermod Product* Small-Signal Gain Noise Figure Supply Voltage Supply Current f P1dB IP3 G NF VCC f=2GHz GHz dBm dBm dB dB V mA 3.5 4.6 20 DC to >6000 5.5 11.3 11.3 11.4 11.5 11.5 9.9 0.05 7.6
MWS11GB11-G1
1. 物料型号: - 型号:MWS11-GB11-xx - 制造商:Microsemi Company

2. 器件简介: - 这是一个低成本、宽带RFIC放大器,采用InGaP/GaAs异质结双极晶体管(HBT)工艺(MOCVD)制造,适用于高达6GHz的无线/有线语音和数据通信产品以及宽带测试设备中的中频(IF)和射频(RF)放大。

3. 引脚分配: - RF IN:RF输入引脚。在大多数应用中应使用直流阻断电容器。 - GND:地连接。应最小化走线,并立即连接到地。 - RF OUT/BIAS:RF输出和偏置引脚。在偏置网络中,选择一个电阻来设置流入该引脚的直流电流。

4. 参数特性: - 工作频率:DC至6GHz - 单电源供电:+5V - 小信号增益:16dB - 1dB压缩点(P1dB):19dBm(5V),频率1GHz

5. 功能详解应用信息: - 宽带增益块、中频或射频缓冲放大器、功率放大器的驱动阶段、低至中等功率应用的最终功率放大器、宽带测试设备。

6. 封装信息: - SOT-89 3-Pin:塑料SOT-89封装,3引脚。 - Gigamite:更小的封装尺寸,适用于板内空间有限的应用。
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