SF2-DEV-KIT

SmartFusion2 Development Kit Quickstart Guide Kit Contents – SF2-DEV-KIT Quantity Description 1 SmartFusion® 1 1 1 1 1 1 FlashPro4 programmer USB A to Micro B cable USB Micro A to A cable USB A to Mini-B cable PCI edge card ribbon cable 12 V power adapter 2 Development Board with M2S050T-1FGG896 Overview Microsemi's SmartFusion2 Development Kit offers a full-featured development board for SmartFusion2 System-on-Chip (SoC) FPGAs, which integrate inherently reliable flash-based FPGA fabric, a 166 MHz ARM® Cortex™-M3 processor, advanced security processing accelerators, DSP blocks, SRAM, eNVM and industry-required high-performance communication interfaces, all on a single chip. The board contains numerous transceivers to support the built-in microcontroller subsystem, such as high speed USB 2.0 On-the-Go (OTG), CAN RS232, RS484, and IEEE1588 time-stamping and Sync E capable Triple Speed Ethernet PHYs. The kit ships with a wall mounted power supply but also has the option to be powered through Power over Ethernet (PoE), includes a 16-bit analog-to-digital converter (ADC) and has IEEE 1588 packet time-stamping capabilities. There is also 512 MB of on-board DDR3 memory and SPI flash to utilize the SmartFusion2 memory management system. The SERDES blocks can be accessed via the PCI edge connector or high speed SMP connectors. SmartFusion2 Development Kit Board Devices On-Board • • • • • • • • M2S050T-1FGG896 – 50K look-up table (LUT), 256 Kbit eNVM, 1.5 Mbit SRAM, and additional distributed SRAM in the FPGA fabric and external memory controller – Peripherals include Triple Speed Ethernet, USB 2.0, SPI, CAN, DMAs, I2Cs, UARTs, timers – 6x 5 Gbps SERDES, PCIe, XAUI/XGXS+ Native SERDES Refer to the SmartFusion2 product page for full device information ZL30362 – IEEE 1588 and Synchronous Ethernet Packet Clock Network Synchronizer Power over Ethernet (PoE) – Up to 48 W of power – Power supply module required: PD-9501G/AC (not supplied) Precision analog-to-digital converter (ADC) – 16-bit, 500 Ksps, 8-channel, single-ended for mixed signal power management DDR/SDRAM – 512 MB of DDR3 memory on-board 256 MB for ECC – 16MB of SDRAM eMMC – 4GB NAND flash memory SPI flash – 8 MB module January 2014 © 2014 Microsemi Corporation Interfaces/Connectors • • • • • • • • • • • • • JTAG interface for Microsemi's FlashPro4 programming and Cortex-M3 processor Embedded Trace Macro connector USB 2.0 On-The-Go (OTG) Controller RS232 port for USB-to-UART connection Two DB9 connectors for CAN ports RJ45 connector for PoE (Power over Ethernet) power. Two RJ45 connectors for TSE Ethernet operation or SGMII mode SERDES Interfaces Include – X4 PCIe Gen1/Gen2 edge fingers – 4 Tx/Rx high speed SMP connectors – FMC header supporting 4 SERDES channels High speed memory interface supporting LPDDR, DDR2, DDR3, and SDRAM memories FMC header for daughtercard support GPIO header for debugging purposes I2C headers SPI headers 1 SmartFusion2 Development Kit Quickstart Guide Block Diagram USB FTDI-SPI Programming RS232 Transceiver CAN1 Transceiver SPI Flash eMMC Flash PD70201 PoE PD Controller Bank 4 Bank 5 SERDES Block 0 – 4x Bank 7 I/O Headers Bank 3 Bank 2 SmartFusion2 SoC FPGA Bank 1 ADS8568 Precision ADC 12-Bit Bank 8 Bank 6, 9 Bank 0 MDDR – x18 USB-ULPI PHY NX7102 3A 18 Sw. Reg. NX9415 5A 22 V Sw. Reg. I2C CAN2 Transceiver RS485 Transceiver HPC FMC Connector High Speed SERDES, LVDS Pair Single-Ended I/Os JTAG: FlashPro4 Programming/ IAR-Debug Level Translators Other Power Regulators – Power Jack for PCIe Connectors Power LEDs/Switch ZL30362 Clock Synthesizer SDRAM x 16 SDB207 Diode Bridge SGMII Ethernet Jack Marvell E1340S 1G 1588 SynE/ PTP Capable Ethernet Jack Debug Push-Button/ Switch RGMII 1G 1588 MAX24288 Clocks/ Oscillators SFP Module SERDES Block 0 – 4x DDR3 Memory LEDs PCI3 Gen 1, Gen 2 Clocks/ Oscillators High Speed SMP Connector Edge Connector Figure 1 • SmartFusion2 Interfaces/Connectors Block Diagram Jumper Settings Jumper Setting Function Jumper Setting Function J195 1-2 J163 1-2 USB Test J188 1-2 J164 1-2 USB Test J197 1-2 J114 1-2 CAN1 Test J121 1-2 SPI Test J115 1-2 CAN1 Test J110 1-2 SPI Test J111 1-2 CAN1 Test J119 1-2 SPI Test J134 1-2 CAN2 Test J118 1-2 SPI Test J131 1-2 CAN2 Test J139 1-2 USB Test J232 1-2 CAN2 Test 2 Connecting the Board Connecting the Board Follow the steps below to connect the board: 1. Connect the USB mini-B cable from your PC to the USB Mini-B connector (FTDI) interface on the board. 2. Connect the FlashPro4 programmer to your PC via the USB mini-B cable. 3. Connect the FlashPro4 programmer to the board via the FP4 header. 4. Connect the 12 V DC power supply to a wall outlet and to the board via the DC jack. 5. Switch the power on to the board via the power-on switch (SW7) 3 SmartFusion2 Development Kit Quickstart Guide List of Changes The following table lists the critical changes that were made in each revision of the document. Revision* Revision 1 (January 2014) Changes Updated the document to remove PP in the device name (SAR 54072). NA Updated device part number in "Kit Contents – SF2-DEV-KIT" section and "SmartFusion2 Development Kit Board" section (SAR 54072). NA Corrected power-on switch in "Connecting the Board" section (SAR 54072). Revision 0 (March 2013) Page Initial Release 3 NA Note: *The revision number is located in the part number after the hyphen. The part number is displayed at the bottom of the last page of the document. The digits following the slash indicate the month and year of publication. 4 Software and Licensing The SmartFusion2 Development Kit is supported by Libero® System-on-Chip (SoC) software v11.0 Beta SP1. SoftConsole software IDE and FlashPro software tools can be used for software design and debug. SmartFusion2 is also supported by Keil and IAR Systems software, which can be installed separately. Refer to the SmartFusion2 Development Kit User Guide for more information. Software releases: www.microsemi.com/index.php?option=com_content&id=1574&lang=en&view=article#downloads Keil and IAR information: www.microsemi.com/index.php?option=com_content&Itemid=2823&id=1563&lang=en&view=article Libero SoC v11.0 and later requires a valid Gold, Platinum, or standalone Libero license. If you need a new license, select FREE Libero SoC Gold license and request a new one from your Microsemi Customer Portal account. This license supports all tools for designing with the SmartFusion2 family and associated development kits. License updates: https://soc.microsemi.com/Portal/default.aspx?r=1 Documentation Resources For further kit information, including user's guide, tutorial, and full design examples, refer to the SmartFusion2 Development Kit page: Documentation: www.microsemi.com/index.php?option=com_content&id=1645&lang=en&view=article#documents As new demos and tutorials become available, they will be posted on the SmartFusion2 Development Kit web page. Microsemi recommends that you sign up for Product Updates to be notified when new material is available. You can sign up for product updates from your Microsemi Customer Portal account. Product updates: https://soc.microsemi.com/Portal/default.aspx?r=2 Technical Support and Contacts Technical support is available online at www.microsemi.com/index.php?option=com_content&id=2112&lang=en&view=article and by email at soc_tech@microsemi.com. Microsemi SoC Sales offices, including Representatives and Distributors, are located worldwide. To find your local representative visit www.microsemi.com/index.php?option=com_content&id=137&lang=en&view=article. Microsemi Corporation (NASDAQ: MSCC) offers a comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and communications; and industrial and alternative energy markets. Products include high-performance, high-reliability analog and RF devices, mixed signal and RF integrated circuits, customizable SoCs, FPGAs, and complete subsystems. Microsemi is headquartered in Aliso Viejo, Calif. Learn more at www.microsemi.com. Microsemi Corporate Headquarters One Enterprise, Aliso Viejo CA 92656 USA Within the USA: +1 (949) 380-6100 Sales: +1 (949) 380-6136 Fax: +1 (949) 215-4996 © 2014 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners. 50200399-1/01.14