UPS5819E3/TR7

UPS5817(e3) and UPS5819(e3) Schottky Barrier Rectifier 1.0 Amp, 20 and 40 Volt Compliant DESCRIPTION Single schottky rectifier assembled in Powermite 1 package which features a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly. The package also incorporates a unique locking tab which acts as an efficient heat path from the die to the mounting plane for external heat sinking with very low thermal resistance junction to case (bottom). This product is suitable for use in switching and regulating power supplies and also charge pump circuits. Important: For the latest information, visit our website http://www.microsemi.com. FEATURES • • • • Ultra low forward voltage drop. Efficient heat path with integral locking bottom metal tab. Supplied in 8mm tape and reel. RoHS compliant. Powermite 1 (DO-216AA) Package APPLICATIONS / BENEFITS • • • • • • High power surface mount package. Guard ring construction for transient protection. Compatible with Automatic Insertion Equipment. Full-metallic bottom eliminates flux entrapment. High surge capacity. Ideal for OR’ing diode. MAXIMUM RATINGS @ 25 ºC unless otherwise stated Parameters/Test Conditions Symbol Peak Repetitive Reverse Voltage and also Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Junction and Storage Temperature Thermal Resistance Junction-to-Case (1) Thermal Resistance Junction-to-Ambient Average Rectified Output Current @ T C = 135 ºC Repetitive Peak Forward Current Surge Peak Forward Current Voltage Rate of Change @ Rated V R and T J = 25 ºC Solder Temperature @ 10 s V RRM V RWM VR V R(RMS) T J and T STG R ӨJC R ӨJA IO I FRM I FSM dv/dt T SP Value UPS5817 UPS5819 20 40 14 28 -55 to +150 15 240 1.0 2.0 50 10,000 260 Notes: 1. Mounted on FR-4 PC board using 1 oz copper with recommended minimum foot print. RF01129, Rev. A (5/8/13) ©2013 Microsemi Corporation Unit V V ºC ºC/W ºC/W A A A V/µs o C MSC – Lawrence 6 Lake Street, Lawrence, MA 01841 Tel: 1-800-446-1158 or (978) 620-2600 Fax: (978) 689-0803 MSC – Ireland Gort Road Business Park, Ennis, Co. Clare, Ireland Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 Website: www.microsemi.com Page 1 of 4 UPS5817(e3) and UPS5819(e3) MECHANICAL and PACKAGING • • • • • • • CASE: Molded epoxy package meets UL94V-0. TERMINALS: Copper with annealed matte-tin plating for RoHS compliance. Solderable per MIL-STD-750 method 2026. (Consult factory for tin-lead plating). MARKING: Body marked with “S17” or “S19”. POLARITY: Cathode designated by Tab 1 (bottom). TAPE & REEL option: Packaging per EIA-481-B with 8 mm tape. Consult factory for quantities. WEIGHT: Approximately 0.016 grams. See Package Dimensions on last page. PART NOMENCLATURE UPS 5817 e3 Powermite Schottky RoHS Compliance e3 = RoHS compliant Blank = non-RoHS compliant Series Number ELECTRICAL CHARACTERISTICS RATING (Conditions) SYMBOL VALUE UPS5817 UPS5819 UNIT Maximum Instantaneous Forward Voltage (2) (I F = 1.0 A, T J = +25 ºC) VF 0.45 0.55 Volts Maximum Instantaneous Reverse Current (2) (V R = 20 V, T J = +25 ºC) I RM 1.0 1.0 mA (V R = 5V, f = 1 MHz) CJ 105 60 pF Typical Junction Capacitance Notes: 2. Measured with a test pulse of 380 µs to minimize self-heating effect. RF01129, Rev. A (5/8/13) ©2013 Microsemi Corporation Page 2 of 4 UPS5817(e3) and UPS5819(e3) R(T), Transient Thermal Resistance (Normalized) GRAPHS Duty Factor Percent Values are Duty Cycle = 100 x t1/t2 t, Pulse Width Time (s) R(T), Transient Thermal Resistance (Normalized) FIGURE 1 Thermal Impedance Junction to Case Duty Factor Percent Values are Duty Cycle = 100 x t1/t2 t, Pulse Width Time (s) FIGURE 2 Thermal Impedance Junction to Ambient RF01129, Rev. A (5/8/13) ©2013 Microsemi Corporation Page 3 of 4 UPS5817(e3) and UPS5819(e3) PACKAGE DIMENSIONS Ltr A B C D E F G H J K Dimensions Inch Millimeters Min Max Min Max 0.029 0.039 0.73 0.99 0.016 0.026 0.40 0.66 0.070 0.080 1.77 2.03 0.087 0.097 2.21 2.46 0.020 0.030 0.50 0.76 0.051 0.061 1.29 1.54 0.021 0.031 0.53 0.78 0.004 0.008 0.10 0.20 0.070 0.080 1.77 2.03 0.035 0.045 0.89 1.14 PAD LAYOUT Ltr A B C D E Dimensions Inch Millimeters 0.100 2.54 0.105 2.67 0.050 1.27 0.030 0.76 0.025 0.64 SCHEMATIC RF01129, Rev. A (5/8/13) ©2013 Microsemi Corporation Page 4 of 4