UM7500
POWER PIN DIODES
DESCRIPTION The UM7500 series features Microsemi’s innovative passivated chip design which takes advantage of the latest silicon wafer bonding and junction passivation techniques. This new series of PIN diodes incorporates all of the desirable RF properties of previous Microsemi diodes plus extremely low leakages and very stable reverse characteristics. Power dissipation capability is assured by Microsemi’s metallurgically bonded, fused in glass construction. This technique continues to be the optimum approach for applications requiring reliable, high power diodes. Low leakage distortion is achieved by maintaining high carrier lifetime and accurately controlling I-region thickness throughout the process. The UM7500 series is designed for use in a broad range of RF and microwave switch and attenuator circuits. The packages make this series suitable for many high-end medical applications such as MRI and CAT scan equipment. For military applications, the new series is capable of meeting all the requirements of MIL-STD-750 including HTRB screening at 80% of rated voltage at 150 OC.
KEY FEATURES
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Voltage Ratings to 1400 Volt Fully Passivated PIN Chip Low Leakage, IR < 0.5 µA Void Less, Particle Free Construction Hermetic Fused in Glass Low Loss, Low Distortion Surface Mount Package Available Metallurgically Bonded, Thermally Matched Construction Compatible with automatic insertion equipment
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
ABSOLUTE MAXIMUM RATINGS AT 25º C (UNLESS OTHERWISE SPECIFIED)
Package A Condition
O 25 C Pin Temperature
PD
θ APPLICATIONS/BENEFITS Isolated stud package available Surface mount package available RoHS compliant packaging available: use UMX7501B, etc.
10 W 15 OC/W 5.5 W 27.5 OC/W 1.5 W 10 W 15 OC/W 7.5 W 20 OC/W 7.5 W 20 OC/W 35 kW
O O -65 C to + 175 C
B & E ½ in. total length to 25 OC Contact Free Air O C 25 C Stud Temperature D SM All
O 25 C Stud Temperature O 25 C End Cap Temperature
1 us pulse (Single) OPERATING AND STORAGE TEMPERATURE RANGE
VOLTAGE RATINGS
Reverse Voltage @ 0.5 uA 100V 200V 400V 600V 800V 1000V 1200V 1400V UM7501 UM7502 UM7504 UM7506 UM7508 UM7510 UM7512 UM7514
UM7500 UM7500
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UM7500
POWER PIN DIODES
ELECTRICAL PARAMETERS @ 25°C (unless otherwise specified)
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Parameter
Total Capacitance Series Resistance Parallel Resistance Parallel Resistance Carrier Lifetime Reverse Current I-Region Width Forward Voltage Forward Bias Harmonic Distortion Reverse Bias Harmonic Distortion
Symbol
CT RS Rp Rp τ IR W VF (R2a/a,R3a/a) (R2a/a,R3a/a)
Conditions
VR=100V, F= 1 MHz If = 50 mA, F= 100 MHz VR = 100 V, F = 100 MHz VR = 0 V, F = 100 MHz IF = 10 mA VR = Voltage rating IF= 50 mA 100 MHz, P=30W, IF=50mA 100 MHz, P=0dBm,VR=0V
MIN.
TYPICAL
0.8 0.8 150k 15k 3.5 0.1 100 0.8 90 70
MAX.
1.0 1.0
Units
pF Ohms Ohms Ohms µs µA µm dBc dBc
100k 10k 2.5
0.5 1.0
80 60
Style “B”
Style “SM”
UM7500 TYPICAL
103
F = 100 MHz
102
Rs (Ohms)
101
100
ELECTRICALS ELECTRICALS
10-1 10-5 10-4 10-3 10-2 10-1 100 101
If (A)
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POWER PIN DIODES
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UM7500 TYPICAL
100
10-1
10-2
If (A)
10-3
10-4
10-5
10-6 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
Vf (V)
UM7500 TYPICAL
10 3 100 MHz
Rp (KOhms)
102 500 MHz
101
1 GHz
ELECTRICALS ELECTRICALS
100 100 101 102
Vr (V)
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POWER PIN DIODES
UM7500 TYPICAL
12
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PD MAX POWER DISSIPATION (W)
11 10 9 8 7 6 5 4 3 2 1 0 0 25 50 75 100 125 o 150 175
"C" PACKAGE
"D" PACKAGE
STUD TEMPERATURE ( C)
ELECTRICALS ELECTRICALS
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UM7500
POWER PIN DIODES
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UM7500 TYPICAL
PULSE THERMAL IMPEDANCE ( C/W)
102
o
DC
101
100 100 101 102 103
PULSE WIDTH (SECONDS)
UM7500 TYPICAL
3.5
3.0
2.5
Ct (pF)
2.0 f = 1 MHz 1.5
ELECTRICALS ELECTRICALS ELECTRICALS ELECTRICALS
1.0 f = 100 MHz 0.5
0.0 1 10 100 1000
Vr (Volts)
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UM7500
POWER PIN DIODES
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STYLE “A”
STYLE “B”
STYLE “C”
STYLE “CR”
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POWER PIN DIODES
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STYLE “D”
STYLE “DR”
STYLE “E”
STYLE “SM”
MECHANICL MECHANICL
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POWER PIN DIODES
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STYLE “SM” FOOTPRINT
NOTES: 1. These dimensions will match the terminals and provide for additional solder fillets at the outboard ends at least as wide as the terminals themselves, assuming accuracy of placement within 0.005” 2. If the mounting method chosen requires use of an adhesive separate from the solder compound, a round (or square) spot of cement as shown should be centrally located.
MECHANICAL MECHANICAL
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POWER PIN DIODES
NOTES:
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NOTES NOTES
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