LS5909 LOW NOISE, LOW DRIFT MONOLITHIC DUAL N-CHANNEL JFET
The LS5909 is a high-performance monolithic dual JFET featuring tight matching and low drift over temperature specifications, and is targeted for use in a wide range of precision instrumentation applications where tight tracking is required. The 8 Pin P-DIP and 8 Pin SOIC provide ease of manufacturing, and the symmetrical pinout prevents improper orientation. (See Packaging Information). FEATURES LOW DRIFT ULTRA LOW LEAKAGE LOW PINCHOFF ABSOLUTE MAXIMUM RATINGS @ 25°C (unless otherwise noted) | VGS1‐2 / T| = 5µV/°C TYP. IG = 150fA TYP. Vp = 2V TYP.
LS5909 Benefits:
Tight Tracking Good matching Ultra Low Leakage Low Drift
Maximum Temperatures Storage Temperature ‐65°C to +150°C Operating Junction Temperature +150°C Maximum Voltage and Current for Each Transistor – Note 1 ‐VGSS Gate Voltage to Drain or Source 40V ‐VDSO Drain to Source Voltage 40V ‐IG(f) Gate Forward Current 10mA ‐IG Gate Reverse Current 10µA Maximum Power Dissipation Device Dissipation @ Free Air – Total 40mW @ +125°C MATCHING CHARACTERISTICS @ 25°C UNLESS OTHERWISE NOTED SYMBOL CHARACTERISTICS VALUE UNITS CONDITIONS | VGS1‐2 / T| max. DRIFT VS. 40 µV/°C VDG=10V, ID=30µA TEMPERATURE TA=‐55°C to +125°C | V GS1‐2 | max. OFFSET VOLTAGE 15 mV VDG=10V, ID=30µA TYP. 60 ‐‐ 300 100 1 400 2 2 ‐‐ ‐‐ ‐‐ ‐‐ ‐‐ 1 ‐‐ 0.1 0.01 90 90 ‐‐ 20 ‐‐ ‐‐ ‐‐ MAX. ‐‐ ‐‐ 500 200 5 1000 5 4.5 4 1 1 2 5 ‐‐ 5 0.1 0.1 ‐‐ ‐‐ 1 70 3 1.5 0.1 UNITS V V µmho µmho % µA % V V pA nA pA nA pA µmho CONDITIONS VDS = 0 ID=1nA IG= 1nA ID= 0 IS= 0 VDG= 10V VGS= 0V f = 1kHz VDG= 10V ID= 30µA f = 1kHz VDG= 10V VGS= 0V VDS= 10V ID= 1nA VDS=10V ID=30µA VDG= 10V ID= 30µA TA= +125°C VDS =0V VGS= 20V TA= +125°C VGG= 20V VDG= 10V VGS= 0V VDG= 10V ID=30µA ∆VDS = 10 to 20V ID=30µA ∆VDS = 5 to 10V ID=30µA VDS= 10V VGS= 0V RG= 10MΩ f= 100Hz NBW= 6Hz VDG=10V ID=30µA f=10Hz NBW=1Hz VDS= 10V VGS= 0V f= 1MHz VDG = 20V ID=30µA
ELECTRICAL CHARACTERISTICS @ 25°C (unless otherwise noted) SYMBOL CHARACTERISTICS MIN. BVGSS Breakdown Voltage 40 BVGGO Gate‐To‐Gate Breakdown 40 TRANSCONDUCTANCE YfSS Full Conduction 70 YfS Typical Operation 50 |YFS1‐2 / Y FS| Mismatch ‐‐ DRAIN CURRENT IDSS Full Conduction 60 |IDSS1‐2 / IDSS| Mismatch at Full Conduction ‐‐ GATE VOLTAGE VGS(off) or Vp Pinchoff voltage 0.6 VGS(on) Operating Range ‐‐ GATE CURRENT ‐IGmax. Operating ‐‐ ‐IGmax. High Temperature ‐‐ ‐IGSSmax. At Full Conduction ‐‐ ‐IGSSmax. High Temperature ‐‐ IGGO Gate‐to‐Gate Leakage ‐‐ OUTPUT CONDUCTANCE YOSS Full Conduction ‐‐ YOS Operating ‐‐ |YOS1‐2| Differential ‐‐ COMMON MODE REJECTION CMR ‐20 log |∆VGS1‐2/∆VDS| ‐‐ CMR ‐20 log |∆VGS1‐2/∆VDS| ‐‐ NOISE NF Figure ‐‐ en Voltage ‐‐ CAPACITANCE CISS Input ‐‐ CRSS Reverse Transfer ‐‐ CDD Drain‐to‐Drain ‐‐
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dB dB nV/√Hz pF
Note 1 – These ratings are limiting values above which the serviceability of any semiconductor may be impaired
SOIC / PDIP (Top View) Available Packages: LS5909 in PDIP / SOIC LS5909 available as bare die Please contact Micross for full package and die dimensions
Micross Components Europe
Tel: +44 1603 788967 Email: chipcomponents@micross.com Web: http://www.micross.com/distribution
Information furnished by Linear Integrated Systems and Micross Components is believed to be accurate and reliable. However, no responsibility is assumed for its use; nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Linear Integrated Systems.
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