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ZL40216LDF1

ZL40216LDF1

  • 厂商:

    MICROSEMI(美高森美)

  • 封装:

    VFQFN32_EP

  • 描述:

    IC CLK BUFFER 1:6 750MHZ 32QFN

  • 数据手册
  • 价格&库存
ZL40216LDF1 数据手册
ZL40216 Precision 1:6 LVDS Fanout Buffer Data Sheet November 2012 Ordering Information Features ZL40216LDG1 ZL40216LDF1 Inputs/Outputs • Six precision LVDS outputs • Operating frequency up to 750 MHz Trays Tape and Reel Matte Tin Accepts differential or single-ended input • LVPECL, LVDS, CML, HCSL, LVCMOS • 32 Pin QFN 32 Pin QFN Package Size: 5 x 5 mm -40oC to +85oC Applications Power • General purpose clock distribution • Option for 2.5 V or 3.3 V power supply • Low jitter clock trees • Current consumption of 93 mA • Logic translation • On-chip Low Drop Out (LDO) Regulator for superior power supply noise rejection • Clock and data signal restoration • Wired communications: OTN, SONET/SDH, GE, 10 GE, FC and 10G FC Performance • Wireless communications • • High performance micro-processor clock distribution Ultra low additive jitter of 104 fs RMS out0_p out0_n out1_p out1_n out2_p out2_n clk_p clk_n Buffer out3_p out3_n out4_p out4_n out5_p out5_n Figure 1 - Functional Block Diagram 1 Microsemi Corporation Copyright 2012, Microsemi Corporation All Rights Reserved. ZL40216 Data Sheet Table of Contents Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Inputs/Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.0 Package Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.0 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.0 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.1 Clock Inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.2 Clock Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.3 Device Additive Jitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3.4 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.4.1 Sensitivity to power supply noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.4.2 Power supply filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.4.3 PCB layout considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.0 AC and DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5.0 Performance Characterization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 6.0 Typical Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 7.0 Package Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 8.0 Mechanical Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2 Microsemi Corporation ZL40216 Data Sheet List of Figures Figure 1 - Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Figure 2 - Pin Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Figure 3 - LVPECL Input DC Coupled Thevenin Equivalent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 4 - LVPECL Input DC Coupled Parallel Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure 5 - LVPECL Input AC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure 6 - LVDS Input DC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 7 - LVDS Input AC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 8 - CML Input AC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 9 - HCSL Input AC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 10 - CMOS Input DC Coupled Referenced to VDD/2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 11 - CMOS Input DC Coupled Referenced to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 12 - Simplified LVDS Output Driver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 13 - LVDS DC Coupled Termination (Internal Receiver Termination) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 14 - LVDS DC Coupled Termination (External Receiver Termination) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 15 - LVDS AC Coupled Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 16 - LVDS AC Output Termination for CML Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 17 - Additive Jitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 18 - Decoupling Connections for Power Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 19 - Differential Voltage Parameter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 20 - Input To Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3 Microsemi Corporation ZL40216 1.0 Data Sheet Package Description 24 22 20 out3_n 18 out1_n out1_p out3_p vdd gnd gnd vdd out2_n out2_p The device is packaged in a 32 pin QFN 16 out4_n 26 out0_n 14 28 NC 12 gnd (E-pad) NC 10 32 NC vdd 6 VDD_core 8 gnd NC clk_n 4 clk_p gnd 2 VDD_core vdd NC NC 30 NC NC out5_p out5_n vt out0_p out4_p Figure 2 - Pin Connections 4 Microsemi Corporation ZL40216 2.0 Data Sheet Pin Description Pin # Name 3, 6 clk_p, clk_n, 28, 27, 26, 25, 24, 23, 18, 17, 16, 15, 14, 13, Description Differential Input (Analog Input). Differential input signals. out0_p, out0_n Differential Output (Analog Output). Differential outputs. out1_p, out1_n out2_p, out2_n out3_p, out3_n out4_p, out4_n out5_p, out5_n 9, 19, 22, 32 vdd Positive Supply Voltage. 2.5 VDC or 3.3 VDC nominal. 1, 8 vdd_core Positive Supply Voltage. 2.5 VDC or 3.3 VDC nominal. 2, 7, 20, 21 gnd Ground. 0 V. 4, 5 10, 11, 12, 29,30, 31 NC No Connection. Leave unconnected. 5 Microsemi Corporation ZL40216 3.0 Data Sheet Functional Description The ZL40216 is an LVDS clock fanout buffer with six identical output clock drivers capable of operating at frequencies up to 750MHz. Inputs to the ZL40216 are externally terminated to allow use of precision termination components and to allow full flexibility of input termination. The ZL40216 can accept DC or AC coupled LVPECL, LVDS, CML or HCSL input signals; single ended input signals can also be accepted. A pin compatible device with internal termination is also available. The ZL40216 is designed to fan out low-jitter reference clocks for wired or optical communications applications while adding minimal jitter to the clock signal. An internal linear power supply regulator and bulk capacitors minimize additive jitter due to power supply noise. The device operates from 2.5V+/-5% or 3.3V+/-5% supply. Its operation is guaranteed over the industrial temperature range -40°C to +85°C. The device block diagram is shown in Figure 1; its operation is described in the following sections. 3.1 Clock Inputs The ZL40216 is adaptable to support different types of differential and singled-ened input signals depending on the passive components used in the input termination. The application diagrams in the following figures allow the ZL40216 to accept LVPECL, LVDS, CML, HCSL and single-ended inputs. VDD_driver VDD VDD_driver R1 R3 Zo = 50 Ohms ZL40216 clk_p LVPECL Driver clk_n Zo = 50 Ohms R2 R4 VDD_driver=3.3V: R1=R3=127 ohm, R2=R4=82 ohm VDD_driver=2.5V: R1=R3=250 ohm, R2=R4=62.5 ohm Figure 3 - LVPECL Input DC Coupled Thevenin Equivalent 6 Microsemi Corporation ZL40216 Data Sheet VDD VDD_driver ZL40216 LVPECL Driver Z o = 50 Ohm s clk_p Z o = 50 Ohm s clk_n 50 Ohm s 50 Ohm s R1 VDD_driver=3.3V: R1 = 50 ohm VDD_driver=2.5V: R1 = 20 ohm Figure 4 - LVPECL Input DC Coupled Parallel Termination 100 Ohm s VDD_driver VDD 0.1 µF Z o = 50 Ohm s LVPECL Driver 0.1 µF 100 Ohm s R VDD_driver = 3.3V: R = 150 Ohm VDD_driver = 2.5 V: R = 85 Ohm Figure 5 - LVPECL Input AC Coupled 7 Microsemi Corporation VDD ZL40216 clk_p Z o = 50 Ohm s R 100 Ohm s clk_n 100 Ohm s ZL40216 Data Sheet VDD VDD_driver ZL40216 Z o = 50 Ohm s LVDS Driver clk_p 100 Ohm s Z o = 50 Ohm s clk_n Figure 6 - LVDS Input DC Coupled VDD VDD 10 K Ohm 0.1 µF VDD_driver 10 K Ohm Zo = 50 Ohms LVDS Driver ZL40216 clk_p 100 Ohm clk_n Zo = 50 Ohms 0.1 µF 10 K Ohm Figure 7 - LVDS Input AC Coupled 8 Microsemi Corporation 10 K Ohm ZL40216 Data Sheet VDD_driver 50 Ohm VDD VDD VDD_driver 50 Ohm 10 K Ohm 10 K Ohm Zo = 50 Ohms clk_p 0.1 µF 0.1 µF CML Driver ZL40216 clk_n Zo = 50 Ohms 10 K Ohm 10 K Ohm Figure 8 - CML Input AC Coupled VDD VDD VDD_driver 0.1 µF 10 K Ohm 10 K Ohm Zo = 50 Ohms ZL40216 clk_p HCSL Driver 0.1 µF clk_n Zo = 50 Ohms 50 Ohm 50 Ohm Figure 9 - HCSL Input AC Coupled 9 Microsemi Corporation 10 K Ohm 10 K Ohm ZL40216 Data Sheet VDD VDD_driver VDD_driver ZL40216 CMOS Driver clk_p R Vref = VDD_driver/2 clk_n C R R = 10 kohm, C = 100 nF Figure 10 - CMOS Input DC Coupled Referenced to VDD/2 VDD VDD VDD_driver ZL40216 R2 CMOS Driver clk_p R1 RA clk_n R3 C Figure 11 - CMOS Input DC Coupled Referenced to Ground VDD_driver R1 (kΩ) R2 (kΩ) R3 (kΩ) RA (kΩ) C (pF) 1.5 1.25 3.075 open 10 10 1.8 1 3.8 open 10 10 2.5 0.33 4.2 open 10 10 3.3 0.75 open 4.2 10 10 Table 1 - Component Values for Single Ended Input Reference to Ground * For frequencies below 100 MHz, increase C to avoid signal integrity issues. 10 Microsemi Corporation ZL40216 3.2 Data Sheet Clock Outputs LVDS has lower signal swing than LVPECL which results in a low power consumption. A simplified diagram for the LVDS output stage is shown in Figure 12. VDD 3 mA - + Output + - Figure 12 - Simplified LVDS Output Driver The methods to terminate the ZL40216 drivers are shown in the following figures. VDD_Rx VDD ZL40216 clk_p clk_n Zo = 50 Ohms LVDS Receiver Zo = 50 Ohms Figure 13 - LVDS DC Coupled Termination (Internal Receiver Termination) 11 Microsemi Corporation ZL40216 Data Sheet VDD_Rx VDD ZL40216 clk_p Zo = 50 Ohms 100 Ohms clk_n LVDS Receiver Zo = 50 Ohms Figure 14 - LVDS DC Coupled Termination (External Receiver Termination) VDD_Rx VDD R1 ZL40216 clk_p R1 Zo = 50 Ohms LVDS Receiver 100 Ohms clk_n Zo = 50 Ohms R2 R2 Note: R1 and R2 values and need for external termination depend on the specification of the LVDS receiver Figure 15 - LVDS AC Coupled Termination 12 Microsemi Corporation VDD_Rx ZL40216 Data Sheet VDD_Rx VDD ZL40218 clk_p clk_n 50 Ohms Zo = 50 Ohms 50 Ohms CML Receiver Zo = 50 Ohms Figure 16 - LVDS AC Output Termination for CML Inputs 13 Microsemi Corporation ZL40216 3.3 Data Sheet Device Additive Jitter The ZL40216 clock fanout buffer is not intended to filter clock jitter. The jitter performance of this type of device is characterized by its additive jitter. Additive jitter is the jitter the device would add to a hypothetical jitter-free clock as it passes through the device. The additive jitter of the ZL40216 is random and as such it is not correlated to the jitter of the input clock signal. The square of the resultant random RMS jitter at the output of the ZL40216 is equal to the sum of the squares of the various random RMS jitter sources including: input clock jitter; additive jitter of the buffer; and additive jitter due to power supply noise. There may be additional deterministic jitter sources, but they are not shown in Figure 17. Jadd2 Jin2 Jps2 + Jin Jadd Jps Jout + = Random input clock jitter (RMS) = Additive jitter due to the device (RMS) = Additive jitter due to power supply noise (RMS) = Resultant random output clock jitter (RMS) Figure 17 - Additive Jitter 14 Microsemi Corporation Jout2= Jin2+Jadd2+Jps2 ZL40216 3.4 Data Sheet Power Supply This device operates employing either a 2.5V supply or 3.3V supply. 3.4.1 Sensitivity to power supply noise Power supply noise from sources such as switching power supplies and high-power digital components such as FPGAs can induce additive jitter on clock buffer outputs. The ZL40216 is equipped with an on-chip linear power regulator and on-chip bulk capacitors to minimize additive jitter due to power supply noise. The on-chip measures in combination with the simple recommended power supply filtering and PCB layout are effective at minimizing additive jitter from power supply noise. 3.4.2 Power supply filtering Jitter levels may increase when noise is present on the power pins. For optimal jitter performance, the device should be isolated from the power planes connected to its power supply pins as shown in Figure 18. • • • • 10 µF capacitors should be size 0603 or size 0805 X5R or X7R ceramic, 6.3 V minimum rating 0.1 µF capacitors should be size 0402 X5R ceramic, 6.3 V minimum rating Capacitors should be placed next to the connected device power pins A 0.15 ohm resistor is recommended vdd_core 0.1 µF 0.1 µF 1 8 0.15 Ω vdd 9 10 µF 0.1 µF 0.1 µF ZL40216 19 22 32 10 µF Figure 18 - Decoupling Connections for Power Pins 3.4.3 PCB layout considerations The power nets in Figure 18 can be implemented either as a plane island or routed power topology without changing the overall jitter performance of the device. 15 Microsemi Corporation ZL40216 4.0 Data Sheet AC and DC Electrical Characteristics Absolute Maximum Ratings* Parameter Sym. Min. Max. Units VDD_R -0.5 4.6 V VPIN -0.5 VDD V 260 °C 125 °C 1 Supply voltage 2 Voltage on any digital pin 3 Soldering temperature 4 Storage temperature TST 5 Junction temperature Tj 125 °C 6 Voltage on input pin Vinput VDD V 7 Input capacitance each pin Cp 500 * Exceeding these values may cause permanent damage. Functional operation under these conditions is not implied. * Voltages are with respect to ground (GND) unless otherwise stated fF T -55 Recommended Operating Conditions* Characteristics Sym. Min. Typ. Max. Units 1 Supply voltage 2.5 V mode VDD25 2.375 2.5 2.625 V 2 Supply voltage 3.3 V mode VDD33 3.135 3.3 3.465 V 3 Operating temperature TA -40 25 85 °C * Voltages are with respect to ground (GND) unless otherwise stated DC Electrical Characteristics - Current Consumption Characteristics 1 Supply current LVDS drivers loaded (all outputs are active) Sym. - Min. Typ. Idd_load Max. 93 Units Notes mA DC Electrical Characteristics - Inputs and outputs - for 2.5/3.3 V supply Characteristics Sym. Min. Typ. Max. Units Notes 1 Differential input common mode VICM 1.1 1.6 V for 2.5 V 2 Differential input common mode VICM 1.1 2.0 V for 3.3 V 3 Differential input voltage VID 0.25 1 V 4 LVDS output differential voltage* VOD 0.25 0.30 0.40 V 5 LVDS Common Mode voltage VCM 1.1 1.25 1.375 V * The VOD parameter was measured between 125 and 750 MHz 16 Microsemi Corporation ZL40216 Data Sheet VOD 2*VOD Figure 19 - Differential Voltage Parameter AC Electrical Characteristics* - Inputs and Outputs (see Figure 20) - for 2.5/3.3 V supply. Characteristics Sym. Min. Typ. Max. Units 750 MHz 1 2 ns 1 Maximum Operating Frequency 1/tp 2 input to output clock propagation delay tpd 3 output to output skew tout2out 80 150 ps 4 part to part output skew tpart2part 120 300 ps 5 Output clock Duty Cycle degradation 0 5 Percent 6 LVDS Output slew rate 0 tPWH/ tPWL -5 rSL 0.55 * Supply voltage and operating temperature are as per Recommended Operating Conditions tP tREFW tREFW Input tpd Output Figure 20 - Input To Output Timing 17 Microsemi Corporation V/ns Notes ZL40216 5.0 Data Sheet Performance Characterization Additive Jitter at 2.5 V* Output Frequency (MHz) Jitter Measurement Filter Typical RMS (fs) 1 125 12 kHz - 20 MHz 148 2 212.5 12 kHz - 20 MHz 152 3 311.04 12 kHz - 20 MHz 121 4 425 12 kHz - 20 MHz 115 5 500 12 kHz - 20 MHz 107 6 622.08 12 kHz - 20 MHz 107 7 750 12 kHz - 20 MHz 105 Notes *The values in this table were taken with an approximate slew rate of 0.8 V/ns Additive Jitter at 3.3 V* Output Frequency (MHz) Jitter Measurement Filter Typical RMS (fs) 1 125 12 kHz - 20 MHz 150 2 212.5 12 kHz - 20 MHz 138 3 311.04 12 kHz - 20 MHz 120 4 425 12 kHz - 20 MHz 115 5 500 12 kHz - 20 MHz 107 6 622.08 12 kHz - 20 MHz 106 7 750 12 kHz - 20 MHz 104 Notes *The values in this table were taken with an approximate slew rate of 0.8 V/ns. Additive jitter from a power supply tone* Carrier frequency Parameter Typical Units 125 25 mV at 100 kHz 24 fs RMS 750 25 mV at 100 kHz 23 fs RMS Notes * The values in this table are the additive periodic jitter caused by an interfering tone typically caused by a switching power supply. For this test, measurements were taken over the full temperature and voltage range for VDD = 3.3 V. The magnitude of the interfering tone is measured at the DUT. 18 Microsemi Corporation ZL40216 6.0 Data Sheet Typical Behavior 0.35 0.2 0.15 0.34 0.1 0.33 VOD Voltage 0.05 0 0.32 -0.05 -0.1 0.31 -0.15 -0.2 0 5 10 15 0.3 20 0 Time (ns) 200 300 400 500 600 -50 125 MHz -55 212.5 MHz -65 -60 425 MHz 750 MHz -65 PSRR (dBc) -70 -75 -80 -70 -75 -80 125 MHz -85 212.5 MHz -90 -85 425 MHz -95 750 MHz -100 100 150 200 250 300 350 400 450 20 500 Power Supply Tone Frequency versus PSRR 0.85 0.8 0.75 0.7 0.65 -40 -20 0 20 40 40 50 60 70 80 Power Supply Tone Magnitude versus PSRR 0.9 0.6 30 Tone Magnitude (mV) Tone Frequency (kHz) Delay (ns) 800 VOD vs Frequency -60 -90 700 Frequency (MHz) Typical Waveform at 155.52 MHz PSRR (dBc) 100 60 80 100 Temperature ( C) Propogation Delay versus Temperature Note: This is for a single device. For more details, see the characterization section. 19 Microsemi Corporation 90 100 ZL40216 7.0 Data Sheet Package Characteristics Thermal Data Parameter Symbol Test Condition Value Junction to Ambient Thermal Resistance ΘJA Still Air 1 m/s 2 m/s 37.4 33.1 31.5 o Junction to Case Thermal Resistance ΘJC 24.4 oC/W Junction to Board Thermal Resistance ΘJB 19.5 oC/W Maximum Junction Temperature* Tjmax 125 oC Maximum Ambient Temperature TA 85 oC 20 Microsemi Corporation Unit C/W ZL40216 8.0 Mechanical Drawing 21 Microsemi Corporation Data Sheet For more information about all Microsemi products visit our Web Site at www.microsemi.com Information relating to products and services furnished herein by Microsemi Corporation or its subsidiaries (collectively “Microsemi”) is believed to be reliable. However, Microsemi assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Microsemi or licensed from third parties by Microsemi, whatsoever. Purchasers of products are also hereby notified that the use of product in certain ways or in combination with Microsemi, or non-Microsemi furnished goods or services may infringe patents or other intellectual property rights owned by Microsemi. This publication is issued to provide information only and (unless agreed by Microsemi in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other information appearing in this publication are subject to change by Microsemi without notice. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical and other products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to Microsemi’s conditions of sale which are available on request. Purchase of Microsemi’s I2C components conveys a license under the Philips I2C Patent rights to use these components in an I2C System, provided that the system conforms to the I2C Standard Specification as defined by Philips. Microsemi, ZL, and combinations thereof, VoiceEdge, VoicePort, SLAC, ISLIC, ISLAC and VoicePath are trademarks of Microsemi Corporation. TECHNICAL DOCUMENTATION - NOT FOR RESALE
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