830-10-001-10-001000 数据手册
INTERCONNECTS 2mm Grid Headers and Sockets Single and Double Row
• Series 830 single and double row interconnects have 2mm pin spacing and permit board stacking as low as .322”. • Pin headers (830 & 832 series) use MM #5012 pins. See page 175 for details. • Sockets (831 & 833 series) use MM #1802 receptacles and accept pin diameters from .015”-.025”. See page 140 for details. • Insulators are high temp. thermoplastic, suitable for all soldering operations.
Series 830, 831 832, 833
2002/95/EC
RoHS
Fig. 1
Ordering Information
Single Row Pin Header
Fig. 1
830-XX-0_ _-10-001000 Specify # of pins 01-50
Double Row Pin Header
Fig. 2
Fig. 2
832-XX-_ _ _-10-001000 Specify # of pins 002-100
For Electrical, Mechanical & Enviromental Data, See pg. 4
XX=Plating Code See Below
For RoHS compliance select p lating code.
SPECIFY PLATING CODE XX=
10 10μ” Au
90 200μ” Sn/Pb
40 200μ” Sn
Pin Plating
Single Row Socket
Fig. 3
Fig. 3
831-XX-0_ _-10-001000 Specify # of pins 01-50
Double Row Socket
Fig. 4
833-XX-_ _ _-10-001000 Specify # of pins 002-100
For RoHS compliance select p lating code.
For Electrical, Mechanical & Enviromental Data, See pg. 4
XX=Plating Code See Below
SPECIFY PLATING CODE XX=
13
10µ” Au 30µ” Au
91
10µ” Au
93
30µ” Au
99
200µ”Sn/Pb
41
10µ” Au
43
44
Fig. 4
Sleeve (Pin) Contact (Clip)
200µ” Sn/Pb 200µ” Sn/Pb 200µ”Sn/Pb 200µ”Sn 200µ”Sn 200µ”Sn 30µ” Au 200µ”Sn
w w w. m i l l - m a x . c o m
70
516-922-6000
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