834-47-058-10-001000

INTERCONNECTS SERIES 834 & 835 • .100” GRID OFP ® PASS-THROUGH SOCKETS Ø.030” & .025” PINS• SINGLE AND DOUBLE ROW STRIPS • 834/835 Series Pass-Through Sockets have a low • • • • *Intrusive reflow (also called “pin-in-paste”) is a technique of using conventional through-hole components in a reflow soldering process. The pass-through socket is placed into plated through-holes in the circuit board (solder paste has previously been screen printed on pads adjacent to the holes) and the board is reflowed in the same pass as other SMT components. Solder will fill the plated through-holes and achieve solder joints as reliable as wave soldering. The OFP® barrier prevents solder paste from being picked up inside the contact during assembly. .088 Ø.030" or .025" PINS #47 SPRING CONTACT MIDDLE CIRCUIT BOARD SOCKET INSULATOR PASS THROUGH SOCKETS RECEPTACLE SLEEVE CIRCUIT BOARD LOWER CIRCUIT BOARD SOLDER JOINT Number of Pins X .100" Series 834...001 .061 DIA. Single Row OFP® Pass-Through Socket 834-XX-0 _ _-10-001000 FIG. 1 .080 Specify number of pins .036 DIA. Through-Hole ® FIG. 1 .025-.036 .025 * .025 .100 Series 835...001 2011/65/EU .061 DIA. Double Row OFP® Pass-Through Socket Specify number of pins RoHS - 2 .130 01-64 835-XX-0 _ _-10-001000 FIG. 2 Number of Pins X .100" / 2 .200 .110 .088 04-72 XX=Plating Code See Below .080 .043 DIA. SPECIFY PLATING CODE XX= .036 DIA. Through-Hole .100 ORGANIC FIBER PLUG ® PUSHED OUT BY INTERCONNECT PIN AFTER SOLDERING ORDERING INFORMATION .130 .043 DIA. INTERCONNECTION PIN US Patent #7,086,870 .025-.036 .025 * .025 .100 .110 Typical Application UPPER CIRCUIT BOARD ® .100 FIG. 2 Sleeve (Pin) Contact (Clip) 93 For Electrical, Mechanical & Enviromental Data, See page 264 43 47 200 µ”Sn/Pb 200 µ” Sn 200 µ” Sn 30 µ” Au 30 µ” Au Au Flash Mill-Max Mfg. Corp. • 190 Pine Hollow Road, P.O. Box 300, Oyster Bay, NY 11771 • 516-922-6000 • Fax: 516-922-9253 • www.mill-max.com PAGE 63 | INTERCONNECTS • .130” profile and will accept Ø.030” round pin, as well as industry standard .025” square pin headers. They are typically used to interconnect two or more parallel circuit boards. Sockets are designed for hand, wave or reflow* soldering. The high temperature insulator is compatible with all solder processes. Unique ORGANIC FIBRE PLUG® barriers prevent solder, paste or flux from contaminating the internal spring contacts. After soldering, the OFP® barriers are pushed out of the socket when the mating header is inserted. Mill-Max sockets use a receptacle consisting of a precision-machined brass sleeve with a press-fit beryllium copper “multi-finger” spring contact. Recommended mounting holes are Ø.046 ±.003” PTH (1,2 mm drilled prior to plating).