SM0502_09

SM0502 – SM1003 TM ® CONTROL DEVICES Surface Mount – MELF PIN Diodes RoHS Compliant Versions DESCRIPTION This line of ‘MELF’ high power PIN diodes are hermetically sealed surface mount packaged devices with full face bonded chips for low inductance construction. The MELF ceramic package has square end terminations which are ideal for surface mount and pick and place operations. The PIN diode chips are coated with a special hard glass passivation which is required for high power applications and to enhance the reliability resulting in MTBFs of greater than one million hours. RoHS compliant versions of these products meet RoHS requirements per EU Directive 2002/95/EC. The standard terminal finish is gold unless otherwise specified. Consult the factory if you have special requirements. KEY FEATURES  Non-Magnetic1 Versions Ideal for MRI Applications  Very Low Inductance, Full Face Bonding  Hi-Rel Hermetic Design  Surface Mount Devices Available in Tape and Reel 2  RoHS Compliant Versions www.MICROSEMI.com Available APPLICATIONS The MELF diodes are used as switching, attenuating and phase shifting elements from HF through 2 GHz and have breakdown voltage ratings up to 500 volts. ‘Non-magnetic1’ .Cer-Met. (MELFs) are also used as switching elements in MRI (magnetic resonance imaging). Conventional Magnetic MELF packages are used in Cellular, Beam Steering units (telephone via satellites) surface mount applications, and Filter Switch banks for Frequency Hopping Radios. APPLICATIONS/BENEFITS  Designed for Low Loss – Low Distortion Applications  Switch – Filter Bank  T/R Control  Attenuators  MRI Switching ABSOLUTE MAXIMUM RATINGS AT 25º C (UNLESS OTHERWISE SPECIFIED) Rating Maximum Leakage Current @80% of Minimum Rated VB Forward Current (1us Pulse) Storage Temperature Operating Temperature Symbol IR IF TSTG TOP Value 500 1 -55 to +150 -55 to +150 Unit nA A SM0502 – SM1003 ºC ºC IMPORTANT: For the most current data, consult our website: www.MICROSEMI.com Specifications are subject to change, consult factory for the latest information. These devices are ESD sensitive and must be handled using ESD precautions. 1‘ Non Magnetic’ refers to any products that are designed with low and ultra low magnetic materials for use in MRI systems RoHS versions are supplied with a matte tin finish. 2 . Copyright  2007 Rev: 2009-02-25 Microsemi Microwave Products Page 1 75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748 SM0502 – SM1003 TM ® CONTROL DEVICES Surface Mount – MELF PIN Diodes RoHS Compliant Versions ELECTRICAL PARAMETERS @ 25C (unless otherwise specified) Vb(V) CT(pF)1 Rs(Ω)2 TL(uS) Rs(Ω)2 IR=10μA @50V @100 mA @200 mA . Model Number (Min) SM0502 – M1 SM0504 – M1 SM0508 – M1 SM0509 – M1 SM0511 – M1 SM0512 – M1 SM1002 – M1 SM1003 – M1 500 500 500 500 500 500 50 35 (Max) 0.5 0.6 0.9 1.2 1.25 1.5 1.2 1.2 @20V (Max) 0.7 0.6 0.4 0.35 0.3 0.25 0.75@50mA 0.5@10mA (Typ) 0.55 0.45 0.25 0.2 0.15 0.12 0.2 0.1 (Typ) 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.6 P (˚C/W) THERMAL RESISTANCE (Max) 35 20 15 15 15 15 15 25 www.MICROSEMI.com Notes: 1- Capacitance (CT) is measured at F = 1 MHz 2- Series Resistance (RS) is measured at F = 100 MHz RoHS and MRI Models Base Model SM0502 – M1 SM0504 – M1 SM0508 – M1 SM0509 – M1 SM0511 – M1 SM0512 – M1 SM1002 – M1 SM1003 – M1 RoHS Compliant PN SMX0502 – M1 SMX0504 – M1 SMX0508 – M1 SMX0509 – M1 SMX0511 – M1 SMX0512 – M1 SMX1002 – M1 SMX1003 – M1 Non-Mag. / RoHS PN SMX0502MR – M1 SMX0504MR – M1 SMX0508MR – M1 SMX0509MR – M1 SMX0511MR – M1 SMX0512MR – M1 SMX1002MR – M1 ELECTRICAL ELECTRICAL SMX1003MR – M1 Copyright  2007 Rev: 2009-02-25 Microsemi Microwave Products Page 2 75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748 SM0502 – SM1003 TM ® CONTROL DEVICES Surface Mount – MELF PIN Diodes RoHS Compliant Versions TYPICAL RS CUREVES PACKAGE STYLE ‘M1’ www.MICROSEMI.com SOLDER PAD LAYOUT GRAPHS GRAPHS Copyright  2007 Rev: 2009-02-25 Microsemi Microwave Products Page 3 75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748