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UPGA301AE3

UPGA301AE3

  • 厂商:

    MICROSEMI(美高森美)

  • 封装:

  • 描述:

    UPGA301AE3 - Nanosecond SCR SWITCH - Microsemi Corporation

  • 数据手册
  • 价格&库存
UPGA301AE3 数据手册
UPGA301Ae3 Nanosecond SCR SWITCH SCOTTSDALE DIVISION DESCRIPTION KEY FEATURES W WW . Microsemi . C OM The UPGA301Ae3 is Designed for high current narrow-pulse switching applications where size and current handling capability are critical. These devices may be triggered on using low power logic drivers from (+0.8 V at 200 μA). Epoxy packaged, oxide passivated planar SCR chips with metallurgic bonds on both sides to achieve high reliability. Internal wire bond connection allows high current surge capability for narrow pulse applications. Very low thermal resistance package Efficient heat path with integral locking bottom metal tab Full metallic bottom eliminates flux entrapment RoHS Compliant with e3 suffix High speed switching capability Compatible with high-speed insertion Low profile height of 1 mm APPLICATIONS/BENEFITS IMPORTANT: For the most current data, consult MICROSEMI’swebsite:http://www.microsemi.com ABSOLUTE MAXIMUM RATINGS AT 25º C (UNLESS OTHERWISE SPECIFIED) Rating Repetative peak Off-State Voltage Peak On-State Current for 50 ns (max) Peak Gate Current Reverse Gate Voltage Storage Temperature Range Operating Temperature Range Symbol VDRM ITSM IGM VGR Ts TJ Value 100 100 250 5 -50 to 150 0 to 125 Unit V A mA V ºC ºC Reference Microsemi MicroNote 601 and 602 THERMAL CHARACTERISTICS (UNLESS OTHERWISE SPECIFIED) Thermal Resistance Junction-to-Case (Anode Bottom) Junction-to-Ambient (1) RθJC RθJA 4.0 65 ºC/Watt ºC/Watt Nanosecond SCR switch for reliable high current pulse generators, modulators and photo-flash quenching Logic drive capability (0.8V, 200μA) Ideal for Laser Range finder and Camera Applications Ideal for Automotive Collision Avoidance Applications MECHANICAL & PACKAGING (1)When mounted on 0.06’ thick FR4 board with 2 oz copper FR4 board with recommended footprint • CASE: Void-free transfer molded thermosetting epoxy compound meeting UL94V-0 • FINISH: Annealed matte-Tin plating over copper and readily solderable per MIL-STD-750 method 2026 (consult factory for Tin-Lead plating) • POLARITY: See figure (left) • MARKING: 301A• • WEIGHT: 0.072 gram (approx.) • Package dimensions on last page • Tape & Reel option: 16 mm tape per Standard EIA-481-B, 5000 on 13” reel Small foot print UPGA301A UPGA301A .190 X .270 inches 1:1 Actual size See mounting pad details on pg 3 Copyright © 2005 7-17-05, Rev D Microsemi 8700 E. Thomas Rd. PO Box 1390, Scottsdale Arizona 85252, 480-941-6300, Fax: 480-947-1503 Page 1 UPGA301Ae3 Nanosecond SCR SWITCH SCOTTSDALE DIVISION ELECTRICAL PARAMETERS@25°C (unless otherwise specified) W WW . Microsemi . C OM Parameter Forward Blocking Current On - State Voltage Gate Trigger Voltage Gate Trigger Current Reverse Gate Current Holding Current Reverse Current (Note 1) Switching characteristics (Tc = 25 °C) Symbol IDRM VT VGT IGT IGR IH IRRM td tr tq tpg(on) dv/dt Conditions VDRM = 100 V, RGK = 1 kΩ IT = 1 A, Ig =10 mA VD = 5 V, RGS = 100 Ω VD = 5 V, RGS = 10 kΩ VGR = 5 V VD = 5 V, RGK = 1 kΩ VRRM = 30 V, RGK = 1 kΩ Ig = 20 mA, IT = 1 A VD = 60 V, IT =1 A, Ig =10 mA dc < 1% IT = 1.0 A , IR = 1.0 A max, RGK = 1 kΩ Ig = 10 mA, IT = 1 A VD = 30 V, RGK = 1 kΩ Min. Typ. 1.1 0.5 10 0.01 3.0 1 20 15 0.3 20 Max. 1.0 1.5 0.75 200 0.1 5.0 10 30 25 0.5 50 Units μA V V μA mA mA mA ns ns μs ns V/μs On characteristics (up to 100 A w/ 100 ns pulse @ Duty Cycle = 0.0001% or less) 1.0 Delay Time Rise Time Circuit Commutated Turn—off Time Gate Trigger—on Pulse Width Critical Rate of Rise Off –State Voltage 15 30 Note 1: Pulse Test intended to guarantee reverse anode voltage capability for pulse commutation. The device should not be operated in the reverse blocking mode on a continuous basic ELECTRICALS ELECTRICALS Copyright © 2005 7-17-05, Rev D Microsemi 8700 E. Thomas Rd. PO Box 1390, Scottsdale Arizona 85252, 480-941-6300, Fax: 480-947-1503 Page 2 UPGA301Ae3 Nanosecond SCR SWITCH SCOTTSDALE DIVISION W WW . Microsemi . C OM Case: Molded Epoxy Meets UL94V-O at 1/8 inch Weight: 72 milligrams Lead and Mounting Temperature: 260°C max for 10 seconds NOTE: All dimensions are in inches. PACKAGE DATA PACKAGE DATA Copyright © 2005 7-17-05, Rev D Microsemi 8700 E. Thomas Rd. PO Box 1390, Scottsdale Arizona 85252, 480-941-6300, Fax: 480-947-1503 Page 3 UPGA301Ae3 Nanosecond SCR SWITCH SCOTTSDALE DIVISION NOTES: W WW . Microsemi . C OM NOTES NOTES Copyright © 2005 7-17-05, Rev D Microsemi 8700 E. Thomas Rd. PO Box 1390, Scottsdale Arizona 85252, 480-941-6300, Fax: 480-947-1503 Page 4
UPGA301AE3 价格&库存

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